Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.

Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.

Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.

Abstract: A display device includes a display panel, a data driving unit, and a timing control unit. The display panel includes a plurality of data driving lines. The data driving unit is electrically coupled to the display panel for driving at least one part of the plurality of data driving lines. The timing control unit is disposed on a side of the display panel for processing a plurality of data vectors generated by a data source. The timing control unit includes an encoder module, a serializer module, and a data transmitter module. The encoder module is used for encoding a plurality of N bit data vectors to a plurality of N+m bit data vectors. The serializer module is electrically coupled to the encoder module for serializing the plurality of N+m bit data vectors. The data transmitter module is used for transmitting the plurality of serialized N+m bit data vectors to the data driving unit.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a pedestal configured to secure a wafer; a nozzle configured to deposit a cleaning solution on the wafer disposed on the pedestal during a cleaning session; and a plurality of contacts configured to secure the wafer to the pedestal while the cleaning solution is deposited on the wafer, wherein a first subset of the plurality of contacts is configured to contact the wafer at a first time interval and a second subset of the plurality of contacts is configured to contact the wafer at a second time interval.

Abstract: The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

Abstract: The present disclosure relates to a contamination controlled semiconductor processing system. The contamination controlled semiconductor processing system includes a processing chamber, a contamination detection system, and a contamination removal system. The processing chamber is configured to process a wafer. The contamination detection system is configured to determine whether a contamination level on a surface of the door is greater than a baseline level. The contamination removal system is configured to remove contaminants from the surface of the door in response to the contamination level being greater than the baseline level.

Abstract: The present disclosure describes a method for controlling a wet processing system includes dispensing one or more chemicals into a processing chamber according to one or more process parameters. The method also includes injecting one or more illumination markers into the processing chamber and obtaining images representing locations of the one or more illumination markers. The method further includes determining a trajectory of an illumination marker of the one or more illumination markers based on the images and determining whether the determined trajectory is outside a predetermined trajectory range. In response to the determined trajectory being outside the predetermined trajectory range, the method further includes adjusting the one or more process parameters.

Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.

Abstract: A display device includes a display panel, a data driving unit, and a timing control unit. The display panel includes a plurality of data driving lines. The data driving unit is electrically coupled to the display panel for driving at least one part of the plurality of data driving lines. The timing control unit is disposed on a side of the display panel for processing a plurality of data vectors generated by a data source. The timing control unit includes an encoder module, a serializer module, and a data transmitter module. The encoder module is used for encoding a plurality of N bit data vectors to a plurality of N+m bit data vectors. The serializer module is electrically coupled to the encoder module for serializing the plurality of N+m bit data vectors. The data transmitter module is used for transmitting the plurality of serialized N+m bit data vectors to the data driving unit.

Abstract: An electronic apparatus and a method for switching touch modes thereof are provided. A touch screen of the electronic apparatus has a plurality of touch modes. A current touch mode of the touch screen is one of the plurality of touch modes. The method includes the following steps. Firstly, the number of times a key module of the electronic apparatus is pressed is determined according to a pulse count of a trigger signal provided by the key module. Next, a first touch mode of the plurality of touch modes is looked up in a lookup table according to the number of times. Afterwards, the current touch mode of the touch screen is switched to the first touch mode.

Abstract: A method of wear leveling receives a write request. The write request indicates received data to be written to memory blocks. The method detects a system condition. Example system conditions include a random write condition, a garbage collection start condition, and/or a sequential write condition. Based on the system condition, the method determines whether the received data comprises hot data or cold data. Some embodiments use a write amplification value to determine the system condition. If the received data comprises hot data, the method writes the received data to a cold block. If the received data comprises cold data, the method writes the received data to a hot block.

Abstract: A method, system, and apparatus are provided for retiring computer memory blocks. Two overall schemes are provided for separating poorly functioning blocks from normally functioning blocks. In a first scheme, after data relocation is finished, firmware remembers the old physical memory block. As soon as the system writes to the old physical memory block with new data, firmware issues a read again and receives back a count of error bits. If the returned error bits are still high, then the system identifies the block as being weak and retires the block. In a second scheme, firmware tracks statistics for data relocates, block reads, activity timers, among other statistics. If some blocks have abnormal activities (e.g., too many data relocates, too many reads, etc.), then the system may identify the block as being weak and may retire the physical memory block.

Abstract: A motor forcibly cooling device with a rear drive assembly includes a motor body and a motor rotating shaft extended out from a center thereof toward one side or two sides thereof, another end of the motor body being assembled with a annular frame to form a covering space allowing a drive and cooling plate to be mounted therein, where the motor rotating shaft is extended out of a through hole configured on a center of the cooling plate to assemble a leaf group on the motor rotating shaft directly, allowing the leaf group to be rotated with the motor, a windshield is configured outside the leaf group to cover a connection of the leaf group with annular frame, allowing the leaf group to cool forcibly the cooling plate and a peripheral face of the motor body through a wind direction guiding covering edge face of the windshield.

Abstract: A method of wear leveling receives a write request. The write request indicates received data to be written to memory blocks. The method detects a system condition. Example system conditions include a random write condition, a garbage collection start condition, and/or a sequential write condition. Based on the system condition, the method determines whether the received data comprises hot data or cold data. Some embodiments use a write amplification value to determine the system condition. If the received data comprises hot data, the method writes the received data to a cold block. If the received data comprises cold data, the method writes the received data to a hot block.

Abstract: A method, system, and apparatus are provided for retiring computer memory blocks. Two overall schemes are provided for separating poorly functioning blocks from normally functioning blocks. In a first scheme, after data relocation is finished, firmware remembers the old physical memory block. As soon as the system writes to the old physical memory block with new data, firmware issues a read again and receives back a count of error bits. If the returned error bits are still high, then the system identifies the block as being weak and retires the block. In a second scheme, firmware tracks statistics for data relocates, block reads, activity timers, among other statistics. If some blocks have abnormal activities (e.g., too many data relocates, too many reads, etc.), then the system may identify the block as being weak and may retire the physical memory block.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: An engine controller, system and method for collecting vehicle data. Drive torque data is determined using the engine controller in the vehicle and is stored in a memory in the vehicle. The drive torque data is stored in a non-time domain format, and may include a histogram of numbers of revolutions at predetermined intervals of drive torque values and/or a matrix of rainflow cycle counts. The drive torque data is temporarily stored in a buffer prior to being stored in the matrix of rainflow cycle counts using back-checking and binning. The drive torque data is downloaded from the vehicle and transmitted to a central data collection center.

Abstract: A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.