Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

Abstract: There is provided a computer-implemented method of executing a query plan against a database. An exemplary method comprises accessing a first subset of rows of a database table using a direct access method for an index. The query plan may comprise the direct access method. The exemplary method also comprises determining a processing cost of accessing the first subset of rows. The exemplary method further comprises modifying the direct access method for the index in response to determining that the processing cost exceeds a specified threshold. Additionally, the exemplary method comprises accessing a second subset of rows of the database table using the modified direct access method.

Abstract: A method of operating a wafer processing system includes etching a batch of wafers. The method also includes transferring at least a portion of the batch of wafers to a first front opening universal pod (FOUP). The method further includes purging an interior of the first FOUP with an inert gas. The method additionally includes transporting the first FOUP from a first loading port to a second loading port. The method also includes monitoring an elapsed time from the purging. The method further includes performing a second purging of the interior of the first FOUP if the elapsed time exceeds a threshold time. The method additionally includes cleaning the batch of wafers.

Abstract: An engine controller, system and method for collecting vehicle data. Drive torque data is determined using the engine controller in the vehicle and is stored in a memory in the vehicle. The drive torque data is stored in a non-time domain format, and may include a histogram of numbers of revolutions at predetermined intervals of drive torque values and/or a matrix of rainflow cycle counts. The drive torque data is temporarily stored in a buffer prior to being stored in the matrix of rainflow cycle counts using back-checking and binning. The drive torque data is downloaded from the vehicle and transmitted to a central data collection center.

Abstract: A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described.

Abstract: The present disclosure provides a supporting and heat dissipating structure. A driver is arranged on an inner surface of a heat sink. The heat sink has protrusions for heat dissipation. An axle hole and a fixing ring are formed at the center of the heat sink. An elastic ring is arranged around the fixing ring for connecting with a supporting frame. A tubular barrel is used for connecting the heat sink to a motor. A structure for easily and firmly supporting the motor and the driver can be obtained. The structure can also absorb vibration while the motor rotating.

Abstract: An electronic device module, an electronic device thereof, a protection element thereof and a method of raising working frequency thereof are provided. The electronic device module comprises the electronic device and the protection element. The electronic device comprises a main body, a device detection element and a central processing unit (CPU), wherein the device detection element and the CPU are disposed within the main body. The protection element comprises a protection cover and a protection detection element, wherein the protection detection element is disposed on the protection cover. The CPU raises a working frequency thereof according to an approaching movement between the device detection element and the protection detection element.

Abstract: A fan device and an electronic device thereof are disclosed. The fan device is disposed in a casing of the electronic device and adjacent to a board of the casing, wherein the board has a first state and a second state. The fan device includes a plurality of fan blades, a shaft, and a ball. The shaft is connected to the plurality of fan blades and allows the plurality of fan blades rotating with the shaft, wherein at least one end of the shaft has a ball accommodating portion and an opening. The ball is disposed in the ball accommodating portion and limited by the opening for not separate from the ball accommodating portion. When the board is in the first state, a gap is between the ball and the casing. When the board is in the second state, the board and the ball touch each other.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins.

Abstract: A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween.

Abstract: A thin heating pipe includes a pipe, a main capillary structure, a first capillary structure, and a second capillary structure. The pipe has a hollow chamber and a connecting chamber. The first capillary structure is disposed in the chamber and between the first and the second capillary structures. The first capillary structure has a first channel, the second capillary structure has a second channel, and the connecting chamber is communicated with the first channel and the second channel.

Abstract: A fixing mechanism for fixing an electronic component is disclosed in the present invention. The fixing mechanism includes a first casing, a boss disposed on the first casing. The electronic component is disposed on the boss. The fixing mechanism further includes a resilient component disposed on the boss and located between the first casing and the electronic component, a circuit board putting on the electronic component and fixed on the first casing, and a second casing pressing the circuit board and fixed on the first casing. The circuit board contacts against the electronic component tightly by an assembly of the first casing and the second casing.

Abstract: The present invention is related to a back frame of a display device. The back frame includes a frame piece and a fixing member having a first portion, a second portion, and a third portion. The first portion extends toward the inside of the back frame. The second portion extends from the first portion and connects with the third portion, fixing a printed circuit board to prevent other internal connecting interfaces from loosening due to the printed circuit board shifting.

Abstract: There is provided a computer-implemented method of executing a query plan against a database. An exemplary method comprises accessing a first subset of rows of a database table using a direct access method for an index. The query plan may comprise the direct access method. The exemplary method also comprises determining a processing cost of accessing the first subset of rows. The exemplary method further comprises modifying the direct access method for the index in response to determining that the processing cost exceeds a specified threshold. Additionally, the exemplary method comprises accessing a second subset of rows of the database table using the modified direct access method.

Abstract: There is provided a computer-implemented method of executing a query plan against a database. An exemplary method comprises accessing a first subset of rows of a database table using a direct access method for an index. The query plan may comprise the direct access method. The exemplary method also comprises determining a processing cost of accessing the first subset of rows. The exemplary method further comprises modifying the direct access method for the index in response to determining that the processing cost exceeds a specified threshold. Additionally, the exemplary method comprises accessing a second subset of rows of the database table using the modified direct access method.

Abstract: A loading port includes a housing and a plurality of stations defined in the housing configured to receive a front opening universal pod (FOUP). The loading port further includes a connector configured to receive an inert gas. At least one of the plurality of stations is configured to deliver the inert gas to the FOUP to purge an interior of the FOUP of moisture. A system including the loading port and a method of using the system are also described.

Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

Abstract: The present disclosure provides a supporting and heat dissipating structure. A driver is arranged on an inner surface of a heat sink. The heat sink has protrusions for heat dissipation. An axle hole and a fixing ring are formed at the center of the heat sink. An elastic ring is arranged around the fixing ring for connecting with a supporting frame. A tubular barrel is used for connecting the heat sink to a motor. A structure for easily and firmly supporting the motor and the driver can be obtained. The structure can also absorb vibration while the motor rotating.

Abstract: A travel padlock for securing an article comprises a housing having a shackle, a key lock and a combination lock. An indicator having at least first and second positions is moved from the first position to the second position upon insertion of an object longitudinally into a key hole of the key lock. In at least one embodiment, at least a portion of the indicator extends beyond the exterior of the housing when in the second position. In addition, in at least one embodiment of the present invention the shackle may be rotated to reset the indicator from the second position back to the first position. Furthermore, in at least one embodiment of the present invention the indicator may be reset from the second position back to the first position without rotating the shackle or unlocking the combination lock. Methods of making and using the padlock are also provided.