Patents by Inventor Yung Yeh

Yung Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250057876
    Abstract: Disclosed herein is a method for treating and/or preventing a lymphangiogenesis-associated disease in a subject, including administering to the subject a therapeutically effective amount of a dihydrolipoic acid (DHLA)-coated gold nanocluster about 0.1 to 10 nm in diameter. Also disclosed is a method for promoting lymphangiogenesis in a subject, including administering to the subject an effective amount of said DHLA-coated gold nanocluster.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 20, 2025
    Inventors: Hung-I YEH, Yih-Jer WU, Shih-Wei WANG, Ching-Hu CHUNG, Cheng-Yung LIN, Wen-Hsiung CHAN, Kuan-Jung LI, Hong-Shong CHANG
  • Publication number: 20240355674
    Abstract: A method for fabricating a semiconductor device includes forming a trench extending from a top surface of a semiconductor substrate into the semiconductor substrate, and forming a gate dielectric layer lining the trench. The method also includes forming a gate electrode layer in the trench and over the top surface of the semiconductor substrate, and forming a bit line structure over a S/D region of the semiconductor structure. The bit line structure includes a protection liner having a U-shaped profile and in direct contact with an upper portion of the gate dielectric layer. The formation of the gate electrode layer includes performing a first deposition process, performing a first etching process after the first deposition process, and performing a second deposition process after the first etching process.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 24, 2024
    Inventors: HUAN-YUNG YEH, CHUN-CHI LAI
  • Patent number: 12094718
    Abstract: The present application discloses a semiconductor device including a first isolation structure, a second isolation structure, and a third isolation structure disposed in a semiconductor substrate. The semiconductor device further includes a transistor and a resistor. The transistor is disposed between the first isolation structure and the second isolation structure, and includes a gate electrode and a first source/drain (S/D) region. The resistor is disposed between the second isolation structure and the third isolation structure, and includes a resistor electrode. The first S/D region is disposed between the gate electrode and the second isolation structure, and is electrically connected to the resistor electrode.
    Type: Grant
    Filed: October 20, 2023
    Date of Patent: September 17, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Huan-Yung Yeh
  • Patent number: 12057348
    Abstract: A method for fabricating a semiconductor device includes forming a trench extending from a top surface of a semiconductor substrate into the semiconductor substrate, and forming a gate dielectric layer lining the trench. The method also includes forming a gate electrode layer in the trench and over the top surface of the semiconductor substrate, and forming a bit line structure over a S/D region of the semiconductor structure. The bit line structure includes a protection liner having a U-shaped profile and in direct contact with an upper portion of the gate dielectric layer. The formation of the gate electrode layer includes performing a first deposition process, performing a first etching process after the first deposition process, and performing a second deposition process after the first etching process.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: August 6, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Huan-Yung Yeh, Chun-Chi Lai
  • Patent number: 12002677
    Abstract: A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: June 4, 2024
    Assignees: HIGHLIGHT TECH CORP., Finesse Technology Co., Ltd.
    Inventors: Chwung-Shan Kou, Wen-Yung Yeh
  • Patent number: 11988559
    Abstract: A color calibrator includes a first casing, a second casing and an optical sensor. The first casing has an accommodating recess and a plurality of first positioning members, wherein the first positioning members are arranged along an axial direction of the accommodating recess. The second casing is telescopically disposed in the accommodating recess. The second casing has a second positioning member. One of the first positioning member and the second positioning member is a magnet. Another one of the first positioning member and the second positioning member is a magnet or a magnetic induction material. The second positioning member cooperates with one of the first positioning members to position the second casing at one of a plurality of telescopic positions with respect to the first casing. The optical sensor is disposed on the second casing.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 21, 2024
    Assignee: Qisda Corporation
    Inventors: Chun-Jung Chen, Yung-Yeh Chang
  • Publication number: 20240047217
    Abstract: The present application discloses a semiconductor device including a first isolation structure, a second isolation structure, and a third isolation structure disposed in a semiconductor substrate. The semiconductor device further includes a transistor and a resistor. The transistor is disposed between the first isolation structure and the second isolation structure, and includes a gate electrode and a first source/drain (S/D) region. The resistor is disposed between the second isolation structure and the third isolation structure, and includes a resistor electrode. The first S/D region is disposed between the gate electrode and the second isolation structure, and is electrically connected to the resistor electrode.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Inventor: HUAN-YUNG YEH
  • Patent number: 11889609
    Abstract: Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: January 30, 2024
    Assignees: HIGHLIGHT TECH CORP., FINESSE TECHNOLOGY CO., LTD.
    Inventors: Chwung-Shan Kou, Wen-Yung Yeh
  • Publication number: 20230415251
    Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform, an electrical discharge machining unit and a repairing device. The carrier platform is used for carrying at least one to-be-machined object. The electrical discharge machining unit comprises at least one electrode and a power supply unit, and is used for performing an electrical discharge machining procedure on a machined target area of the to-be-machined object by the electrode along a machining direction. When there is an area to be repaired on an appearance of the electrode, the repairing device performs a repairing procedure on the electrode, thereby achieving effects of stable electrical discharge and preventing short-circuit problem in the electrical discharge machining procedure.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 28, 2023
    Applicant: HIGHLIGHT TECH CORP.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH, CHANG-YING CHEN
  • Publication number: 20230415252
    Abstract: Disclosed is an electrical discharge machining apparatus at least comprising a carrier platform and an electrical discharge machining unit. The carrier platform is used to carry at least one to-be-machined object. The electrical discharge machining unit comprises an electrode, a jig and a power supply unit. When the electrical discharge machining unit performs an electrical discharge machining procedure on a machined target area of the to-be-machined object along a machining direction, an electrical discharge section of the electrode and the machined target area of the to-be-machined object move relatively. The invention is capable of improving a machining procedure, saving an overall machining time and saving a time required for electrode replacement.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 28, 2023
    Applicant: HIGHLIGHT TECH CORP.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH, CHANG-YING CHEN
  • Patent number: 11833603
    Abstract: An electrical discharge machining apparatus and an electrical discharge machining method with adjustable machining parameters comprise a carrier and an electrical discharge machining (EDM) unit. The carrier is used for placing a to-be-machined object defined with a machining target area. A discharge electrode of the electrical discharge machining (EDM) unit is used to cut the machining target area of the to-be-machined object along a first cutting direction with at least one machining parameter, the machining parameter is correspondingly adjusted when a specified parameter of the to-be-machined object changes to a first numerical value, thereby using the adjusted machining parameter to perform a second cutting step on the machining target area of the to-be-machined object. A segmented cutting technology for solving a problem that a cutting speed (mm2/min) is slowed down and a total cutting time is prolonged due to changes of the specified parameter of electrical discharge machining cutting.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: December 5, 2023
    Inventors: Chwung-Shan Kou, Wen-Yung Yeh
  • Publication number: 20230335408
    Abstract: The present application discloses a semiconductor device including a first isolation structure, a second isolation structure, and a third isolation structure disposed in a semiconductor substrate. The semiconductor device further includes a transistor and a resistor. The transistor is disposed between the first isolation structure and the second isolation structure, and includes a gate electrode and a first source/drain (S/D) region. The resistor is disposed between the second isolation structure and the third isolation structure, and includes a resistor electrode. The first S/D region is disposed between the gate electrode and the second isolation structure, and is electrically connected to the resistor electrode.
    Type: Application
    Filed: June 21, 2023
    Publication date: October 19, 2023
    Inventor: HUAN-YUNG YEH
  • Publication number: 20230268226
    Abstract: A method for fabricating a semiconductor device includes forming a trench extending from a top surface of a semiconductor substrate into the semiconductor substrate, and forming a gate dielectric layer lining the trench. The method also includes forming a gate electrode layer in the trench and over the top surface of the semiconductor substrate, and forming a bit line structure over a S/D region of the semiconductor structure. The bit line structure includes a protection liner having a U-shaped profile and in direct contact with an upper portion of the gate dielectric layer. The formation of the gate electrode layer includes performing a first deposition process, performing a first etching process after the first deposition process, and performing a second deposition process after the first etching process.
    Type: Application
    Filed: February 22, 2022
    Publication date: August 24, 2023
    Inventors: HUAN-YUNG YEH, CHUN-CHI LAI
  • Patent number: 11728174
    Abstract: The present application discloses a method for fabricating a semiconductor device using a tilted etch process. The method includes forming an etching stop layer on a substrate, forming a target layer on the etching stop layer, forming a first hard mask layer on the target layer, forming second hard mask layers on the first hard mask layer, performing a first tilted etch process on the first hard mask layer to form first openings along the first hard mask layer and adjacent to first sides of the second hard mask layers, and performing a second tilted etch process on the first hard mask layer to form second openings along the first hard mask layer and adjacent to second sides of the second hard mask layers.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: August 15, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Huan-Yung Yeh
  • Patent number: 11504802
    Abstract: A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: November 22, 2022
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Yu-Ting Lyu, Hsiang-Pin Wang, Po-Chi Hu, Chao-Yung Yeh
  • Publication number: 20220367189
    Abstract: A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.
    Type: Application
    Filed: May 12, 2022
    Publication date: November 17, 2022
    Applicants: HIGHLIGHT TECH CORP., Finesse Technology Co., Ltd.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH
  • Publication number: 20220362872
    Abstract: An electrical discharge machining apparatus and an electrical discharge machining method with adjustable machining parameters comprise a carrier and an electrical discharge machining (EDM) unit. The carrier is used for placing a to-be-machined object defined with a machining target area. A discharge electrode of the electrical discharge machining (EDM) unit is used to cut the machining target area of the to-be-machined object along a first cutting direction with at least one machining parameter, the machining parameter is correspondingly adjusted when a specified parameter of the to-be-machined object changes to a first numerical value, thereby using the adjusted machining parameter to perform a second cutting step on the machining target area of the to-be-machined object. A segmented cutting technology for solving a problem that a cutting speed (mm2/min) is slowed down and a total cutting time is prolonged due to changes of the specified parameter of electrical discharge machining cutting.
    Type: Application
    Filed: May 12, 2022
    Publication date: November 17, 2022
    Applicant: HIGHLIGHT TECH CORP.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH
  • Publication number: 20220369430
    Abstract: Disclosed is an annealing system integrated with laser and microwave. The annealing system is provided with a microwave system, a laser system, and a measurement and control system. The microwave system provides a microwave energy to a first area of a to-be-annealed object for annealing the first area of the to-be-annealed object. The laser system uses a laser to provide a laser energy to a second area of the to-be-annealed object for annealing the second area of the to-be-annealed object. The measurement and control system monitors and controls a power of a microwave and/or a laser. The annealing system is capable of reducing a time required for an overall annealing, and also capable of avoiding cracks or defects caused by large stress differences.
    Type: Application
    Filed: May 12, 2022
    Publication date: November 17, 2022
    Applicants: HIGHLIGHT TECH CORP., Finesse Technology Co., Ltd.
    Inventors: CHWUNG-SHAN KOU, WEN-YUNG YEH
  • Patent number: D1063926
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: February 25, 2025
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Ning Chai, Yu-Wen Cheng, Tzu-Yung Huang, Wang-Hung Yeh
  • Patent number: D1063927
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: February 25, 2025
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Ning Chai, Yu-Wen Cheng, Tzu-Yung Huang, Wang-Hung Yeh