Patents by Inventor Yusheng Bian

Yusheng Bian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240402486
    Abstract: Systems and methods for designing photonic integrated circuits (PICs) include a simulation program with virtual optical probing functions and, optionally, bidirectional optical signal propagation simulation. For probing, a processor receives an output expression specifying a virtual optical probing function (e.g., for power in dBm, etc.) and a net within a PIC design. If different simulation types are enabled, the expression specifies simulation type. If bidirectionality is enabled, the expression specifies the forward or reverse direction. In response, the processor accesses the PIC design and results of simulation(s) thereof and calculates and outputs an optical signal parameter value for the specified net.
    Type: Application
    Filed: May 30, 2023
    Publication date: December 5, 2024
    Inventors: Abdelsalam Aboketaf, Frederick G. Anderson, Yusheng Bian, Petar I Todorov, Bradley A. Orner
  • Publication number: 20240393624
    Abstract: Structures for a thermo-optic phase shifter and methods of forming a thermo-optic phase shifter. The structure comprises an interconnect structure including a dielectric layer, a waveguide core on the dielectric layer, and a heater on the dielectric layer. The heater includes a resistive heating element positioned adjacent to the waveguide core.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 28, 2024
    Inventors: Brian McGowan, Ping-Chuan Wang, Michal Rakowski, Sujith Chandran, Yusheng Bian
  • Publication number: 20240393625
    Abstract: Structures for a thermo-optic phase shifter and methods of forming a thermo-optic phase shifter. The structure comprises a semiconductor substrate, and a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element. The first resistive heating element and the second resistive heating element have a first thickness, and the slab layer has a second thickness that is less than the first thickness. The structure further comprises a waveguide core including a portion that is laterally positioned between the first resistive heating element and the second resistive heating element. The slab layer of the heater is disposed between the portion of the waveguide core and the semiconductor substrate.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 28, 2024
    Inventors: Sujith Chandran, Yusheng Bian, Won Suk Lee
  • Publication number: 20240395965
    Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a photodetector including a pad and a semiconductor layer positioned on the pad. The semiconductor layer has a sidewall, the pad comprises a semiconductor material, and the pad includes a top surface and a side edge. The structure further comprises a waveguide core including a tapered section adjacent to the side edge of the pad, and a confining feature in the pad adjacent to the sidewall of the semiconductor layer. The confining feature extends below the top surface of the pad, and the confining feature comprises a dielectric material.
    Type: Application
    Filed: May 23, 2023
    Publication date: November 28, 2024
    Inventor: Yusheng Bian
  • Publication number: 20240385373
    Abstract: A photonic integrated circuit (PIC) includes a waveguide in or over a semiconductor substrate. The waveguide has a terminal end. The PIC also includes an optical absorber having a curved shape adjacent to opposing sides and an endwall of the terminal end of the waveguide, i.e., it surrounds the terminal end of the waveguide. The optical absorber is multi-layered and includes a light absorbing layer. The light absorbing layer may include germanium or a vanadate. The optical absorber terminates or attenuates any stray optical signals from the waveguide while maintaining low back reflection.
    Type: Application
    Filed: May 20, 2023
    Publication date: November 21, 2024
    Inventor: Yusheng Bian
  • Patent number: 12147075
    Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure comprises a substrate and a back-end-of-line edge coupler including a waveguide core and a grating positioned in a vertical direction between the substrate and the waveguide core. The first waveguide core includes a first longitudinal axis, the grating includes a second longitudinal axis and a plurality of segments positioned with a spaced-apart arrangement along the second longitudinal axis, and the second longitudinal axis is aligned substantially parallel to the first longitudinal axis.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: November 19, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Rod Augur
  • Publication number: 20240377582
    Abstract: Structures including an edge coupler and methods of forming such structures. The structure comprises an edge coupler including a first portion and a second portion between the first portion and a semiconductor substrate, a first coupling-assistance feature adjacent to the first portion of the edge coupler, and a second coupling-assistance feature adjacent to the first portion of the edge coupler. The first portion of the edge coupler is positioned in a lateral direction between the first coupling-assistance feature and the second coupling-assistance feature.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 14, 2024
    Inventors: Yusheng Bian, Takako Hirokawa
  • Publication number: 20240377583
    Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a photodetector including a pad and a semiconductor layer on the pad, a first waveguide core including a tapered section adjacent to a sidewall of the semiconductor layer, and a second waveguide core including a curved section adjacent to the sidewall of the semiconductor layer. The curved section includes a plurality of segments, and the tapered section of the first waveguide core is overlapped by at least one of the plurality of segments in the curved section of the second waveguide core.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 14, 2024
    Inventor: Yusheng Bian
  • Patent number: 12135455
    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including a first waveguide core with a first end portion, a second waveguide core with a second end portion overlaying and physically separated from the first end portion, and a coupler configured to facilitate low-loss optical signal transmission between the waveguide cores. The coupler can include at least one array of photonic material elements (e.g., photonic crystal elements or photonic metamaterial elements) embedded in cladding material between the end portions. Alternatively, the coupler can include at least one photonic material layer (e.g., a photonic crystal layer or a photonic metamaterial layer) between and physically separated from the end portions and an array of cladding material elements extending through the photonic material layer. Also disclosed is a PIC structure including an on-chip system (e.g., a photonic computing system) including a crossing array implemented using any of the above-described couplers.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: November 5, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Kenneth J. Giewont
  • Patent number: 12135456
    Abstract: Structures for a waveguide core and methods of fabricating such structures. The structure comprises a waveguide core including a section having a first trapezoidal portion and a second trapezoidal portion stacked with the first trapezoidal portion. The first trapezoidal portion has a first trapezoidal shape, and the second trapezoidal portion has a second trapezoidal shape different from the first trapezoidal shape.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: November 5, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Koushik Ramachandran, Karen Nummy
  • Publication number: 20240361529
    Abstract: Structures including a cavity adjacent to an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate including a cavity with a sidewall, a dielectric layer on the semiconductor substrate, and an edge coupler on the dielectric layer. The structure further comprises a fill region including a plurality of fill features adjacent to the edge coupler. The fill region includes a reference marker at least partially surrounded by the plurality of fill features, and the reference marker has a perimeter that surrounds a surface area of the dielectric layer, and the surface area overlaps with a portion of the sidewall of the cavity.
    Type: Application
    Filed: April 25, 2023
    Publication date: October 31, 2024
    Inventors: Keith Donegan, Thomas Houghton, Yusheng Bian, Karen Nummy, Kevin Dezfulian, Takako Hirokawa
  • Patent number: 12130470
    Abstract: A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the die, and a second groove aligning a core of a second optical fiber positioned therein with a second optical component in a second, different layer at a second different vertical depth in the plurality of layers. The grooves may also have end faces at different lateral depths from an edge of the body of the PIC die. Any number of the first and second grooves can be used to communicate an optical signal to any number of layers at different vertical and/or lateral depths within the body of the PIC die.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: October 29, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Nicholas A. Polomoff, Thomas Houghton, Yusheng Bian
  • Publication number: 20240348005
    Abstract: Structures including a photonics chip and a surface-mounted laser chip, and methods of forming same. The structure comprises a photonics chip including a surface, a laser chip including a light output and a body that are spaced from the surface of the photonics chip, a first adhesive between the body of the laser chip and the surface of the photonics chip, and a second adhesive between the body of the laser chip and the surface of the photonics chip. The light output is oriented toward the surface of the photonics chip, the first adhesive has a first thermal conductivity, the second adhesive has a second thermal conductivity that is less than the first thermal conductivity of the first adhesive, and the second adhesive is disposed in a light path between the light output of the laser chip and the surface of the photonics chip.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Inventors: Zhuojie Wu, Yusheng Bian, Koushik Ramachandran
  • Publication number: 20240347652
    Abstract: Structures including a photodetector and methods of forming a structure including a photodetector. The structure comprises a semiconductor layer comprising a crystalline semiconductor material, a waveguide core including a first sidewall and a second sidewall, and a photodetector including a light-absorbing layer, an anode, and a cathode. The light-absorbing layer includes a first portion and a second portion that are disposed on the semiconductor layer. The first portion of the light-absorbing layer is adjacent to the first sidewall of the waveguide core, and the second portion of the light-absorbing layer is adjacent to the second sidewall of the waveguide core.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Inventors: Zhuojie Wu, Yusheng Bian, Judson R. Holt
  • Patent number: 12111495
    Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. The structure comprises an edge coupler including a first waveguide core and a second waveguide core adjacent to the first waveguide core in a lateral direction. The first waveguide core includes a first section with a first thickness and a first plurality of segments projecting in a vertical direction from the first section. The second waveguide core includes a second section with a second thickness and a second plurality of segments projecting in the vertical direction from the second section.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: October 8, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Publication number: 20240329299
    Abstract: Structures for an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate, a first waveguide core including a curved section and an end that terminates the curved section, and a second waveguide core including a section disposed adjacent to the curved section of the first waveguide core. The first waveguide core is positioned between the second waveguide core and the semiconductor substrate.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 3, 2024
    Inventor: Yusheng Bian
  • Publication number: 20240329308
    Abstract: Structures including multiple photonics chips and methods of fabricating a structure including multiple photonics chips. The structure comprises a first chip including a first edge and a first plurality of optical couplers disposed at the first edge, and a second chip including a second edge adjacent to the first edge of the first chip and a second plurality of optical couplers. The second plurality of optical couplers are disposed at the second edge adjacent to the first plurality of optical couplers.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 3, 2024
    Inventors: Arpan Dasgupta, Yusheng Bian, John M. Safran, Norman Robson
  • Patent number: 12092868
    Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a first waveguide core in the first chip region, a second chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary, the first waveguide core includes a first tapered section and the second waveguide core includes a second tapered section adjacent to the first tapered section. The first tapered section has a first longitudinal axis aligned substantially parallel to the boundary, and the second tapered section has a second longitudinal axis aligned substantially parallel to the boundary.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: September 17, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Publication number: 20240288631
    Abstract: Structures for a waveguide escalator and methods of forming such structures. A structure comprises a first waveguide core, and a back-end-of-line stack including a first dielectric layer, a second dielectric layer on the first dielectric layer, an opening in the second dielectric layer, a second waveguide core including a section that overlaps with a section of the first waveguide core, and a plurality of third waveguide cores disposed between the section of the first waveguide core and the section of the second waveguide core. The plurality of third waveguide cores are positioned inside the opening in the second dielectric layer, the first dielectric layer comprises a first material with a first refractive index, and the second dielectric layer comprises a second material with a second refractive index different from the first refractive index.
    Type: Application
    Filed: February 28, 2023
    Publication date: August 29, 2024
    Inventors: Yusheng Bian, Kevin Dezfulian, Kenneth Giewont, Karen Nummy
  • Publication number: 20240272359
    Abstract: Structures for an optical power splitter and methods of forming a structure for an optical power splitter. The structure comprises a spiral waveguide core having an outer perimeter. The structure further comprises a plurality of waveguide cores. Each waveguide core has a section disposed adjacent to the outer perimeter of the spiral waveguide core.
    Type: Application
    Filed: February 14, 2023
    Publication date: August 15, 2024
    Inventors: Yusheng Bian, Roderick Alan Augur