Abstract: A transmission line assembly is configured such that (i) a first target inner layer is one of second to (N?1)-th pattern layers selected therefrom, and (ii) a second target inner layer is another one of the second to (N?1)-th pattern layers selected therefrom; the second to (N?1)-th pattern layers except for the first and second target inner layers are referred to as inner layers. The transmission line assembly includes band-like first and second slits formed through the ground pattern of a corresponding one of the first and second target inner layers to expose a part of one of dielectric layers; the one of the dielectric layers is adjacent to the corresponding one of the first and second target inner layers. Each of the first and second slits has an edge facing the interlayer line, and the edge of each of the first and second slits is concavely curved toward the interlayer line.

Abstract: According to one embodiment, an anomaly detection apparatus includes a processing circuit. The processing circuit is configured to: acquire measured values from sensors installed in a system, a first function, a first threshold, and a second function to output a second threshold; generate the predicted values based on the measured value and the first function; detect that a deviation between the measured values and the predicted values exceeds the first threshold; calculate the feature quantities based on the measured values; and determine whether a number of consecutive times is equal to or larger than the second threshold to detect an anomaly or a sign of the anomaly.

Abstract: A plasma processing method includes supplying a voltage to an electrode provided in an electrostatic chuck, thereby adsorbing a substrate onto an upper surface of the electrostatic chuck; after the voltage supplied to the electrode of the electrostatic chuck is stabilized, cutting off the supply of the voltage to the electrode, thereby bringing the electrode into a floating state; and after the voltage supplied to the electrode of the electrostatic chuck is stabilized, performing a predetermined processing with plasma on a surface of the substrate adsorbed onto the electrostatic chuck.

Abstract: A projection-type display apparatus includes a liquid crystal panel including a panel pixel, an optical path shifting element that shifts a projected pixel projected from the panel pixel, and a display control circuit that controls the liquid crystal panel and the optical path shifting element. The display control circuit supplies, to the liquid crystal panel, the same data signal and controls the projected pixel to be at a same position in a unit period f1-1 and a unit period f2-1 period, and controls the optical path shifting element to cause the position of the projected pixel in each of a unit period f1-2 to a unit period f1-4, to be different from the position of the projected pixel in a respective one of a unit period f2-2 to a unit period f2-4.

Abstract: A projection-type display apparatus includes a liquid crystal panel including a panel pixel, an optical path shifting element that shifts a projected pixel projected from the panel pixel, and a display control circuit that controls the liquid crystal panel and the optical path shifting element. The display control circuit supplies, to the liquid crystal panel, the same data signal and controls the projected pixel to be at a same position in each of a unit period f1-1 and a unit period f2-1, and controls the optical path shifting element to cause a shift direction from the projected pixel before the shift toward the projected pixel after the shift from a unit period f1-2 to a unit period f1-4 to be opposite to the shift direction from the projected pixel before the shift toward the projected pixel after the shift from a unit period f2-2 to a unit period f2-4.

Abstract: A radar apparatus includes an antenna unit, a cover portion, and a radio-wave suppression portion. The antenna unit includes an antenna surface in which one or more antennas that radiate radio waves are provided and is configured to emit a target radio wave of a predetermined frequency band. The cover portion is configured to be provided in a position through which the target radio wave passes. The radio-wave suppression portion is integrated with the cover portion in an out-of-detection-range area, of an outer surface of the cover portion, that is an area outside a range of a detection angle of the antenna portion, and includes a conductive portion that has conductivity and a non-conductive portion that does not have conductivity.

Abstract: A connector includes a housing having a first connection portion and a second connection portion adjacent to the first connection portion, a first cap and a second cap pivotally supported by the housing respectively to be displaceable between an open position where the first and second connection portions are exposed to outside and a closed position where the first and second connection portions are shielded from the outside, a first lock and a second lock rotatably supported by the housing to lock the first cap and the second cap respectively, and a power transmission member rotatably supported by the housing. The power transmission member is configured to transmit a rotational force in a lock releasing direction of the second lock to the first lock such that the first cap and the second cap are integrally displaced to the open position.

Abstract: A connector includes a housing having a first connection portion and a second connection portion adjacent to the first connection portion, a first cap and a second cap pivotally supported by the housing respectively to be displaceable between an open position where the first and second connection portions are exposed to outside and a closed position where the first and second connection portions are shielded from the outside, a first lock and a second lock rotatably supported by the housing configured to lock the first cap and the second cap respectively. The second lock has a power transmission portion configured to transmit a rotational force in a lock releasing direction of the second lock to the first lock such that the first cap and the second cap are integrally displaced to the open position.

Abstract: A method of manufacturing a light-emitting device includes: providing a structure body including: a first substrate having a first surface and a second surface opposite to the first surface, the first surface including first regions and second regions; first light-emitting element portions respectively located on the first regions; and second light-emitting element portions respectively located on the second regions; fixing the first light-emitting element portions to a second substrate without fixing the second light-emitting element portions to the second substrate; subsequently, transferring the first light-emitting element portions from the first substrate to the second substrate by removing, from the second surface, portions of the first substrate overlapping the first regions when viewed from the second surface; and subsequently, separating the first light-emitting element portions from the second substrate in a state in which the second light-emitting element portions are located on the second regions.

Abstract: A plasma processing apparatus includes an electrostatic chuck that adsorbs a substrate, a relay circuit that turns ON and OFF the supply of voltage to the electrostatic electrode, a plasma generator, and a controller. The controller (a) controls the DC power supply to supply the voltage to the electrostatic electrode, thereby adsorbing the substrate to the electrostatic chuck, (b) controls the relay circuit to turn OFF the supply of the voltage to the electrostatic electrode, thereby bringing the electrostatic electrode into a floating state, (c) controls the plasma generator to start a plasma processing of the substrate, (d) controls the relay circuit to turn ON the supply of the voltage to the electrostatic electrode, thereby acquiring current flowing through the power supply line, and (e) determines an adsorbed state of the substrate based on the current.

Abstract: A substrate processing method is provided. The method includes a) causing a substrate to be attracted to an electrostatic chuck, and b) processing the substrate. The method includes c) determining a charge removal temperature based on information preliminarily stored in a storage, thereby adjusting a surface temperature of the electrostatic chuck to be greater than or equal to the determined charge removal temperature, the information indicating a relationship between a maximum surface temperature of the electrostatic chuck, during substrate processing, and a residual charge amount for the processed substrate. The method includes d) removing a charge from the processed substrate.

Abstract: Provided is a cleaning method in a plasma processing apparatus for substrates. This cleaning method comprises: (a) forming a plasma in a chamber of the plasma processing apparatus while a substrate is not being held in place by an electrostatic chuck in the chamber; and (b) supplying voltage to the electrostatic chuck to reduce the charge on the surface of the electrostatic chuck while plasma is being formed in (a).

Abstract: A light emitting device includes: a semiconductor structure including: a first semiconductor layer including: a first side parallel to an m-plane of the first semiconductor layer, and a second side meeting the first side, the second side being parallel to an a-plane of the first semiconductor layer, a light emitting layer disposed on a portion of the first semiconductor layer, and a second semiconductor layer disposed on the light emitting layer; a first conductive member disposed on the first semiconductor layer; a second conductive member disposed on the second semiconductor layer; a first terminal disposed on the first conductive member; a second terminal disposed on the second conductive member; and a covering member covering a lateral surface of the first conductive member, a lateral surface of the second conductive member, a lateral surface of the first terminal, and a lateral surface of the second terminal.

Abstract: According to one embodiment, an analysis system includes a detector, a first determiner, a second determiner, and an output part. The detector detects a worker in an image of a work site, and calculates a position of the worker. The first determiner refers to layout data related to a layout of a plurality of work areas in the work site and determines a movement path of the worker in the layout based on the calculated position. The second determiner determines a work intensity of the worker from biological data of the worker. The output part outputs an analysis result of the layout, the movement path between the plurality of work areas, a movement frequency of the movement path, and the work intensity of the movement path.

Abstract: An apparatus for plasma processing is configured to generate plasma in a chamber and periodically apply a pulsed negative DC voltage to an upper electrode from a DC power supply in the plasma processing on a substrate and in plasma cleaning. A duty ratio of the pulsed negative DC voltage used for the plasma processing is smaller than a duty ratio of the pulsed negative DC voltage used for the plasma cleaning. An absolute value of an average value of an output voltage of the DC power supply used for the plasma processing is smaller than an absolute value of an average value of the output voltage of the DC power supply used for the plasma cleaning.

Abstract: According to one embodiment, a calculation system includes a detector, a combiner, and a duration calculator. The detector refers to a plurality of images of an object imaged from mutually-different angles, detects the object in each of the images, and calculates a provisional position of the object in a coordinate system for each of the images. The coordinate system is prescribed. The combiner calculates a combined position of the object in the coordinate system by using the calculated plurality of provisional positions. The duration calculator refers to process information and a plurality of execution regions and calculates a duration of at least a portion of a plurality of processes based on the combined position and the execution regions. The process information includes information relating to the processes. The execution regions are represented using the coordinate system. The processes are executed in the execution regions.

Abstract: A light emitting element comprises: a semiconductor layered body including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer; and a dielectric member being in contact with the first semiconductor layer. The first semiconductor layer refractive index with respect to a wavelength of light differs from the light emitting layer refractive index with respect to the wavelength of light. The dielectric member comprises a first dielectric portion and a second dielectric portion. In a second direction that is perpendicular to a first direction that extends from the second semiconductor layer to the first semiconductor layer, a first portion of the first semiconductor layer is positioned between the first dielectric portion and the second dielectric portion. The first dielectric portion comprises the first surface and the second surface.

Abstract: According to one embodiment, a progress determination system includes a first acquisition part and a second acquisition part. The first acquisition part acquires area data relating to area values of a plurality of colors from an image of an article, the article relating to a task. The second acquisition part acquires a classification result from a classifier by inputting the area data to the classifier. The classification result indicates a progress amount.

Abstract: There is provided a plasma processing apparatus comprising: a chamber where a substrate is disposed and processed by plasma generated therein; a substrate attraction portion disposed in the chamber, having therein an electrode, and configured to attract the substrate by a voltage applied to the electrode; a conductive member disposed in the chamber; and a voltage supply configured to apply a voltage to the electrode. A reference potential terminal of the voltage supply is connected to the conductive member, and the voltage supply applies a voltage having as a reference potential a potential of the conductive member to the electrode.

Abstract: A plasma processing method includes supplying a voltage to an electrode provided in an electrostatic chuck, thereby adsorbing a substrate onto an upper surface of the electrostatic chuck; after the voltage supplied to the electrode of the electrostatic chuck is stabilized, cutting off the supply of the voltage to the electrode, thereby bringing the electrode into a floating state; and after the voltage supplied to the electrode of the electrostatic chuck is stabilized, performing a predetermined processing with plasma on a surface of the substrate adsorbed onto the electrostatic chuck.