Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

Abstract: The moving object tracking apparatus emphasizes an image with specific size in each of fluoroscopic images derived from two or more paired fluoroscopic radiographic devices, obtains a value indicating certainty degree of detecting a candidate position of the object to be tracked on the image subjected to the emphasizing process, extracts the candidate position based on the value indicating the certainty degree of detection, calculates a value indicating a correlation between the candidate position extracted from images picked up from two or more directions, and a position of the fluoroscopic radiation generator, detects the position of the object to be tracked based on the value indicating the certainty degree of detection, and the value indicating the correlation, and controls irradiation of radiation to an irradiation target based on the detected position of the object to be tracked.

Abstract: A phase difference film composed of a resin containing a copolymer including polymerization units A and B, the phase difference film including a cylindrical phase separation structure that generates a structural birefringence, the phase separation structure including a phase (A) having the polymerization unit A as a main component and a phase (B) having the polymerization unit B as a main component, and the phase difference film satisfying the following condition (1) or (2). Condition (1): D(A)>D(B) and f(B)>0.5, and a direction giving a maximum refractive index among in-plane directions and an orientation direction of a cylinder in the phase separation structure are parallel to each other. Condition (2): D(A)>D(B) and f(A)>0.5, and a direction giving a maximum refractive index among in-plane directions and an orientation direction of a cylinder in the phase separation structure are orthogonal to each other.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

Abstract: An ink jet liquid composition contains an organic solvent, a polymerizable compound, a photopolymerization initiator, and a polyether-modified siloxane compound having a weight-average molecular weight of 3,000 or more, and the content of the organic solvent is 40% by mass or more and 90% by mass or less with respect to the total mass of the composition. In addition, an ink jet recording method using the ink jet liquid composition is provided.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

Abstract: When performing dephosphorization treatment of hot metal by adding a refining agent as a lime source and an oxygen source (dephosphorizing agent(s) and a gaseous oxygen source into the hot metal accommodated in a hot metal holding container, the refining agent used is a refining agent having an Ig-loss value of from 4.0% by mass to 35.0% by mass and including 60% by mass or more of quicklime.

Abstract: To provide dummy openings having at least one of arrangement and shape determined depending on the shape of a non-effective region.

Abstract: Provided are a pretreatment liquid for recording an image on an impermeable base material with an aqueous ink, the pretreatment liquid including an aqueous medium, a resin a having a glass transition temperature of lower than 25° C., and particles of a resin b having a glass transition temperature of 25° C. or higher; an ink set; a base material for image recording; an image recorded material; a method of producing a base material for image recording; and an image recording method.

Abstract: Provided are an ink set which is used for recording an image on a surface having a surface energy of 40 mN/m or greater and included in an impermeable base material, the ink set including an ink containing water, a colorant, and resin particles, and a pretreatment liquid containing water and resin particles, in which the resin particles contained in the pretreatment liquid include at least one of a mixture of acrylic resin particles and polyester resin particles or composite particles including an acrylic resin and a polyester resin, and the resin particles contained in the ink include at least one of acrylic resin particles or polyurethane resin particles; an image recording method; a method of producing a laminate; an image recorded material; and a laminate.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

Abstract: A vehicular power source device includes: a case incorporating a battery; a service plug coupled to the battery incorporated in the case; and a protection cover of the service plug. The protection cover includes: a covering portion of the service plug; a fixing board fixed to the case via a fastener; and an opening board disposed to be adjacent to the fixing board and providing a gap to the case. In addition, the fixing board includes: a fixing portion fixed onto the case via the fastener; a linking portion linking the fixing portion to the covering portion; and a breaking portion. The breaking portion is provided in the fixing portion or in a boundary portion between the fixing portion and the linking portion, and a breaking strength of the breaking portion is lower than that of the linking portion.

Abstract: An object to provide a press-forming method that can efficiently suppress springback and easily specify a position where a springback reduction effect by rigidity improvement is large, and the press-forming method used in producing a press-formed product having a predetermined shape by press-forming a sheet material, the method including: a first process that repeatedly performs a springback analysis, while changing a position to be restricted, to specify a position where a springback reduction effect by rigidity improvement is large; a second process that performs a rigidity improvement measure on a position of the sheet material corresponding to the position of the formed-product model specified in the first process; and a third process that produces the press-formed product by press-forming the sheet material on which the rigidity improvement measure has been performed.

Abstract: A function/process of recording marker position data and spot data is provided. The marker position data includes position information of a marker 29 measured for tumor tracking irradiation and information on time of execution of X-ray imaging. The spot data includes information on time of irradiation of each spot, a delivered irradiation position, and a delivered irradiation amount. The marker position data and the spot data are synchronized based on the time information, and by using the marker position data and the spot data upon spot irradiation, a delivered dose distribution of proton irradiation is calculated. With this configuration, it is possible to take the influence of interplay effect into consideration, and it is possible to support to make more appropriate determination upon replanning of a treatment plan.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

Abstract: The present invention relates to a therapeutic substance delivery device for delivering a therapeutic substance to a desired site in a bodily duct, characterized in that the therapeutic substance delivery device is provided with: a therapeutic substance loading portion; a connector which is connected to the therapeutic substance loading portion; and a supplying/discharging pipe connected to the connector; and in that the therapeutic substance loading portion includes a main body portion in which a recessed portion is formed, a resilient film, and a connecting pipe; the connector is provided with a joint main body, a flange portion fixed to the other end portion side of the joint main body, and a fixing nut through which the joint main body passes; the joint main body is provided with a tube fastening portion; and at least part of the inner wall of the fixing nut is provided with a thread.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

Abstract: Provided are a method of producing a recording medium, including a step of preparing a liquid A which includes at least one kind of aggregating agent selected from the group consisting of an acid, a polyvalent metal compound, and a metal complex, and water, a step of preparing a liquid B which includes a resin and water, a step of mixing the liquid A with the liquid B at an ambient temperature of 5° C. to 40° C. to obtain a mixed solution, a step of storing the mixed solution at an ambient temperature of 5° C. to 40° C., and a step of applying the mixed solution after the storage onto an impermeable base material within 30 days from the start of mixing the liquid A with the liquid B to obtain a recording medium; and an image recording method.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing out air to push up each device chip and picking up each device chip from the polyester sheet.