Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

Abstract: A lighting device includes a first light source to emit first light; a diffuser to receive the first light and emits first scattered light; and a frame to support the first light source and the diffuser. The the diffuser includes nanoparticles, and guides the received first light, scatters it with the nanoparticles, and emits it as the first scattered light. The diffuser includes an incident surface to receive the first light, a first surface on which an emission surface to emit the first scattered light is formed, and a second surface opposite the first surface. The incident surface is at a first edge portion of the diffuser, the frame is opened to expose at least a portion of a region on the first surface of the diffuser in which the emission surface is formed and a region on the second surface corresponding thereto.

Abstract: The diffusive body lets first light enter and emits scattered light, wherein a scattering layer and a transmission layer, the diffusive body has a light incidence surface that lets the first light enter and a main surface where a first light emission surface emitting the scattered light is formed, the light incidence surface is formed at an end face forming a first end part of the main surface, the diffusive body functions as a light guide path that makes the entered first light move to and fro between the scattering layer and the transmission layer, the scattering layer includes an optical medium on a nanometer order and generates the scattered light by having the first light scattered by the optical medium on the nanometer order, and a correlated color temperature of the scattered light is higher than the correlated color temperature of the first light.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

Abstract: An image recording method includes determining whether a surface energy of a base material is less than 50 mN/m or greater than 50 mN/m; deciding a condition for drying a pretreatment liquid containing water and an aggregating agent as a condition A in which the mass ratio of the mass of the pretreatment liquid after being dried to the mass of the pretreatment liquid before being dried is 30% or greater and deciding a condition for drying the pretreatment liquid as a condition B in which the mass ratio thereof is less than 50% in a case where the surface energy is determined to be less than 50 mN/m and 50 mN/m or greater, respectively; applying the pretreatment liquid to the base material; drying the applied pretreatment liquid under the drying condition decided; and applying an ink containing water and a colorant to at least a part of the base material.

Abstract: An automotive-structural-part joint structure is formed by bending one metal sheet, includes a groove portion including a top portion and a pair of side wall portions, is provided at an end part of one automotive structural part in a longitudinal direction, and is configured to join the one automotive structural part to another automotive structural part in an intersecting direction. The automotive-structural-part joint structure includes: a pair of vertical rib portions configured to stand upward from both side ends of the top portion; and an outward-directed flange portion configured to extend outward from three side edges of the groove portion on an end part side where the other automotive structural part is joined, the flange portion being continuously formed along the three side edges.

Abstract: The battery module includes: battery stack including a plurality of batteries that are stacked, each of the plurality of batteries having valve portion; duct plate configured to cover a surface of battery stack on which a plurality of valve portions are disposed, duct plate having gas discharge duct that temporarily stores a gas blown off from valve portions of respective batteries; cover plate placed on duct plate; and a flow path portion defined by duct plate and cover plate, the flow path portion extending from gas discharge duct and allowing leaking of the gas in gas discharge duct to an outside of the battery module. Cover plate includes first vertical wall portion at an end portion of cover plate in stacking direction of batteries, first vertical wall portion extending in a second direction along which cover plate and duct plate are arranged and overlapping with duct plate as viewed in stacking direction of batteries.

Abstract: A top-blowing lance nozzle is configured to freely switch an adequate expansion condition so as to control an oxygen-blowing amount and a jetting velocity independently of each other without requiring a plurality of lance nozzles or a mechanically movable part. A lance nozzle is configured to blow refining oxygen to molten iron charged in a reaction vessel while a gas is blown from a top-blowing lance to the molten iron. One or more blowing holes for blowing a working gas are on an inner wall side surface of the nozzle, at a site where the lance nozzle has a minimum cross-sectional area in a nozzle axis direction or at a neighboring site of the site.

Abstract: The battery module includes: battery stack including a plurality of batteries that are stacked, each of the plurality of batteries having valve portion; duct plate configured to cover a surface of battery stack on which the plurality of valve portions are disposed, duct plate having gas discharge duct that is connected to valve portions of respective batteries, and temporarily stores a blown-off gas; cover plate placed on duct plate; and flow path portion defined by duct plate and cover plate, flow path portion extending from gas discharge duct and allowing leaking of a gas in gas discharge duct to an outside of battery module. Cover plate is disposed in a state where a predetermined gap is formed between cover plate and first wall portion of gas discharge duct that faces valve portions, and opening that allows an inside of gas discharge duct and the gap to communicate with each other is formed in first wall portion of gas discharge duct.

Abstract: Provided is an image recording method including applying a pretreatment liquid containing water and a resin X and an ink containing water and a colorant onto a resin base material A which has a specific distortion rate and to which a tension is applied, to obtain an image, heating the image to a temperature Td and drying the image, and cooling the image to a temperature Tr, in which ?total calculated by Equation (1) is 40 kgf/cm2 or less. E(Td) represents an elastic modulus of the resin X at the temperature Td, ?(Td) represents an expansion coefficient of the resin base material A under specific conditions, E(T) represents an elastic modulus of the resin X at a temperature T of the image in the cooling, ?r(T) represents a linear expansion coefficient of the resin X at the temperature T, and ?s(T) represents a linear expansion coefficient of the resin base material A under specific conditions.

Abstract: Provided is an image recording method including applying an ink containing water, a resin X, and a colorant onto a resin base material A which has a specific distortion rate and to which a tension is applied, to obtain an image, heating the image to a temperature Td and drying the image, and cooling the image to a temperature Tr, in which ?total calculated by Equation (1) is 40 kgf/cm2 or less. E(Td) represents an elastic modulus of the resin X at the temperature Td, ?(Td) represents an expansion coefficient of the resin base material A under specific conditions, E(T) represents an elastic modulus of the resin X at a temperature T of the image in the cooling, ?r(T) represents a linear expansion coefficient of the resin X at the temperature T, and ?s(T) represents a linear expansion coefficient of the resin base material A under specific conditions.

Abstract: Battery module includes: battery stack including a plurality of batteries that are stacked, each of the plurality of batteries having valve portion; duct plate configured to cover a first surface of battery stack on which a plurality of valve portions are disposed, duct plate having gas discharge duct that temporarily stores a gas blown off from valve portions of respective batteries; cover plate placed on duct plate; flow path portion defined by duct plate and cover plate, flow path portion being connected to gas discharge duct through opening, flow path portion extending in a first direction that intersects with stacking direction of the batteries, flow path portion allowing leaking of the gas in gas discharge duct to an outside of battery module; and gas restricting wall portion disposed in gas discharge duct between valve portion and opening.

Abstract: The battery module includes: battery stack including a plurality of batteries that are stacked, each of the plurality of batteries having valve portion; duct plate configured to cover a surface of battery stack on which the plurality of valve portions are disposed, duct plate having gas discharge duct that is connected to valve portions of the respective batteries, and temporarily stores a blown-off gas; cover plate placed on duct plate; and flow path portion defined by duct plate and cover plate, flow path portion extending from gas discharge duct in a first direction that intersects with stacking direction and allowing leaking of the gas in gas discharge duct to an outside of battery module. Cover plate has opening through which a midst portion of flow path portion is communicable with the outside of the battery module.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

Abstract: A lighting unit includes a first light source to emit first light; and a diffusive body including a first incidence surface that allows the first light to enter, a diffusive part that includes nanoparticles, guides the entered first light and makes the first light be scattered by the nanoparticles into first scattered light, and an emission surface that emits the first scattered light, wherein the first incidence surface is formed on a first edge part of the diffusive body, the first scattered light is emitted from a first region of the emission surface, and a correlated color temperature of the first scattered light is higher than a correlated color temperature of the first light.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.

Abstract: Provided are: a pretreatment liquid for an impermeable base material, including an aggregating agent (A) which contains at least one selected from the group consisting of an organic acid and a polyvalent metal salt, a nitrogen-containing compound (B) which contains at least one selected from the group consisting of ammonia, an amine, and a heterocyclic compound containing a basic nitrogen atom, and resin particles (C), and water; an ink set; an image recording method; an image recorded material; and a recording medium and a method of producing the same.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyolefin sheet, then picking up each device chip from the polyolefin sheet.