Abstract: There are provided an evaluation method and a prediction method for a technology to be reflected in a press die designing method. A deformation limit evaluation method includes evaluating the deformation limit on a sheared surface of a metal sheet in press-forming the sheared metal sheet. The deformation limit is evaluated and a crack in the sheared surface is predicted based on the relationship between an index value determined from two surface strain distribution gradients of a surface strain distribution gradient in a sheet thickness direction in the sheared surface and a surface strain distribution gradient in a bending ridge line direction by bending in a direction away from the sheared surface at an evaluation position among distributions of strains generated near the boundary between a bending outside surface and the sheared surface of the metal sheet to be bent and a tension generated in the sheared surface.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

Abstract: An article processing apparatus includes: a configuration determination unit configured to determine a configuration of at least one transport unit including articles, and stacked article groups each including a pallet, and at least one of the articles placed on the pallet, wherein the at least one of the articles is placed on the pallet in a manner that allows a pallet of another article group to be placed thereon, excluding uppermost one of the stacked article groups; a palletizing mechanism configured to place the at least one of the articles on the pallet so as to form each of the article groups included in the transport unit whose configuration is determined by the configuration determination unit; and a stacking mechanism configured to stack the article groups formed by the palletizing mechanism so as to form the transport unit determined by the configuration determination unit.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

Abstract: To prevent a crack from occurring on a sheared end face due to press forming, a technology is provided for evaluating and predicting a crack limit of the sheared end face of a metal sheet and determining press forming conditions. In a deformation limit evaluation method for, when deforming by press forming a metal sheet subjected to shearing, evaluating a deformation limit of the sheared end face of the metal sheet, the deformation limit is evaluated by an index value obtained from two stress gradients at an evaluation position among stress distributions occurring in the vicinity of the sheared end face of the metal sheet due to the press forming, which gradients are a stress gradient in a sheet thickness direction and a stress gradient in a direction away from the sheared end face.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of cooling the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

Abstract: An article processing apparatus includes: a configuration determination unit configured to determine a configuration of at least one transport unit including articles, and stacked article groups each including a pallet, and at least one of the articles placed on the pallet, wherein the at least one of the articles is placed on the pallet in a manner that allows a pallet of another article group to be placed thereon, excluding uppermost one of the stacked article groups; a palletizing mechanism configured to place the at least one of the articles on the pallet so as to form each of the article groups included in the transport unit whose configuration is determined by the configuration determination unit; and a stacking mechanism configured to stack the article groups formed by the palletizing mechanism so as to form the transport unit determined by the configuration determination unit.

Abstract: Provided are an image forming method including a step of preparing an ink which contains water and an organic solvent A having a vapor pressure of 0.20 kPa or less at 20° C. and in which a content of the organic solvent A is 10% by mass or greater, a step of preparing an aggregating liquid containing an aggregating agent, a step of preparing an overcoat liquid which contains a resin and an organic solvent B having a vapor pressure of 2.50 kPa or greater at 20° C. and in which a content of the organic solvent B is 10% by mass or greater, a step of applying the aggregating liquid onto an impermeable base material, a step of applying the ink to at least a portion of a region to which the aggregating liquid has been applied according to an ink jet method to form an image, and a step of applying the overcoat liquid onto the region to which the aggregating liquid has been applied in the impermeable base material, on which the image has been formed; and an ink set.

Abstract: A control system for a work machine includes a plurality of hydraulic pumps that discharge hydraulic oil, a hydraulic cylinder that moves a working equipment element, a plurality of flow rate control valves that are respectively connected to the hydraulic pumps and adjust a flow rate of the hydraulic oil supplied to the hydraulic cylinder, a plurality of supply flow paths respectively connected to the of flow rate control valves, a meter-in flow path that connects a collective part of the supply flow paths and an inlet of the hydraulic oil in the hydraulic cylinder, a plurality of discharge flow paths respectively connected to the flow rate control valves, a meter-out flow path that connects a collective part of the discharge flow paths and an outlet of the hydraulic oil in the hydraulic cylinder, and a throttle disposed in the meter-out flow path.

Abstract: The diffusive body lets first light enter and emits scattered light, wherein a scattering layer and a transmission layer, the diffusive body has a light incidence surface that lets the first light enter and a main surface where a first light emission surface emitting the scattered light is formed, the light incidence surface is formed at an end face forming a first end part of the main surface, the diffusive body functions as a light guide path that makes the entered first light move to and fro between the scattering layer and the transmission layer, the scattering layer includes an optical medium on a nanometer order and generates the scattered light by having the first light scattered by the optical medium on the nanometer order, and a correlated color temperature of the scattered light is higher than the correlated color temperature of the first light.

Abstract: When performing dephosphorization treatment of hot metal by adding a refining agent as a lime source and an oxygen source (dephosphorizing agent(s) and a gaseous oxygen source into the hot metal accommodated in a hot metal holding container, the refining agent used is a refining agent having an Ig-loss value of from 4.0% by mass to 35.0% by mass and including 60% by mass or more of quicklime.

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

Abstract: To enable an appropriate and quick detection of a change in an internal structure of a patient, a computer program causes a computer to detect a change in an internal structure of a patient. The process includes calculating a second water equivalent thickness obtained from a second three-dimensional image being a three-dimensional image of a patient, which is newly obtained; a process of calculating a change of a first water equivalent thickness from the second water equivalent thickness, the first water equivalent thickness being obtained from a first three-dimensional image being a three-dimensional image of the patient in treatment planning; and a process of calculating a dose volume histogram change for calculating a change in a dose volume histogram from the treatment plan, based on the calculated water equivalent thickness change and correlation information indicating a correlation between a water equivalent thickness change value and dose distribution information.

Abstract: A work machine control system includes: a pump; a cylinder operating a working equipment element in a movable range based on hydraulic oil supplied from the pump; a first path connected to the pump; a second path branching from the first path; a control valve adjusting the flow rate of the oil supplied to the cylinder via the first path; a bleed valve adjusting the flow rate of the oil discharged to a tank via the second path; a sensor detecting a posture of the element in the range; and a control device outputting a first command for adjusting the flow rate of the oil supplied to the cylinder and a second command for adjusting the flow rate of the oil discharged to the tank when element is determined to be present in an end section of the range based on detection data of the sensor.

Abstract: The secondary battery disclosed herein includes: a battery case; an electrode body accommodated in the battery case; a resin-cured product with which a space between the electrode body and a bottom of the battery case is filled and which is cured; an electrolyte accommodated in the battery case. A thermal conductivity of the resin-cured product is 0.2 W/(m·K) or more.

Abstract: The system includes a bed on which an irradiation target is mounted, an irradiation device that irradiates the irradiation target with a particle beam, and a magnetic resonance imaging apparatus that captures an image of an irradiation object and includes a magnet that generates a static magnetic field in an image capturing space in which the irradiation target is disposed, and a yoke disposed outside the image capturing space and through which a magnetic flux of the generated magnetic field passes. The irradiation device 21 is disposed on a back surface side of the yoke when viewed from the image capturing space, and irradiates the irradiation target with the particle beam from a through-hole or gap provided in the yoke. A direction in which the particle beam enters the image capturing space intersects with a direction of a static magnetic field applied to the image capturing space by the magnet.

Abstract: A laminate battery module has a plurality of laminate batteries, and a thermal expansion member. Each laminate battery has an exterior body, and an electrode body accommodated in the exterior body. The exterior body has a wide surface, and a sealing portion. The plurality of laminate batteries are arrayed sequentially so that the wide surfaces oppose each other, with an outgassing region being set in a pre-determined part of the periphery of the wide surfaces. The thermal expansion member is interposed between the wide surfaces of the plurality of laminate batteries, and protrudes in a region excluding the outgassing region. A portion of the thermal expansion member protruding in a region excluding the outgassing region expands when a pre-determined temperature is exceeded, and fills a region of the periphery of the laminate batteries, excluding the outgassing region.

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyolefin sheet side to push up each device chip through the polyolefin sheet and picking up each device chip from the polyolefin sheet.

Abstract: A sensor element includes element main body including side surfaces, a detection unit, connector electrodes disposed on the rear end-side part of the side surfaces, a porous layer that covers at least front end-side part of the side surface, the porous layer having a porosity of 10% or more, and a water-penetration reduction portion. The water-penetration reduction portion is disposed on the side surface so as to divide the porous layer or to be located closer to the rear end than the porous layer. The length L of the water-penetration reduction portion is 0.5 mm or more. The water-penetration reduction portion includes, among a dense layer covering the side surface and having a porosity of less than 10% and a gap region in which the porous layer is absent, at least the dense layer. The water-penetration reduction portion reduces the capillarity of water.