Patents by Inventor Yusuke Inoue
Yusuke Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100213000Abstract: A vehicular muffler is configured and arranged to smoothly introduce exhaust gas into a sound-absorbing material disposed inside of an outer case which has a plurality of relatively short inner sleeves therein. The muffler includes a porous plate which is disposed inside of the outer case, and which is connected to an exhaust pipe, and the porous plate is operatively connected to an outlet pipe which discharges an exhaust gas to the outside environment through an opening formed in an outlet side of the outer case. In one embodiment, the inner sleeves are arranged substantially parallel to each other, and are fluidly connected to a joint exhaust feed pipe disposed inside the outer case. The inner sleeves are connected to the outlet pipe on the outlet side of the outer case.Type: ApplicationFiled: February 18, 2010Publication date: August 26, 2010Applicant: HONDA MOTOR CO., LTD.Inventor: Yusuke INOUE
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Publication number: 20100207416Abstract: A seat structure for a vehicle, such as a motorcycle, includes a seat arranged rearwardly of a fuel tank mounted on a vehicle body frame. The seat includes a cushion member, and a bottom plate for holding the cushion member. The cushion member is made of an elastic material. The bottom plate is fixed to the vehicle body frame and to the fuel tank. The cushion member includes a bulging portion which bulges forwardly from a front end portion of the bottom plate and onto an upper surface of a stepped portion of the fuel tank. The bulging portion is supported on the upper surface of the fuel tank.Type: ApplicationFiled: February 5, 2010Publication date: August 19, 2010Applicant: HONDA MOTOR CO., LTD.Inventor: Yusuke Inoue
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Publication number: 20100186849Abstract: A reliably operable sealing and pump-up device with simple jig installation and in which the jig does not come out even when subjected to pressure. The sealing and pump-up device 10 includes: a liquid agent container 18 containing a sealing agent 32; an injection unit 20 that is connected to an outlet 29 of the liquid agent container 18 and has a liquid pressurization and supply chamber 40 and a jig insertion hole 44; a jig 82 that by insertion into the jig insertion hole 44 pierces an aluminum seal 30 by means of a piercing member 62 and closes off the jig insertion hole 44; and a leading end portion 85, of an insertion portion 84, having a step 85A that catches on an edge 44B of a jig insertion hole 44 before the jig 82 that has been inserted into the jig insertion hole 44 reaches a piercing position, when the aluminum seal 30 is pierced. The jig 82 has simple installation and can be reliably operated because the jig 82 does not come out even when subjected to pressure.Type: ApplicationFiled: June 9, 2008Publication date: July 29, 2010Applicant: BRIDGESTONE CORPORATIONInventors: Masaki Yoshida, Yuji Takeda, Ryuji Izumoto, Yusuke Inoue, Takahiko Kojima
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Publication number: 20100189575Abstract: When a press jig is inserted into a jig insertion hole, an O-ring attached to the outer peripheral surface of the press jig is prevented from being caught on an air supply port opening to the inner peripheral surface of the jig insertion hole and damaged. In a sealing pump-up device 10, the opening diameter of an air supply port 58 opening to the inner peripheral surface of a jig insertion hole 44 provided at one end of an air supply path 60 is set smaller than the strand diameters of an O-ring 72 and an O-ring 96. Consequently, the width at the edge of the air supply ports 58 on which the O-rings 72, 96 may possibly be caught can be made sufficiently smaller than the strand diameter of the O-rings 72, 96.Type: ApplicationFiled: June 13, 2007Publication date: July 29, 2010Applicant: BRIDGESTONE CORPORATIONInventors: Masaki Yoshida, Yusuke Inoue, Yuji Takeda
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Patent number: 7750740Abstract: There are included a Wilkinson divider/combiner dividing an input signal, amplifying elements amplifying outputs of the Wilkinson divider/combiner, and a Wilkinson divider/combiner combining outputs of respective amplifying elements. A variable capacitor element is connected to a branch point of a signal transmission path in the Wilkinson divider/combiner. A capacitance value of the variable capacitor element is controlled in correspondence with a frequency of an input signal, whereby a matching frequency is corrected to increase an operating frequency band.Type: GrantFiled: August 20, 2008Date of Patent: July 6, 2010Assignee: Fujitsu LimitedInventor: Yusuke Inoue
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Publication number: 20090317124Abstract: A method for manufacturing a cleaning device of the image forming apparatus, the method includes: applying a liquid material to an area outer than an edge located at an end portion of a toner accommodating portion in the longitudinal direction of a toner removing member, wherein the liquid material is applied so as to satisfy one of the predetermined conditions.Type: ApplicationFiled: December 17, 2008Publication date: December 24, 2009Inventors: Kazunori Iwamoto, Naoki Koike, Yusuke Inoue
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Patent number: 7588111Abstract: To provide a rear shock absorber arrangement structure for a motorcycle having no limitation on the arrangement flexibility and shape of a storage chamber. In a rear shock absorber arrangement structure for a motorcycle, including a unit swing type power unit U swingably connected to a body frame F and rotatably supporting a rear wheel WR, a rear shock absorber suspends the power unit from the body frame F. A storage chamber is disposed above the rear wheel WR. A lower end of the rear shock absorber is brought into connection at a position lower than the wheel-axle O provided in the power unit U as viewed from the side of the vehicle. An upper end of the rear shock absorber is connected to a portion lower than the storage chamber and near a bottom portion of the storage chamber.Type: GrantFiled: January 30, 2007Date of Patent: September 15, 2009Assignee: Honda Motor Co., Ltd.Inventors: Hideki Hayashi, Susumu Michisaka, Shohei Takiguchi, Yusuke Inoue, Yasuyuki Maeda
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Publication number: 20090192641Abstract: A semiconductor manufacturing method and apparatus is provided that can improve uniformity of processing time of oxidation thickness. When starting a heat oxidation process, a time for optimum oxidation processing in the process management system is calculated based on atmospheric pressure data, a target thickness of that process, oxidization time, thickness data and atmospheric pressure data in the immediately preceding process under the same oxidization processing job. The optimum system comprises a process management system such as a host computer, a device having a barometer, a heat oxidation-processing device and a thickness-measuring device. The host computer, the barometer, the heat oxidation processing device and the thickness-measuring device are connected via a network so as to transmit data to and from each device.Type: ApplicationFiled: September 27, 2007Publication date: July 30, 2009Applicant: SEIKO EPSON CORPORATIONInventors: Akira TADANO, Yusuke INOUE, Isao YOKOYAMA
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Publication number: 20090084596Abstract: An electronic part-incorporated multilayer substrate is provided. The multi-layer substrate includes a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top insulating resin layer formed on a top surface of the core, a wiring layer selectively formed on an outer surface of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in any of the holes. Both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation.Type: ApplicationFiled: August 28, 2008Publication date: April 2, 2009Applicant: TAIYO YUDEN CO., LTD.Inventors: Yusuke INOUE, Eiji MUGIYA, Masashi MIYAZAKI, Tatsuro SAWATARI, Yuichi SUGIYAMA
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Patent number: 7511592Abstract: A switch circuit includes a balanced line connected between one end of an unbalanced line having another end connected to an input terminal and an output terminal and a balanced line connected between the one end of the unbalanced line and an output terminal. On each of the balanced lines, a plurality of quarter-wave transmission lines are connected in cascade, and each of a plurality of FETs, whose impedance is controllable, is connected between one pair of transmission lines constituting a balanced line for each interconnection point between the transmission lines, so that the power of a signal is distributed to both of the pair of transmission lines, and therefore the inputted power becomes half on each balanced line, thereby making it possible to prevent a DC-like current from flowing when the FET is in an off state even if a high frequency signal with high power is inputted.Type: GrantFiled: February 27, 2006Date of Patent: March 31, 2009Assignee: Fujitsu LimitedInventor: Yusuke Inoue
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Publication number: 20080303597Abstract: There are included a Wilkinson divider/combiner dividing an input signal, amplifying elements amplifying outputs of the Wilkinson divider/combiner, and a Wilkinson divider/combiner combining outputs of respective amplifying elements. A variable capacitor element is connected to a branch point of a signal transmission path in the Wilkinson divider/combiner. A capacitance value of the variable capacitor element is controlled in correspondence with a frequency of an input signal, whereby a matching frequency is corrected to increase an operating frequency band.Type: ApplicationFiled: August 20, 2008Publication date: December 11, 2008Applicant: FUJITSU LIMITEDInventor: Yusuke INOUE
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Patent number: 7453329Abstract: In a variable attenuator attenuating a signal inputted to an input terminal from a plurality of transmission lines connected in series between the input terminal and an output terminal and outputting the signal from the output terminal, first and second resistance elements to improve an input/output characteristic are connected in parallel respectively to the transmission line connected to the input terminal and the transmission line connected to the output terminal, so that reflection in input/output is sustained by the first and second resistance elements, to obtain a good input/output characteristic, and so that an impedance in a signal line is increased at a time of maximum attenuation without being suppressed by the first and second resistance elements, to obtain a large attenuation amount.Type: GrantFiled: September 18, 2007Date of Patent: November 18, 2008Assignee: Fujitsu LimitedInventor: Yusuke Inoue
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Publication number: 20080032653Abstract: In a variable attenuator attenuating a signal inputted to an input terminal from a plurality of transmission lines connected in series between the input terminal and an output terminal and outputting the signal from the output terminal, first and second resistance elements to improve an input/output characteristic are connected in parallel respectively to the transmission line connected to the input terminal and the transmission line connected to the output terminal, so that reflection in input/output is sustained by the first and second resistance elements, to obtain a good input/output characteristic, and so that an impedance in a signal line is increased at a time of maximum attenuation without being suppressed by the first and second resistance elements, to obtain a large attenuation amount.Type: ApplicationFiled: September 18, 2007Publication date: February 7, 2008Inventor: Yusuke Inoue
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Patent number: 7280884Abstract: An optimum method for deposition time is provided that can improve uniformity of processing time of oxidation thickness. When starting a heat oxidation process, a time for optimum oxidation processing in the process management system is calculated based on atmospheric pressure data, a target thickness of that process, oxidization time, thickness data and atmospheric pressure data in the immediately preceding process under the same oxidization processing job. The optimum system comprises a process management system such as a host computer, a device having a barometer, a heat oxidation-processing device and a thickness-measuring device. The host computer, the barometer, the heat oxidation processing device and the thickness-measuring device are connected via a network so as to transmit data to and from each device.Type: GrantFiled: February 23, 2004Date of Patent: October 9, 2007Assignee: Seiko Epson CorporationInventors: Akira Tadano, Yusuke Inoue, Isao Yokoyama
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Publication number: 20070175690Abstract: To provide a rear shock absorber arrangement structure for a motorcycle having no limitation on the arrangement flexibility and shape of a storage chamber. In a rear shock absorber arrangement structure for a motorcycle, including a unit swing type power unit U swingably connected to a body frame F and rotatably supporting a rear wheel WR, a rear shock absorber suspends the power unit from the body frame F. A storage chamber is disposed above the rear wheel WR. A lower end of the rear shock absorber is brought into connection at a position lower than the wheel-axle 0 provided in the power unit U as viewed from the side of the vehicle. An upper end of the rear shock absorber is connected to a portion lower than the storage chamber and near a bottom portion of the storage chamber.Type: ApplicationFiled: January 30, 2007Publication date: August 2, 2007Inventors: Hideki Hayashi, Susumu Michisaka, Shohei Takiguchi, Yusuke Inoue, Yasuyuki Maeda
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Publication number: 20070075589Abstract: A switch circuit includes a balanced line connected between one end of an unbalanced line having another end connected to an input terminal and an output terminal and a balanced line connected between the one end of the unbalanced line and an output terminal. On each of the balanced lines, a plurality of quarter-wave transmission lines are connected in cascade, and each of a plurality of FETs, whose impedance is controllable, is connected between one pair of transmission lines constituting a balanced line for each interconnection point between the transmission lines, so that the power of a signal is distributed to both of the pair of transmission lines, and therefore the inputted power becomes half on each-balanced line, thereby making it possible to prevent a DC-like current from flowing when the FET is in an off state even if a high frequency signal with high power is inputted.Type: ApplicationFiled: February 27, 2006Publication date: April 5, 2007Inventor: Yusuke Inoue
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Patent number: 7147541Abstract: The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.Type: GrantFiled: February 23, 2006Date of Patent: December 12, 2006Assignee: Speedfam Co., Ltd.Inventors: Hitoshi Nagayama, Yusuke Inoue
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Patent number: 7137867Abstract: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.Type: GrantFiled: February 23, 2006Date of Patent: November 21, 2006Assignee: Speedfam Co., Ltd.Inventors: Hitoshi Nagayama, Yusuke Inoue
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Publication number: 20060194512Abstract: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.Type: ApplicationFiled: February 23, 2006Publication date: August 31, 2006Applicant: SPEEDFAM Co., Ltd.Inventors: Hitoshi Nagayama, Yusuke Inoue
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Publication number: 20060194511Abstract: The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.Type: ApplicationFiled: February 23, 2006Publication date: August 31, 2006Applicant: SPEEDFAM Co., Ltd.Inventors: Hitoshi Nagayama, Yusuke Inoue