Abstract: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.

Abstract: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures distance from the senor to the upper surface of carrier with holes for the work pieces being inserted respectively. The measured distance is successively monitored and polishing is stopped when the distance has become a predetermined value corresponding to target amount of material removal from the work piece.

Abstract: The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based on the polishing duration time, and the second and subsequent polishing operations are finished based on the measured distance values of a distance sensor, and after each polishing operation including the first polishing, the measured value of the distance sensor is calibrated based on the measured value and target value of finishing thickness of the work piece. Since the calibration is performed for each polishing operation, it is possible to maintain thickness control accuracy over a long period of time.

Abstract: An optimum method for deposition time is provided that can improve uniformity of processing time of oxidation thickness. When starting a heat oxidation process, a time for optimum oxidation processing in the process management system is calculated based on atmospheric pressure data, a target thickness of that process, oxidization time, thickness data and atmospheric pressure data in the immediately preceding process under the same oxidization processing job. The optimum system comprises a process management system such as a host computer, a device having a barometer, a heat oxidation-processing device and a thickness-measuring device. The host computer, the barometer, the heat oxidation processing device and the thickness-measuring device are connected via a network so as to transmit data to and from each device.

Abstract: In a silently operating pilot-operated flow regulating valve, a main valve element is not allowed to vibrate freely, e.g., in lateral direction in an opened state and cannot constitute a noise source because while the main valve element is brought into its open position, an urging force acts upon the main valve element so as to tilt it into vibration suppressing contact with the valve seat whereby vibration of the main valve element is restricted.

Abstract: To achieve a silent, noiseless operation supercooling degree-controlled expansion valve 10 wherein vibration of a valve element 14 induced by refrigerant flow changes is suppressed and a spring 18 presses valve element 14 in an oblique direction inclined with respect to an axial direction thereof against a surrounding member 12 to thereby restrict vibration of the valve element.

Abstract: The present invention provides a polishing compound which does not make stain grow on the surface of work-piece comprising, the dispersion containing 1-30 wt. % of metal oxide particles having 8-500 nm average diameter, acid or alkali and salt, and whose pH is 7-12. Desirably said polishing compound is the compound in which water soluble organic solvent is contained. Further, present invention provides edge polishing method and surface polishing method by use of said polishing compound.

Abstract: Both the front and rear surfaces and side of a disc-shaped workpieces W transferred along a transfer path 2 are washed by forward-rotating rollers 15a that contact the workpieces while rotating in a forward direction and backward-rotating rollers 15b that contact the workpieces while rotating in a backward direction, the respective types of rollers being located on the respective sides of the transfer path.