Patents by Inventor Yusuke Kimura
Yusuke Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7862474Abstract: A speed change control device for an automatic transmission according to this invention determines whether or not a request to downshift a gear position of the transmission exists during traveling in a manual speed change mode (S1, S2), and calculates an input shaft rotation speed of the transmission following a downshift based on the downshift request (S4). When it is determined that the calculated rotation speed is higher than a rotation speed limit value (S5), the speed change control device performs a downshift to a gear position at which the input shaft rotation speed of the transmission is lower than the calculated rotation speed (S6, S8).Type: GrantFiled: March 28, 2007Date of Patent: January 4, 2011Assignees: JATCO Ltd, Nissan Motor Co., Ltd.Inventors: Yusuke Kimura, Atsufumi Kobayashi, Tatsuo Ochiai, Shuichi Wakabayashi, Akihiro Makiyama, Ryoji Kadono
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Patent number: 7819764Abstract: A speed change control device for a belt type continuously variable transmission has a speed change control unit (32) which controls an oil pressure for determining a speed ratio of the continuously variable transmission (10) by operating a step motor (40), and detects a rotation speed of a primary pulley or a secondary pulley. A driving speed of the step motor (40) is limited using two or more of a temperature of a working oil of the speed change control unit (32), the speed ratio of the continuously variable transmission (10), and the detected rotation speed as parameters.Type: GrantFiled: January 12, 2007Date of Patent: October 26, 2010Assignee: JATCO LtdInventors: Yusuke Kimura, Tatsuo Ochiai
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Publication number: 20100238512Abstract: An information processing apparatus includes a designation unit configured to designate a concealing procedure of variable data relating to print data containing reusable data and variable data, an attribute addition unit configured to add, according to the concealing procedure designated by the designation method, concealment attributes relating to the concealing procedure of the variable data, to print attributes of the print data in association with the variable data, and a transferring unit configured to transfer a print job containing information relating to the print data and the print attributes to which the concealment attributes have been added by the attribute addition unit, to a printing apparatus.Type: ApplicationFiled: March 16, 2010Publication date: September 23, 2010Applicant: CANON KABUSHIKI KAISHAInventor: Yusuke Kimura
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Patent number: 7774120Abstract: A control apparatus for an automatic transmission includes a control section having a normal control section configured to actuate the step motor at a first speed by using a feedback control including an integral control in accordance with the target pulley ratio and the actual pulley ratio, a high speed control section configured to actuate the step motor at a second speed higher than the first speed by an open loop control based on the target pulley ratio, a judgment section configured to judge whether there is a high speed operation request, and a switch section configured to select the normal control performed by the normal control section at a normal condition, and to switch to the high speed control when a switch start condition is satisfied, the switch start condition including a first condition that the judgment section judges there is the high speed operation request.Type: GrantFiled: October 30, 2006Date of Patent: August 10, 2010Assignee: JATCO LtdInventors: Midori Yamaguchi, Yoshihisa Kodama, Tatsuya Ozone, Toshiji Iida, Fumito Shinohara, Toshiyuki Shibuya, Atsufumi Kobayashi, Yusuke Kimura
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Publication number: 20100137488Abstract: A bright pigment of the present invention includes a scaly inorganic base 10, a silver-containing coating 11 that covers the inorganic base 10 and contains silver or a silver alloy, and a yellowing-suppressing coating 2 that covers the inorganic base 10 from outside of the silver-containing coating 11 and contains a metal compound functioning as an oxidizing agent. The metal compound is preferably at least one selected from the group consisting of a hydroxide of metal, an oxide hydrate of metal, and a salt of an oxide hydrate of metal, and the metal is at least one selected from the group consisting of tungsten, molybdenum, bismuth, vanadium, or cerium.Type: ApplicationFiled: April 23, 2007Publication date: June 3, 2010Applicant: NIPPON GLASS COMPANY, LIMITEDInventors: Takeaki Kitamura, Yusuke Kimura
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Patent number: 7682224Abstract: A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.Type: GrantFiled: June 4, 2008Date of Patent: March 23, 2010Assignee: Disco CorporationInventors: Yusuke Kimura, Toshiharu Daii, Takashi Mori
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Patent number: 7550387Abstract: A semiconductor wafer processing method for planarizing an additional layer formed on the front side of a semiconductor wafer. First, the wafer is held on a chuck table included in a cutting device in the condition where the additional layer is exposed, and a table base supporting the chuck table is moved toward a working position. In concert with the movement of the table base, the exposed surface of the additional layer is cut by a bit of a cutting tool rotationally driven by a spindle motor. Thereafter, the exposed surface of the additional layer is polished by a polishing device to planarize the exposed surface of the additional layer.Type: GrantFiled: July 25, 2008Date of Patent: June 23, 2009Assignee: Disco CorporationInventors: Kazuma Sekiya, Yusuke Kimura
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Publication number: 20090145735Abstract: A lever switch device, includes a lever main body rotatably supported by a body around a predetermined rotation center axis, a first remote shaft rotatably incorporated in the lever main body, and comprising a first operating knob at one end and a first operation portion at another end for operating an operational object by a rotational operation of the first operating knob, a second remote shaft rotatably arranged in the lever main body with a coaxial structure with the first remote shaft, and includes a second operating knob at one end and a second operation portion at another end for operating an operational object by a rotational operation of the second operating knob. Rotation centers of the first and second operation portions are provided on the rotation center axis of the lever main body.Type: ApplicationFiled: December 2, 2008Publication date: June 11, 2009Applicant: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHOInventors: Yusuke KIMURA, Kenpo KURACHI, Shigeo NAKAMURA
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Publication number: 20090061599Abstract: A semiconductor wafer processing method for planarizing an additional layer formed on the front side of a semiconductor wafer. First, the wafer is held on a chuck table included in a cutting device in the condition where the additional layer is exposed, and a table base supporting the chuck table is moved toward a working position. In concert with the movement of the table base, the exposed surface of the additional layer is cut by a bit of a cutting tool rotationally driven by a spindle motor. Thereafter, the exposed surface of the additional layer is polished by a polishing device to planarize the exposed surface of the additional layer.Type: ApplicationFiled: July 25, 2008Publication date: March 5, 2009Applicant: DISCO CORPORATIONInventors: Kazuma Sekiya, Yusuke Kimura
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Publication number: 20090042488Abstract: A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin film in contact with a suction surface of a chuck table in a grinding apparatus, and the exposed back-side surface of the wafer is ground. Unevenness in thickness of the resin film is suppressed, whereby the thickness of the wafer subjected to back grinding is made to be uniform.Type: ApplicationFiled: July 17, 2008Publication date: February 12, 2009Applicant: DISCO CORPORATIONInventors: Kazuma Sekiya, Yusuke Kimura, Takashi Mori, Toshiharu Daii
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Publication number: 20090004859Abstract: A method of machining a wafer in which, at the time of grinding the back-side surface of the wafer, only a back-side surface region corresponding to a device formation region where semiconductor chips are formed is thinned by grinding, to form a recessed part on the back side of the wafer. An annular projected part surrounding the recessed part is utilized to secure rigidity of the wafer. Next, the recessed part is etched to cause metallic electrodes to project from the bottom surface of the recessed part, thereby forming a back-side electrode parts, then an insulating film is formed in the recessed part, and the insulating film and end surfaces of the back-side electrode parts are cut.Type: ApplicationFiled: June 18, 2008Publication date: January 1, 2009Applicant: DISCO CORPORATIONInventors: Yusuke Kimura, Kuniaki Tsurushima
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Publication number: 20080318497Abstract: A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.Type: ApplicationFiled: June 4, 2008Publication date: December 25, 2008Applicant: DISCO CORPORATIONInventors: Yusuke Kimura, Toshiharu Daii, Takashi Mori
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Patent number: 7458625Abstract: A deck cross-member comprises a first pipe, a joint member, and a second pipe. The first pipe is configured to support a steering unit. The first pipe has a cross section that is uniform along the axial direction as viewed in a plane perpendicular to the axial direction. The joint member is inserted in the first pipe and secured to the first pipe. The joint member incorporates a receptacle unit. The second pipe is inserted in the receptacle unit of the joint member, thus secured to the joint member. The second pipe has a cross section that is uniform along the axial direction as viewed in a plane perpendicular to the axial direction.Type: GrantFiled: June 5, 2007Date of Patent: December 2, 2008Assignee: Mitsubishi Aluminum Company, Ltd.Inventors: Yusuke Kimura, Satoshi Yanagimoto, Yoshiaki Ohhashi
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Patent number: 7402118Abstract: A control device for controlling a continuously variable transmission (5) is disclosed. The control device has an oil pressure control unit (100) which supplies an oil pressure to a primary pulley (10) and secondary pulley (11) based on a command signal indicative of a target speed-reduction ratio, a sensor (26) which detects a rotation speed (Np1) of the primary pulley (26), and a controller (20) which transmits the command signal indicative of the target speed-reduction ratio to the oil pressure control unit (100).Type: GrantFiled: September 23, 2004Date of Patent: July 22, 2008Assignee: Jatco LtdInventors: Yusuke Kimura, Tatsuo Ochiai, Kenji Yoneda, Tateki Jozaki, Takeshi Chibahara, Jun Shiomi
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Patent number: 7389176Abstract: In an engine output control apparatus of a power train employing an engine and an automatic transmission, capable of executing engine output control for excessive torque input prevention engine torque limiting action and for a shift speed control of the transmission, at least two different kinds of engine output control systems having control characteristics differing from each other, are provided. A controller selectively uses these engine output control systems depending on a power-train operating condition, such that a first one of the engine output control systems having a superior transient response is used for the engine output control for shift response control during shifting, and that a second one of the engine output control systems having a superior steady-state stability is used for the engine output control for excessive torque input prevention engine torque limiting action during non-shifting.Type: GrantFiled: June 7, 2007Date of Patent: June 17, 2008Assignees: Nissan Motor Co., Ltd., JATCO LtdInventors: Ryouji Kadono, Masahiro Iriyama, Tetsuya Fuke, Ryouichi Ootaki, Yusuke Kimura, Tatsuo Ochiai
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Publication number: 20070296247Abstract: A deck cross-member comprising a first pipe, a joint member, and a second pipe. The first pipe is configured to support a steering unit. The first pipe has a cross section that is uniform along the axial direction as viewed in a plane perpendicular to the axial direction. The joint member is inserted in the first pipe and secured to the first pipe. The joint member incorporates a receptacle unit. The second pipe is inserted in the receptacle unit of the joint member, thus secured to the joint member. The second pipe has a cross section that is uniform along the axial direction as viewed in a plane perpendicular to the axial direction.Type: ApplicationFiled: June 5, 2007Publication date: December 27, 2007Inventors: Yusuke Kimura, Satoshi Yanagimoto, Yoshiaki Ohhashi
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Publication number: 20070287589Abstract: In a shift-shock reducing apparatus of a power train employing an engine and an automatic transmission, an engine controller executes engine-torque correction for canceling an inertia torque generated owing to a change in transmission input speed during a shift, for shift-shock reduction. A transmission controller includes a shift-speed correction circuit for compensating for a shift speed of the automatic transmission depending on engine load, so as to effectively suppress the generated inertia torque, thereby aimfully reducing or suppressing shift shocks.Type: ApplicationFiled: June 7, 2007Publication date: December 13, 2007Inventors: Ryouji Kadono, Kouji Wakuda, Masahiro Iriyama, Ryouichi Ootaki, Yusuke Kimura, Tatsuo Ochiai, Atsufumi Kobayashi, Shuichi Wakabayashi
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Publication number: 20070288151Abstract: In an engine output control apparatus of a power train employing an engine and an automatic transmission, capable of executing engine output control for excessive torque input prevention engine torque limiting action and for a shift speed control of the transmission, at least two different kinds of engine output control systems having control characteristics differing from each other, are provided. A controller selectively uses these engine output control systems depending on a power-train operating condition, such that a first one of the engine output control systems having a superior transient response is used for the engine output control for shift response control during shifting, and that a second one of the engine output control systems having a superior steady-state stability is used for the engine output control for excessive torque input prevention engine torque limiting action during non-shifting.Type: ApplicationFiled: June 7, 2007Publication date: December 13, 2007Inventors: Ryouji Kadono, Masahiro Iriyama, Tetsuya Fuke, Ryouichi Ootaki, Yusuke Kimura, Tatsuo Ochiai
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Publication number: 20070232443Abstract: A speed change control device for an automatic transmission according to this invention determines whether or not a request to downshift a gear position of the transmission exists during traveling in a manual speed change mode (S1, S2), and calculates an input shaft rotation speed of the transmission following a downshift based on the downshift request (S4). When it is determined that the calculated rotation speed is higher than a rotation speed limit value (S5), the speed change control device performs a downshift to a gear position at which the input shaft rotation speed of the transmission is lower than the calculated rotation speed (S6, S8).Type: ApplicationFiled: March 28, 2007Publication date: October 4, 2007Inventors: Yusuke Kimura, Atsufumi Kobayashi, Tatsuo Ochiai, Shuichi Wakabayashi, Akihiro Makiyama, Ryoji Kadono
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Publication number: 20070197320Abstract: A speed change control device for a belt type continuously variable transmission has a speed change control unit (32) which controls an oil pressure for determining a speed ratio of the continuously variable transmission (10) by operating a step motor (40), and detects a rotation speed of a primary pulley or a secondary pulley. A driving speed of the step motor (40) is limited using two or more of a temperature of a working oil of the speed change control unit (32), the speed ratio of the continuously variable transmission (10), and the detected rotation speed as parameters.Type: ApplicationFiled: January 12, 2007Publication date: August 23, 2007Inventors: Yusuke Kimura, Tatsuo Ochiai