Patents by Inventor Yusuke Kobayashi

Yusuke Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240063258
    Abstract: A semiconductor device has an active region through which current flows and an edge termination structure region arranged outside the active region. The semiconductor device includes a low-concentration semiconductor layer of a first conductivity type, and formed in the edge termination structure region, on a front surface of a semiconductor substrate. The semiconductor device includes a second semiconductor layer of a second conductivity type, in contact with one of a semiconductor layer of the second conductivity type in the active region and a semiconductor layer of the second conductivity type in contact with a source electrode. The second semiconductor layer has an impurity concentration that is lower than that of the semiconductor layer, and the second semiconductor layer is not in contact with a surface of the semiconductor substrate.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yusuke KOBAYASHI, Yasuhiko Oonishi, Masanobu Iwaya
  • Publication number: 20240054272
    Abstract: An information processing apparatus according to one embodiment, comprising: a regression model generator configured to, by combining two or more of a plurality of variables, generate a plurality of terms that include combinations of two or more of the plurality of variables, respectively, and generate a regression model that regresses a property variable or an objective variable indicating an output of an objective function that includes the property variable, by the plurality of terms; a subgroup generator configured to generate, based on coefficients of the plurality of terms included in the regression model, subgroups that are the combinations of variables included the terms, respectively; and a subspace search processor configured to perform search for each of subspaces spanned by the subgroups based on an optimization criterion for the objective function, and generate pieces of first design value data that include values of the plurality of variables for the subspaces.
    Type: Application
    Filed: February 27, 2023
    Publication date: February 15, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hiro GANGI, Yasunori TAGUCHI, Hideyuki NAKAGAWA, Tomoaki INOKUCHI, Yusuke KOBAYASHI, Akihiro GORYU
  • Publication number: 20240041497
    Abstract: To ensure that a biodegradable medical implement dissolves in vivo at an appropriate dissolution rate. The biodegradable medical implement of the present invention is formed of a magnesium material, and, at least in one transverse section, a layer of magnesium crystal grains in which a (0001) plane in a hexagonal crystal structure is oriented toward a surface side is continuous over an entire circumference.
    Type: Application
    Filed: November 29, 2021
    Publication date: February 8, 2024
    Applicants: NITTO SEIKO CO., LTD., KYOTO PREFECTURAL PUBLIC UNIVERSITY CORPORATION, NATIONAL UNIVERSITY CORPORATION UNIVERSITY OF TOYAMA
    Inventors: Masakazu Ishihara, Yoshimitsu Ueno, Tomoaki Murata, Yukito Otsuki, Yusuke Kobayashi, Yoshinobu Oka, Wook-Cheol Kim, Tetsuo Aida, Sadami Tsutsumi
  • Publication number: 20240023934
    Abstract: According to one embodiment, the ultrasonic probe includes a transducer group, an acoustic transmission layer, and a protective material. The transducer group has a plurality of transducers transmitting ultrasonic waves. The acoustic transmission layer transmits the ultrasonic waves transmitted by the transducer group. The protective material protects the transducer group and the acoustic transmission layer. A width of the transducer group in an elevation direction and an opening width of the protective material at the position corresponding to the body contact surface of the acoustic transmission layer are almost identical. The transducer group is provided at a predetermined distance from the body contact surface of the acoustic transmission layer.
    Type: Application
    Filed: July 17, 2023
    Publication date: January 25, 2024
    Applicant: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Yusuke KOBAYASHI, Hiroyuki SHIKATA, Makoto OGI
  • Publication number: 20240030344
    Abstract: According to one embodiment, a semiconductor device includes a first element. The first element includes a first conductive member, a second conductive member, a first semiconductor member, a third conductive member, and a third conductive member wiring. The first conductive member includes a first conductive portion including a first face and a second conductive portion including a second face. The second conductive member includes a third conductive portion including a third face and a fourth conductive portion including a fourth face. The fourth conductive portion includes a facing conductive portion. The first semiconductor member is of a first conductive type. The first semiconductor member includes a first partial region, a second partial region and a third partial region. The third partial region includes a facing face facing the facing conductive portion. The third conductive member wiring is electrically connected to the third conductive member.
    Type: Application
    Filed: February 21, 2023
    Publication date: January 25, 2024
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Tomoaki INOKUCHI, Hiro GANGI, Yusuke KOBAYASHI, Tatsuya NISHIWAKI, Shotaro BABA, Hiroki NEMOTO, Tatsunori SAKANO
  • Patent number: 11855134
    Abstract: A semiconductor device includes, as a semiconductor region in which semiconductor layers are formed, an active region through which current flows and an edge termination structure region outside the active region and in which an edge termination structure is formed. The semiconductor device includes as the semiconductor layers: a drift layer of a first conductivity type and a base layer of a second conductivity type, in contact with the edge termination region; and includes an interlayer insulating film provided on the semiconductor region, on a side thereof where the base layer is formed. The edge termination region has a first semiconductor layer of the second conductivity type, continuous from the base layer and having an outer peripheral end not in contact with the interlayer insulating film, and a second semiconductor layer of the first conductivity type, in contact with the first semiconductor layer and forming a first PN junction therewith.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: December 26, 2023
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yusuke Kobayashi, Yasuhiko Oonishi, Masanobu Iwaya
  • Publication number: 20230391540
    Abstract: This can for an effervescent beverage includes an upper surface, a lower surface, and a middle part. On the inner surface of the middle part, a plurality of first recesses is formed, each having a diameter of at least 5 ?m. The number of the plurality of first recesses is 200 to 2,000 per 1 mm2.
    Type: Application
    Filed: December 27, 2021
    Publication date: December 7, 2023
    Inventors: Toru Kohara, Ryuhei Kuroda, Midori Morita, Yusuke Kobayashi, Tetsuya Natsumoto
  • Patent number: 11837637
    Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, first and second conductive members, a semiconductor member, and a first insulating member. The first conductive member is electrically connected with the second electrode or is electrically connectable with the second electrode. The semiconductor member includes first to third semiconductor regions. The first semiconductor region includes first to fourth partial regions. The third partial region is between the first and second partial regions. The second semiconductor region is between the third partial region and the third semiconductor region. The fourth partial region is between the third partial region and the second semiconductor region. At least a portion of the second semiconductor region is between the second conductive member and the third electrode. The second conductive member is electrically insulated from the second and third electrodes. The first insulating member includes first to third insulating regions.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: December 5, 2023
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiro Gangi, Tomoaki Inokuchi, Yusuke Kobayashi, Hiroki Nemoto
  • Patent number: 11824111
    Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a conductive member, a semiconductor member, and an insulating member. The second electrode includes a conductive portion. The conductive portion is between the third electrode and the conductive member. The conductive member is electrically connected with the second electrode. The semiconductor member includes first to third semiconductor regions. The second semiconductor region is between the third semiconductor region and a portion of the first semiconductor region. The second semiconductor region is between the third electrode and the conductive member. The conductive portion is electrically connected with the second and third semiconductor regions. The first electrode is electrically connected with the first semiconductor region. At least a portion of the first insulating member is between the semiconductor member and the third electrode and between the semiconductor member and the first conductive member.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: November 21, 2023
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hiro Gangi, Tomoaki Inokuchi, Yusuke Kobayashi, Hiroki Nemoto
  • Patent number: 11779305
    Abstract: A puncture adapter of an embodiment holds a puncture needle and is attached to an ultrasonic probe having an ultrasonic probe group. The puncture adapter has a puncture bracket that can be fixed to the ultrasonic probe and a puncture needle guide that is attached to the puncture bracket. The puncture bracket is not fixed to the ultrasonic probe when the puncture needle guide is not attached. The puncture bracket is fixed to the ultrasonic probe when the puncture needle guide is attached.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: October 10, 2023
    Assignee: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Tomohiro Sato, Yusuke Kobayashi, Hiroyuki Shikata
  • Patent number: 11777028
    Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a first conductive member, a semiconductor member, and a first insulating member. The third electrode includes a third electrode end portion and a third electrode other-end portion. The first conductive member includes a first conductive member end portion and a first conductive member other-end portion. The first conductive member is electrically connected with one of the second electrode or the third electrode. The semiconductor member includes first to fourth semiconductor regions. The first semiconductor region includes first and second partial regions. The third semiconductor region is electrically connected with the second electrode. The fourth semiconductor region is electrically connected with the first electrode. At least a portion of the first insulating member is between the semiconductor member and the third electrode and between the semiconductor member and the first conductive member.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: October 3, 2023
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Yusuke Kobayashi, Akihiro Goryu, Ryohei Gejo, Hiro Gangi, Tomoaki Inokuchi, Shotaro Baba, Tatsuya Nishiwaki, Tsuyoshi Kachi
  • Patent number: 11777025
    Abstract: According to one embodiment, a semiconductor device includes a semiconductor member, first and second electrodes, a gate electrode, a gate terminal, a first conductive member, a first terminal, and a first insulating member. The semiconductor member includes first and second semiconductor regions, and a third semiconductor region provided between the first and second semiconductor regions. The first electrode is electrically connected to the first semiconductor region. The second electrode is electrically connected to the second semiconductor region. The gate terminal is electrically connected to the gate electrode. The first conductive member is electrically insulated from the first and second electrodes, and the gate electrode. The first terminal is electrically connected to the first conductive member.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: October 3, 2023
    Assignees: KABUSHIKA KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Yusuke Kobayashi, Tatsunori Sakano, Hiro Gangi, Tomoaki Inokuchi, Takahiro Kato, Yusuke Hayashi, Ryohei Gejo, Tatsuya Nishiwaki
  • Patent number: 11763347
    Abstract: A control apparatus includes a controller configured to determine whether a user who travels in a vehicle has stopped off at a place different from a destination, with reference to positional data indicating a position of the user, the user having accepted a recommendation to stop off at the place using the vehicle, the recommendation being presented together with an advertisement promoting the place.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: September 19, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Chikage Kubo, Yusuke Kobayashi, Minoru Kubota, Kentaro Takahashi, Hideo Hasegawa, Takashi Horiguchi
  • Publication number: 20230271879
    Abstract: The present invention relates to a chemically strengthened glass, satisfying: a ratio ICS (?400)/ICS being more than 0.13 in a stress profile, the ICS representing an integrated value of compressive stress in a region from a surface of the glass to a depth where the compressive stress becomes 0 in the stress profile, and the ICS (?400) representing an integrated value of compressive stress in a region from a depth of 400 ?m from the surface of the glass to the depth where the compressive stress becomes 0 in the stress profile.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 31, 2023
    Applicant: AGC Inc.
    Inventors: Yusuke FUJIWARA, Yoichi TAKATO, Yusuke KOBAYASHI
  • Patent number: 11742403
    Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, a first conductive member, and an insulating part region. The second electrode includes a first electrode portion. The semiconductor member includes a first semiconductor region. The first semiconductor region includes first to third partial regions. The first partial region is between the first electrode and the first electrode portion. The second partial region is between the first and third electrodes. The third partial region is between the first partial region and the first electrode portion. The third partial region includes first and second positions. The second position is between the first partial region and the first position. The first conductive member includes first and second portions. The first portion is between the second partial region and the third electrode. The insulating part region includes first and second insulating regions.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: August 29, 2023
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoaki Inokuchi, Hiro Gangi, Yusuke Kobayashi, Hiroki Nemoto
  • Publication number: 20230253485
    Abstract: According to one embodiment, a semiconductor device includes first to fourth electrodes, a semiconductor member, and an insulating member. The semiconductor member includes first to sixth semiconductor regions. The third semiconductor region includes first and second partial regions. A part of the fourth semiconductor region is between the second partial and second semiconductor regions. The fifth semiconductor region is between the second partial region and a part of the fourth semiconductor region. The sixth semiconductor region is between the first electrode and the first semiconductor region. The second electrode is electrically connected to the second semiconductor region. The fourth electrode is between the first partial region and the third electrode. A part of the insulating member is provided between the semiconductor member and the third electrode, between the semiconductor member and the fourth electrode, and between the third and fourth electrodes.
    Type: Application
    Filed: August 2, 2022
    Publication date: August 10, 2023
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Takahiro KATO, Tatsunori SAKANO, Yusuke KOBAYASHI, Ryohei GEJO
  • Publication number: 20230235123
    Abstract: An addition reaction type polyimide resin molded body having a thickness of 5 mm or more, with a number of defects having a size of 0.5 mm or more present on the entire surface of the molded body being 1 per 100 cm2 or less. The addition reaction type polyimide resin molded body is formed by: holding a prepolymer of an addition reaction type polyimide resin at a temperature equal to or higher than a viscosity increase starting temperature of the addition reaction type polyimide resin and increasing a melt viscosity at a temperature lower by 10° C. than the viscosity increase starting temperature to 70 to 900 kPa·s; grinding and mixing the addition reaction type polyimide resin to form a molding precursor; and shaping the molding precursor at a temperature equal to or higher than a heat-curing temperature of the addition reaction type polyimide resin.
    Type: Application
    Filed: June 7, 2021
    Publication date: July 27, 2023
    Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Kouta SEGAMI, Kazunobu WATANABE, Yusuke KOBAYASHI
  • Patent number: 11705003
    Abstract: A controller of an information processing apparatus is configured to acquire information indicating a loudness of sound emitted by a second vehicle parked within a predetermined range from a first vehicle or a vehicle height of the second vehicle, and in a case in which the controller determines that the loudness or the vehicle height exceeds a predetermined first threshold, the controller provides a predetermined notification to the first vehicle via a communication interface.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: July 18, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toyokazu Nakashima, Yurika Tanaka, Shoji Sakamoto, Yusuke Kobayashi, Kotaro Okabe, Hirotada Nakanishi, Naoya Oka, Daiki Otani
  • Patent number: 11681882
    Abstract: Included are: a storage unit that stores device installation position information indicating installation positions for devices installed under floors of vehicles of a train, stores reading locations at each of which at least one individual information item identifying one of the devices is read from an identification tag storing the individual information item, each of the reading locations being where radio waves are emitted toward the identification tag affixed to corresponding one of the devices, and stores, correspondingly to radio wave strength for each of the plurality of the reading locations, at least one individual information item that is read with varied radio wave strengths in radio wave emission; and a position specifying unit that ascertains which device carrying the individual information item is in which installation position of the vehicles of the train and associates the installation position with the individual information item identified.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: June 20, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Takeuchi, Yusuke Kobayashi
  • Patent number: 11676490
    Abstract: A control apparatus includes a controller configured to acquire time slot data indicating a reserved time slot at a place that provides a service, and positional data indicating a position of a user who has reserved the time slot indicated by the time slot data, and determine whether to take the user to the place using a vehicle according to a remaining time until the time slot indicated by the time slot data, and the position indicated by the positional data.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: June 13, 2023
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Chikage Kubo, Yusuke Kobayashi, Minoru Kubota, Kentaro Takahashi, Hideo Hasegawa, Takashi Horiguchi