Abstract: A semiconductor device includes, as a semiconductor region in which semiconductor layers are formed, an active region through which current flows and an edge termination structure region outside the active region and in which an edge termination structure is formed. The semiconductor device includes as the semiconductor layers: a drift layer of a first conductivity type and a base layer of a second conductivity type, in contact with the edge termination region; and includes an interlayer insulating film provided on the semiconductor region, on a side thereof where the base layer is formed. The edge termination region has a first semiconductor layer of the second conductivity type, continuous from the base layer and having an outer peripheral end not in contact with the interlayer insulating film, and a second semiconductor layer of the first conductivity type, in contact with the first semiconductor layer and forming a first PN junction therewith.

Abstract: This can for an effervescent beverage includes an upper surface, a lower surface, and a middle part. On the inner surface of the middle part, a plurality of first recesses is formed, each having a diameter of at least 5 ?m. The number of the plurality of first recesses is 200 to 2,000 per 1 mm2.

Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, first and second conductive members, a semiconductor member, and a first insulating member. The first conductive member is electrically connected with the second electrode or is electrically connectable with the second electrode. The semiconductor member includes first to third semiconductor regions. The first semiconductor region includes first to fourth partial regions. The third partial region is between the first and second partial regions. The second semiconductor region is between the third partial region and the third semiconductor region. The fourth partial region is between the third partial region and the second semiconductor region. At least a portion of the second semiconductor region is between the second conductive member and the third electrode. The second conductive member is electrically insulated from the second and third electrodes. The first insulating member includes first to third insulating regions.

Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a conductive member, a semiconductor member, and an insulating member. The second electrode includes a conductive portion. The conductive portion is between the third electrode and the conductive member. The conductive member is electrically connected with the second electrode. The semiconductor member includes first to third semiconductor regions. The second semiconductor region is between the third semiconductor region and a portion of the first semiconductor region. The second semiconductor region is between the third electrode and the conductive member. The conductive portion is electrically connected with the second and third semiconductor regions. The first electrode is electrically connected with the first semiconductor region. At least a portion of the first insulating member is between the semiconductor member and the third electrode and between the semiconductor member and the first conductive member.

Abstract: A puncture adapter of an embodiment holds a puncture needle and is attached to an ultrasonic probe having an ultrasonic probe group. The puncture adapter has a puncture bracket that can be fixed to the ultrasonic probe and a puncture needle guide that is attached to the puncture bracket. The puncture bracket is not fixed to the ultrasonic probe when the puncture needle guide is not attached. The puncture bracket is fixed to the ultrasonic probe when the puncture needle guide is attached.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor member, first and second electrodes, a gate electrode, a gate terminal, a first conductive member, a first terminal, and a first insulating member. The semiconductor member includes first and second semiconductor regions, and a third semiconductor region provided between the first and second semiconductor regions. The first electrode is electrically connected to the first semiconductor region. The second electrode is electrically connected to the second semiconductor region. The gate terminal is electrically connected to the gate electrode. The first conductive member is electrically insulated from the first and second electrodes, and the gate electrode. The first terminal is electrically connected to the first conductive member.

Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a first conductive member, a semiconductor member, and a first insulating member. The third electrode includes a third electrode end portion and a third electrode other-end portion. The first conductive member includes a first conductive member end portion and a first conductive member other-end portion. The first conductive member is electrically connected with one of the second electrode or the third electrode. The semiconductor member includes first to fourth semiconductor regions. The first semiconductor region includes first and second partial regions. The third semiconductor region is electrically connected with the second electrode. The fourth semiconductor region is electrically connected with the first electrode. At least a portion of the first insulating member is between the semiconductor member and the third electrode and between the semiconductor member and the first conductive member.

Abstract: A control apparatus includes a controller configured to determine whether a user who travels in a vehicle has stopped off at a place different from a destination, with reference to positional data indicating a position of the user, the user having accepted a recommendation to stop off at the place using the vehicle, the recommendation being presented together with an advertisement promoting the place.

Abstract: The present invention relates to a chemically strengthened glass, satisfying: a ratio ICS (?400)/ICS being more than 0.13 in a stress profile, the ICS representing an integrated value of compressive stress in a region from a surface of the glass to a depth where the compressive stress becomes 0 in the stress profile, and the ICS (?400) representing an integrated value of compressive stress in a region from a depth of 400 ?m from the surface of the glass to the depth where the compressive stress becomes 0 in the stress profile.

Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, a first conductive member, and an insulating part region. The second electrode includes a first electrode portion. The semiconductor member includes a first semiconductor region. The first semiconductor region includes first to third partial regions. The first partial region is between the first electrode and the first electrode portion. The second partial region is between the first and third electrodes. The third partial region is between the first partial region and the first electrode portion. The third partial region includes first and second positions. The second position is between the first partial region and the first position. The first conductive member includes first and second portions. The first portion is between the second partial region and the third electrode. The insulating part region includes first and second insulating regions.

Abstract: According to one embodiment, a semiconductor device includes first to fourth electrodes, a semiconductor member, and an insulating member. The semiconductor member includes first to sixth semiconductor regions. The third semiconductor region includes first and second partial regions. A part of the fourth semiconductor region is between the second partial and second semiconductor regions. The fifth semiconductor region is between the second partial region and a part of the fourth semiconductor region. The sixth semiconductor region is between the first electrode and the first semiconductor region. The second electrode is electrically connected to the second semiconductor region. The fourth electrode is between the first partial region and the third electrode. A part of the insulating member is provided between the semiconductor member and the third electrode, between the semiconductor member and the fourth electrode, and between the third and fourth electrodes.

Abstract: An addition reaction type polyimide resin molded body having a thickness of 5 mm or more, with a number of defects having a size of 0.5 mm or more present on the entire surface of the molded body being 1 per 100 cm2 or less. The addition reaction type polyimide resin molded body is formed by: holding a prepolymer of an addition reaction type polyimide resin at a temperature equal to or higher than a viscosity increase starting temperature of the addition reaction type polyimide resin and increasing a melt viscosity at a temperature lower by 10° C. than the viscosity increase starting temperature to 70 to 900 kPa·s; grinding and mixing the addition reaction type polyimide resin to form a molding precursor; and shaping the molding precursor at a temperature equal to or higher than a heat-curing temperature of the addition reaction type polyimide resin.

Abstract: A controller of an information processing apparatus is configured to acquire information indicating a loudness of sound emitted by a second vehicle parked within a predetermined range from a first vehicle or a vehicle height of the second vehicle, and in a case in which the controller determines that the loudness or the vehicle height exceeds a predetermined first threshold, the controller provides a predetermined notification to the first vehicle via a communication interface.

Abstract: Included are: a storage unit that stores device installation position information indicating installation positions for devices installed under floors of vehicles of a train, stores reading locations at each of which at least one individual information item identifying one of the devices is read from an identification tag storing the individual information item, each of the reading locations being where radio waves are emitted toward the identification tag affixed to corresponding one of the devices, and stores, correspondingly to radio wave strength for each of the plurality of the reading locations, at least one individual information item that is read with varied radio wave strengths in radio wave emission; and a position specifying unit that ascertains which device carrying the individual information item is in which installation position of the vehicles of the train and associates the installation position with the individual information item identified.

Abstract: A control apparatus includes a controller configured to acquire time slot data indicating a reserved time slot at a place that provides a service, and positional data indicating a position of a user who has reserved the time slot indicated by the time slot data, and determine whether to take the user to the place using a vehicle according to a remaining time until the time slot indicated by the time slot data, and the position indicated by the positional data.

Abstract: A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.

Abstract: In an electric rotating machine apparatus according to the present disclosure, there is adopted a structure in which an extending portion of a control circuit board on which a power module for supplying electric power to windings and a driving circuit for the power module are mounted passes through an external-connection opening portion of an electromagnetic shield and then is connected with connectors. A filter circuit 11 is mounted on the extending portion of the control circuit board so as to secure noise-removal capability. Because a conventional dedicated wiring board for mounting the filter circuit thereon is not required, the foregoing structure can contribute to downsizing and cost reduction. In addition, the foregoing structure can contribute to downsizing and cost reduction of an electric power steering apparatus equipped with the electric rotating machine apparatus according to the present disclosure.

Abstract: According to one embodiment, a semiconductor device includes a supporter including a first surface, first, second, and third conductive parts, a semiconductor region, and an insulating part. A first direction from the first toward second conductive part is along the first surface. The semiconductor region includes first, second, and third partial regions. A second direction from the first toward second partial region is along the first surface and crosses the first direction. The third partial region is between the first partial region and the second conductive part in the first direction. The third partial region includes a counter surface facing the second conductive part. A direction from the counter surface toward the third conductive part is along the second direction. The insulating part includes an insulating region. At least a portion of the insulating region is between the counter surface and the third conductive part.

Abstract: According to the embodiment, a semiconductor memory device includes a first conductive layer, a second conductive layer, a first memory cell, a second memory cell, a third conductive layer, a first contact, a intermediate memory cell, a fourth conductive layer, a third memory cell, a fifth conductive layer, and a second contact. The third conductive layer is separated from the first conductive layer and the second conductive layer in a third direction crossing a first direction and crossing a second direction and extends in the second direction. The fifth conductive layer is separated from the second conductive layer in the third direction and extends in the second direction. A first length of the second conductive layer along the second direction is shorter than a second length of the fifth conductive layer along the second direction.

Abstract: A marking pen, comprising: a shaft cylinder; a porous pen core accommodated in the shaft cylinder, and configured to project from, and retract into, an opening part provided at a tip end of the shaft cylinder; an inner cotton accommodated in the shaft cylinder, and filled with an aqueous ink composition to be fed to the pen core, the aqueous ink composition including a water soluble organic solvent in an amount of from 20 mass % to 60 mass %; and a delivery mechanism configured to cause a tip end of the pen core to project from, and retract into, the opening part.