Patents by Inventor Yusuke Nagai

Yusuke Nagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7470566
    Abstract: A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal patterns which are formed on the streets, comprising the steps of: a laser beam application step for carrying out laser processing to form a dividing start point along a street on both sides of the test metal patterns by applying a laser beam along the street on both sides of the test metal patterns in the street formed on the wafer; and a dividing step for dividing the wafer which has been laser processed to form dividing start points along the dividing start points by exerting external force to the wafer, resulting in leaving the streets having the test metal patterns formed thereon behind.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: December 30, 2008
    Assignee: Disco Corporation
    Inventors: Masaru Nakamura, Yusuke Nagai
  • Patent number: 7449396
    Abstract: A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular frame; a deteriorated layer forming step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines, from the side of the front surface of the wafer held on the frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the deteriorated layers have been formed of the wafer held on the frame; an expansion step for enlarging the interval between chips by stretching the dicing tape affixed to the wafer divided into individual chips; and a picking up step for picking up each chip from the expanded dicing tape
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: November 11, 2008
    Assignee: Disco Corporation
    Inventors: Masahiro Murata, Yusuke Nagai, Yukio Morishige, Satoshi Kobayashi, Naoki Ohmiya
  • Patent number: 7435607
    Abstract: A laser processing method for forming a deteriorated layer, which has been once molten and then re-solidified, in the inside of a wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along a dividing line formed on the wafer, comprising: a protective tape affixing step for affixing a protective tape having gas permeability to one side of the wafer; a wafer holding step for holding the wafer having the protective tape affixed thereto on the chuck table of a laser beam machine in such a manner that the surface side onto which the protective tape has been affixed comes into contact with the chuck table; and a laser beam application step for applying a pulse laser beam capable of passing through the wafer from the other surface side of the wafer held on the chuck table with its focusing point set to a position near the one surface of the wafer to form the deteriorated layer exposed to the one surface along the dividing line in the inside of the wafer.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: October 14, 2008
    Assignee: Disco Corporation
    Inventor: Yusuke Nagai
  • Publication number: 20080218481
    Abstract: In one embodiment, the present invention provides an apparatus having a liquid crystal touch panel and operation keys, the liquid crystal touch panel displaying display buttons, and the operation keys being outside of the liquid crystal touch panel, and the display buttons of the liquid crystal touch panel and the operation keys being operated together, in which the liquid crystal touch panel, on a screen, displays display contents that differ from each other such that the display contents can be viewed from two directions that differ from each other, and such that display buttons on the screen of the liquid crystal touch panel when viewed from one direction and operation keys used with the display buttons are near each other, the display buttons are disposed on the screen, or the operation keys are disposed relative to the liquid crystal touch panel.
    Type: Application
    Filed: March 3, 2008
    Publication date: September 11, 2008
    Inventors: Tatsuya WATABE, Tomoki Tanaka, Tadashi Nagaso, Rika Ichiu, Masaki Higashiura, Katsuya Kitayama, Yusuke Nagai, Naofumi Ueda
  • Publication number: 20080153264
    Abstract: A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal patterns which are formed on the streets, comprising the steps of: a laser beam application step for carrying out laser processing to form a dividing start point along a street on both sides of the test metal patterns by applying a laser beam along the street on both sides of the test metal patterns in the street formed on the wafer; and a dividing step for dividing the wafer which has been laser processed to form dividing start points along the dividing start points by exerting external force to the wafer, resulting in leaving the streets having the test metal patterns formed thereon behind.
    Type: Application
    Filed: February 25, 2008
    Publication date: June 26, 2008
    Inventors: Masaru Nakamura, Yusuke Nagai
  • Publication number: 20080128953
    Abstract: A workpiece dividing method comprising applying a laser beam from one surface side of a workpiece permeable to the laser beam. The laser beam applied from the one surface side of the workpiece is focused onto the other surface of the workpiece or its vicinity to deteriorate a region ranging from the other surface of the workpiece to a predetermined depth. The deterioration of the workpiece is substantially melting and resolidification.
    Type: Application
    Filed: November 19, 2007
    Publication date: June 5, 2008
    Inventors: Yusuke Nagai, Satoshi Kobayashi, Hitoshi Hoshino
  • Publication number: 20080105662
    Abstract: A laser beam processing method comprising holding a plate-like workpiece having dividing lines formed in a lattice pattern on the front surface on a chuck table and applying a laser beam capable of passing through the plate-like workpiece to the plate-like workpiece held on the chuck table along the dividing lines to form a deteriorated layer in the inside of the plate-like workpiece along the dividing lines, wherein a height position detection step of detecting the position of a height of the surface on the side to which the laser beam is applied, of the plate-like workpiece held on the chuck table along a dividing line; and a laser beam application step of applying a laser beam to the workpiece along the dividing line while controlling the position of the focusing point of the laser beam corresponding to the position of the height detected in the height position detection step.
    Type: Application
    Filed: December 21, 2007
    Publication date: May 8, 2008
    Inventors: Koichi Shigematsu, Yusuke Nagai
  • Patent number: 7364986
    Abstract: A laser beam processing method comprising the step of processing-feeding a wafer having devices which are formed in a large number of areas sectioned by streets arranged in a lattice pattern on the front surface while a laser beam capable of passing through the wafer is applied to the wafer to form deteriorated layers along the streets in the inside of the wafer, wherein the laser beam is applied at a predetermined angle toward a direction intersecting at right angles to the processing-feed direction relative to a direction perpendicular to the laser beam applied surface of the wafer.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: April 29, 2008
    Assignee: Disco Corporation
    Inventors: Yusuke Nagai, Satoshi Kobayashi
  • Patent number: 7350446
    Abstract: A wafer dividing apparatus for dividing along dividing lines a wafer whose strength is reduced, along the dividing lines, comprising a tape holding means for holding a protective tape affixed to one surface side of the wafer; and a wafer dividing means comprising a first suction-holding member and a second suction-holding member, both having a holding surface for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line through the protective tape, and a moving means for moving the first suction-holding member and the second suction-holding member in directions that they separate from each other, wherein the holding surface of the first suction-holding member and the holding surface of the second suction-holding member are inclined such that they descend or ascend toward their side edges that are opposed to each other.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: April 1, 2008
    Assignee: Disco Corporation
    Inventor: Yusuke Nagai
  • Patent number: 7348199
    Abstract: A wafer processing method of dividing a wafer having function elements formed in areas sectioned by dividing lines formed on the front surface in a lattice pattern, into individual chips along the dividing lines, which comprises a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer along the dividing lines; a wafer supporting step for putting the back surface of the wafer on an extensible support tape mounted on an annular frame; and a dividing step for dividing the wafer along the dividing lines by expanding the support tape affixed to the wafer, wherein the dividing step comprises first dividing the wafer along dividing lines extending in a predetermined direction and subsequently, along dividing lines extending in a direction intersecting with the predetermined direction by expanding the support tape such that tensile force acting in a direction perpendicular to the dividing lines extending in the predetermined direction becomes larger than tensile force acting in a
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: March 25, 2008
    Assignee: Disco Corporation
    Inventors: Yusuke Nagai, Masaru Nakamura
  • Publication number: 20080050257
    Abstract: The invention downsizes and simplifies structures of a compressor and its driving system apparatus, and achieves a reduction of a noise. An oil free screw compressor is constituted by compressor main bodies compressing a gas, a motor driving rotors of the compressor main bodies via step-up gears, a gear casing storing the step-up gears, cooling apparatuses cooling a discharge air and the like. An oil tank is provided independently from the gear casing, the motor is fixed to a common base, the gear casing is integrally attached to the motor via a flange, and the compressor main bodies are integrally attached to the gear casing via the flange. Further, the cooling apparatuses are arranged in an upper side of the driving system apparatus, and a cooling fan is installed in an upper side thereof.
    Type: Application
    Filed: July 19, 2007
    Publication date: February 28, 2008
    Inventors: NATSUKI KAWABATA, HITOSHI NISHIMURA, YUSUKE NAGAI
  • Patent number: 7332415
    Abstract: A method of dividing a silicon wafer along predetermined dividing lines, comprising a deteriorated layer forming step for forming deteriorated layers exposed to at least a surface to which a laser beam is applied, from the inside of the silicon wafer by applying a pulse laser beam with a wavelength capable of passing through the silicon wafer to the silicon wafer along the dividing lines; and a dividing step for dividing the silicon wafer along the dividing lines by applying a laser beam having absorptivity for the silicon wafer to the silicon wafer along the dividing lines where the deteriorated layers have been formed, from the side to which the deteriorated layers have been exposed, to generate thermal stress along the dividing lines.
    Type: Grant
    Filed: November 1, 2004
    Date of Patent: February 19, 2008
    Assignee: Disco Corporation
    Inventors: Yusuke Nagai, Satoshi Kobayashi, Yukio Morishige
  • Patent number: 7329564
    Abstract: A method of dividing a wafer having a plurality of dividing lines formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of dividing lines into individual chips, along the dividing lines, the method comprising the steps of forming a deteriorated layer by applying a laser beam capable of passing through the wafer along the dividing lines; expanding the support tape affixed to the wafer to divide the wafer into individual chips along the dividing lines where the deteriorated layer has been formed and to form a space between adjacent chips; and applying an external stimulus to an area, to which the wafer is affixed, of the support tape in the above state to cure the adhesive layer to maintain the space between adjacent chips.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: February 12, 2008
    Assignee: Disco Corporation
    Inventors: Masaru Nakamura, Yusuke Nagai, Kentaro Iizuka
  • Publication number: 20080019752
    Abstract: A document is made which consists of a large number of recording sheets whose originality can be certified with reliability. Different specific images are respectively formed on a plurality of recording sheets of recording sheets outputted in constant order. Confirmation holes are formed on recording sheets at higher levels than the recording sheets with the specific images formed thereon, in positions in conformity with the positions of the specific images. When a document made by stacking those recording sheets is seen from the top, and the specific images are visible through the confirmation holes, the originality of the document can be certified. When the specific image is invisible through the confirmation hole, it is found that the document has been changed due to missing of part of the recording sheets, a change in order of the recording sheets, or the like, and hence the originality of the document cannot be certified.
    Type: Application
    Filed: July 13, 2007
    Publication date: January 24, 2008
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Naofumi Ueda, Yusuke Nagai
  • Patent number: 7279403
    Abstract: Disclosed herein is a dividing apparatus for dividing a plate-like workpiece, which is put on the top surface of a protective tape affixed to an annular frame and which has reduced strength along dividing lines. The apparatus includes a frame holder for holding the annular frame, a tape expander for expanding the protective tape, a detector for detecting the plate-like workpiece, a divider for pressing dividing lines to divide the workpiece into chips along the lines detected by the detector, a device for pushing up divided chips through the protective tape, and a device for picking up pushed up chips.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: October 9, 2007
    Assignee: Disco Corporation
    Inventors: Yusuke Nagai, Satoshi Kobayashi
  • Patent number: 7244938
    Abstract: A method of checking a deteriorated layer formed in the inside of a workpiece along a dividing line by applying a laser beam capable of passing through the workpiece to the workpiece along the dividing line formed on the workpiece, the method comprising a focusing step of positioning a microscope of infrared image pick-up means to the dividing line formed on the workpiece, and setting the focusing point of the microscope to a position where the deteriorated layer in the inside of the workpiece has been formed; and an image pick-up step of picking up an image of the inside of the workpiece by moving the infrared image pick-up means and the workpiece along the dividing line relative to each other to scan the workpiece, wherein the deteriorated layer formed in the inside of the workpiece is checked based on the image picked up in the image pick-up step.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: July 17, 2007
    Assignee: Disco Corporation
    Inventor: Yusuke Nagai
  • Patent number: 7232741
    Abstract: A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.
    Type: Grant
    Filed: October 20, 2004
    Date of Patent: June 19, 2007
    Assignee: Disco Corporation
    Inventors: Yusuke Nagai, Masaru Nakamura, Satoshi Kobayashi, Yukio Morishige
  • Patent number: 7223937
    Abstract: A laser beam processing method for forming deteriorated layers along a dividing line in the inside of a workpiece by applying a pulse laser beam of a wavelength capable of passing through the workpiece along the dividing line formed on the workpiece, wherein a plurality of pulse laser beams are applied with a predetermined space therebetween in the width direction of the dividing line to form a plurality of parallel deteriorated layers along the dividing line.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: May 29, 2007
    Assignee: Disco Corporation
    Inventors: Yusuke Nagai, Satoshi Kobayashi
  • Patent number: 7179722
    Abstract: A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing step for polishing the back surface of the wafer having the protective member affixed to the front surface; a deteriorated layer formation step for forming a deteriorated layer along the dividing lines in the inside of the wafer by applying a pulse laser beam capable of passing through the wafer to the wafer along the dividing lines from the polished back surface side of the wafer; a frame holding step for affixing the back surface of the wafer in which the deteriorated layers have been formed along the dividing lines, to a dicing tape mounted on an annular frame; a dividing step for dividing the wafer into individual chips along the dividing lines by exerting external force along the dividing lines where the
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: February 20, 2007
    Assignee: Disco Corporation
    Inventors: Masahiro Murata, Yusuke Nagai, Yukio Morishige, Satoshi Kobayashi, Naoki Ohmiya
  • Patent number: 7179724
    Abstract: A method of processing a wafer having devices in a plurality of areas sectioned by streets arranged in a lattice pattern on the front surface to form a metal film on a back surface thereof, wherein a laser beam application step for applying a laser beam capable of passing through a wafer, along the streets formed on the wafer to form a deteriorated layer is carried out before a metal film forming step for forming a metal film on the back surface of the wafer.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: February 20, 2007
    Assignee: Disco Corporation
    Inventors: Tadato Nagasawa, Yusuke Nagai