Abstract: Provide are a peptide gel with practically sufficient mechanical strength and a self-assembling peptide capable of forming the peptide gel. The self-assembling peptide is formed of the following amino acid sequence: a1b1c1b2a2b3db4a3b5c2b6a4 where: a1 to a4 each represent a basic amino acid residue; b1 to b6 each represent an uncharged polar amino acid residue and/or a hydrophobic amino acid residue, provided that at least five thereof each represent a hydrophobic amino acid residue; c1 and c2 each represent an acidic amino acid residue; and d represents a hydrophobic amino acid residue.

Abstract: Provide are a peptide gel with practically sufficient mechanical strength and a self-assembling peptide capable of forming the peptide gel. The self-assembling peptide is formed of the following amino acid sequence: a1b1c1b2a2b3db4a3b5c2b6a4 where: a1 to a4 each represent a basic amino acid residue; b1 to b6 each represent an uncharged polar amino acid residue and/or a hydrophobic amino acid residue, provided that at least five thereof each represent a hydrophobic amino acid residue; c1 and c2 each represent an acidic amino acid residue; and d represents a hydrophobic amino acid residue.

Abstract: A cell culture vessel supplies cells close to the center of gel and deeper down to the bottom with sufficient nutrients for attaining an enhanced survival rate of the cultivated cells. The cell culturing vessel comprises a culture tray capable of holding a liquid culture medium and a cell mixture container fixed to inner walls of the culture tray for retaining the cell mixture. Once the culture tray is filled with the liquid culture medium, the cell mixture retained in the cell mixture container has its opposite outer parts exposed to the liquid culture medium.

Abstract: A screw compressor comprising: a pair of male and female screw rotors; and an air-cooled heat exchanger, wherein the air-cooled heat exchanger is provided above a motor for driving the compressor body; wherein, with respect to a cooling wind for the air-cooled heat exchanger, the air-cooled heat exchanger is inclined to the upstream side; wherein the uppermost portion of a unit suction port for the air-cooled heat exchanger cooling winds is positioned below the uppermost portion of the air-cooled heat exchanger positioned at the uppermost portion; wherein the lowermost portion of the unit suction port for the air-cooled heat exchanger cooling wind is positioned below the lowermost portion of the air-cooled heat exchanger positioned at the lowermost portion; and wherein the cooling wind for the air-cooled heat exchanger is exhausted from a ceiling portion of the compressor unit.

Abstract: Provide are a peptide gel with practically sufficient mechanical strength and a self-assembling peptide capable of forming the peptide gel. The self-assembling peptide is formed of the following amino acid sequence: a1b1c1b2a2b3db4a3b5c2b6a4 where: a1 to a4 each represent a basic amino acid residue; b1 to b6 each represent an uncharged polar amino acid residue and/or a hydrophobic amino acid residue, provided that at least five thereof each represent a hydrophobic amino acid residue; c1 and c2 each represent an acidic amino acid residue; and d represents a hydrophobic amino acid residue.

Abstract: A document is made which consists of a large number of recording sheets whose originality can be certified with reliability. Different specific images are respectively formed on a plurality of recording sheets of recording sheets outputted in constant order. Confirmation holes are formed on recording sheets at higher levels than the recording sheets with the specific images formed thereon, in positions in conformity with the positions of the specific images. When a document made by stacking those recording sheets is seen from the top, and the specific images are visible through the confirmation holes, the originality of the document can be certified. When the specific image is invisible through the confirmation hole, it is found that the document has been changed due to missing of part of the recording sheets, a change in order of the recording sheets, or the like, and hence the originality of the document cannot be certified.

Abstract: This invention provides a mixing method by which a mixing object can be uniformly mixed into a gelled assembly within a short time period. The method for mixing a mixing object into a gelled assembly comprises freezing the gelled assembly; melting the frozen assembly to obtain a sol; mixing the resultant sol and the mixing object; and reconstituting the gelled assembly from the sol into which the mixing object has been mixed.

Abstract: This invention provides a mixing method by which a mixing object can be uniformly mixed into a gelled assembly within a short time period. The method for mixing a mixing object into a gelled assembly comprises freezing the gelled assembly; melting the frozen assembly to obtain a sol; mixing the resultant sol and the mixing object; and reconstituting the gelled assembly from the sol into which the mixing object has been mixed.

Abstract: A screw compressor comprising: a pair of male and female screw rotors; and an air-cooled heat exchanger, wherein the air-cooled heat exchanger is provided above a motor for driving the compressor body; wherein, with respect to a cooling wind for the air-cooled heat exchanger, the air-cooled heat exchanger is inclined to the upstream side; wherein the uppermost portion of a unit suction port for the air-cooled heat exchanger cooling winds is positioned below the uppermost portion of the air-cooled heat exchanger positioned at the uppermost portion; wherein the lowermost portion of the unit suction port for the air-cooled heat exchanger cooling wind is positioned below the lowermost portion of the air-cooled heat exchanger positioned at the lowermost portion; and wherein the cooling wind for the air-cooled heat exchanger is exhausted from a ceiling portion of the compressor unit.

Abstract: An upper limit of allowed print count is set for each user requesting print jobs, and a multi function printer includes: (i) a schedule transmission requesting section for acquiring schedule information of the user; (ii) a print count predicting section for predicting, on the basis of the acquired schedule information, allowed print count assigned to the user, and the number of printed sheets, whether changing the upper limit of the allowed print count is required; and (iii) a settings change inquiry section for inquiring a manager terminal of whether the manager terminal authorizes changing the upper limit of the allowed print count. If having obtained from the manager terminal authorization of change of the upper limit of the allowed print count, the multi function printer performs a print job within a range of a new allowed print count.

Abstract: The invention downsizes and simplifies structures of a compressor and its driving system apparatus, and achieves a reduction of a noise. An oil free screw compressor is constituted by compressor main bodies compressing a gas, a motor driving rotors of the compressor main bodies via step-up gears, a gear casing storing the step-up gears, cooling apparatuses cooling a discharge air and the like. An oil tank is provided independently from the gear casing, the motor is fixed to a common base, the gear casing is integrally attached to the motor via a flange, and the compressor main bodies are integrally attached to the gear casing via the flange. Further, the cooling apparatuses are arranged in an upper side of the driving system apparatus, and a cooling fan is installed in an upper side thereof.

Abstract: A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.

Abstract: When it is judged that the IP address of a PC for the administrator is not included in IP addresses received from the PC for the administrator under accessing while a PC whose access is to be authorized is registered (NO in S20), the IP address of the PC for the administrator is registered besides IP addresses received for identifying PCs (S21). Meanwhile, when it is judged that the IP address of a PC for the administrator is included in IP addresses received from the PC for the administrator under accessing while a PC whose access is to be rejected is registered (YES in S43), the IP addresses received for identifying PCs are registered after excluding the IP address of the PC for the administrator therefrom (S21). This makes it possible to avoid a situation that an access from the terminal device for the administrator to a network device becomes impossible.

Abstract: A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal patterns which are formed on the streets, comprising the steps of: a laser beam application step for carrying out laser processing to form a dividing start point along a street on both sides of the test metal patterns by applying a laser beam along the street on both sides of the test metal patterns in the street formed on the wafer; and a dividing step for dividing the wafer which has been laser processed to form dividing start points along the dividing start points by exerting external force to the wafer, resulting in leaving the streets having the test metal patterns formed thereon behind.

Abstract: A method of dividing an adhesive film mounted on the back surface of a wafer having a plurality of streets formed on the front surface in a lattice pattern and function elements formed in a plurality of areas sectioned by the plurality of streets, along the streets in a state where the wafer is put on the surface of a protective tape mounted on an annular frame, wherein the adhesive film is cooled and the protective tape is expanded to divide the adhesive film along the peripheries of the function elements.

Abstract: A silicon wafer laser processing method for forming a deteriorated layer along dividing lines formed on a silicon wafer in the inside of the silicon wafer by applying a laser beam along the dividing lines, wherein the wavelength of the laser beam is set to 1,100 to 2,000 nm.

Abstract: A method of dividing a wafer along a plurality of first dividing lines and a plurality of second dividing lines intersecting with the first dividing lines on the surface of the wafer. The method includes an internal deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer along both the first dividing lines and the second dividing lines by applying a laser beam along the first dividing lines and the second dividing lines. It also includes an intersection deteriorated layer forming step for forming a deteriorated layer thicker than the deteriorated layer formed in the internal deteriorated layer forming step by applying a laser beam to intersection areas between the first and second dividing lines. Thereafter, a dividing step divides the wafer into individual chips along the first and second dividing lines by exertion of external force to the wafer.

Abstract: A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface and test metal patterns which are formed on the streets, having a metal pattern breaking step for forming a break line in the test metal patterns by applying a pulse laser beam having permeability to the wafer to the rear surface of the wafer with its focal point set near the test metal patterns; a deteriorated layer forming step for forming a deteriorated layer along the streets above the break lines in the inside of the wafer by applying a pulse laser beam having permeability to the wafer to the rear surface of the wafer with its focal point set to a position above the break lines in the inside of the wafer; and a dividing step.

Abstract: A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.

Abstract: A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface, and having test metal patterns which are formed on the streets, comprising the steps of: a laser beam application step for carrying out laser processing to form a dividing start point along a street on both sides of the test metal patterns by applying a laser beam along the street on both sides of the test metal patterns in the street formed on the wafer; and a dividing step for dividing the wafer which has been laser processed to form dividing start points along the dividing start points by exerting external force to the wafer, resulting in leaving the streets having the test metal patterns formed thereon behind.