Patents by Inventor Yusuke Yoshida

Yusuke Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260201959
    Abstract: A seal ring having an annular shape and one cut includes: a pair of decreasing portions where a radial dimension of the seal ring decreases toward the cut; and recessed parts in at least one end surface in an axis line direction. The recessed parts include a first recess in the decreasing portions and a second recess spaced apart from the cut relative to the first recess. Between an inner peripheral surface of the seal ring and the second recess, an inner periphery side wall demarcating both of those and a communication portion causing both of those to communicate with each other are formed. Between the inner peripheral surface and the first recess, an enlarged communication portion is formed so both of those communicate with each other. The enlarged communication portion has one portion, and a circumferential dimension of the enlarged communication portion is larger than that of the communication portion.
    Type: Application
    Filed: December 14, 2023
    Publication date: July 16, 2026
    Inventors: Takumi SATO, Yusuke YOSHIDA
  • Publication number: 20260203966
    Abstract: An image processing apparatus comprises: an acquisition unit that acquires an image; a first generation unit that generates a luminance image indicating luminance of the acquired image; and a second generation unit that generates text indicating characteristics of the acquired image.
    Type: Application
    Filed: December 23, 2025
    Publication date: July 16, 2026
    Inventors: YUSUKE YOSHIDA, SHUMA YOKOYAMA, TAKAYUKI KOMATSU, HIROSHI KANEKO
  • Publication number: 20260188609
    Abstract: The present invention efficiently and accurately diagnoses abnormalities of blankers. An abnormality diagnosis method for a blanking aperture array substrate according to the present embodiment includes grouping the plurality of individual blankers into a plurality of groups, measuring blanking performance of the individual blankers for each group, and iteratively subdividing any group exhibiting abnormal blanking performance into subgroups to identify an individual blanker having abnormal blanking performance.
    Type: Application
    Filed: February 20, 2026
    Publication date: July 2, 2026
    Applicant: NuFlare Technology, Inc.
    Inventors: Yoshihisa KAWABATA, Yasuo SENGOKU, Hideo INOUE, Takuya MATSUKAWA, Yusuke YOSHIDA
  • Publication number: 20260166591
    Abstract: A sludge treatment device includes a pair of wheels that include driving wheels, and are disposed vertically; an endless power transmission member that is wound around the pair of wheels, and extends between the pair of wheels in upper and lower lines; a carriage that is disposed so as to be movable forward between the pair of wheels, and includes a raising and lowering scraper configured to draw sludge and a carriage wheel placed on a rail; a pulling portion that is provided at a part of the power transmission member; and first to fourth engagement portions that are provided at the carriage, and have a shape in which the pulling portion moving rotationally along the power transmission member is engageable and disengageable with respect to the first to fourth engagement portions.
    Type: Application
    Filed: March 31, 2022
    Publication date: June 18, 2026
    Inventors: Akihiro KITAMURA, Nobuyuki HASHIMOTO, Yusuke YOSHIDA
  • Patent number: 12654891
    Abstract: A binding machine includes a magazine configured to accommodate a wire, a wire feeding portion configured to feed the wire accommodated in the magazine, a curl forming portion configured to constitute an annular feeding path for winding the wire fed by the wire feeding portion around a binding object, and a binding portion configured to twist the wire wound around the binding object. The curl forming portion includes a curling guide that curls the wire fed by the wire feeding portion, and a leading guide that leads the wire curled by the curling guide to the binding portion. The magazine includes a feeding path forming portion that forms a feeding path of the wire, and a regulating portion that regulates movement of the wire in a direction intersecting a direction in which the wire is fed in the feeding path forming portion.
    Type: Grant
    Filed: December 27, 2023
    Date of Patent: June 16, 2026
    Assignee: Max Co., Ltd.
    Inventors: Hiroki Ishiguro, Taichi Yamazaki, Shigeki Shindou, Yusuke Yoshida, Tetsuro Fukuda, Shingo Takahashi, Makoto Kosuge
  • Patent number: 12617272
    Abstract: An accelerator device includes a pedal lever, a drive source, a power transmission mechanism, and a control unit. The pedal lever is operable in response to a pedaling operation. The drive source generates a driving force when being energized. The power transmission mechanism transmits the driving force of the drive source to the pedal lever, and applies a reaction force in an opposite direction to a pedaling direction of the pedal lever. The control unit includes a reaction force controller that controls the reaction force applied to the pedal lever by controlling the drive source. The reaction force controller holds an initial reaction force for a reaction force hold time from a start of reaction force application, and performs a reaction force reduction control in which the reaction force is reduced as a time function after an elapse of the reaction force hold time.
    Type: Grant
    Filed: January 17, 2025
    Date of Patent: May 5, 2026
    Assignee: DENSO CORPORATION
    Inventors: Yusuke Yoshida, Soichi Kinouchi
  • Patent number: 12610763
    Abstract: A method includes providing a semiconductor substrate and forming a dielectric layer over the semiconductor substrate. The method includes forming a metal layer over the dielectric layer. The method includes forming a patterned mask over the metal layer. The method includes performing a first etching process using a first etchant to form metal patterns separated by trenches in the metal layer. The method further includes performing a second etching process using a second etchant and a passivant to extend the trenches in the dielectric layer, resulting in a passivation layer formed along sidewalls of the metal patterns.
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: April 21, 2026
    Assignee: Tokyo Electron Limited
    Inventors: Jason Marion, Indroneil Roy, Yusuke Yoshida, Yun Han
  • Publication number: 20260102105
    Abstract: A biological signal measurement system includes a biological signal measurement apparatus and a data analysis apparatus. The data analysis apparatus generates a stimulation signal and wirelessly transmits the stimulation signal to the measurement apparatus. The measurement apparatus measures a biological signal of a subject responding to the stimulation. The measurement apparatus acquires a trigger signal corresponding to the stimulation signal, and utilizes a synchronous sampling circuit to synchronize and sample the trigger signal and the biological signal, generating a synchronously sampled data set. The measurement apparatus transmits the synchronously sampled data set to the data analysis apparatus. The data processing apparatus performs data processing on the received biological signal and trigger signal within the synchronously sampled data set to time-align the biological signal with the trigger signal.
    Type: Application
    Filed: December 17, 2025
    Publication date: April 16, 2026
    Applicants: Murata Manufacturing Co., Ltd., VIE, INC.
    Inventors: Motoyasu NAKAO, Yuji NIHEI, Yusuke YOSHIDA, Yasuhiko IMAMURA, Yasushi NARUSE
  • Publication number: 20260101160
    Abstract: A measurement system includes a first measurement apparatus and a second measurement apparatus. Each apparatus includes a sensor that outputs a measurement signal, a wireless communication circuit that receives a trigger signal, and a synchronous sampling circuit. Each synchronous sampling circuit is configured to sample a both the trigger signal received and the measurement signal in synchronization with each other and output a synchronous trigger signal and a synchronous measurement signal. The wireless communication unit of each apparatus then transmits a signal pair including the synchronous trigger signal and the synchronous measurement signal.
    Type: Application
    Filed: December 10, 2025
    Publication date: April 9, 2026
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Motoyasu NAKAO, Yuji NIHEI, Yusuke YOSHIDA
  • Patent number: 12598933
    Abstract: A method includes providing a semiconductor substrate and forming a fin protruding from the semiconductor substrate. The method includes forming a silicon-containing layer over the fin. The method further includes patterning the silicon-containing layer to form a gate structure over the fin, where patterning the silicon-containing layer is implemented using an etchant and a passivant that includes a silicon-containing gas and a nitrogen-containing gas.
    Type: Grant
    Filed: September 1, 2023
    Date of Patent: April 7, 2026
    Assignee: Tokyo Electron Limited
    Inventors: Jason Marion, Alexander Kaiser, Yusuke Yoshida, Yun Han
  • Publication number: 20260087869
    Abstract: A money handling apparatus includes a banknote handling assembly, a coin handling assembly, and a first operation surface having a banknote inlet portion, a banknote outlet portion, a coin inlet portion, and a coin outlet portion and facing a front direction in a front-back direction of the money handling apparatus. The banknote inlet portion and the coin inlet portion are aligned and the banknote outlet portion and the coin outlet portion are aligned in a right-left direction of the money handling apparatus, which is perpendicular to the front-back direction. The banknote inlet portion and the banknote outlet portion overlap and the coin inlet portion and the coin outlet portion overlap in the up-down direction of the money handling apparatus, which is perpendicular to the right-left direction and perpendicular to the front-back direction.
    Type: Application
    Filed: December 2, 2025
    Publication date: March 26, 2026
    Applicant: Glory Ltd.
    Inventors: Yoshikazu MITSUSADA, Takuro HAMADA, Yusuke YOSHIDA, Masato TAKEUCHI
  • Patent number: 12575353
    Abstract: A method of processing a substrate that includes: forming a bottom passivation layer including an oxide over a first portion of a dielectric layer at a bottom of a recess of the substrate, the recess having sidewalls including a second portion of the dielectric layer; and performing a lateral etch to etch the second portion of the dielectric layer, the bottom passivation layer covering the first portion of the dielectric layer during the lateral etch, and where the forming of the bottom passivation layer includes exposing the substrate to a first plasma including a halogen, and exposing the substrate to a second plasma including oxygen to form the bottom passivation layer.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: March 10, 2026
    Assignee: Tokyo Electron Limited
    Inventors: Adam Pranda, Yusuke Yoshida, Aelan Mosden, Yun Han
  • Patent number: 12564986
    Abstract: A compression molding die includes a first mold and a second mold. The first mold includes a bottom surface member and a side surface member. A space is providable in the first mold by a step of at least one of an outer peripheral surface of the bottom surface member and an inner peripheral surface of the side surface member. The first mold includes a gas inlet capable of introducing gas into the space, a gas outlet through which the gas introduced into the space is dischargeable, and a seal member below the space.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: March 3, 2026
    Assignee: TOWA CORPORATION
    Inventors: Yusuke Yoshida, Kunihiko Fujiwara, Kosuke Hayashi
  • Publication number: 20260027753
    Abstract: A molding die includes one die and the other die arranged opposing the one die, the other die having a cavity where a release film is arranged. The other die includes a main surface member that forms a main surface of the cavity and a side surface member that forms a side surface of the cavity. On an opposing surface of the side surface member opposing the one die, a release film adsorption hole that adsorbs the release film is formed including a plurality of first suction holes and a second suction hole that connects adjacent first suction holes. On the opposing surface, the first suction hole is larger than the second suction hole in the direction perpendicular to the direction in which the second suction hole extends to connect adjacent first suction holes.
    Type: Application
    Filed: August 31, 2023
    Publication date: January 29, 2026
    Applicant: TOWA CORPORATION
    Inventors: Yusuke YOSHIDA, Yohei ONISHI, Mamoru SUNADA, Ken MORITA, Atsushi MORIKAMI
  • Patent number: 12535138
    Abstract: A circular annular seal ring made from a resin is adapted to be disposed between an outer member and an inner member that rotate relative to each other. The seal ring is disposed in a circumferential groove of the outer member or the inner member to isolate a liquid space from an external space. The seal ring is formed from an elongated and arcuate rod to define a circle by joining ends of the rod, and has a junction formed from the ends. The seal ring has a radial thickness gradually decreasing from two points that are apart from the junction toward the junction. The points are separated from the junction by an angle of not less than 60 degrees and not more than 150 degrees about a central axis of the circle.
    Type: Grant
    Filed: April 12, 2024
    Date of Patent: January 27, 2026
    Assignee: NOK CORPORATION
    Inventors: Hideya Watanabe, Yusuke Yoshida
  • Publication number: 20260004930
    Abstract: Systems and methods for automated caregiving are disclosed. One aspect includes a sensing system configured to monitor an individual, including at least one camera and at least one microphone. The at least one camera may be configured to capture any combination of video and images of an individual being monitored. The microphone may be configured to capture audio signals generated by the individual. An edge computing system connected to the sensing system may be configured to receive one or more sensed signals associated with the sensing system monitoring the individual. The sensed signals may include the video or images and the audio signals. A remote computing system connected to the edge computing system via a network may be configured to receive the sensed signals from the edge computing system, process the sensed signals using an artificial intelligence (AI)-based system, and provide assistance to the individual being monitored.
    Type: Application
    Filed: June 26, 2025
    Publication date: January 1, 2026
    Inventors: Goutham Kamath, Yuta Endo, Yusuke Yoshida
  • Patent number: 12513902
    Abstract: A three-dimensional memory device includes vertical layer stacks that are laterally spaced apart by backside trenches that laterally extend along a first horizontal direction, where each of the vertical layer stacks includes a respective alternating stack of insulating layers and electrically conductive layers, memory openings vertically extending through the alternating stacks, memory opening fill structures located in the memory openings and including a respective vertical stack of memory elements and a respective vertical semiconductor channel, and backside trench fill structures located within a respective one of the backside trenches. Each of the backside trench fill structures includes a plurality of dielectric bridge structures laterally spaced apart along the first horizontal direction and dielectric fin portions located at levels of a plurality of the electrically conductive layers.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: December 30, 2025
    Assignee: Sandisk Technologies, Inc.
    Inventors: Hiromi Minamitani, Kei Nozawa, Yusuke Yoshida
  • Patent number: 12511972
    Abstract: A money handling apparatus includes a banknote handling assembly, a coin handling assembly, and a first operation surface having a banknote inlet portion, a banknote outlet portion, a coin inlet portion, and a coin outlet portion and facing a front direction in a front-back direction of the money handling apparatus. The banknote inlet portion and the coin inlet portion are aligned and the banknote outlet portion and the coin outlet portion are aligned in a right-left direction of the money handling apparatus, which is perpendicular to the front-back direction. The banknote inlet portion and the banknote outlet portion overlap and the coin inlet portion and the coin outlet portion overlap in the up-down direction of the money handling apparatus, which is perpendicular to the right-left direction and perpendicular to the front-back direction.
    Type: Grant
    Filed: October 1, 2024
    Date of Patent: December 30, 2025
    Assignee: GLORY LTD.
    Inventors: Yoshikazu Mitsusada, Takuro Hamada, Yusuke Yoshida, Masato Takeuchi
  • Publication number: 20250333201
    Abstract: A binding machine includes: a curl forming portion configured to form an annular feeding path for winding the wire fed by a wire feeding portion around a to-be-bound object; and a binding portion configured to twist the wire wound on the to-be-bound object. The curl forming portion includes an arm part configured to curl the wire fed by the wire feeding portion, and a curl guide part configured to guide the wire curled by the arm part to the binding portion. The curl guide part includes a bottom surface portion on a radially outer side of the annular feeding path. The bottom surface portion includes a guiding portion forming at least a part of a tip portion side of the curl guide part and configured to guide a tip of the wire toward a base end portion side of the curl guide part.
    Type: Application
    Filed: December 17, 2024
    Publication date: October 30, 2025
    Inventors: Tetsuro Fukuda, Shingo Takahashi, Naoki Kamiya, Yusuke Yoshida
  • Patent number: 12457735
    Abstract: A semiconductor structure includes an alternating stack of insulating layers and electrically conductive layers that is located on a front side of at least one semiconductor material layer; memory openings vertically extending through the alternating stack; memory opening fill structures; a dielectric material portion contacting sidewalls of the insulating layers of the alternating stack. In one embodiment, a connection via structure can vertically extend through the dielectric material portion, and a metal plate can contact the connection via structure. Alternately or additionally, an integrated via and pad structure may be provided, which includes a conductive via portion vertically extending through the dielectric material portion and a conductive pad portion located on an end of the conductive via portion.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: October 28, 2025
    Assignee: Sandisk Technologies, Inc.
    Inventors: Yusuke Yoshida, Teruo Okina, Kenichi Okabe