Abstract: In one example, a method of processing a substrate includes receiving a substrate in a processing chamber, the substrate having an etch mask positioned over an underlying layer to be etched, where the underlying layer is a silicon-containing layer. The method includes executing a first etch process that includes forming a first plasma from a first process gas that includes hydrogen bromide or chlorine and etching the underlying layer using products of the first plasma. The method includes executing a second etch process that includes forming a second plasma from a second process gas that includes fluorine and etching the substrate using products from the second plasma. The method may include alternating between the first etch process and the second etch process.

Abstract: A seal ring capable of stabilizing sealing performance while reducing rotation torque. A seal ring 100 has a plurality of first dynamic pressure generation groove 131 and a plurality of second dynamic pressure generation groove 132 on an outer peripheral surface thereof with intervals in the circumferential direction, the plurality of first dynamic pressure generation groove 131 extending from a position close to a first side surface 100A with respect to the center of width in an axial direction to the first side surface 100A and configured to generate dynamic pressure with relative rotation between a housing and the seal ring 100, and the plurality of second dynamic pressure generation groove 132 extending from a position close to a second side surface 100B with respect to the center of width in the axial direction to the second side surface 100B and configured to generate dynamic pressure with the relative rotation between the housing and the seal ring 100.

Abstract: A friction stir spot welding apparatus includes: a pin that is columnar; a shoulder that is cylindrical, the pin being within the shoulder; a rotary driver that rotates the pin and the shoulder about an axis that coincides with a center axis of the pin; and an advance-retreat driver that advances and retreats the pin and the shoulder along the axis. A first groove is formed at a tip end portion of an outer peripheral surface of the shoulder so as to extend in a direction along the center axis of the pin.

Abstract: A friction stir welding apparatus is used at a butted portion where a second workpiece is butted against a first workpiece such that the second workpiece is upright on the first workpiece. The friction stir welding apparatus includes: a rotary tool that is plunged into one inner corner of a pair of inner corners that are positioned, at the butted portion, on both sides of the second workpiece, respectively; an inner corner presser that presses the other inner corner of the pair of inner corners; and a mover that moves the rotary tool and the inner corner presser along a direction in which the butted portion extends. The inner corner presser includes a pressing roller that presses the other inner corner while rolling in a state where the inner corner presser is being moved by the mover.

Abstract: A binding machine includes a wire feeding unit configured to feed a wire to be wound on an object to be bound, a binding unit configured to twist the wire wound on the object to be bound, a curl guide configured to curl the wire being fed by the wire feeding unit, and an inductive guide configured to guide the wire curled by the curl guide toward the binding unit. The wire feeding unit includes a pair of feeding members facing each other with a feeding path of the wire being interposed therebetween, each of the feeding members configured to rotate about a shaft as a support point extending in a direction intersecting with the feeding path of the wire, and a position regulation part configured to regulate axial relative positions of the pair of feeding members.

Abstract: The present invention provides a resin leakage prevention member 401 for use in a molding die 1000, wherein the molding die 1000 includes a lower die 200 and an upper die 100, the lower die 200 has a side member 201 and a bottom member 202, a space surrounded by the side member 201 and the bottom member 202 forms a cavity 204, the cavity 204 is configured to accommodate a resin material 20a, the side member 201 is configured to move relatively vertical to the bottom member 202, and the resin leakage prevention member 401 is disposed on a peripheral portion of an upper surface of the bottom member 202 and along an inner peripheral surface of the side member 201, thereby sealing a gap between the side member 201 and the bottom member 202 and preventing a resin from leaking from the cavity 204 into the gap.

Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a feeding path of the wire along which the wire fed in a first direction by the wire feeding unit is wound around an object; and a binding unit configured to twist the wire fed in first direction by the wire feeding unit and wound on the object. The wire feeding unit includes a pair of feeding members configured to sandwich the wire and to feed the wire by a rotating operation, and a feeding motor configured to drive the feeding members. The binding machine further includes a control unit configured to control the wire feeding unit. The control unit is configured to control the wire feeding unit to enable the wire sandwiched by the feeding members to be discharged from the feeding members.

Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl guide configured to curl the wire fed in a forward direction by the wire feeding unit; and a binding unit configured to twist the wire fed in a reverse direction by the wire feeding unit and wound on an object. The binding unit includes a wire engaging body configured to engage a tip end-side of the wire fed in the forward direction by the wire feeding unit, curled by the curl guide and wound around the object. The binding machine includes a pulling unit for pulling, toward the object, a wire on a second side positioned on an opposite side to the curl guide with respect to the object earlier than a wire on a first side positioned on the curl guide of the wire wound around the object and engaged at its tip end.

Abstract: A vacuum processing apparatus includes a processing unit comprising a processing chamber disposed in a vacuum container, a detector detecting a thickness of the target film on a wafer or an end point during the processing of the wafer using a light from the wafer, the detector being functioned to detect the thickness or the end point by comparing a data pattern of obtained in advance indicating light intensities of a plurality of wavelengths related to the film thickness using the wavelength as a parameter and a real data pattern indicating the light intensities of the plurality of wavelengths obtained at a particular time during the processing, and the data pattern being obtained by dividing differential coefficient value of time-series data of the light intensities of the plurality of wavelengths by time-series data indicating values of the light intensities of the plurality of wavelengths.

Abstract: A seal ring has, on an outer peripheral surface side thereof, a pair of recessed parts 140 extending in a circumferential direction on both sides in a width direction thereof to form a projection part 120 between the pair of recessed parts 140, and has a plurality of ribs 130 connected to the projection part 120 and extending to lateral surfaces of the seal ring at intervals in the circumferential direction inside the pair of recessed parts 140, and a plurality of ribs 130 arranged on a sealed region side among the plurality of ribs 130 have lateral-wall surfaces on an upstream side in a relative rotation direction of a housing with respect to a shaft, each of the lateral-wall surfaces having inclined surfaces inclined from the upstream side to a downstream side in the relative rotation direction of the housing from the projection part 120 toward the lateral surfaces of the seal ring.

Abstract: A light source device includes has a configuration in which a height of a heat sink from a reference surface when the reference surface is a bottom surface of a housing is set to be lower than a height of a light source unit from the reference surface, and a heat pipe includes a first heat pipe, a first end part of which is connected with the heat generation body and a second end part of which is connected with the heat sink, and a second heat pipe, a third end part of which is connected with a heat generation body and a fourth end part of which is connected with the heat sink so that a distance to the second end part is longer than a distance between the first end part and the third end part.

Abstract: A binding machine includes: a wire feeding unit; a curl forming unit; a butting part; a cutting unit; and a binding unit. The binding unit includes: a rotary shaft; a wire engaging body configured to move in an axis direction of the rotary shaft and to engage the wire in a first operation area in the axis direction, and to move in the axis direction and to twist the wire in a second operation area in the axis direction; a rotation regulation part; and a tension applying part configured to perform, in the second operation area, an operation of applying tension on the wire engaged by the wire engaging body in the first operation area. The tension applied to the wire is equal to or larger than 10% and equal to or smaller than 50% with respect to a maximum tensile load of the wire.

Abstract: A binding machine is configured to feed a wire in a first direction, to curl the wire, to surround a to-be-bound object with the wire, to return the wire in a second direction opposite to the first direction, to wind the wire on the to-be-bound object, and to twist the wire, thereby binding the to-be-bound object. The binding machine includes: a main body; a reel accommodation unit; a wire feeding unit; a curl forming unit; a binding unit; a grip; a starter; and a feeding path. The reel accommodation unit is provided in the main body on an opposite side to the curl forming unit with respect to the starter, and the feeding path is provided with a load reducing part configured to reduce a load of the wire or the reel accommodation unit.

Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a path along which the wire fed by the wire feeding unit is to be wound around a to-be-bound object; a butting part against which the to-be-bound object is to be butted; a cutting unit configured to cut the wire wound on the to-be-bound object; a binding unit configured to twist the wire wound on the to-be-bound object and cut by the cutting unit; and a tension applying part configured to apply tension to the wire to be cut at the cutting unit with a force higher than a force applied in a loosening direction of the wire wound on the to-be-bound object.

Abstract: A binding machine includes: a wire feeding unit; a curl forming unit; a cutting unit; a binding unit; a motor; and a control unit. The binding unit includes: a rotary shaft to be driven by the motor; a wire engaging body configured to engage the wire and to rotate together with the rotary shaft, thereby twisting the wire; and a rotation regulation part configured to regulate rotation of the wire engaging body. The control unit is configured to control stop of the motor rotating in a direction of twisting the wire, based on a position in a rotation direction of the wire engaging body and a position at which the rotation of the wire engaging body can be regulated by the rotation regulation part.

Abstract: A binding machine includes: a wire feeding unit; a curl forming unit; a butting part; a cutting unit; and a binding unit. The binding unit includes a rotary shaft; a wire engaging body configured to move in an axis direction of the rotary shaft and to engage the wire in a first operation area in the axis direction of the rotary shaft, and configured to move in the axis direction of the rotary shaft and to twist the wire with rotating together with the rotary shaft in a second operation area in the axis direction of the rotary shaft; a rotation regulation part configured to regulate rotation of the wire engaging body; and a tension applying part configured to perform, in the second operation area, operations of applying tension and releasing the applied tension on the wire engaged by the wire engaging body in the first operation area.

Abstract: An endoscope illumination light switching device includes a rotation body in which a plurality of holes including a first hole are formed in a circumferential direction and that switches a hole on an irradiation optical path through rotation, a drive device configured to rotationally drive the rotation body, a sensor, and a processor configured to control a stop position of the rotation body based on a detection signal from the sensor. The rotation body includes a first detection target shape portion corresponding to the first hole, and another detection target shape portion. The sensor outputs a detection signal in response to detection of each shape portion when the rotation body rotates.

Abstract: A light source device includes has a configuration in which a height of a heat sink from a reference surface when the reference surface is a bottom surface of a housing is set to be lower than a height of a light source unit from the reference surface, and a heat pipe includes a first heat pipe, a first end part of which is connected with the heat generation body and a second end part of which is connected with the heat sink, and a second heat pipe, a third end part of which is connected with a heat generation body and a fourth end part of which is connected with the heat sink so that a distance to the second end part is longer than a distance between the first end part and the third end part.

Abstract: A seal ring capable of stabilizing sealing performance while reducing rotation torque. A seal ring 100 has a plurality of first dynamic pressure generation groove 131 and a plurality of second dynamic pressure generation groove 132 on an outer peripheral surface thereof with intervals in the circumferential direction, the plurality of first dynamic pressure generation groove 131 extending from a position close to a first side surface 100A with respect to the center of width in an axial direction to the first side surface 100A and configured to generate dynamic pressure with relative rotation between a housing and the seal ring 100, and the plurality of second dynamic pressure generation groove 132 extending from a position close to a second side surface 100B with respect to the center of width in the axial direction to the second side surface 100B and configured to generate dynamic pressure with the relative rotation between the housing and the seal ring 100.

Abstract: Plasma ion energy distribution for ions having different masses is controlled by controlling the relationship between a base RF frequency and a harmonic RF frequency. By the controlling the RF power frequencies, characteristics of the plasma process may be changed based on ion mass. The ions that dominate etching may be selectively based upon whether an ion is lighter or heavier than other ions. Similarly, atomic layer etch processes may be controlled such that the process may be switched between a layer modification step and a layer etch step though adjustment of the RF frequencies. Such switching is capable of being performed within the same gas phase of the plasma process. The control of the RF power includes controlling the phase difference and/or amplitude ratios between a base RF frequency and a harmonic frequency based upon the detection of one or more electrical characteristics within the plasma apparatus.