Patents by Inventor Yusuke Yoshida

Yusuke Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11891822
    Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a feeding path of the wire along which the wire fed in a first direction by the wire feeding unit is wound around an object; and a binding unit configured to twist the wire fed in first direction by the wire feeding unit and wound on the object. The wire feeding unit includes a pair of feeding members configured to sandwich the wire and to feed the wire by a rotating operation, and a feeding motor configured to drive the feeding members. The binding machine further includes a control unit configured to control the wire feeding unit. The control unit is configured to control the wire feeding unit to enable the wire sandwiched by the feeding members to be discharged from the feeding members.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: February 6, 2024
    Assignee: Max Co., Ltd.
    Inventors: Kouichirou Morimura, Yusuke Yoshida, Takahiro Ito, Hiroki Ishiguro
  • Publication number: 20240040786
    Abstract: A semiconductor structure includes an alternating stack of insulating layers and electrically conductive layers that is located on a front side of at least one semiconductor material layer. memory openings vertically extending through the alternating stack, memory opening fill structures located in the memory openings and including a respective vertical semiconductor channel and a respective vertical stack of memory elements, a dielectric material portion laterally offset from the alternating stack, a connection via structure vertically extending through the dielectric material portion, a metallic plate in contact with a proximal end surface of the connection via structure, and a backside contact pad in electrical contact with the metallic plate and spaced from the connection via structure by the metallic plate.
    Type: Application
    Filed: October 10, 2023
    Publication date: February 1, 2024
    Inventors: Yusuke YOSHIDA, Teruo OKINA, Takanori HANADA, Shigeyuki YOSHIDA
  • Publication number: 20240015959
    Abstract: A semiconductor structure includes an alternating stack of insulating layers and electrically conductive layers that is located on a front side of at least one semiconductor material layer; memory openings vertically extending through the alternating stack; memory opening fill structures; a dielectric material portion contacting sidewalls of the insulating layers of the alternating stack. In one embodiment, a connection via structure can vertically extend through the dielectric material portion, and a metal plate can contact the connection via structure. Alternately or additionally, an integrated via and pad structure may be provided, which includes a conductive via portion vertically extending through the dielectric material portion and a conductive pad portion located on an end of the conductive via portion.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 11, 2024
    Inventors: Yusuke Yoshida, Teruo Okina, Kenichi Okabe
  • Publication number: 20240009899
    Abstract: A compression mold includes a first mold and a second mold. The first mold includes a side surface member and a bottom surface member. The side surface member includes a step height on a bottom surface member side of the side surface member. The step height includes a first surface of the side surface member, a second surface that extends from the first surface toward the bottom surface member, and a third surface that extends downward from the second surface. The bottom surface member includes an upper surface where a resin material can be arranged and a slide surface that extends downward from the upper surface and is slidable with respect to the third surface of the side surface member. The third surface of the side surface member is not exposed while the resin material is supplied.
    Type: Application
    Filed: September 10, 2021
    Publication date: January 11, 2024
    Applicant: TOWA CORPORATION
    Inventors: Yusuke YOSHIDA, Yohei ONISHI
  • Patent number: 11858670
    Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a path along which the wire fed by the wire feeding unit is to be wound around a to-be-bound object; a butting part against which the to-be-bound object is to be butted; a cutting unit configured to cut the wire wound on the to-be-bound object; a binding unit configured to twist the wire wound on the to-be-bound object and cut by the cutting unit; and a tension applying part configured to apply tension to the wire to be cut at the cutting unit with a force higher than a force applied in a loosening direction of the wire wound on the to-be-bound object.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: January 2, 2024
    Assignee: MAX CO., LTD.
    Inventors: Osamu Itagaki, Shinpei Sugihara, Kouichirou Morimura, Yusuke Yoshida, Ichiro Kusakari
  • Patent number: 11850653
    Abstract: A binding machine includes: a wire feeding unit; a curl forming unit; a cutting unit; a binding unit; a motor; and a control unit. The binding unit includes: a rotary shaft to be driven by the motor; a wire engaging body configured to engage the wire and to rotate together with the rotary shaft, thereby twisting the wire; and a rotation regulation part configured to regulate rotation of the wire engaging body. The control unit is configured to control stop of the motor rotating in a direction of twisting the wire, based on a position in a rotation direction of the wire engaging body and a position at which the rotation of the wire engaging body can be regulated by the rotation regulation part.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: December 26, 2023
    Assignee: MAX CO., LTD.
    Inventors: Yusuke Yoshida, Kouichirou Morimura, Ichiro Kusakari
  • Publication number: 20230406557
    Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a path along which the wire fed by the wire feeding unit is to be wound around a to-be-bound object; a butting part against which the to-be-bound object is to be butted; a cutting unit configured to cut the wire wound on the to-be-bound object; a binding unit configured to twist the wire wound on the to-be-bound object and cut by the cutting unit; and a tension applying part configured to apply tension to the wire to be cut at the cutting unit with a force higher than a force applied in a loosening direction of the wire wound on the to-be-bound object.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 21, 2023
    Applicant: MAX CO., LTD.
    Inventors: Osamu ITAGAKI, Shinpei SUGIHARA, Kouichirou MORIMURA, Yusuke YOSHIDA, Ichiro KUSAKARI
  • Patent number: 11828373
    Abstract: The check valve (1) is of straight pipe joint type and oblique lift type. It includes: a valve seat (12a); a moving body (2) capable of linearly reciprocating between a closed state where it is in close contact with the valve seat and an open state where it is separated from the valve seat; a primary flow path (inflow path (12c)) on an upstream side of the moving body; and a secondary flow path (outflow path (12d)) on a downstream side of the moving body. The moving body includes a valve body (6) and a valve shaft (7) extending from the valve body. The valve seat supporting the valve body is formed to straddle the center line (CL) of the connection flow path that linearly extends including the primary flow path (inflow path) and the secondary flow path (outflow path 12d) in a cross section including the center line thereon.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: November 28, 2023
    Assignee: ISHIZAKI CO., LTD.
    Inventors: Nobuyuki Ishizaki, Takeshi Ouchi, Kazuhiro Ota, Daisuke Kikuchi, Kazuhiko Kojima, Futoshi Hasegawa, Eiji Hara, Yusuke Yoshida
  • Patent number: 11819904
    Abstract: A binding machine includes: a wire feeding unit; a curl forming unit; a butting part; a cutting unit; and a binding unit. The binding unit includes a rotary shaft; a wire engaging body configured to move in an axis direction of the rotary shaft and to engage the wire in a first operation area in the axis direction of the rotary shaft, and configured to move in the axis direction of the rotary shaft and to twist the wire with rotating together with the rotary shaft in a second operation area in the axis direction of the rotary shaft; a rotation regulation part configured to regulate rotation of the wire engaging body; and a tension applying part configured to perform, in the second operation area, operations of applying tension and releasing the applied tension on the wire engaged by the wire engaging body in the first operation area.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: November 21, 2023
    Assignee: MAX CO., LTD.
    Inventors: Kouichirou Morimura, Yusuke Yoshida, Ichiro Kusakari
  • Patent number: 11813692
    Abstract: A friction stir welding apparatus is used at a butted portion where a second workpiece is butted against a first workpiece such that the second workpiece is upright on the first workpiece. The friction stir welding apparatus includes: a rotary tool that is plunged into one inner corner of a pair of inner corners that are positioned, at the butted portion, on both sides of the second workpiece, respectively; an inner corner presser that presses the other inner corner of the pair of inner corners; and a mover that moves the rotary tool and the inner corner presser along a direction in which the butted portion extends. The inner corner presser includes a pressing roller that presses the other inner corner while rolling in a state where the inner corner presser is being moved by the mover.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: November 14, 2023
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Hideki Okada, Yusuke Yoshida, Kenichi Kamimuki
  • Patent number: 11779996
    Abstract: A binding machine includes a wire feeding unit configured to feed two wires to be wound on an object to be bound, a wire guide configured to align the two wires in parallel, a binding unit having an engaging member in which the wires are to be engaged, and the binding unit configured to twist the wires which are wound on the object to be bound and which are engaged in the engaging member, a curl guide configured to curl the wires being fed by the wire feeding unit into a loop shape, an inductive guide configured to guide the wires curled by the curl guide toward the binding unit, and a parallel alignment regulation part configured to guide an alignment direction of the two wires to be engaged with the engaging member in a radial direction of the loop.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: October 10, 2023
    Assignee: MAX CO., LTD.
    Inventors: Yusuke Yoshida, Kenichi Arai, Takahiro Ito, Shigeki Shindou
  • Publication number: 20230269540
    Abstract: A speaker includes a diaphragm having a perfectly circular hole in which a bobbin is attached and an oval or elliptical outer peripheral end. The diaphragm includes a perfectly circular cross-sectional area in the range of a predetermined height above a base having the perfectly circular hole. The diaphragm further includes an intermediate area whose outer surface has a small curvature radius above the perfectly circular cross-sectional area and an expanded area that is oval in cross section above the intermediate area.
    Type: Application
    Filed: February 9, 2023
    Publication date: August 24, 2023
    Applicant: ALPS ALPINE CO., LTD.
    Inventors: Hiroki Toita, Yusuke Yoshida
  • Patent number: 11725405
    Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl guide configured to curl the wire fed in a forward direction by the wire feeding unit; and a binding unit configured to twist the wire fed in a reverse direction by the wire feeding unit and wound on an object. The binding unit includes a wire engaging body configured to engage a tip end-side of the wire fed in the forward direction by the wire feeding unit, curled by the curl guide and wound around the object. The binding machine includes a pulling unit for pulling, toward the object, a wire on a second side positioned on an opposite side to the curl guide with respect to the object earlier than a wire on a first side positioned on the curl guide of the wire wound around the object and engaged at its tip end.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: August 15, 2023
    Assignee: MAX CO., LTD.
    Inventors: Kouichirou Morimura, Yusuke Yoshida
  • Publication number: 20230242291
    Abstract: A binding machine includes: a wire feeder; a curl forming unit forming a wire feeding path for winding a wire fed in a first direction by the wire feeder; a binding unit configured to twist a wire wound around the objects to be bound; and a controller configured to control the wire feeder and the binding unit. The wire feeder includes a pair of feed members configured to clamp a wire and feed a wire by a rotation operation, and a feed motor configured to rotate in a first rotation direction to drive the feed members to feed a wire in the first direction, and the controller changes a state into a first state and a second state to feed a wire in the first direction, when a wire is inserted into a position where a wire is feedable in the first direction by the pair of feed members.
    Type: Application
    Filed: December 28, 2022
    Publication date: August 3, 2023
    Applicant: MAX CO., LTD.
    Inventors: Kouichirou MORIMURA, Yusuke YOSHIDA, Takahiro ITO
  • Patent number: 11712823
    Abstract: The present invention provides a resin leakage prevention member 401 for use in a molding die 1000, wherein the molding die 1000 includes a lower die 200 and an upper die 100, the lower die 200 has a side member 201 and a bottom member 202, a space surrounded by the side member 201 and the bottom member 202 forms a cavity 204, the cavity 204 is configured to accommodate a resin material 20a, the side member 201 is configured to move relatively vertical to the bottom member 202, and the resin leakage prevention member 401 is disposed on a peripheral portion of an upper surface of the bottom member 202 and along an inner peripheral surface of the side member 201, thereby sealing a gap between the side member 201 and the bottom member 202 and preventing a resin from leaking from the cavity 204 into the gap.
    Type: Grant
    Filed: August 21, 2021
    Date of Patent: August 1, 2023
    Assignee: TOWA CORPORATION
    Inventors: Yusuke Yoshida, Yohei Onishi
  • Patent number: 11699741
    Abstract: In an example, a method includes depositing a first sidewall spacer layer over a substrate having a layer stack including alternating layers of a nanosheet and a sacrificial layer, and a dummy gate formed over the layer stack, the first sidewall spacer layer formed over the dummy gate. The method includes depositing a metal-containing liner over the first sidewall spacer layer; forming a first sidewall spacer along the dummy gate by anisotropically etching the metal-containing liner and the first sidewall spacer layer; performing an anisotropic etch back process to form a plurality of vertical recesses in the layer stack; laterally etching the layer stack and form a plurality of lateral recesses between adjacent nanosheets; depositing a second sidewall spacer layer to fill the plurality of lateral recesses; and etching a portion of the second sidewall spacer layer to expose tips of the nanosheet layers.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: July 11, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Yusuke Yoshida, Sergey Voronin, Christopher Talone, Alok Ranjan
  • Publication number: 20230166319
    Abstract: A binding machine includes a wire feeding unit configured to feed two wires to be wound on an object to be bound, a wire guide configured to align the two wires in parallel, a binding unit having an engaging member in which the wires are to be engaged, and the binding unit configured to twist the wires which are wound on the object to be bound and which are engaged in the engaging member, a curl guide configured to curl the wires being fed by the wire feeding unit into a loop shape, an inductive guide configured to guide the wires curled by the curl guide toward the binding unit, and a parallel alignment regulation part configured to guide an alignment direction of the two wires to be engaged with the engaging member in a radial direction of the loop.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 1, 2023
    Applicant: MAX CO., LTD.
    Inventors: Yusuke YOSHIDA, Kenichi ARAI, Takahiro ITO, Shigeki SHINDOU
  • Patent number: 11635147
    Abstract: The seal ring is annular around an axis x and includes an annular outer peripheral surface facing an outer periphery side, and a plurality of recessed parts. The recessed parts are formed in such a way as to be spaced apart from each other in a circumferential direction and are recessed from the outer peripheral surface toward an inner periphery side. The recessed parts expand, in the axis x direction, from one side surface to a position which does not reach another side surface. The outer peripheral surface includes a annular contact surface between the another side surface and the position, and rib surfaces respectively between mutually neighboring recessed parts in the circumferential direction. Each of the rib surfaces extends between the one side surface and the position in the axis x direction.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: April 25, 2023
    Assignee: NOK CORPORATION
    Inventors: Yusuke Yoshida, Koji Watanabe
  • Patent number: 11614169
    Abstract: A seal ring has, on an outer peripheral surface side thereof, a pair of recessed parts 140 extending in a circumferential direction on both sides in a width direction thereof to form a projection part 120 between the pair of recessed parts 140, and has a plurality of ribs 130 connected to the projection part 120 and extending to lateral surfaces of the seal ring at intervals in the circumferential direction inside the pair of recessed parts 140, and a plurality of ribs 130 arranged on a sealed region side among the plurality of ribs 130 have lateral-wall surfaces on an upstream side in a relative rotation direction of a housing with respect to a shaft, each of the lateral-wall surfaces having inclined surfaces inclined from the upstream side to a downstream side in the relative rotation direction of the housing from the projection part 120 toward the lateral surfaces of the seal ring.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 28, 2023
    Assignee: NOK CORPORATION
    Inventor: Yusuke Yoshida
  • Patent number: 11608202
    Abstract: A binding machine includes a wire feeding unit, a binding unit, a curl guide and an inductive guide. The inductive guide has a converging passage through which the wire fed by the wire feeding unit and curled by the curl guide passes, and a cross-sectional area of the converging passage decreases along an entry direction of the wire from an opening end portion that the wire enters. The inductive guide has an entry angle regulation part configured to change an entry angle of the wire entering the converging passage, and the inductive guide is provided on an inner side with respect to a virtual line interconnecting the opening end portion and a narrowest part of the converging passage at which the cross-sectional area is the narrowest.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: March 21, 2023
    Assignee: MAX CO., LTD.
    Inventors: Yusuke Yoshida, Kenichi Arai, Makoto Kosuge, Shigeki Shindou