Abstract: A binding machine includes: a wire feeding unit configured to feed a wire; a curl forming unit configured to form a path along which the wire fed by the wire feeding unit is to be wound around a to-be-bound object; a butting part against which the to-be-bound object is to be butted; a cutting unit configured to cut the wire wound on the to-be-bound object; a binding unit configured to twist the wire wound on the to-be-bound object and cut by the cutting unit; and a tension applying part configured to apply tension to the wire to be cut at the cutting unit with a force higher than a force applied in a loosening direction of the wire wound on the to-be-bound object.

Abstract: An endoscope illumination light switching device includes a rotation body in which a plurality of holes including a first hole are formed in a circumferential direction and that switches a hole on an irradiation optical path through rotation, a drive device configured to rotationally drive the rotation body, a sensor, and a processor configured to control a stop position of the rotation body based on a detection signal from the sensor. The rotation body includes a first detection target shape portion corresponding to the first hole, and another detection target shape portion. The sensor outputs a detection signal in response to detection of each shape portion when the rotation body rotates.

Abstract: A light source device includes has a configuration in which a height of a heat sink from a reference surface when the reference surface is a bottom surface of a housing is set to be lower than a height of a light source unit from the reference surface, and a heat pipe includes a first heat pipe, a first end part of which is connected with the heat generation body and a second end part of which is connected with the heat sink, and a second heat pipe, a third end part of which is connected with a heat generation body and a fourth end part of which is connected with the heat sink so that a distance to the second end part is longer than a distance between the first end part and the third end part.

Abstract: A seal ring capable of stabilizing sealing performance while reducing rotation torque. A seal ring 100 has a plurality of first dynamic pressure generation groove 131 and a plurality of second dynamic pressure generation groove 132 on an outer peripheral surface thereof with intervals in the circumferential direction, the plurality of first dynamic pressure generation groove 131 extending from a position close to a first side surface 100A with respect to the center of width in an axial direction to the first side surface 100A and configured to generate dynamic pressure with relative rotation between a housing and the seal ring 100, and the plurality of second dynamic pressure generation groove 132 extending from a position close to a second side surface 100B with respect to the center of width in the axial direction to the second side surface 100B and configured to generate dynamic pressure with the relative rotation between the housing and the seal ring 100.

Abstract: Plasma ion energy distribution for ions having different masses is controlled by controlling the relationship between a base RF frequency and a harmonic RF frequency. By the controlling the RF power frequencies, characteristics of the plasma process may be changed based on ion mass. The ions that dominate etching may be selectively based upon whether an ion is lighter or heavier than other ions. Similarly, atomic layer etch processes may be controlled such that the process may be switched between a layer modification step and a layer etch step though adjustment of the RF frequencies. Such switching is capable of being performed within the same gas phase of the plasma process. The control of the RF power includes controlling the phase difference and/or amplitude ratios between a base RF frequency and a harmonic frequency based upon the detection of one or more electrical characteristics within the plasma apparatus.

Abstract: An electric power tool includes a driving unit generating a driving force by electricity and various components functioning by electricity, a circuit board on which a control unit configured to control the driving unit and the various components is mounted, a plurality of connectors connecting a plurality of wirings, which extend from the driving unit and the various components, with a plurality of wirings, which extend from the circuit board, a body portion installed therein with the driving unit, the various components, the circuit board and the plurality of connectors, and a receiving portion which receives the plurality of connectors therein and which is fixed to the body portion.

Abstract: Embodiments are described herein that form silicon germanium nano-wires while reducing or eliminating erosion of nitride layers (e.g., masks and spacers) caused during selective etching of silicon with respect to silicon germanium during formation of silicon germanium nano-wires. oxide layers are used to protect nitride layers during formation of silicon germanium (SiGe) nano-wires. In particular, multilayer spacers including oxide/nitride/oxide layers are formed to protect the nitride layers during selective silicon etch processes that are used to form silicon germanium nano-wires, for example, for field effect transistors (FETs). The multilayer spacers allow for target levels of erosion to be achieved for the nitride layers.

Abstract: A sheet handling apparatus includes: a transport path along which a sheet is transported; a first transport member disposed on one side of the transport path; and a second transport member disposed opposed to the first transport member with the transport path interposed therebetween. The first transport member and the second transport member are driven to rotate. The sheet is transported by the first transport member rotating with an outer peripheral surface thereof being in contact with a first face of the sheet, and by the second transport member rotating in a direction opposite to a rotation direction of the first transport member, with an outer peripheral surface thereof being in contact with a second face of the sheet different from the first face.

Abstract: Methods are disclosed to detect plasma light emissions during plasma processing, to analyze light intensity data associated with the plasma source, and to adjust operating parameters for the plasma source and/or the process chamber based upon light intensity distributions associated with the plasma processing. The light intensity distributions for the plasma sources and related analysis can be conducted across multiple processing tools. For some embodiments, plasma discharge stability and/or chamber-to-chamber matching information is determined based upon light intensity data, and the operation of the processing tools are adjusted or controlled based upon stability and/or matching determinations. The disclosed embodiments thereby provide simple, low-cost solutions to assess and improve plasma sources and discharge stability for plasma processing tools such as plasma etch and deposition tools.

Abstract: Systems and methods are disclosed for plasma discharge ignition to reduce surface particles and thereby decrease defects introduced during plasma processing. A microelectronic workpiece is positioned on a holder within a process chamber that includes a first radio frequency (RF) power source configured to couple RF power to a top portion of the process chamber, a second RF power source configured to couple RF power to the holder, and a direct current (DC) power supply. Initially, a process gas for plasma process is flowed into the process chamber. The process gas is ignited to form plasma by activating the second RF power source to apply RF power to the holder. Subsequently, the microelectronic workpiece is clamped to the holder by applying the positive voltage to the holder with the DC power supply, and the first RF power source is activated to maintain the plasma within the process chamber.

Abstract: In order to drop a coin into an opening formed in a transport path for sorting coins, a coin handling apparatus includes: a transport path having a transport surface in which the opening for dropping a coin is formed; a conveyor configured to transport a coin on the transport surface along the transport path; a gate including a plurality of members configured to move between a closed position for closing the opening such that a coin transported by the conveyor is not dropped into the opening, and an opened position for opening the opening such that the coin is dropped into the opening; and a drive motor configured to drive the plurality of members to control the gate to move between the closed position and the opened position.

Abstract: The seal ring is annular around an axis x and includes an annular outer peripheral surface facing an outer periphery side, and a plurality of recessed parts. The recessed parts are formed in such a way as to be spaced apart from each other in a circumferential direction and are recessed from the outer peripheral surface toward an inner periphery side. The recessed parts expand, in the axis x direction, from one side surface to a position which does not reach another side surface. The outer peripheral surface includes a annular contact surface between the another side surface and the position, and rib surfaces respectively between mutually neighboring recessed parts in the circumferential direction. Each of the rib surfaces extends between the one side surface and the position in the axis x direction.

Abstract: A binding machine includes a wire feeding unit configured to feed a wire to be wound on an object to be bound, a binding unit configured to twist the wire wound on the object to be bound, a curl guide configured to curl the wire being fed by the wire feeding unit, an inductive guide configured to guide the wire curled by the curl guide toward the binding unit, and a retraction guide part configured to retract the wire to a downstream side of the binding unit with respect to a feeding direction of the wire that is fed by the wire feeding unit in a direction of curling the wire by the curl guide.

Abstract: A binding machine includes a wire feeding unit configured to feed a wire to be wound on an object to be bound, a binding unit configured to twist the wire wound on the object to be bound, a curl guide configured to curl the wire being fed by the wire feeding unit, and an inductive guide configured to guide the wire curled by the curl guide toward the binding unit. The wire feeding unit includes a pair of feeding members facing each other with a feeding path of the wire being interposed therebetween, each of the feeding members configured to rotate about a shaft as a support point extending in a direction intersecting with the feeding path of the wire, and a position regulation part configured to regulate axial relative positions of the pair of feeding members.

Abstract: A binding machine includes a wire feeding unit configured to feed two wires to be wound on an object to be bound, a wire guide configured to align the two wires in parallel, a binding unit having an engaging member in which the wires are to be engaged, and the binding unit configured to twist the wires which are wound on the object to be bound and which are engaged in the engaging member, a curl guide configured to curl the wires being fed by the wire feeding unit into a loop shape, an inductive guide configured to guide the wires curled by the curl guide toward the binding unit, and a parallel alignment regulation part configured to guide an alignment direction of the two wires to be engaged with the engaging member in a radial direction of the loop.

Abstract: A binding machine includes a wire feeding unit, a binding unit, a curl guide and an inductive guide. The inductive guide has a converging passage through which the wire fed by the wire feeding unit and curled by the curl guide passes, and a cross-sectional area of the converging passage decreases along an entry direction of the wire from an opening end portion that the wire enters. The inductive guide has an entry angle regulation part configured to change an entry angle of the wire entering the converging passage, and the inductive guide is provided on an inner side with respect to a virtual line interconnecting the opening end portion and a narrowest part of the converging passage at which the cross-sectional area is the narrowest.

Abstract: In one example, a method of processing a substrate includes receiving a substrate in a processing chamber, the substrate having an etch mask positioned over an underlying layer to be etched, where the underlying layer is a silicon-containing layer. The method includes executing a first etch process that includes forming a first plasma from a first process gas that includes hydrogen bromide or chlorine and etching the underlying layer using products of the first plasma. The method includes executing a second etch process that includes forming a second plasma from a second process gas that includes fluorine and etching the substrate using products from the second plasma. The method may include alternating between the first etch process and the second etch process.

Abstract: Residue at the base of a feature in a substrate to be etched is limited so that improved profiles may be obtained when forming vertical, narrow pitch, high aspect ratio features, for example fin field effect transistor (FinFET) gates. A thin bottom layer of the feature is formed of a different material than the main layer of the feature. The bottom material may be comprised of a material that preferentially etches and/or preferentially oxidizes as compared to the main layer. The bottom layer may comprise silicon germanium. The preferential etching characteristics may provide a process in which un-etched residuals do not remain. Even if residuals remain, after etch of the feature, an oxidation process may be performed. Enhanced oxidation rates of the bottom material allow any remaining residual to be oxidized. Plasma oxidation may be used. The oxidized material may then be removed by utilizing standard oxide removal mechanisms.

Abstract: A binding machine includes: an accommodation portion accommodating a reel around which a wire is wound; a wire feeding portion configured to feed the wire in a forward direction, winds the wire around a binding object, feeds the wire in a reverse direction, and wraps the wire around the binding object; and a torsion portion that twists the wire. The accommodation portion accommodates the reel such that the reel is offset in one direction along an axial direction of the reel with respect to the wire feeding portion. The binding machine further includes a restricting portion, in a wire passage between the reel and the wire feeding portion, which protrudes inward of the accommodation portion and has a restricting surface with which the wire bent in the other direction along the axial direction of the reel between the reel and the wire feeding portion comes in contact.