Patents by Inventor Yutaka Unno

Yutaka Unno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11367631
    Abstract: A ceramic heater includes a ceramic plate having a wafer placement surface on which a wafer is to be placed, and incorporating a resistance heating element therein, and a ceramic tubular shaft having one end joined to a rear surface of the plate. The tubular shaft has a vertical sectional shape including an S-like portion or a curved portion having an inflection point in at least one position, and includes a through-hole penetrating the tubular shaft from the one end to the other end with an axis extending along the vertical sectional shape of the tubular shaft.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: June 21, 2022
    Assignee: NGK Insulators, Ltd.
    Inventor: Yutaka Unno
  • Publication number: 20220174788
    Abstract: A ceramic heater includes a disc-shaped ceramic plate having a wafer placement surface, and a shaft provided on a surface on an opposite side of the wafer placement surface of the ceramic plate. First and second resistance heating elements are embedded inside the ceramic plate. When the ceramic plate is viewed from above, the gap (first gap) between first turn-back sections which face each other in a circumferential direction, and the gap (second gap) between second turn-back sections which face each other in a circumferential direction are arranged so as not to overlap.
    Type: Application
    Filed: November 17, 2021
    Publication date: June 2, 2022
    Applicant: NGK INSULATORS, LTD.
    Inventors: Tomohiro HARA, Yutaka UNNO
  • Publication number: 20220146526
    Abstract: A method for evaluating a sample includes obtaining a blood plasma sample prepared from human blood, conducting detection of a predetermined molecule in the blood plasma sample, and evaluating the quality of the blood plasma sample based on the intensity of the molecule acquired by the detection.
    Type: Application
    Filed: January 27, 2020
    Publication date: May 12, 2022
    Applicant: SHIMADZU CORPORATION
    Inventors: Yumi UNNO, Shuichi KAWANA, Yutaka AOKI, Junichi MASUDA, Hirotaka FUJIMOTO, Tsuyoshi NAKANISHI
  • Publication number: 20220112599
    Abstract: A ceramic heater includes a disk-shaped ceramic plate having a wafer placement surface on a front surface thereof, the ceramic plate having a plasma electrode and a heater electrode embedded therein in this order, from closest to the wafer placement surface to farthest, in such a manner that the plasma electrode and the heater electrode are spaced apart from each other; a cylindrical shaft that supports the ceramic plate from a back surface of the ceramic plate; a plasma electrode connecting member arranged in the cylindrical shaft and connected to the plasma electrode; a heater electrode connecting member arranged in the cylindrical shaft and connected to the heater electrode; and a planar shield portion arranged on the back surface of the ceramic plate or embedded in the ceramic plate so as to be closer to the back surface than the heater electrode, the planar shield portion being connected to ground.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 14, 2022
    Applicant: NGK INSULATORS, LTD.
    Inventors: Tomohiro HARA, Yutaka UNNO
  • Patent number: 11223302
    Abstract: An electrostatic chuck has a structure in which an electrostatic electrode is embedded in a disk-like ceramic plate and attracts a wafer that is placed on the ceramic plate and that has a diameter smaller than that of the ceramic plate by Johnsen-Rahbek force. The electrostatic chuck includes an insulating film that has an electric resistance larger than that of the ceramic plate in an annular region of a front surface of the ceramic plate from an outer circumferential edge of the ceramic plate to the inside of an outer circumferential edge of the wafer that is placed on the ceramic plate.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: January 11, 2022
    Assignee: NGK Insulators, Ltd.
    Inventors: Reo Watanabe, Nobuyuki Kondou, Yutaka Unno
  • Publication number: 20210007181
    Abstract: A wafer placement table includes: a ceramic member having a wafer placement surface; a mesh electrode buried in the ceramic member; a conductive connection member in contact with the mesh electrode and exposed to outside from a surface of the ceramic member on the opposite side of the wafer placement surface; and an external current-carrying member joined to a surface of the connection member exposed to outside. The mesh electrode has a mesh opening in a region that faces the connection member, and the mesh opening is filled with a sintered conductor being a sintered body of a mixture containing a conductive powder and a ceramic raw material.
    Type: Application
    Filed: June 11, 2020
    Publication date: January 7, 2021
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka UNNO, Shuichiro MOTOYAMA
  • Publication number: 20200396801
    Abstract: A multi-zone heater includes an outer circumferential zone heater and first and second elemental wire portions. The outer circumferential zone heater is a coil that is provided in an outer circumferential zone of a ceramic substrate in the same plane as a plane in which a central zone heater is provided and that is routed throughout the outer circumferential zone in a unicursal manner from one end portion to the other end portion in the outer circumferential portion. The first elemental wire portion extends from a first terminal, passes through a central portion, is connected to the one end portion of the outer circumferential zone heater, and has a meandering shape in plan view. The second elemental wire portion extends from a second terminal, passes through the central portion, is connected to the other end portion of the outer circumferential zone heater, and has a meandering shape in plan view.
    Type: Application
    Filed: August 28, 2020
    Publication date: December 17, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka UNNO, Nobuyuki KONDOU
  • Patent number: 10861680
    Abstract: A wafer support of the present invention includes shield sheet embedded in the ceramic base between the plasma generation electrode and the heater electrode in a state not contacting both the electrodes; and a shield pipe electrically connected to the shield sheet and laid to extend to outside of the ceramic base from the surface of the ceramic base on the side opposite to the wafer placement surface, wherein the wiring member for the plasma generation electrode is inserted through inside of the shield pipe in a state not contacting the shield pipe, and the wiring member for the heater electrode is disposed outside the shield pipe in a state not contacting the shield pipe.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: December 8, 2020
    Assignee: NGK Insulators, Ltd.
    Inventors: Daiki Maeda, Yutaka Unno
  • Publication number: 20200312696
    Abstract: An electrostatic-chuck heater is a Johnsen-Rahbek electrostatic-chuck heater and is used in a process of forming a conductive film on a wafer. The electrostatic-chuck heater includes a disc-shaped ceramic base including an electrostatic electrode and a heating resistor, and a hollow shaft attached to a side of the ceramic base that is opposite a wafer-mounting surface. A protruding ring is provided on the wafer-mounting surface and having an outside diameter smaller than a diameter of the wafer. A through-hole extends in a peripheral wall of the hollow shaft from a lower end through to an area of the wafer-mounting surface that is on an inner side with respect to the protruding ring. The through-hole allows gas to be supplied from the lower end of the hollow shaft into a below-wafer space enclosed by the wafer-mounting surface, the protruding ring, and the wafer mounted on the wafer-mounting surface.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 1, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka UNNO, Reo WATANABE
  • Publication number: 20200163165
    Abstract: A ceramic heater includes a ceramic plate having a wafer mounting surface and having a resistive heating element embedded in the plate; and a ceramic tubular shaft having a tubular shape and bonded to a back surface of the plate. The plate has a circular recess with a bottom in the back surface thereof. The tubular shaft has a plate-side flange extending radially outward from an outer peripheral surface of a plate-side end portion. An entire end surface of the plate-side end portion of the tubular shaft is bonded to a bonding region of the back surface of the plate outside the circular recess. The opening diameter d1 of the plate-side end portion of the tubular shaft, the inner diameter d2 of the plate-side flange of the tubular shaft, and the diameter D1 of the circular recess of the plate satisfy d2?d1?D1.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventor: Yutaka Unno
  • Publication number: 20200126773
    Abstract: An electrostatic-chuck heater is of a Johnsen-Rahbek type and is used in a process of forming a conductive film on a wafer. The electrostatic-chuck heater includes a disc-shaped ceramic base including an electrostatic electrode and a heating resistor, and a hollow shaft attached to a side of the ceramic base that is opposite a side having a wafer-mounting surface. A through-hole extends in a peripheral wall of the hollow shaft from a lower end through to an area of the wafer-mounting surface that is on an inner side with respect to a circular groove. The through-hole allows gas to be supplied from the lower end of the hollow shaft into a below-wafer space enclosed by the wafer-mounting surface, an outermost projection group, and the wafer mounted on the wafer-mounting surface.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka UNNO, Reo WATANABE
  • Publication number: 20200111697
    Abstract: An electrostatic chuck has a structure in which an electrostatic electrode is embedded in a disk-like ceramic plate and attracts a wafer that is placed on the ceramic plate and that has a diameter smaller than that of the ceramic plate by Johnsen-Rahbek force. The electrostatic chuck includes an insulating film that has an electric resistance larger than that of the ceramic plate in an annular region of a front surface of the ceramic plate from an outer circumferential edge of the ceramic plate to the inside of an outer circumferential edge of the wafer that is placed on the ceramic plate.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 9, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Reo WATANABE, Nobuyuki KONDOU, Yutaka UNNO
  • Publication number: 20200090964
    Abstract: A ceramic heater includes a ceramic substrate including, on an upper surface, a wafer mount surface that receives a wafer, and a heater electrode embedded in an inside of the ceramic substrate. The ceramic substrate includes a core portion and a surface layer portion disposed on a surface of the core portion. The surface layer portion has volume resistivity higher than volume resistivity of the core portion. The core portion has thermal conductivity higher than thermal conductivity of the surface layer portion. The surface layer portion is disposed over an area of at least one of a side surface of the core portion and an upper surface of the core portion, the area being not covered with the wafer.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka UNNO, Shuichiro MOTOYAMA
  • Publication number: 20200075361
    Abstract: A ceramic heater includes a ceramic plate having a wafer placement surface on which a wafer is to be placed, and incorporating a resistance heating element therein, and a ceramic tubular shaft having one end joined to a rear surface of the plate. The tubular shaft has a vertical sectional shape including an S-like portion or a curved portion having an inflection point in at least one position, and includes a through-hole penetrating the tubular shaft from the one end to the other end with an axis extending along the vertical sectional shape of the tubular shaft.
    Type: Application
    Filed: August 22, 2019
    Publication date: March 5, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventor: Yutaka UNNO
  • Patent number: 10566218
    Abstract: A ceramic heater includes a disk-shaped ceramic plate with an upper surface defining a wafer placement surface on which a wafer is to be placed. One or more inner-peripheral-side heater elements are embedded in an inner peripheral zone of the ceramic plate, and one or more outer-peripheral-side heater elements are embedded in an outer peripheral zone of the ceramic plate. A thickness of the ceramic plate in a predetermined zone is 3.9% or less of a diameter of the ceramic plate. The predetermined zone is a zone including a boundary line between the inner peripheral zone and the outer peripheral zone.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: February 18, 2020
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Hiroshi Takebayashi
  • Publication number: 20180218885
    Abstract: A wafer support of the present invention includes shield sheet embedded in the ceramic base between the plasma generation electrode and the heater electrode in a state not contacting both the electrodes; and a shield pipe electrically connected to the shield sheet and laid to extend to outside of the ceramic base from the surface of the ceramic base on the side opposite to the wafer placement surface, wherein the wiring member for the plasma generation electrode is inserted through inside of the shield pipe in a state not contacting the shield pipe, and the wiring member for the heater electrode is disposed outside the shield pipe in a state not contacting the shield pipe.
    Type: Application
    Filed: January 24, 2018
    Publication date: August 2, 2018
    Applicant: NGK INSULATORS, LTD.
    Inventors: Daiki Maeda, Yutaka Unno
  • Publication number: 20180204748
    Abstract: A ceramic heater includes a disk-shaped ceramic plate with an upper surface defining a wafer placement surface on which a wafer is to be placed. One or more inner-peripheral-side heater elements are embedded in an inner peripheral zone of the ceramic plate, and one or more outer-peripheral-side heater elements are embedded in an outer peripheral zone of the ceramic plate. A thickness of the ceramic plate in a predetermined zone is 3.9% or less of a diameter of the ceramic plate. The predetermined zone is a zone including a boundary line between the inner peripheral zone and the outer peripheral zone.
    Type: Application
    Filed: March 1, 2018
    Publication date: July 19, 2018
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yutaka Unno, Hiroshi Takebayashi
  • Publication number: 20170069520
    Abstract: A ceramic heater 10 includes a ceramic member 12, a heater element 14, a connection member 16, and an externally conducting member 18. The connection member 16 is a cylindrical metal member embedded in a bottom surface of a hole 12c in the ceramic member 12 so as to reach the heater element 14. The connection member 16 has a diameter D of 3.5 to 5 mm. The connection member 16 includes a circular surface that touches the heater element 14, a cylinder side surface, and a corner portion 16b between the circular surface and the cylinder side surface. The corner portion 16b has a curvature radius R of 0.3 to 1.5 mm. The ratio R/D is within a range of 0.09 to 0.30. The externally conducting member 18 is joined to the connection member 16 with a joining layer 20 interposed therebetween.
    Type: Application
    Filed: November 17, 2016
    Publication date: March 9, 2017
    Applicant: NGK INSULATORS, LTD.
    Inventor: Yutaka UNNO
  • Patent number: 9548226
    Abstract: A high-frequency power supply includes a shaft bonded to one surface of a plate serving as a gas distributor plate. The plate includes a radio-frequency electrode buried therein. The shaft has a through-hole through which a gas flows. The plate and the shaft are made of a ceramic material. The shaft has a double-tube structure including the inner tube and the outer tube . The interior space of the inner tube forms the through-hole. The plate is hermetically solid-state bonded to the inner tube and the outer tube. The shaft is bonded to the center of the plate.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: January 17, 2017
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Tetsuhisa Abe
  • Patent number: 9123757
    Abstract: A heating device 10 includes a ceramic base 20, a resistance heating element 22, and a hollow shaft 40. The ceramic base 20 includes a central portion 20a and a peripheral portion 20b. The resistance heating element 22 is designed in such a manner that the density of heating in the central portion 20a is 1.4 to 2.0 times that in the peripheral portion 20b. The hollow shaft 40 includes a first section 41 and a second section 42. The thickness tb1 of the first section 41 is 6 to 10 mm. The thickness tb2 of the second section 42 is 0.3 to 0.5 times the thickness tb1 of the first section 41. The length of the first section 41 is 0.4 to 0/8 times the overall length of the hollow shaft 40.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: September 1, 2015
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Junya Waki