Abstract: A heating apparatus for a semiconductor producing system is provided, including a heater having a mounting face, an opposed back face, a first resistance heating element, a second resistance heating element provided along substantially the same plane as the first heating element, a first terminal connected with the first heating element and a second terminal connected with the second heating element. A supporting member is fixed to the back face of the heater. First and second power supply means are respectively connected with the first and second terminals and contained in an inner space of the supporting member. A conductive connector connects the first heating element and the first terminal but not the second heating element. The first heating element is provided in a first zone, the second heating element is provided in a second zone, and the conductive connector is provided in the plane and the second zone.

Abstract: A heating device includes a substantially cylindrical shaft joined to a joint surface of a plate-shaped ceramic substrate opposite to a heating surface, the ceramic substrate including a resistance heating element embedded in the ceramic substrate. The shaft includes a flange portion formed in the end joined to the ceramic substrate and a first cylindrical portion connecting to the flange portion, and a ratio D3/D1 of an inner diameter D3 of a joint area in the flange portion and an outer diameter D1 of the first cylindrical portion is not less than 92%.

Abstract: A heating device comprises a substrate having a heating surface, a heating element buried in the substrate, a cylindrical member joined to the substrate, and lead wires for supplying current to the heating element. In addition, the thermal conductivity of the substrate is about 1.0 to about 2.0 times the thermal conductivity of the cylindrical member.

Abstract: A heater including a plate-shaped substrate having a heating surface for heating an object and a heater element provided in the substrate or on its surface. A central axis C2 of a circumscribed circle of the heater element and a central axis C1 of the substrate are not on the same axis and a gap exists between the axes. When manufacturing the heater, a central axis C1 of a resistant heater is specified, thermal uniformity of the heating surface of a preliminary substrate is evaluated, and a central axis C2 of the substrate is specified. The central axis C2 is specified at a position where the thermal uniformity of the heating surface is superior to a case where the central axis C2 of the substrate is located on the central axis C1. Then a substrate having the central axis C2 is formed by subjecting the preliminary substrate to grinding processing.

Abstract: Disclosed is a substrate processing device capable of reducing damage of a peripheral member when a power supply member generates heat. The substrate processing device includes: a resistance heating element and a high-frequency electrode, to which a voltage is applied; a power supply member for a resistance heating element, and a power supply member for a high-frequency electrode, which supply power to the resistance heating element and the high-frequency electrode, respectively; a peripheral member disposed close to circumferences of these power supply members; and heat insulators arranged between the power supply members and the peripheral member and having heat resistance to a temperature at least higher than 250° C.

Abstract: To provide a plasma processing device in which an amount of heat generated from a power supply member is small when the power supply member is supplied with high frequency current. A substrate heater as the plasma processing device includes a ceramic base including a high frequency electrode and a high frequency electrode power supply member supplying high frequency current to the high frequency electrode. The high frequency electrode power supply member includes a power supply body and a high conductivity metal layer which is formed on the outer peripheral surface of the power supply body and has a conductivity higher than that of the power supply body.

Abstract: A processing device includes a base which holds a processing target. In the base, a gas providing passage circular in cross section, which provides gas to an outer circumference of the base, is formed.

Abstract: According to a related art for evaluating the position accuracy of heaters with respect to the plate, it is necessary to attach an energizing electrode to the heaters, and energize the heaters for a predetermined period to heat the entire plate, before measuring the temperature distribution map. Therefore, there is a problem in that several tens of minutes are required until the temperature distribution map can be measured. As the plate becomes larger, the time required for energizing the heaters to heat the entire plate becomes longer. A technique for evaluating the position accuracy of heaters with respect to the plate, without executing a process for energizing the heaters to heat the plate is disclosed.

Abstract: A gas providing member includes a body portion which forms a gas providing passage between the body portion and a processing member which holds the processing target, and the gas providing passage provides gas onto a processing target. In the body portion, a gas reservoir portion located in the gas providing passage is formed.

Abstract: An object of the present invention is to provide a ceramic heater so that hot spots around the end portions of a heat resistor may be prevented. A ceramic heater has a ceramic substrate having a mounting face for an object to be heated, a heat resistor 3B embedded in the substrate and having end portions 3a, and a connecting member 6 electrically connected with the end portion 3a. At least one connecting member 6 substantially has an outer shape of a sphere, an ellipsoid of revolution, or a cylinder. The connecting member 6 has a fixing portion 3a of the heat resistor by means of caulking.

Abstract: A heating device comprises a substrate having a heating surface, a heating element buried in the substrate, a cylindrical member joined to the substrate, and lead wires for supplying current to the heating element. In addition, the thermal conductivity of the substrate is about 1.0 to about 2.0 times the thermal conductivity of the cylindrical member.

Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Abstract: A heating system 25 has a main electric heat-generating element 3 and a heating surface 4a for heating an object, auxiliary electric heat-generating elements 5A to 5D, and a main power source 1 for supplying power to the main heating element. The system 25 further has an auxiliary power source 2 for supplying power to the auxiliary heating elements, and a power source controller for controlling the power supplied to the main heating element and to the auxiliary heating elements respectively and independently. Power supplied to the main heating element 3 is controlled by the controller within a first power range and power supplied to the auxiliary heating elements is controlled by the controller within a second power range. The second power range has a width smaller than that of the first power range so as to control temperature distribution on the heating surface 4a.

Abstract: A heater includes a plate-shaped substrate having a heating surface for heating an object to be heated and a heater element provided in the substrate or on a surface thereof. A central axis C2 of a circumscribed circle of the resistant heater element and a central axis C1 of the substrate are not on the same axis and there is a gap between these two axes. In a method of manufacturing the heater, a central axis C1 of a resistant heater is specified, thermal uniformity of the heating surface of a preliminary substrate is evaluated, and a central axis C2 of the substrate is specified. The central axis C2 is specified at a position where the thermal uniformity of the heating surface is superior to a case where the central axis C2 of the substrate is located on the central axis C1. Then a substrate having the central axis C2 is formed by subjecting the preliminary substrate to grinding processing.

Abstract: An object of the present invention is to provide a ceramic heater so that hot spots around the end portions of a heat resistor may be prevented. A ceramic heater has a ceramic substrate having a mounting face for an object to be heated, a heat resistor 3B embedded in the substrate and having end portions 3a, and a connecting member 6 electrically connected with the end portion 3a. At least one connecting member 6 substantially has an outer shape of a sphere, an ellipsoid of revolution, or a cylinder. The connecting member 6 has a fixing portion 6a fixing the end portion 3a of the heat resistor by means of caulking.

Abstract: A heating apparatus 10A usable for a system for producing a semiconductor is provided. The apparatus has a heater 1A with a mounting face 2a for mounting a semiconductor and a back face 2b, a supporting member 11 fixed to the back face 2b of the heater 1A and having an outer surface and an inner surface facing an inner space. The apparatus further has a first power supply means 15 and a second power supply means 14. The heater 1A has a plate-shaped substrate 2, a first heating element 3 composed of a resistance heating material, and a second heating element 4 composed of a resistance heating material and controllable independently with respect to the element 3. The heater further has a first terminal 6A connected with the first heating element 3 and a second terminal 7 connected with the second heating element 4. The supporting member 11 has a length larger than the width “L” of the supporting member 11.

Abstract: A heating system 25 has a main heating element 3 generating heat be supplying an electric power supplied and having a heating surface 4a for heating an object, auxiliary heating elements 5A to 5D generating heat by supplying an electric power, and a main power source 1 for supplying the to the main heating element 3. The system 25 further has an auxiliary power source 2 supplying the power to the auxiliary heating elements 5A to 5D, and a power source controller 2 for controlling the power supplied to the main heating element and the power supplied to the auxiliary heating elements respectively and independently. The power supplied from the main power source 1 to the main heating element 3 is controlled by the controller 2 within a first power range. The power supplied from the auxiliary power source to the auxiliary heating elements is controlled by the controller 2 within a second power range.