Patents by Inventor Yu Wei Huang

Yu Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250226275
    Abstract: A component-embedded structure for warpage suppression is provided. The component-embedded structure includes a first frame, a second frame, at least one component and an insulating material. The second frame is disposed within the first frame. The component is disposed within the second frame. The height of the first frame is higher than that of the second frame. The insulating material is filled between the first frame and the second frame, and between the second frame and the component.
    Type: Application
    Filed: January 5, 2024
    Publication date: July 10, 2025
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei HUANG, Chin-Hung WANG
  • Publication number: 20250012144
    Abstract: A pull cord release wheel for window blinds spring motor, and provides a release wheel for a spring motor of a curtain unit for winding a pull cord. The release wheel is mainly configured with a ridge at the corner joint position of a spoke, and pull cord access holes penetrate through a tread along with a planar ring spoke. Two through holes are formed on the tread enabling passage to the two side surfaces thereof, and an open space is provided at the outlet directions of the through holes. An outer circumference ridge surface of the ridge is used to take up a bunching force generated by a final winding of a second layer winding during the ascending process of a change in reverse winding of a third layer winding, thereby preventing squeezing a first winding that has been wound as an inner layer causing disordered winding.
    Type: Application
    Filed: September 17, 2024
    Publication date: January 9, 2025
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Publication number: 20240418036
    Abstract: The present invention provides a cordless curtain and guide braking unit thereof, wherein the guide braking unit includes a fixing mount and a round rod shaped metal wire that is wound round to form a slide sheering member. The fixing mount is configured with a bottom block, and a pull cord through hole is provided in the center of the surface thereof. The slide sheering member is provided with a circular through-hole and fastening rod members, wherein the circular through-hole is axially positioned corresponding to the pull cord through hole, with the fastening rod members fixed to two sides of the circular through-hole. The inner circular edge of the circular through-hole is used to provide the pull cord with cornering slippage, which protects the various system components and produces the desired damping effect.
    Type: Application
    Filed: June 12, 2024
    Publication date: December 19, 2024
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Publication number: 20240305238
    Abstract: A shutter includes a plurality of light-guiding devices each of which includes a light collector and a beam expander. The light collector includes a light-guiding plate that has a first end portion and a second end portion opposite to the first end portion in a first direction, and a plurality of light-collecting members that are disposed on the first end portion and that are arranged in the first direction. Each of the light-collecting members has a curved surface that is adapted for reflecting light beams that travel into the light-collecting member so that the light beams travel into the light-guiding plate. The beam expander is disposed on the second end portion of the light-guiding plate. When the light beams travel into the light-guiding plate, the light-guiding plate is adapted for the light beams to reflect therein, and to travel through the second end portion into the beam expander.
    Type: Application
    Filed: June 22, 2023
    Publication date: September 12, 2024
    Applicant: National Taiwan Normal University
    Inventors: Tun-Chien TENG, Yu-Wei HUANG
  • Publication number: 20240222305
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a circuit layer, and a plurality of contacts electrically connecting the circuit layer to the carrier. Each contact includes a metal portion and an insulating portion. The insulating portion surrounds the metal portion. A gap is formed between the contacts.
    Type: Application
    Filed: February 9, 2023
    Publication date: July 4, 2024
    Applicant: Industrial Technology Research Institute
    Inventor: Yu-Wei HUANG
  • Patent number: 12021018
    Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: June 25, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei Huang, Shau-Fei Cheng
  • Publication number: 20240194716
    Abstract: Some embodiments relate to an integrated chip including a semiconductor substrate and a pixel array comprising a plurality of photodetectors in the semiconductor substrate. The pixel array further comprises a plurality of transistors on a frontside of the semiconductor substrate. A backside ground (BSGD) structure extends into a backside of the semiconductor substrate, opposite the frontside, and further surrounding the pixel array along a periphery of the pixel array. The BSGD structure has a first sloped sidewall extending from a bottom surface of the BSGD structure that is recessed into the semiconductor substrate.
    Type: Application
    Filed: January 5, 2023
    Publication date: June 13, 2024
    Inventors: Yu-Wei Huang, Chen-Hsien Lin, Shyh-Fann Ting
  • Publication number: 20240175314
    Abstract: A window blind position damping device is applied to a window blind with slat being expanded horizontally, forming a damping to a pull cord effectively when the slat is pulled down at any height, so as to define the height. The window blind position damping device includes a machine part, and an interior of the machine part has a spring scroll wheel and a position damping device which links a pull cord through a provided release idler. A damping shear pillar is vertically disposed on a base plate of the provided machine part, between an outlet of the release idler and an opening. By a provided shear ridge, the damping shear pillar shears an overrun section of the pull cord that passes through, forming the damping and thereby defining and fixing the slat at any height when being expanded.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 30, 2024
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Publication number: 20240080984
    Abstract: A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 7, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Wei Huang, Ching-Feng Yu, Chih-Cheng Hsiao
  • Publication number: 20240055462
    Abstract: An image sensor device and methods of forming an image sensor device are provided. The image sensor device includes a plurality of image-sensing elements arranged within the device substrate. The image sensor device further includes an isolation grid structure extending into the device substrate and made up of a plurality of isolation grid segments that surround the outer perimeters of the plurality of image-sensing elements. The isolation grid structure includes a passivation liner and a conductive material in contact with the passivation liner. The conductive material may be an indium-tin-oxide film.
    Type: Application
    Filed: August 15, 2022
    Publication date: February 15, 2024
    Inventors: Yu-Wei HUANG, Chen-Hsien LIN, Tzu-Hsuan HSU
  • Publication number: 20230399891
    Abstract: The present invention discloses a blind slat positioning device and a window blind thereof. The positioning device can fix the slat at any height at which the slat is pulled down. The positioning device includes a turning seat which is provided at least with an overbend element for a pull cord to wrap around. The overbend element includes at least a ridge, resulting an effect that the slat stops at the height at which the slat is pulled down, with the aid of gravity.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 14, 2023
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Patent number: 11756865
    Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: September 12, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Che Hung, Shih-Hsien Wu, Yu-Wei Huang
  • Publication number: 20230187372
    Abstract: An electronic device includes a via-array substrate, an outer layer, and an alignment substrate. The via-array substrate has a plurality of first vias. The outer layer has a plurality of second vias and is disposed on a side of the via-array substrate. The first vias are greater in distribution density or quantity than the second vias. A part of the first vias is electrically connected to the second vias, and another part of the first vias is electrically floating. The alignment substrate includes a core layer disposed on the outer layer, a plurality of conductive traces, a plurality of interconnecting pads, and a plurality of alignment mark pads. The conductive traces are disposed in the core layer. The interconnecting pads and the alignment mark pads are disposed on a surface of the core layer located away from the outer layer. A part of the conductive traces electrically connects a part of the interconnecting pads and a part of the first vias.
    Type: Application
    Filed: August 11, 2022
    Publication date: June 15, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tsung-Yi HUNG, Yu-Wei HUANG
  • Publication number: 20230170288
    Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 1, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Wei HUANG, Shau-Fei CHENG
  • Publication number: 20230135103
    Abstract: A leading wire of pull cord of release wheel in a window blind is disclosed. In the beginning that the release wheel reels the pull cord, the winding angle of the pull cord can be defined that the wound reel can be neatly ordered. In a location of winding hub of the release wheel close to an inner spoke side, at least a piercing hole is transfixed along an inscribed tangent. In addition, a winding definer is further disposed in the direction at which the pull cord is spinning out, allowing the direction of an initial reeling coil to be defined in advance, so that the reel can be wound orderly.
    Type: Application
    Filed: December 20, 2021
    Publication date: May 4, 2023
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Patent number: 11486196
    Abstract: A curtain hanging assembly that consists of a curtain assembly able to effect horizontal opening and closing of curtains, and includes two elastic motor units provided with elastic feedback. Interactive dynamics between the two elastic motor units, through linear linkage, respectively cause torque forces produced to be in mutual opposition, enabling the let down area of the curtains to be naturally fixed at any height position.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: November 1, 2022
    Inventors: Hsien-Te Huang, Yu-Wei Huang
  • Patent number: 11239141
    Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 1, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ren-Shin Cheng, Shih-Hsien Wu, Yu-Wei Huang, Chih Ming Shen, Yi-Chieh Tsai
  • Publication number: 20220005754
    Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 6, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ren-Shin CHENG, Shih-Hsien WU, Yu-Wei HUANG, Chih Ming SHEN, Yi-Chieh TSAI
  • Publication number: 20210363821
    Abstract: A curtain hanging assembly that consists of a curtain assembly able to effect horizontal opening and closing of curtains, and includes two elastic motor units provided with elastic feedback. Interactive dynamics between the two elastic motor units, through linear linkage, respectively cause torque forces produced to be in mutual opposition, enabling the let down area of the curtains to be naturally fixed at any height position.
    Type: Application
    Filed: February 8, 2021
    Publication date: November 25, 2021
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Publication number: 20210257279
    Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.
    Type: Application
    Filed: January 4, 2021
    Publication date: August 19, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Che HUNG, Shih-Hsien WU, Yu-Wei HUANG