Abstract: An acceleration sensor, including a base; anchor point; an inner side supporting unit, a middle part of which is fixed to the base through the anchor point, a first seesaw unit elastically connected to an outer side of a first end of the inner side supporting unit; a second seesaw unit elastically connected to an outer side of a second end of the inner side supporting unit; and an out-of-plane displacement detection unit. Each of the first seesaw unit and the second seesaw unit is symmetrically distributed about a symmetry axis of the acceleration sensor. The first seesaw unit includes two first seesaw structures at two sides of the symmetry axis and the second seesaw unit includes two second seesaw structures at two sides of the symmetry axis. An influence of Y-axis angular acceleration on the acceleration sensor is greatly reduced and a cross inhibition ratio thereof is improved.

Abstract: Provided is an acceleration sensor, including a base; a first anchor point fixed to a middle part of the base; an inner side mass unit surrounding an outer side of the first anchor point, an outer side mass unit surrounding an outer side of the inner side mass unit, a first seesaw unit and a second seesaw unit arranged opposite to each other to define an annular structure surrounding an outer side of the outer side mass unit, a first acceleration detection unit and a second acceleration detection unit. Part of the first acceleration detection unit is arranged at the annular structure to detect acceleration in an out-of-plane Z-axis direction, the second acceleration detection unit is arranged at the outer side mass unit to detect acceleration in an in-plane X-axis direction and in an in-plane Y-axis direction. A design thereof is reasonable and the sensitivity is high.

Abstract: An acceleration sensor, including a first acceleration detection unit configured to detect acceleration in an out-of-plane Z-axis direction, a second acceleration detection unit configured to detect acceleration in an in-plane X-axis direction and/or an in-plane Y-axis direction, a base, a connecting arm, a first anchor point, a first elastic member and a second elastic member. The first acceleration detection unit includes a first seesaw unit and a second seesaw unit arranged opposite to each other to define an annular structure. The annular structure surrounds an outer side of the second acceleration detection unit. The first anchor point is located at a middle part of the substrate, and the connection arm is fixed to the substrate through the first anchor point. The connection arm is located between the first acceleration detection unit and the second acceleration detection unit. A structure design thereof is reasonable and the anti-interference capability is great.

Abstract: An example standard cell includes: a first active region and a second active region; a first gate strip, where the first gate strip extends in a first direction and is located away from a substrate; two second gate strips, where the first gate strip is located between the two second gate strips, and two ends of the second active region are located close to the substrate; and two spacing regions and two first shallow trench isolation regions, where the first active region is located between the two spacing regions, the second active region is located between the two first shallow trench isolation regions, and a width of each of the two spacing regions and a width of each of the two first shallow trench isolation regions are equal to an arrangement spacing between the first gate strip and the two second gate strips.

Abstract: The MEMS device includes a cap sheet defining a recess, and a device sheet bonded with the cap sheet and defining a functional cavity directly facing the recess. The cap sheet includes a substrate having a first surface facing the device sheet, a ground structure and a first metal layer disposed on a portion of the first surface outside the recess, and the ground structure disposed along perimeter of an area where the first metal layer located. The device sheet includes a substrate, a structure layer and a second metal layer sequentially stacked. The structure layer includes a first portion located in the functional cavity and a second portion surrounding the first portion, and the second metal layer is located on the second portion. By the first and second metal layer, the cap sheet is bonded with the device sheet, and all electrodes of the MEMS device are electrically connected.

Abstract: Provided is a fully decoupled MEMS gyroscope, including a base, a sensing unit elastically connected to the base, and a driving unit coupled with the sensing unit and driving the sensing unit to move. The base includes a coupling anchor point located at a center of a rectangle and a coupling structure elastically connected to the coupling anchor point. The driving unit includes four driving members located at inner positions of four corners of the rectangle. The sensing unit includes two X mass blocks symmetrically arranged in two of the avoiding intervals, two Y mass blocks symmetrically arranged in the other two of the avoiding intervals, four Z mass blocks elastically connected to the adjacent driving members and located at the four corners of the rectangle, and four Z detection decoupling members elastically connected to the adjacent Z mass blocks and elastically connected to each other around the rectangle.

Abstract: A three-axis MEMS gyroscope includes a substrate, a sensing unit connected with the substrate, and a driving unit driving the sensing unit to move. The substrate includes anchor point structures and coupling structures connected with the anchor point structures. The driving unit includes driving pieces. One ends of each of the driving pieces are elastically connected with an adjacent coupling structure. The sensing unit includes X and Y mass blocks and Z mass blocks. Each of the X and Y mass blocks is arranged in a corresponding avoiding space. The X and Y mass blocks are respectively connected with adjacent coupling structures to form a rectangular frame. The Z mass blocks are connected with the driving pieces and separately arranged on one side of each driving piece away from each anchor point structure. The three-axis MEMS gyroscope is differentially driven, which realizes differential detection and reduces quadrature error.

Abstract: The invention discloses a MEMS gyroscope, including a substrate, a first unit and a second unit, and the first unit and the second unit are relatively arranged on the substrate along the first direction. The first unit is connected to the second unit through a coupling spring, and the substrate is also provided with a driving electrode and a detection electrode. The first unit includes a first weight and a second weight. The second unit includes the third weight and the fourth weight set oppositely along the second direction. The second set of coupling structures are connected to the third weight and fourth weight. Compared with the prior art, the beneficial effect of the present invention is that the MEMS gyroscope adopts a symmetrical layout, which facilitates the realization of differential detection and improves the sensitivity.

Abstract: Provided is a fully decoupled MEMS gyroscope, including an anchor point unit, a sensing unit elastically connected to the anchor point unit, and a driving unit configured to drive the sensing unit to move. The anchor point unit includes a center anchor point subunit located at a center of a rectangle and four side anchor points. The driving unit includes four driving members located on four sides of the rectangle. The sensing unit includes two X mass blocks symmetrically arranged in two avoiding intervals, two Y mass blocks symmetrically arranged in the other two avoiding intervals, four Z mass blocks respectively located at an outer side of each driving member, and four Z detection decoupling members respectively located at an outer side of each Z mass block. The X mass blocks and the Y mass blocks are respectively connected to each side anchor point.

Abstract: An inertial sensor and a method therefor are provided. The inertia sensor includes a first substrate; a first insulation layer stacked on the first substrate; a first conducting layer stacked on the first insulation layer and including first openings; stoppers corresponding to the first openings and embedded into the first openings to close the first openings; a second insulation layer stacked on the first conducting layer and including a cavity; a second conducting layer stacked on the second insulation layer and including second openings; a first bonding structure stacked on the second conducting layer; a second substrate; and a second bonding structure stacked on the second substrate, the second bonding structure and the first bonding structure being bonded together to define a closed space therebetween. Thus, a structure thereof remains stable, thereby minimizing the feature size and bringing more room of device performance improvement.

Abstract: A micromachined gyroscope and an electronic product are provided. The micromachined gyroscope includes a driving component, a detecting component, first connecting components, and second connecting components. The driving component includes first driving pieces, second driving pieces, and driving devices driving the first driving pieces and the second driving piece to move. The detecting component includes first detecting pieces arranged along a third direction, second detecting pieces arranged along a fourth direction, and detecting devices for detecting movement distances of the first detecting pieces and/or the second detecting pieces along a fifth direction. Each of the first connecting pieces and the second connecting pieces rotates around a center thereof, so the second detecting pieces and the first detecting pieces respectively reciprocate along the third direction and the fourth direction.

Abstract: An inertial sensor and a method therefor. The inertial sensor includes: a first substrate; a medium layer stacked on the first substrate; a first electric-conductive layer stacked on the medium layer, first openings being formed in the first electric-conductive layer and spaced from one another; second electric-conductive layers being bonded to the first electric-conductive layer through bonding structures, a gap being formed between adjacent second electric-conductive layers, which are connected to each other by a connection part, and second openings being formed in each of the second electric-conductive layers and spaced from one another; and a second substrate covering the first substrate, a closed space being formed between the second substrate and the first substrate. Compared with a traditional single-layer structure, the die size is reduced, the manufacturing cost is reduced, and the integration of device into portable consumer applications is improved, and XY axis sensitivity is improved.

Abstract: An MEMS sensor and a method therefor. The MEMS sensor includes a buried electrode layer; a top electrode layer spaced from the buried electrode layer, a cavity being formed between the buried electrode layer and the top electrode layer; and a device layer received the cavity. The device layer includes movable mass blocks spaced from one another, each of which is supported on the buried electrode layer through a respective anchor portion, a preset gap is formed between each movable mass block and the top electrode layer, and the preset gap formed by one of the movable mass blocks is different from the preset gap formed by another one of the movable mass blocks. This structure allows for greater flexibility in design and provides higher sensitivity and larger actuation force on the sensor, and die size reduction is achieved while achieving more complex designs with higher accuracy and miniaturization.

Abstract: Provided are a micromechanical gyroscope and an electronic product. The micromechanical gyroscope includes a first mass, a plurality of second masses, a plurality of first flexible beams and a plurality of second flexible beams. The first mass is provided with a mounting area, the plurality of second masses are distributed in a first direction, and the plurality of drivers are distributed in first direction and disposed on two opposite sides of the plurality of second masses in first direction. The plurality of drivers and the plurality of second masses are all located within the mounting area, and the first mass surrounds outer sides of the plurality of drivers and outer sides of the plurality of second masses. With the micromechanical gyroscope and the electronic product, the coriolis conversion rate of the first mass 1 can be improved, and the utilization of a chip area can be maximized.

Abstract: A MEMS gyroscope for three-axis detection relates to the technical field of gyroscope and includes a substrate, a sensing unit elastically connected with the substrate, and a driving unit coupled with the sensing unit and driving the sensing unit to move. The substrate includes anchor point structures respectively located at four corners of the substrate and four coupling structures respectively elastically connected with the four anchor point structures. An avoiding space is formed between two adjacent coupling structures. The driving unit includes two driving pieces separately elastically connected with adjacent coupling structures. The two driving pieces are symmetrically arranged and are frame-shaped. The sensing unit includes four X and Y mass blocks, two Z mass blocks elastically connected with the driving pieces, and two decoupling mass blocks. The two decoupling mass blocks are elastically connected.

Abstract: The present invention relates to an accelerometer, which comprises a substrate and detecting devices. The substrate is provided with supporting anchor points and electrode fixing anchor points; the detecting device comprises two detecting plates and corresponding detecting electrodes, and the detecting electrodes are connected to the electrode fixing anchor points through connecting arms; the detecting plate is elastically connected to the supporting anchor point, the two detecting plates are asymmetrically arranged with respect to axes of the supporting anchor points, and the two detecting plates are parallel to each other and in opposite directions; and the detecting electrodes and the detecting plates are arranged at intervals to form a detecting capacitor.

Abstract: A micromechanical gyroscope and an electronic device are related. The micromechanical gyroscope includes a first movement member, a second movement member, many drive members and a detection member, the first movement member has a first center, with two ends along a second direction oscillating around the first center along a first and a third directions, the second movement member has a second center, with two ends along the first direction oscillating around the second center along the second and third directions. The drive members can drive oscillations of the first and second movement members. The detection member is located above or below the first and second movement members in the third direction, to detect moving distances of the first and second movement members along the third direction. The micromechanical gyroscope can detect angular velocities in two directions simultaneously and perform differential detection to reduce errors, thus expanding application scenarios.

Abstract: The present invention provides a dual-axis gyroscope and an electronic device. The dual-axis gyroscope comprises first mass blocks, second mass blocks, a driving unit and a detecting unit. Tightly coupled connections are formed between adjacent first mass blocks, and between adjacent second mass blocks, thus improving the accuracy of displacement ratios of the first mass blocks and the second mass blocks, and enhancing the operational accuracy and stability of the dual-axis gyroscope. Furthermore, the requirement for the machining precision of the first mass blocks and the second mass blocks is reduced, thus lowering the manufacturing cost of the dual-axis gyroscope and the electronic device.

Abstract: A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a corresponding conductive structure layer. The device sheet defines a functional cavity having a first region, a second region, and a third region. The at least two device structure layers and the at least one conductive structure layer each are across the first region, the second region, and the third region, and the at least two device structure layers and the at least one conductive structure layer cooperatively form a first movable structure in the first region, define an anchor point in the second region, and form a second movable structure in the third region.

Abstract: The invention provides a micromachined gyroscope. The micromachined gyroscope includes a driving structure, a detection structure and a connection component. The driving structure includes a first moving component and a driving component. The driving component is used to drive the movement of the first moving component. The detection structure includes a second moving component and a detection component installed in the second moving component. The detection component is used to detect the movement distance of the second moving component along the third or fourth direction. The driving component is installed inside the first moving component, and the detection component is installed inside the second moving component. Greater drive of amplitude can be achieved at the same drive voltage, thereby increasing the sensitivity of the micromachined gyroscope.