Abstract: A MEMS gyroscope includes an anchor point, a resonator, and a transducer. The resonator includes eight resonating blocks arranged at equal intervals and a coupling beam connecting each two adjacent resonating blocks. The resonating blocks are connected with the anchor point through anchoring beams. The anchoring beams decouple radial motion and circumferential motion of the resonating blocks. The resonating blocks include first resonating blocks, second resonating blocks, third resonating blocks, and fourth resonating blocks. In a vibration mode, the transducer drives the first and second resonating blocks to vibrate along along a first axis and a second axis respectively, so the third and fourth resonating blocks are driven to vibrate along the fourth axis and the third axis respectively. In a detection mode, the transducer detects vibration of the third resonating blocks along the third axis and the vibration of the fourth resonating blocks along the fourth axis.

Abstract: The invention provides a micromachined gyroscope. The micromachined gyroscope includes a driving structure, a detection structure and a connection component. The driving structure includes a first moving component and a driving component. The driving component is used to drive the movement of the first moving component. The detection structure includes a second moving component and a detection component installed in the second moving component. The detection component is used to detect the movement distance of the second moving component along the third or fourth direction. The driving component is installed inside the first moving component, and the detection component is installed inside the second moving component. Greater drive of amplitude can be achieved at the same drive voltage, thereby increasing the sensitivity of the micromachined gyroscope.

Abstract: The present invention provides a MEMS gyroscope having internal coupling beam, an external coupling beam, a drive structure and a detection structure. The drive structure includes multiple driving weights, and the detection structure includes multiple testing weights. The drive structure further includes a first decoupling structure and a first transducer. The first decoupling structure is arranged on the side of the driving weight far away from the internal coupling beam, and the first transducer excites the driving weight to vibrate. The MEMS gyroscope of the present invention can fully increase the layout area of the first transducer, thereby realizing a larger vibration amplitude under a small driving voltage, thereby increasing the sensitivity.

Abstract: The present invention provides a micromachined gyroscope, including: a base; an anchor point fixed to the base; a number of vibration structures; and a drive structure used for driving the vibration structure to vibrate in a x-y plane along a ring direction. The drive structure includes at least four groups arranged at intervals along the ring direction and symmetrical about an x axis and a y axis. The micromachined gyroscope works in two vibration modes interchanging with each other, including a driving mode status working in a first mode status and a testing mode status working in a second mode status. By virtue of the configuration described in the invention, the micromachined gyroscope can realize three-axis detection at the same time, and greatly improves the quality utilization rate of the vibration structure.

Abstract: The present invention provides a MEMS gyroscope having internal coupling beam, an external coupling beam, a drive structure and a detection structure. The drive structure includes multiple driving weights, and the detection structure includes multiple testing weights. The drive structure further includes a first decoupling structure and a first transducer. The first decoupling structure is arranged on the side of the driving weight far away from the internal coupling beam, and the first transducer excites the driving weight to vibrate. The MEMS gyroscope of the present invention can fully increase the layout area of the first transducer, thereby realizing a larger vibration amplitude under a small driving voltage, thereby increasing the sensitivity.

Abstract: The present invention provides a micromachined gyroscope, including: a base; an anchor point fixed to the base; a number of vibration structures; and a drive structure used for driving the vibration structure to vibrate in a x-y plane along a ring direction. The drive structure includes at least four groups arranged at intervals along the ring direction and symmetrical about an x axis and a y axis. The micromachined gyroscope works in two vibration modes interchanging with each other, including a driving mode status working in a first mode status and a testing mode status working in a second mode status. By virtue of the configuration described in the invention, the micromachined gyroscope can realize three-axis detection at the same time, and greatly improves the quality utilization rate of the vibration structure.

Abstract: The present invention is to provide a MEMS wave gyroscope with improved sensitivity. The MEMS wave gyroscope includes a base; an anchor structure fixed to the base; and a volatility structure suspended above the base. The volatility structure includes N horizontal beams and M straight beams for being interlaced to form M nodes. The horizontal beam is divided into M?1 first beam units by the nodes. The straight beam is divided into N?1 second beam units by the nodes. A first in-surface transducer is formed by the second beam unit coupled with a mechanical field and an electric field of the second beam unit on two opposite sides along the second axis. A first out-surface transducer is formed by at least one of two opposite sides of the second beam coupled with the mechanical field and electric field of the second beam unit.

Abstract: The present invention is to provide a MEMS wave gyroscope with improved sensitivity. The MEMS wave gyroscope includes a base; an anchor structure fixed to the base; and a volatility structure suspended above the base. The volatility structure includes N horizontal beams and M straight beams for being interlaced to form M nodes. The horizontal beam is divided into M-1 first beam units by the nodes. The straight beam is divided into N-1 second beam units by the nodes. A first in-surface transducer is formed by the second beam unit coupled with a mechanical field and an electric field of the second beam unit on two opposite sides along the second axis. A first out-surface transducer is formed by at least one of two opposite sides of the second beam coupled with the mechanical field and electric field of the second beam unit.

Abstract: One of the objects of the present invention is to provide a three-axis micromachined gyroscope which improves the detection sensitivity for detecting angular velocity. Accordingly, the present invention provides a three-axis micromachined gyroscope, including: a base; a vibration part suspended by the base, including a vibration assembly for receiving Coriolis force and generating a position change; a drive electrode for driving the vibration part; a detection part connected with the vibration part for detecting position change of the weights after receiving Coriolis force, and converting the position change of the weight into an electrical signal for outputting; and a swing center of each weight being outside the corresponding weight. When the three-axis micromachined gyroscope receives an angular velocity, the swinging weight is subjected to Coriolis force and a corresponding position change occurs.

Abstract: The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.

Abstract: The present invention provides a motion control structure and a actuator. The motion control structure includes a motion platform, a first actuator having a first execution unit arranged on opposite sides of the motion platform along an X-axis direction and a second execution unit arranged on opposite sides of the motion platform along a Y-axis direction. The first execution unit includes a first actuating element displaced along the X-axis direction. The second execution unit includes a second actuating element displaced along the Y-axis direction. A second actuator surrounds an inner periphery of the motion platform and includes a third execution unit having an assembly portion displaced along the Z-axis direction. The motion control structure of the invention has the advantages that the motion platform can be driven to realize motion in six degrees of freedom.

Abstract: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator, and the first resonator and the second resonator are movably connected with the substrate. The coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting piece and a second connecting piece. The first guide beam and the second guide beam are arranged on two opposite sides of a direction perpendicular to a vibration direction of the first resonator or the second resonator. The first coupling beam is connected with the first guide beam, the second guide beam and the first resonator. The second coupling beam is connected with the first guide beam, the second guide beam and the second resonator.

Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.

Abstract: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.

Abstract: The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

Abstract: A method of detecting failure of a semiconductor device includes forming an active fin on an active region of a substrate, the active fin extending in a first direction, forming a gate structure on the active fin, the gate structure extending in a second direction intersecting the first direction, forming source/drain layers on respective portions of the active fins at opposite sides of the gate structure, forming a wiring to be electrically connected to the source/drain layers, and applying a voltage to measure a leakage current between the source/drain layers. Only one or two active fins may be formed on the active region. Only one or two gate structures may be formed on the active fin.

Abstract: A test element group includes a test element including a plurality of test transistors connected in series between a first node and a second node, the second node being connected to a ground node; a first transistor connected between the first node and a power supply node; and a second transistor configured to generate an output current, proportional to a voltage at the first node, and connected to the first node and the power supply node.

Abstract: A semiconductor device includes first and second pads separated from each other, first and second test elements connected to the first and second pads and connected to each other in parallel between the first and second pads, a first diode connected to the first test element in series, and a second diode connected to the second test element in series.

Abstract: A method of detecting failure of a semiconductor device includes forming an active fin on an active region of a substrate, the active fin extending in a first direction, forming a gate structure on the active fin, the gate structure extending in a second direction intersecting the first direction, forming source/drain layers on respective portions of the active fins at opposite sides of the gate structure, forming a wiring to be electrically connected to the source/drain layers, and applying a voltage to measure a leakage current between the source/drain layers. Only one or two active fins may be formed on the active region. Only one or two gate structures may be formed on the active fin.