Abstract: A display panel is provided, which includes a first substrate and a second substrate arranged opposite to each other. The first substrate includes a first electrode and a second electrode. The second substrate includes a light shielding layer. The light shielding layer includes a light transmitting region and a light shielding region. The first electrode includes slits extending in a first direction, and an orthographic projection of two ends of at least one of the slits onto the first substrate is within an orthographic projection of the light shielding region onto the first substrate. A display panel and a display device are also provided.

Abstract: The invention relates to the field of milling, specifically a point position layout optimization method and a follow-up support head in mirror milling. It features an annular and linear sliding module to design a support head with adjustable support points. A corresponding layout optimization method is developed, starting with a coupled vibration model of the machining process. A layout optimization model is then created, with the quantity of support points and the support radius as decision variables. The goal is to minimize vibration amplitude and root mean square, constrained by structural interference and boundary conditions. The solution is achieved using a particle swarm optimization algorithm, supplemented by parameter scanning and a penalty function strategy. This invention addresses the limitations of existing single support point layouts for the mirror milling of various large thin-walled workpieces.

Abstract: Described herein is an aqueous coating composition including at least one binder, at least one sustainable pigment selected from recycled carbon black or coffee grounds or tea, at least one solvent and optionally at least one crosslinking agent and/or at least one additive. The use of the sustainable pigments in the aqueous coating results in colored coatings on substrates, such as flexible foam substrates, having a high optical quality as well as good mechanical properties. Also described herein is a process for producing the aqueous coating composition and a method for coating a substate using the aqueous coating composition. Finally, described herein is a substrate bearing a coating produced by the method.

Abstract: A display panel is provided, which includes a first substrate and a second substrate arranged opposite to each other. The first substrate includes a first electrode and a second electrode. The second substrate includes a light shielding layer. The light shielding layer includes a light transmitting region and a light shielding region. The first electrode includes slits extending in a first direction, and an orthographic projection of two ends of at least one of the slits onto the first substrate is within an orthographic projection of the light shielding region onto the first substrate. A display panel and a display device are also provided.

Abstract: The present disclosure provides a self-generating heat process for in-situ converting medium-low mature and organic-rich shale, and relates to the field of in-situ mining of medium-low mature shale rich in organic matter, the self-generating heat process mainly comprises the following steps: locally preheating the vincinity of an injection well of medium-low mature and organic-rich shale formation with well-reformed reservoir and injecting ambient temperature air into the preheated formation to excite and establish a chemical reaction zone composed of a residue zone, an autogenous heat zone, a thermal cracking zone and a preheating zone. Heat is released by oxidation reaction of residues generated after kerogen thermal cracking, so as to realize convection heating of medium-low mature and organic-rich shale formation. Oil and gas products generated from kerogen thermal cracking enter production wells through fractures and are lifted to the ground surface.

Abstract: A power storage apparatus includes a first power storage unit, a second power storage unit, a resonant circuit, a first switch, a second switch, a third switch and a fourth switch. The first end of the first switch is coupled to a first end of the first power storage unit. The second end of the first switch is coupled to a first end of the second switch and is coupled to a first end of the resonant circuit. The second end of the second switch is coupled to a second end of the first power storage unit and is coupled to a first end of the second power storage unit. The first end of the third switch is coupled to the first end of the second power storage unit and is coupled to the second end of the second switch.

Abstract: A method for a primary virtual machine (VM) to schedule a sibling VM task executed by a hypervisor. Upon request of the sibling VM, the hypervisor creates a sibling task which includes a hypervisor ID. The hypervisor ID is then communicated to the primary VM. Subsequently, the primary VM creates a broker task, identified by its broker ID, and based on the received hypervisor ID for the sibling VM task. The primary VM then communicates to the hypervisor a mapping of the broker ID to the corresponding hypervisor ID. Finally, the primary VM executes the broker task when instructed by a scheduler of the primary VM. The broker task then triggers the hypervisor to run the corresponding sibling task based on the mapping.

Abstract: An array substrate, a liquid crystal display panel and a display apparatus. The array substrate comprises: a substrate (10), a first insulating layer (20), a second insulating layer (30), a third insulating layer (40), a planarization layer (50), a first electrode layer (90A), a fourth insulating layer (70) and a second electrode layer (90B), the third insulating layer comprises a first interlayer insulating layer (40A), a second interlayer insulating layer (40B) and a third interlayer insulating layer (40C), which are sequentially stacked; the first interlayer insulating layer is located on the side of the second interlayer insulating layer close to the substrate (10), the third interlayer insulating layer is located on the side of the second interlayer insulating layer away from the substrate; the material of the first interlayer insulating layer and third interlayer insulating layer comprises silicon oxide, the material of the second interlayer insulating layer comprises silicon nitride.

Abstract: A method for detecting a surface gradient of an unstructured road based on Lidar includes: obtaining an environmental point cloud of a target region by using a Lidar, and filtering out a point cloud of a non-surface region to obtain a point cloud of a surface region; calculating a normal vector of the point cloud of the surface region, and obtaining an included angle of the surface of each region relative to a coordinate system of the Lidar; and obtaining pitching angle information of a vehicle at this time from a vehicle-mounted inertial measurement unit (IMU), and correcting the included angle with the pitching angle information to obtain the gradient of the surface of each region.

Abstract: A light-emitting diode (LED) sub-chip and a method of producing the same are provided. The LED sub-chip comprises an epitaxial layer disposed on a growth substrate, where the epitaxial layer comprises a plurality of electrodes. The groove disposed between the LED sub-chip and a second LED sub-chip, where the groove penetrates through the epitaxial layer separating the two sub-chips. The bridge insulating layer at least partially covering a sidewall of the groove, where the sidewall comprises a first surface and a second surface above the first surface, where the texture of the second surface is less granular than a texture of the first surface. The bridge electrode on the bridge insulating layer, where the bridge electrode connects respective electrodes of the two sub-chips at the first surface.

Abstract: A film laminating device is configured to attach a protective film on an electronic device. A top cover assembly comprising a protective film and a top cover is provided thereof, and the protective film comprises a protective layer and a release layer with a handle. A base is provided with a limit slot configured to place the electronic device, and when the top cover assembly is placed on a support table of the base, the side, deviating from the top cover, of the protective film may be in contact with the electronic device. The release layer is removed through pulling the handle, one end of the protective layer is in linear contact with a screen of the electronic device, the top cover is then bent upwards to be separated from the protective layer, the protective layer is gradually adsorbed on the screen according to its own gravity.

Abstract: A flip light emitting chip and a manufacturing method thereof are disclosed, wherein the flip light emitting chip comprises an N-type semiconductor layer, an active region, a P-type semiconductor layer, a reflective layer, a barrier layer, a bonding layer, a first insulating layer, an extended electrode layer, a second insulating layer, an N-type electrode, and a P-type electrode sequentially grown from a substrate. The first insulating layer has at least one first channel and at least one second channel. A first extended electrode portion and a second extended electrode portion of the extended electrode layer are respectively formed on the first insulating layer and extended to the N-type semiconductor layer via the first channel and to the barrier layer via the second channel. The second insulating layer has at least one third channel and at least one fourth channel.

Abstract: A flip light emitting chip and a manufacturing method thereof are provided. The flip light emitting chip includes a substrate and an extended stacking layer formed on the substrate. The extended stacking layer includes a first semiconductor layer formed on the substrate, an active region formed on the first semiconductor layer, and a second semiconductor layer formed on the active region. The flip light emitting chip further includes a reflective layer formed on the second semiconductor layer, a barrier layer formed on the second semiconductor layer and covering the reflective layer, a bonding layer formed on the barrier layer and an insulating layer formed on the bonding layer such that the bonding layer is retained between the barrier layer and the insulating layer for enhancing a binding force between the barrier layer and the insulating layer.

Abstract: A mini LED chip and a manufacturing method thereof are provided. The mini LED chip includes a growth substrate and a light-emitting epitaxial layer including a first type semiconductor layer, a luminous layer, and a second type semiconductor layer. The second type semiconductor layer and the luminous layer include an electrode contact hollow part that exposes the first type semiconductor layer. Further, the mini LED chip includes a transparent conductive layer disposed on a side of the second type semiconductor layer facing away from the growth substrate, an extended electrode disposed on a side of the transparent conductive layer facing away from the growth substrate, an insulating and isolating reflection layer covering the electrode contact hollow part and an exposed surface of the transparent conductive layer and the extended electrode facing away from the growth substrate, and a first bonding electrode and a second bonding electrode.

Abstract: The present disclosure provides a massive picture processing method, a massive picture processing device, an electronic apparatus and a computer readable storage medium, relating to the technical field of data processing. Said method comprises: acquiring matrixes corresponding to a plurality of channels of respective picture in massive pictures, and performing bit-based layering on respective matrixes; storing, according to an inverted index structure, picture-bit-layered data corresponding to respective channels after bit-based layering, and generating a picture-layer index record file; decoding all the picture-layer indexes of the picture according to the picture-layer index record file and synthesizing the picture according to the decoding result.

Abstract: A method and a system for determining a safe under keel clearance of an ultra-large ship are provided. The method comprises: acquiring operation parameter values of the ship; obtaining fluid pressure according to the values; obtaining a squat force and a trim moment of the ship according to the pressure; establishing a mirror image model based on speed potential to establish a squat clearance calculation model for the ship; determining a half-wave rising height with above calculation model; obtaining draught and trim changes according to the squat force and the trim moment, to determine a maximum squat clearance of the hull; determining the safe under keel clearance; and controlling the squat clearance of the ship according to the safe under keel clearance of the ship, to avoid navigation dangers, and improve the loading rate.