Patents by Inventor Zheng Wei

Zheng Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925728
    Abstract: The present invention relates to a degradable vascular stent capable of avoiding late restenosis, comprising a base region formed by a polylactic acid based polymer; at least one storage region in which an active agent is stored; and an outer layer of a drug sustained release coating covered on the base region and/or the storage region. Before the mass of the polylactic acid based polymer is decreased by 10-20%, the active agent is retained in structural units of the polylactic acid based polymer. After the mass of the polylactic acid based polymer is decreased by 10-20%, the active agent is released from the storage region. The base region provides a supporting capacity for ensuring patency of blood vessels; the drug sustained release coating is used for drug release in an early stage; and the active agent only works in late degradation of the stent to avoid late restenosis.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: March 12, 2024
    Assignee: Shandong Huaan Biotechnology Co., Ltd.
    Inventors: Zheng Wei, Bin Huang, Jian Xie, Yunhong Mu
  • Publication number: 20230333801
    Abstract: This application discloses an application access method and a related apparatus. The application access method includes: A first electronic device runs a target application, and obtains first display content of the target application; the first electronic device obtains a screen display parameter of a second electronic device; the first electronic device determines display data based on the first display content and the screen display parameter of the second electronic device, where the display data includes a display location and a display size of the first display content; and the first electronic device sends the display data to the second electronic device, and the second electronic device displays an application interface of the target application based on the display data.
    Type: Application
    Filed: September 8, 2021
    Publication date: October 19, 2023
    Inventors: Kun Guo, Zheng Wei, Shizhao Zhang, Li Wang
  • Publication number: 20230335505
    Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Zheng Wei WU
  • Patent number: 11775488
    Abstract: System, method, and various embodiments for providing a data access and recommendation system are described herein. An embodiment operates by identifying a column access of one or more data values of a first column of a plurality of columns of a table of a database during a sampling period. A count of how many of the one or more data values are accessed during the column access are recorded. A first counter is incremented by the count. The sampling period is determined to have expired. A load recommendation on how to load data values into the first column based on the first counter is computed. The load recommendation for implementation into the database for one or more subsequent column accesses is provided.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: October 3, 2023
    Assignee: SAP SE
    Inventors: Panfeng Zhou, Vivek Kandiyanallur, Colin Florendo, Robert Schulze, Zheng-Wei She, Yanhong Wang, Amarnadh Sai Eluri
  • Publication number: 20230296781
    Abstract: There is provided a method of controlling laser scanning by a rotorcraft. The rotorcraft includes: a rotatable body frame configured to rotate during flight; a laser rangefinder mounted on the rotatable body frame and configured to perform laser scanning; and a magnetometer configured to measure magnetic field. The method includes: obtaining magnetic field measurement data from the magnetometer while the rotatable body frame is rotating during flight, the magnetic field measurement data including a sinusoidal signal; estimating a frequency of the sinusoidal signal; and controlling the laser rangefinder to perform laser scanning based on the estimated frequency of the sinusoidal signal. There is also provided a corresponding controller for controlling laser scanning by a rotorcraft, and a corresponding rotorcraft configured to perform laser scanning including the controller.
    Type: Application
    Filed: July 7, 2021
    Publication date: September 21, 2023
    Inventors: Shaohui FOONG, Chee How TAN, Danial Sufiyan Bin Shaiful -, Zheng Wei Emmanuel TANG
  • Patent number: 11706558
    Abstract: The present invention discloses an earphone cover and an earphone assembly. The earphone cover having a through hole running axially through thereof. The earphone cover comprises a first attachment end, a second attachment end, a support portion, and a space defined by the support portion. The first and second attachment ends are positioned at each end of the through hole respectively. The support portion is set between the first and second attachment ends. The space is configured between an inner surface of the support portion and an outer surface of the earphone. The support portion deforms and air in the space escapes via the first and/or the second attachment ends under compression, and the support portion recovers to an original shape when the compression is removed.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: July 18, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventor: Zheng Wei
  • Patent number: 11682631
    Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Zheng Wei Wu
  • Publication number: 20230094961
    Abstract: Through exploration of the characteristics of a crop canopy structure and the variation laws in the crop development processes, a three-dimensional crop canopy structure model and a dynamic maize growth simulation are established by fusing the three-dimensional crop canopy structure model. The model describes the crop growth and development stages by adopting growing degree-days, carries out dynamic simulation on a two-dimensional maize canopy structure by adopting a Logistic equation, and characterizes veins, leaf margin and the like by adopting a spatial topological structure. On this basis, a dynamic simulation method for a three-dimensional spatial crop canopy structure is finally established, the coupling simulation of multiple hydrothermal carbonization processes in a complex farmland ecosystem is realized, and thus the simulation capability and universality of the crop model are effectively improved.
    Type: Application
    Filed: June 16, 2022
    Publication date: March 30, 2023
    Applicant: China Institute of Water Resources and Hydropower Research
    Inventors: Baozhong ZHANG, Meng DUAN, Zheng WEI, Congying HAN, Yaqi WANG, Zhi ZHAO, Jiabing CAI, Zhigong PENG, He CHEN, Shuaijie ZHANG
  • Patent number: 11550765
    Abstract: Implementations include providing, by a computer-executed migration advisor executing within a run-time of a source database system, a query data set including queries processed by the source database system during production use of the source database system, providing, by the migration advisor, an object data set including data representative of database objects stored within a database of the source database system, generating, by the migration advisor, a list of query-level features and a list of object-level features, each feature in the list of query-level features and each feature in the list of object-level features including a feature that is deprecated in a target database system, resolving one or more issues represented by features of one or more of the list of query-level features and the list of object-level features, and executing migration of the database of the source database system to the database of the target database system.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: January 10, 2023
    Assignee: SAP SE
    Inventors: Xia-ge Dai, Zheng-Wei Wang, Weizhong Qiu, Jian Luo
  • Publication number: 20220399283
    Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 15, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Zheng Wei WU
  • Patent number: 11433061
    Abstract: Compounds are provided that act as potent antagonists of the CCR2 receptor. Animal testing demonstrates that these compounds are useful for treating inflammation, a hallmark disease for CCR2. The compounds are generally aryl sulfonamide derivatives and are useful in pharmaceutical compositions, methods for the treatment of CCR2-mediated diseases, and as controls in assays for the identification of CCR2 antagonists.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: September 6, 2022
    Assignee: ChemoCentryx, Inc.
    Inventors: Solomon Ungashe, Zheng Wei, Arindrajit Basak, Trevor T. Charvat, Wei Chen, Jeff Jin, Jimmie Moore, Yibin Zeng, Sreenivas Punna, Daniel Dairaghi, Derek Hansen, Andrew M. K. Pennell, John J. Wright, Antoni Krasinski, Qiang Wang
  • Patent number: 11435465
    Abstract: A vehicle radar device includes a first antenna unit, a second antenna unit, at least one computing unit and at least one circuit board. The first antenna unit and the second antenna unit are communicatively connected to the at least one computing unit. The at least one circuit board includes a first board portion and a second board portion. The first antenna unit is a circuit board type and disposed on the first board portion. The second antenna unit is a circuit board type and disposed on the second board portion. The at least one computing unit disposed on at least one of the first board portion and the second board portion. When an angle between the first board portion and the second board portion is P12, and the following condition is satisfied: 80degrees ?P12?130 degrees.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: September 6, 2022
    Assignees: CUB ELECPARTS INC., CUBTEK INC.
    Inventors: San-Chuan Yu, Yuan-Tung Hung, Ya-Ling Chi, Cheng-Hsin Li, Zheng-Wei Ke, Wei-Shun Shih
  • Patent number: D981713
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: March 28, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Xiaoyu Yi, Zheng Wei
  • Patent number: D982552
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 4, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Jingxuan Wei, Zheng Wei
  • Patent number: D984417
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: April 25, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Qiang Ma, Zheng Wei, Qi Shao
  • Patent number: D985543
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: May 9, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Jingxuan Wei, Zheng Wei
  • Patent number: D998022
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: September 5, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Xiaoyu Yi, Zheng Wei
  • Patent number: D1000425
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: October 3, 2023
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Zheng Wei, Qiang Ma, Jingxuan Wei
  • Patent number: D1011105
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: January 16, 2024
    Assignee: SECRETLAB SG PTE. LTD.
    Inventors: Alaric Wei Shen Choo, Vincent Sin, Ian Alexander Zheng Wei Ang, Ee Hao Gabriel Lim, Jon Hao Chan, Alicia Jie Yi Phua
  • Patent number: D1016780
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: March 5, 2024
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Hangyu Li, Zheng Wei, Qiang Ma