Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: An interaction method and apparatus and an electronic device. The method comprises: displaying a first application interface, wherein the first application interface comprises an interface of a first application; and creating a second application account in the first application interface, wherein the second application account is used for logging in a second application. Therefore, a new interaction mode is provided.

Abstract: A pea-derived peptide with a muscle-building effect and a preparation method thereof, and a drug and use, are disclosed. A pea protein is subjected to enzymatic hydrolysis, and five polypeptides with muscle-building effect are obtained by separation as separate peptide fragments. In an in vitro aging skeletal muscle cell assay, changes are analyzed in a gene expression level of regulatory pathways related to skeletal muscle cell proliferation and differentiation, apoptosis and autophagy, and protein synthesis and degradation. In addition, animal experiments are conducted to study the muscle-building effect and a corresponding mechanism of the pea-derived peptide. This shows that the five polypeptide sequences have a significant muscle-building effect, usable as a polypeptide drug for the treatment of sarcopenia.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: The present invention relates to a degradable vascular stent capable of avoiding late restenosis, comprising a base region formed by a polylactic acid based polymer; at least one storage region in which an active agent is stored; and an outer layer of a drug sustained release coating covered on the base region and/or the storage region. Before the mass of the polylactic acid based polymer is decreased by 10-20%, the active agent is retained in structural units of the polylactic acid based polymer. After the mass of the polylactic acid based polymer is decreased by 10-20%, the active agent is released from the storage region. The base region provides a supporting capacity for ensuring patency of blood vessels; the drug sustained release coating is used for drug release in an early stage; and the active agent only works in late degradation of the stent to avoid late restenosis.

Abstract: Provided is a message encapsulation and de-encapsulation method and device, a storage medium, and an electronic device. The message encapsulation method includes: encapsulating a bit indexed explicit replication (BIER) header in an IPv6 extended header of an IPv6 message in combination with a generic fragmentation header (GFH), a generic encapsulating security payload (GESP), or a generic authentication header (GAH). The problem in the related art of how to combine a GFH mechanism with a BIER header encapsulated in an IPv6 extended header can be solved; when the BIER header is encapsulated in the IPv6 extended header, the BIER header can be combined with the GFH/GESP/GAH, thereby simply and efficiently realizing fragmentation, encapsulating security and authentication functions of a BIER multicast message.

Abstract: In one aspect, separator-free energy storage devices are disclosed. Such devices comprise a first electrode and a second electrode. In some embodiments, the first electrode is opposite the second electrode. The first and/or second electrodes are formed from a nanocomposite material. The nanocomposite material includes plurality of carbon nanostructures, each of which is at least partially coated with a layer of material comprising a transition metal oxide. In some embodiments, the coating layer is uniform or substantially uniform in one or more properties.

Abstract: This application discloses an application access method and a related apparatus. The application access method includes: A first electronic device runs a target application, and obtains first display content of the target application; the first electronic device obtains a screen display parameter of a second electronic device; the first electronic device determines display data based on the first display content and the screen display parameter of the second electronic device, where the display data includes a display location and a display size of the first display content; and the first electronic device sends the display data to the second electronic device, and the second electronic device displays an application interface of the target application based on the display data.

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

Abstract: System, method, and various embodiments for providing a data access and recommendation system are described herein. An embodiment operates by identifying a column access of one or more data values of a first column of a plurality of columns of a table of a database during a sampling period. A count of how many of the one or more data values are accessed during the column access are recorded. A first counter is incremented by the count. The sampling period is determined to have expired. A load recommendation on how to load data values into the first column based on the first counter is computed. The load recommendation for implementation into the database for one or more subsequent column accesses is provided.

Abstract: There is provided a method of controlling laser scanning by a rotorcraft. The rotorcraft includes: a rotatable body frame configured to rotate during flight; a laser rangefinder mounted on the rotatable body frame and configured to perform laser scanning; and a magnetometer configured to measure magnetic field. The method includes: obtaining magnetic field measurement data from the magnetometer while the rotatable body frame is rotating during flight, the magnetic field measurement data including a sinusoidal signal; estimating a frequency of the sinusoidal signal; and controlling the laser rangefinder to perform laser scanning based on the estimated frequency of the sinusoidal signal. There is also provided a corresponding controller for controlling laser scanning by a rotorcraft, and a corresponding rotorcraft configured to perform laser scanning including the controller.

Abstract: The present invention discloses an earphone cover and an earphone assembly. The earphone cover having a through hole running axially through thereof. The earphone cover comprises a first attachment end, a second attachment end, a support portion, and a space defined by the support portion. The first and second attachment ends are positioned at each end of the through hole respectively. The support portion is set between the first and second attachment ends. The space is configured between an inner surface of the support portion and an outer surface of the earphone. The support portion deforms and air in the space escapes via the first and/or the second attachment ends under compression, and the support portion recovers to an original shape when the compression is removed.

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.