Abstract: A request to apply a plurality of voltage pulses to memory cells of a memory device can be received. A number of the voltage pulses can be applied the memory cells of the memory device, where a voltage pulse of the number of the voltage pulses places the memory cells of the memory device at a voltage level associated with a defined voltage state. A set of bit error rates associated with the memory cells of the memory device at the voltage level can be determined. Responsive to determining that the set of bit error rates does not satisfy a threshold condition, an additional number of the voltage pulses to the memory cells of the memory device can be applied.

Abstract: A request to read data at the memory device is received. A first read operation is performed to read the data at the memory device using a first read threshold voltage. The data read at the memory device using the first read threshold voltage is determined to be associated with a first unsuccessful correction of an error. Responsive to determining that the data read at the memory device using the first read threshold voltage is associated with the first unsuccessful correction of the error, a second read threshold voltage is stored at a register to replace a preread threshold voltage previously stored at the register that is associated with the memory device. The first preread threshold voltage was previously used to perform a preread operation at the memory device. A second read operation to read the data at the memory device is performed using the second read threshold voltage.

Abstract: Multiple sets of values corresponding to operating characteristics of a memory sub-system are established. For each of the sets of values, a read voltage level corresponding to a decreased bit error rate of a programming distribution of the memory sub-system is identified. A data structure is stored that includes the read voltage level for each set of values corresponding to the operating characteristics. In response to a read command, a current set of values of the operating characteristics is determined. Using the data structure, a stored read voltage level corresponding to the current set of values of the operating characteristics is identified. The read command is executed using the stored read voltage level corresponding to the current set of values of the operating characteristics.

Abstract: A processing device in a memory sub-system initiates read operations on each of a plurality of segments in a first region of the memory device during a first time interval, wherein at least a subset of the plurality of segments in the first region of the memory device are storing host data. The processing device further receives, as a result of at least one read operation, at least one data signal from a corresponding one of the plurality of segments in the first region of the memory device, and performs a signal calibration operation using the at least one data signal to synchronize one or more relevant signals with a reference clock signal used by the processing device.

Abstract: A method for performing a refresh operation based on system characteristics is provided. The method includes determining that a current operating condition of a memory component is in a first state. The method also includes detecting a change in the operating condition from the first state to a second state. The method further includes setting a refresh period associated with the memory component based on the change of the operating condition. The refresh period corresponds to a period of time between a first time when a write operation is performed on a segment of the memory component and a second time when a refresh operation is to be performed on the segment. Moreover, the method includes performing the refresh operation according to the refresh period.

Abstract: A current demarcation voltage is determined, where the current demarcation voltage is to be applied to a memory cell for reading a state of the memory cell. Based on the current demarcation voltage and a space between a first threshold voltage distribution corresponding to a first state of the memory cell and a second threshold voltage distribution corresponding to a second state of the memory cell, a test demarcation voltage having a low error rate of reading the state of the memory cell is selected. The current demarcation voltage is set to correspond to the selected test demarcation voltage.

Abstract: A request to apply a plurality of voltage pulses to memory cells of a memory device can be received. A number of the voltage pulses can be applied the memory cells of the memory device, where a voltage pulse of the number of the voltage pulses places the memory cells of the memory device at a voltage level associated with a defined voltage state. A set of bit error rates associated with the memory cells of the memory device at the voltage level can be determined. Responsive to determining that the set of bit error rates does not satisfy a threshold condition, an additional number of the voltage pulses to the memory cells of the memory device can be applied.

Abstract: A method for performing a refresh operation based on system characteristics is provided. The method includes determining that a current operating condition of a memory component is in a first state. The method also includes detecting a change in the operating condition from the first state to a second state. The method further includes setting a refresh period associated with the memory component based on the change of the operating condition. The refresh period corresponds to a period of time between a first time when a write operation is performed on a segment of the memory component and a second time when a refresh operation is to be performed on the segment. Moreover, the method includes performing the refresh operation according to the refresh period.

Abstract: Methods and systems for improving the reliability of data stored within a semiconductor memory are described. One issue with determining stored data states for memory cells within a NAND-type memory is that the voltage at the source end of a NAND string may vary greatly from when a memory cell of the NAND string is program verified to when the memory cell is subsequently read leading to bit errors. To compensate for this variability in the source line voltage, different sensing conditions (e.g., the bit line voltages and/or the sensing times) may be applied during a read operation to different sets of memory cells depending on the source line resistance from the memory cells or on the source line voltage zone assigned to the memory cells.

Abstract: A data structure is stored that includes a slope value corresponding to each die temperature of a set of die temperatures, where the slop value represents a change of a read voltage level as a function of a write-to-read delay time of a memory sub-system. In response to a read command, a current write-to-read delay time and a current die temperature are determined. Using the data structure, a stored slope value corresponding to the current die temperature is identified. An adjusted read voltage level is determined based at least in part on the stored slope value and the current write-to-read delay time. The read command is executed using the adjusted read voltage level.

Abstract: A system includes a memory component, and a processing device coupled with the memory component. The processing device to identify a group of management units of the memory component, wherein the group of management units is included in a set of retired groups of management units, select a management unit from the group of management units, perform a media integrity check on the management unit to determine a failed bit count of the management unit, and in response to the failed bit count of the management unit failing to satisfy a threshold criterion, remove the group of management units from the set of retired groups of management units.

Abstract: A system includes a plurality of memory devices and a processing device (e.g., a controller), operatively coupled to the plurality of memory devices. The processing device is to detect a power-on of the system and determine a read-retry trigger rate (TR) of a subset of codewords of the plurality of memory devices during a time interval after an initialization of the memory component. The processing device is further to determine whether the TR satisfies a threshold criterion. In response to the TR not satisfying the threshold criterion, the processing device is to initialize a full-memory refresh of the plurality of memory devices.

Abstract: A memory system includes a sense system configured to control parasitic noise sources by increasing selected bit line or channel voltages during sense stages. The increase may be tied to a triggering threshold voltage level. That is, while performing a memory operation, the sense system may increase the selected bit line voltage level dependent on a reference voltage level or memory state associated with a sense stage being above the triggering threshold level.

Abstract: Methods and systems for improving the reliability of data stored within a semiconductor memory are described. One issue with determining stored data states for memory cells within a NAND-type memory is that the voltage at the source end of a NAND string may vary greatly from when a memory cell of the NAND string is program verified to when the memory cell is subsequently read leading to bit errors. To compensate for this variability in the source line voltage, different sensing conditions (e.g., the bit line voltages and/or the sensing times) may be applied during a read operation to different sets of memory cells depending on the source line resistance from the memory cells or on the source line voltage zone assigned to the memory cells.

Abstract: A current demarcation voltage is determined, where the current demarcation voltage is to be applied to a memory cell for reading a state of the memory cell. A plurality of test demarcation voltages is determined based on the current demarcation voltage and a space between a first threshold voltage distribution corresponding to a first state of the memory cell and a second threshold voltage distribution corresponding to a second state of the memory cell. For each test demarcation voltage, an error rate of reading the state of the memory cell based on a respective test demarcation voltage is determined. A test demarcation voltage having the lowest error rate from the plurality of test demarcation voltages is determined. The current demarcation voltage is set to correspond to the test demarcation voltage having the lowest error rate.

Abstract: Methods and systems for improving the reliability of data stored within a semiconductor memory are described. One issue with determining stored data states for memory cells within a NAND-type memory is that the voltage at the source end of a NAND string may vary greatly from when a memory cell of the NAND string is program verified to when the memory cell is subsequently read leading to bit errors. To compensate for this variability in the source line voltage, different sensing conditions (e.g., the bit line voltages and/or the sensing times) may be applied during a read operation to different sets of memory cells depending on the source line resistance from the memory cells or on the source line voltage zone assigned to the memory cells.

Abstract: A non-volatile memory system comprises a plurality of word lines, a plurality of bit lines, non-volatile memory cells, and a sensing circuit. The sensing circuit is configured to sense a first set of the memory cells coupled to a contiguous set of the bit lines and a selected word line using a first bit line settling time. The sensing circuit is configured to sense a second set of the memory cells coupled to a non-contiguous set of the bit lines and the selected word line using a second bit line settling time.

Abstract: Methods and systems for improving the reliability of data stored within a semiconductor memory are described. One issue with determining stored data states for memory cells within a NAND-type memory is that the voltage at the source end of a NAND string may vary greatly from when a memory cell of the NAND string is program verified to when the memory cell is subsequently read leading to bit errors. To compensate for this variability in the source line voltage, different sensing conditions (e.g., the bit line voltages and/or the sensing times) may be applied during a read operation to different sets of memory cells depending on the source line resistance from the memory cells or on the source line voltage zone assigned to the memory cells.

Abstract: An apparatus, system, and method are disclosed for identifying and selecting a subgroup of memory cells for use during a programming or erasing operation, in order to execute the programming or erasing operation in less time, while avoiding over and under programming errors. Memory devices disclosed herein may include a state change/programming circuit, a counting circuit, a determination circuit, an identification circuit, and/or a subgroup selection circuit, where each of these circuits are configured to perform operations related to the overall process of identifying and selecting the subgroup of memory cells for utilization during a programming operation.

Abstract: A memory system includes a sense system configured to control parasitic noise sources by increasing selected bit line or channel voltages during sense stages. The increase may be tied to a triggering threshold voltage level. That is, while performing a memory operation, the sense system may increase the selected bit line voltage level dependent on a reference voltage level or memory state associated with a sense stage being above the triggering threshold level.