Patents by Inventor Zhi Qi

Zhi Qi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9115186
    Abstract: Disclosed herein are trimeric polypeptide pharmaceutical compositions comprising three monomers, each monomer comprising a polypeptide having the amino acid sequence of the N-terminal heptad repeat (NHR or HR1) or C-terminal heptad repeat (CHR or HR2) of the transmembrane glycoprotein of human immunodeficiency virus (HIV) and a trimerization motif.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: August 25, 2015
    Assignee: New York Blood Center
    Inventors: Shibo Jiang, Zhi Qi, Xi Chen, Chungen Pan
  • Patent number: 9068984
    Abstract: The present invention relates to compounds, compositions, methods, systems and kits for treating neuropathic pain regulated by SIP30. The present invention provides SIP30 antagonists for the treatment of neuropathic pain.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: June 30, 2015
    Assignee: RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY
    Inventors: Lei Yu, Ning Guo, Yu-Qui Zhang, Zhi-Qi Zhao, Naihe Jing
  • Patent number: 8936789
    Abstract: Provided herein are immunogenic compositions comprising fusion proteins, the fusion proteins comprising lentivirus gp41 or a fragment thereof, a trimerization or oligomerization motif and an immunoenhancer that elicit potent and broad HIV neutralizing antibody responses in the immunized hosts. Also disclosed are methods of making and using the immunogenic compositions.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: January 20, 2015
    Assignee: New York Bood Center, Inc.
    Inventors: Shibo Jiang, Zhi Qi, Chungen Pan
  • Publication number: 20140191352
    Abstract: A wafer-level packaging method of BSI image sensors includes the following steps: S1: providing a wafer package body comprising a silicon base, an interconnect layer, a hollow wall and a substrate; S2: cutting the wafer package body via a first blade in a first cutting process to separate the interconnect layer of adjacent BSI image sensors; and S3: cutting the wafer package body via a second blade in a second cutting process to obtain independent BSI image sensors. As a result, damage of the interconnect layer and the substrate may be decreased to improve performance and reliability of the BSI image sensor.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 10, 2014
    Applicant: China Wafer Level CSP Co., Ltd.
    Inventors: Zhi-Qi WANG, Qiong YU, Wei WANG
  • Publication number: 20120245216
    Abstract: The present invention relates to compounds, compositions, methods, systems and kits for treating neuropathic pain regulated by SIP30. The present invention provides SIP30 antagonists for the treatment of neuropathic pain.
    Type: Application
    Filed: September 2, 2010
    Publication date: September 27, 2012
    Applicant: RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY
    Inventors: Lei Yu, Ning Guo, Yu-Qui Zhang, Zhi-Qi Zhao, Naihe Jing
  • Patent number: 7980886
    Abstract: The invention provides a conducting device having identification function, which includes a device body, a socket part disposed on the device body, a first identification unit and a second identification unit disposed on the device body. Compared with the prior art, the conducting device having identification function of the invention has the first identification unit and the second identification unit. Therefore, it could notice a user that the connecting part provides at least two connecting components having different functions for being identified to be selectively engaged so that the engagement could be more convenient and exacter.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: July 19, 2011
    Assignee: Lotes Co., Ltd.
    Inventor: Zhi Qi Liu
  • Publication number: 20100204120
    Abstract: Disclosed herein are trimeric polypeptide pharmaceutical compositions comprising three monomers, each monomer comprising a polypeptide having the amino acid sequence of the N-terminal heptad repeat (NHR or HR1) or C-terminal heptad repeat (CHR or HR2) of the transmembrane glycoprotein of human immunodeficiency virus (HIV) and a trimerization motif.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 12, 2010
    Inventors: Shibo Jiang, Zhi Qi, Xi Chen, Chungen Pan
  • Publication number: 20100098724
    Abstract: Provided herein are immunogenic compositions comprising fusion proteins, the fusion proteins comprising lentivirus gp41 or a fragment thereof, a trimerization or oligomerization motif and an immunoenhancer that elicit potent and broad HIV neutralizing antibody responses in the immunized hosts. Also disclosed are methods of making and using the immunogenic compositions.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 22, 2010
    Inventors: Shibo Jiang, Zhi Qi, Chungen Pan
  • Publication number: 20090269974
    Abstract: The invention provides a conducting device having identification function, which includes a device body, a socket part disposed on the device body, a first identification unit and a second identification unit disposed on the device body. Compared with the prior art, the conducting device having identification function of the invention has the first identification unit and the second identification unit. Therefore, it could notice a user that the connecting part provides at least two connecting components having different functions for being identified to be selectively engaged so that the engagement could be more convenient and exacter.
    Type: Application
    Filed: September 18, 2008
    Publication date: October 29, 2009
    Applicant: LOTES CO., LTD.
    Inventor: Zhi Qi LIU