Patents by Inventor Zhi Yong Zhou
Zhi Yong Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070144709Abstract: A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting to a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set therebetween and thermally engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set therebetween and thermally engaging with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates therebetween and thermally engaging with the first and second base plates.Type: ApplicationFiled: December 25, 2005Publication date: June 28, 2007Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan, Zhi-Yong Zhou, Jiang-Jian Wen
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Publication number: 20070095509Abstract: A heat dissipation device includes a heat sink (10) and a heat pipe (20). The heat sink includes a base (12), a fins group (16) extending from the base, and a cover (14) contacting with the fins group. The heat pipe surrounds top and bottom and two opposite sides of the fins group and thermally connects with the base and the cover.Type: ApplicationFiled: November 2, 2005Publication date: May 3, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan, Zhi-Yong Zhou, Jiang-Jian Wen
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Publication number: 20060278372Abstract: A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting with the cold plate to fins (60).Type: ApplicationFiled: November 17, 2005Publication date: December 14, 2006Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Jiang-Jian Wen
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Patent number: 7143815Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, and a liquid inlet port (18) in communication with the container (14). A funnel-shaped channel is defined in the liquid inlet port (18), and radiuses of the funnel-shaped channel are descended along a liquid flow direction.Type: GrantFiled: March 1, 2005Date of Patent: December 5, 2006Assignee: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Patent number: 7121326Abstract: A heat sink comprises a plurality of stacked fins being combined. Each fin comprises a plate body with two pairs of locking structures formed symmetrically on two opposite edges of the plate body. Each locking structure comprises an interval part extending integratedly from the plate body, a bearing part depending from the interval part, a lateral position portion and a detaining portion extend continuously from the bearing part. A tab is formed on each detaining portion. The fins are combined in such a manner that the bearing part of each fin bears against an adjacent fin; the plate body of each fin is sandwiched between the bearing part and the detaining portion of each locking structure of an adjacent fin, and between the lateral position portions of a pair of locking structures of the adjacent fin, the tabs of each fin bear against the corresponding interval parts of the adjacent fin.Type: GrantFiled: May 24, 2005Date of Patent: October 17, 2006Assignee: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Patent number: 7075790Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.Type: GrantFiled: July 27, 2004Date of Patent: July 11, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Chun-Chi Chen, Xue-Wen Peng, Hsieh Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20060137863Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).Type: ApplicationFiled: August 15, 2005Publication date: June 29, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Jiang-Jian Wen
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Publication number: 20060126301Abstract: A locking device (10) for securing a heat sink to an electronic device includes a rectangular main frame (20), four first fasteners (30) respectively pivotably attached to four corners of the main frame and two second fasteners (40) pivotably attached to the main frame at opposite sides thereof. Each of the first and second fasteners respectively is capable of rotating relative to the main frame from a non-stretched position to a stretched position for attachment of the heat sink to the electronic device.Type: ApplicationFiled: December 14, 2004Publication date: June 15, 2006Applicant: HON HAI Precision Industry CO., LTD.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Bo-Tao Wang
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Publication number: 20060120053Abstract: A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.Type: ApplicationFiled: August 23, 2005Publication date: June 8, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Shao-Long Zhai, Zhi-Yong Zhou
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Publication number: 20060118276Abstract: A heat sink comprises a plurality of stacked fins being combined. Each fin comprises a plate body with two pairs of locking structures formed symmetrically on two opposite edges of the plate body. Each locking structure comprises an interval part extending integratedly from the plate body, a bearing part depending from the interval part, a lateral position portion and a detaining portion extend continuously from the bearing part. A tab is formed on each detaining portion. The fins are combined in such a manner that the bearing part of each fin bears against an adjacent fin; the plate body of each fin is sandwiched between the bearing part and the detaining portion of each locking structure of an adjacent fin, and between the lateral position portions of a pair of locking structures of the adjacent fin, the tabs of each fin bear against the corresponding interval parts of the adjacent fin.Type: ApplicationFiled: May 24, 2005Publication date: June 8, 2006Applicant: Foxconn Tecnology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20060104032Abstract: A heat dissipation device for an electronic unit includes a heat sink and at least a heat pipe. The heat sink includes a base for contacting with the electronic unit and a plurality of fins arranged on the base to create a first heat transfer path for the electronic unit. The heat pipe is attached to the heat sink and includes an evaporating portion for contacting with the electronic unit, and a condensing portion thermally contacting with the fins to create a second heat transfer path for the electronic unit.Type: ApplicationFiled: November 16, 2004Publication date: May 18, 2006Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou, Jiang-jian Wen
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Publication number: 20060096743Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a base (11) and a liquid inlet port (18) in communication with the container (14). The base (11) comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid, and the rough surface is opposing to the heat-absorbing surface.Type: ApplicationFiled: March 2, 2005Publication date: May 11, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Patent number: 7013959Abstract: A liquid cooling system includes a heat absorbing unit (4) defining a chamber therein for containing coolant, and a heat dissipation unit (2) comprising a liquid circulation module (20) in flow communication with the heat absorbing unit, and a plurality of cooling fins (27). The liquid circulation module comprises first and second hollow cooling bodies (21, 23) cooperatively defining a space therebetween to receive the cooling fins, and a pump (24) coupled to the second cooling body, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.Type: GrantFiled: August 19, 2004Date of Patent: March 21, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Zhi Yong Zhou
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Publication number: 20060051222Abstract: A miniature pump in accordance with the present invention comprises a pump casing (1) and a liquid circulating unit (2) received in the pump casing. The pump casing defines an enclosed space (15) for storing liquid therein. A spacing plate (12) is arranged in the pump casing to divide the enclosed space into a first chamber (16) and a second chamber. The spacing plate defines a through opening (122) at a center portion thereof to make the first and second chambers communicate with each other. An inlet (104) and an outlet (110) are formed on the pump casing respectively communicating with the first and second chambers. The liquid circulating unit is mounted in the second chamber for circulating the liquid in a liquid cooling system.Type: ApplicationFiled: February 1, 2005Publication date: March 9, 2006Applicant: Foxconn Technology Co.,LtdInventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20060021737Abstract: A liquid cooling device includes a hollow heat absorbing unit (2) containing liquid therein, a first heat exchange body (32) and a second heat exchange body (34). The first heat exchange body defines isolated first and second rooms (330, 331) therein. The second heat exchange body defines flow-communicated first and second chambers (350, 351) therein. The first chamber is communicated to the first room, and the second chamber is communicated to the second room. The liquid cooling device further includes a pump (4) fluidly connected between the heat absorbing unit and the second room, and a pipe (7) fluidly connecting the heat absorbing unit and the first room.Type: ApplicationFiled: June 28, 2005Publication date: February 2, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20060005953Abstract: A liquid cooling device includes a casing (10), a liquid inlet port (18) and a liquid outlet port (19) in communication with the casing (10). The casing (10) includes a heat-absorbing base (11). The base (11) includes a porous layer interior of the casing (10).Type: ApplicationFiled: February 25, 2005Publication date: January 12, 2006Applicant: Foxconn Technology Co., LtdInventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20050276703Abstract: A miniature pump includes a pump casing (1) defining therein an inner space with an inlet (104) and an outlet (110) both being in flow communication with the inner space, a liquid circulating unit (2) having an impeller (26) received in the inner space, a motor driving unit (3) received in the inner space to drive the impeller to rotate, and a partition wall (14) arranged in the pump casing to space the liquid circulating unit and the motor driving unit. The impeller carries a first permanent magnet (260). The motor driving unit includes a motor having a rotor (34) and a second permanent magnet (340) attached to the rotor. The second permanent magnet corresponds to the first permanent magnet with a flux gap formed therebetween. Each of the first and second permanent magnets has a plurality of alternating N and S poles.Type: ApplicationFiled: December 17, 2004Publication date: December 15, 2005Applicant: HON HAI Precision Industry CO., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20050241804Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, and a liquid inlet port (18) in communication with the container (14). A funnel-shaped channel is defined in the liquid inlet port (18), and radiuses of the funnel-shaped channel are descended along a liquid flow direction.Type: ApplicationFiled: March 1, 2005Publication date: November 3, 2005Applicant: Foxconn Technology Co.,LtdInventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Yong Zhou
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Publication number: 20050045311Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.Type: ApplicationFiled: July 27, 2004Publication date: March 3, 2005Inventors: Chun-Chi Chen, Xue-Wen Peng, Hsieh Lee, Cheng-Tien Lai, Zhi-Yong Zhou