Abstract: In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.

Abstract: An apparatus includes an optical interposer including a first surface, a first mating protrusion extending outwardly from the first surface, and two or more alignment protrusions extending outwardly from the first surface. The first mating protrusion is to be partially disposed within a first recess formed in a second surface of a photonic integrated circuit (PIC) die when the first surface of the optical interposer opposes the second surface of the PIC die and respective distal surfaces of the two or more alignment protrusions contact the second surface of the PIC die. A first portion of an outer surface of the first mating protrusion is to contact a first side wall of the first recess and a second portion of the outer surface of the first mating protrusion is to oppose a second side wall of the first recess such that a second space is to be defined therebetween.

Abstract: Electrical connectors for a semiconductor device package to a circuit board are provided. The electrical connectors can include interconnections having a first resistance that is greater than a second resistance. Assemblies are provided that include an electrical connector and a circuit board. Assemblies can also include a semiconductor device package. The assemblies provide connections to ground on the circuit board that have a higher resistance than connections for signal input output.

Abstract: A medical catheter (1) comprising a proximal end and a distal end. The distal end comprises a sensor array (32) used for displaying a lumen inner wall (51); a coaxial rotation device, with a through hole in communication with the proximal end of the catheter (1). The through hole is for establishing a channel between a target bifurcated lumen (52) and the catheter distal end (1). A lumen internal fixing device (13) is provided for fixing relative positions of the catheter distal end (1) and the lumen inner wall (51), so as to ensure the stability of establishing a channel between the bifurcated lumen (52) and the catheter proximal end (1). The medical catheter detects the structure and distribution of the lumen (51) in a human body, and can conveniently guide an operator to probe into the target bifurcated lumen (52) to satisfy the requirements of a surgical operation.

Abstract: Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.

Abstract: Techniques and mechanisms for facilitating horizontal communication with a photonic integrated circuit (PIC) chip, and a lens structure which is optically coupled thereto. In an embodiment, a PIC chip comprises integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) which are coupled to the integrated circuitry via the photonic waveguides. The PIC chip forms respective first divergent lens surfaces of the IECs, which are each at a respective terminus of a corresponding one of the photonic waveguides. A lens structure, which is adjacent to the IECs, comprises a second divergent lens surface having an orientation which is substantially orthogonal to the respective orientations of the first divergent lens surfaces. In another embodiment, an edge of the PIC chip forms one or more recess structures, and the lens structure comprises one or more tenon portions which each extends into a respective recess structure of the one or more recess structures.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: Disclosed is a control circuit for a relay in an uninterruptible power supply, comprising a plurality of capacitors comprising at least a first capacitor; and a plurality of relays comprising at least a first relay, a second relay, a third relay and a fourth relay, wherein a first terminal of the first relay is connected to a positive electrode of a battery, a second terminal of the first relay is connected to a first terminal of the first capacitor, a first terminal of the second relay is connected to a negative electrode of the battery, a second terminal of the second relay is connected to a second terminal of the first capacitor, a second terminal of the third relay is connected to the second terminal of the first relay, and a second terminal of the fourth relay is connected to the second terminal of the second relay.

Abstract: An antenna system according to an embodiment of the present disclosure includes an antenna unit and a metal cavity corresponding to the antenna unit. The metal cavity is grounded and provided with an opening connected with the outside. By introducing the metal cavity, an embodiment of the present invention solves the problem of multi-band mutual coupling caused by a common ground current by using the cavity filter structure with a small size.

Abstract: Intraoral sensors and associated systems, devices, and methods are provided. In some embodiments, an intraoral sensor for sensing pH within an intraoral cavity of a subject includes a film composed of a biocompatible polymer and a pH-sensitive molecule. The pH-sensitive molecule can be configured to change in color based on a pH within a subject's intraoral cavity. The pH-sensitive molecule can be immobilized in the film. The intraoral sensor can also include an adhesive configured to couple the film to a surface of a dental appliance or a tooth of the subject.

Abstract: A LED lighting device, comprising: a base which has a bottom plate and a side wall, a cavity being formed between the bottom plate and the side wall; an optical component which covers one side of the base in a light-emitting direction of the LED lighting device; and a light source which is provided in the cavity of the base and comprises a circuit board and several LED arrays, the LED arrays comprising LED lamp beads fixed on the circuit board. The optical component comprises an optical unit, and the optical unit comprises a plurality of first optical components and a plurality of second optical components which correspond to the first optical components.

Abstract: Apparatuses and methods for monitoring wear status of a dental appliance may include a sensing module that sensing the temperature and one or more additional modalities (e.g., capacitance, impedance, pressure force) around a dental appliance to track when the user is wearing or not wearing the dental appliance. These sensing modules may also determine compliance more accurately with a dental treatment plan.

Abstract: Embodiments disclosed herein include sockets and socket modules. In an embodiment, a socket module comprises a housing and a first pin through the housing in a first row of pins. In an embodiment, a second pin is through the housing in a second row of pins. In an embodiment, at least three intervening rows of pins are between the first row of pins and the second row of pins. In an embodiment, one or more pin locations in the at least three intervening rows of pins are depopulated.

Abstract: A water environmental DNA collection apparatus, including a lower box body and collection components, where a clear water chamber, a motor chamber, a water pump chamber and a power supply chamber are provided in the lower box body, a motor is provided in the motor chamber, a water pump is provided in the water pump chamber, the lower box body is fixedly connected with a first filtering mechanism, the water pump communicates with the first filtering mechanism, a support column is fixedly connected outside the lower box body, and a turntable is fixedly connected with the support column; and a plurality of groups of collection components are provided, each collection component includes a press filter, a cylinder and a bottom shell, a transverse plate is fixedly connected inside the cylinder, the cylinder is divided into a filter pressing chamber and a filtering chamber through the transverse plate.

Abstract: Disclosed are a display panel and a display device. The display panel is provided with a first region. The display panel includes a substrate, and an isolation structure layer and a display function layer located on the substrate. The isolation structure layer includes a light-transmitting portion and a plurality of isolation openings. The display function layer includes a plurality of light-emitting devices respectively located within the plurality of isolation openings. A touch structure is located on a side, away from the substrate, of the isolation structure layer. The display panel may be applied to the field of under-screen recognition.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include a liquid metal interposer. In an embodiment, the liquid metal interposer comprises a substrate with a first opening in the substrate and a second opening in the substrate. In an embodiment, a channel is between the first opening and the second opening. In an embodiment, the channel fluidically couples the first opening to the second opening.

Abstract: An LED lighting device includes a seat, an optical assembly and a light source. The seat has a baseplate and a sidewall. A chamber is formed between the baseplate and the sidewall. The optical assembly completely covers a light-emitting side of the LED lighting device. The light source is disposed in the chamber of the seat and includes multiple LED arrays. Each LED array includes an LED chip. The optical assembly includes an optical unit. The optical unit includes multiple first optical members and multiple second optical members corresponding to the first optical members. The LED arrays correspond to the first optical members. Each first optical member possesses an effect of light diffusion resulting from its own material property. Each second optical member includes one or more sets of optical walls. Each set of optical walls surrounds one of the first optical members.

Abstract: Multichannel optical assemblies for optical IO (input output) systems are provided. The optical assemblies comprise an optical isolator. In some examples the optical assemblies also comprise an array of GRIN lenses. In other examples, the optical assemblies also comprise micromirrors.

Abstract: A LED lighting device, comprising: a base which has a bottom plate and a side wall, a cavity being formed between the bottom plate and the side wall; an optical component which covers one side of the base in a light-emitting direction of the LED lighting device; and a light source which is provided in the cavity of the base and comprises a circuit board and several LED arrays, the LED arrays comprising LED lamp beads fixed on the circuit board. The optical component comprises an optical unit, and the optical unit comprises a plurality of first optical components and a plurality of second optical components which correspond to the first optical components.