Abstract: Embodiments disclosed herein include sockets and socket modules. In an embodiment, a socket module comprises a housing and a first pin through the housing in a first row of pins. In an embodiment, a second pin is through the housing in a second row of pins. In an embodiment, at least three intervening rows of pins are between the first row of pins and the second row of pins. In an embodiment, one or more pin locations in the at least three intervening rows of pins are depopulated.

Abstract: A water environmental DNA collection apparatus, including a lower box body and collection components, where a clear water chamber, a motor chamber, a water pump chamber and a power supply chamber are provided in the lower box body, a motor is provided in the motor chamber, a water pump is provided in the water pump chamber, the lower box body is fixedly connected with a first filtering mechanism, the water pump communicates with the first filtering mechanism, a support column is fixedly connected outside the lower box body, and a turntable is fixedly connected with the support column; and a plurality of groups of collection components are provided, each collection component includes a press filter, a cylinder and a bottom shell, a transverse plate is fixedly connected inside the cylinder, the cylinder is divided into a filter pressing chamber and a filtering chamber through the transverse plate.

Abstract: Disclosed are a display panel and a display device. The display panel is provided with a first region. The display panel includes a substrate, and an isolation structure layer and a display function layer located on the substrate. The isolation structure layer includes a light-transmitting portion and a plurality of isolation openings. The display function layer includes a plurality of light-emitting devices respectively located within the plurality of isolation openings. A touch structure is located on a side, away from the substrate, of the isolation structure layer. The display panel may be applied to the field of under-screen recognition.

Abstract: A system for predicting disease with graph convolutional neural network based on multimodal magnetic resonance imaging, which extracts the radiomics information of multiple brain regions across modals as the features of nodes from multimodal magnetic resonance data, and extracts the connectomics information between brain regions to form an adjacency matrix. T1-weighted structural images extract cortical information through cortical reconstruction, and resting-state magnetic resonance data are used to calculate amplitude of low frequency fluctuations, regional homogeneity and functional connectivity. Through multimodal data preprocessing, image index extraction and structured data integration, multimodal unstructured magnetic resonance image data are integrated into unified graph-structured data, and the disease is predicted by a graph convolutional neural network method.

Abstract: The disclosure provides display substrate and display panel, and belongs to field of display technology. The display substrate includes base substrate; and gate lines, data lines and sub-pixels on base substrate. Sub-pixels form first pixel groups arranged side by side along first direction and second pixel groups arranged side by side along second direction; first region is between any two adjacent first pixel groups, and second region is between any two adjacent second pixel groups; common electrode line is in at least a portion of the first regions, and common electrode line and data line are in different first regions; and common electrode line includes common electrode line segments and protrusions each coupled between two common electrode line segments, a width of protrusion in any direction is larger than that of common electrode line segment in first direction; and protrusion is in the second region.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include a liquid metal interposer. In an embodiment, the liquid metal interposer comprises a substrate with a first opening in the substrate and a second opening in the substrate. In an embodiment, a channel is between the first opening and the second opening. In an embodiment, the channel fluidically couples the first opening to the second opening.

Abstract: An LED lighting device includes a seat, an optical assembly and a light source. The seat has a baseplate and a sidewall. A chamber is formed between the baseplate and the sidewall. The optical assembly completely covers a light-emitting side of the LED lighting device. The light source is disposed in the chamber of the seat and includes multiple LED arrays. Each LED array includes an LED chip. The optical assembly includes an optical unit. The optical unit includes multiple first optical members and multiple second optical members corresponding to the first optical members. The LED arrays correspond to the first optical members. Each first optical member possesses an effect of light diffusion resulting from its own material property. Each second optical member includes one or more sets of optical walls. Each set of optical walls surrounds one of the first optical members.

Abstract: Multichannel optical assemblies for optical IO (input output) systems are provided. The optical assemblies comprise an optical isolator. In some examples the optical assemblies also comprise an array of GRIN lenses. In other examples, the optical assemblies also comprise micromirrors.

Abstract: A LED lighting device, comprising: a base which has a bottom plate and a side wall, a cavity being formed between the bottom plate and the side wall; an optical component which covers one side of the base in a light-emitting direction of the LED lighting device; and a light source which is provided in the cavity of the base and comprises a circuit board and several LED arrays, the LED arrays comprising LED lamp beads fixed on the circuit board. The optical component comprises an optical unit, and the optical unit comprises a plurality of first optical components and a plurality of second optical components which correspond to the first optical components.

Abstract: The present application relates to a test structure and a test method for implementing an on-site dry-wet cycle of a large-grain-size rock-soil body. The solution includes: a test site evenly paved with a test material; a test tank arranged in the test site, where two ends of each test tank in a width direction are separated from soil bodies of other test sites by steel plates, and each test tank is provided with a plurality of water permeable holes. The present application can implement an on-site dry-wet cycle test of a large-grain-size rock-soil body, and is suitable for engineering practice.

Abstract: An LED lighting device includes a seat having a baseplate, a sidewall, and an end wall. The first end of the sidewall is connected to a periphery of the baseplate and forms a chamber with the baseplate. The second end of the sidewall is connected to the end wall and forms a receiving space with the end wall. A light source containing a plurality of LED arrays is disposed in the chamber. An electric power source is disposed in the receiving space, and an optical assembly is disposed on the light source. The optical assembly includes a plurality of first optical members and a plurality of second optical members. Each of the first optical members covers one of the LED arrays. Each of the second optical members includes a set of optical walls surrounding one of the first optical members.

Abstract: A semiconductor chip package is described. The semiconductor chip package has a substrate. The substrate has side I/Os on the additional surface area of the substrate. The side I/Os are coupled to I/Os of a semiconductor chip within the semiconductor chip package. A cooling assembly has also been described. The cooling assembly has a passageway to guide a cable to connect to a semiconductor chip's side I/Os that are located between a base of a cooling mass and an electronic circuit board that is between a bolster plate and a back plate and that is coupled to second I/Os of the semiconductor chip through a socket that the semiconductor chip's package is plugged into.

Abstract: Techniques and mechanisms for optically coupling a photonic integrated circuit (PIC) chip to an optical fiber via a planar optical waveguide structure. In an embodiment, a PIC chip comprises integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) which are coupled to the integrated circuitry via the photonic waveguides. The PIC chip forms respective divergent lens surfaces of the IECs, which are each at a respective terminus of a corresponding one of the photonic waveguides. A planar optical waveguide structure, which is adjacent to the IECs, comprises a core which is optically coupled between the PIC chip and an array of optical fibers. In another embodiment, an edge of the PIC forms a stepped structure, wherein an upper portion of the stepped structure comprises the plurality of coplanar IECs, and a lower portion of the stepped structure extends past the plurality of coplanar IECs.

Abstract: An uninterruptible power supply, a control method and a power supply system for normally starting the uninterruptible power supply and securing switch devices are provided. The uninterruptible power supply includes a first rectification circuit, a charge-discharge circuit, a bus capacitor, a first switch circuit and a second rectification circuit. The first rectification circuit is connected to the charge-discharge circuit, and is configured to rectify a voltage outputted by the alternating current power supply. The charge-discharge circuit is connected to the bus capacitor, and is configured to charge the bus capacitor after boosting the voltage outputted by the first rectification circuit, until the voltage across the bus capacitor reaches a first voltage. The first switch circuit is connected to the second rectification circuit, and is configured to connect the alternating current power supply to the second rectification circuit.

Abstract: This application provides a shooting method. By implementing the method, a terminal device such as a mobile phone or a tablet computer can determine a shot protagonist based on a user operation when starting shooting or in a shooting process. In the shooting process, the terminal device may display, in a preview window, an image stream collected by a camera, and the terminal device may further generate a small window that specially displays the protagonist. After recording ends, a user may obtain two videos: an original video generated based on the image stream in the preview window, and a close-up video generated based on a protagonist image stream in the small window. In this way, the user can choose to use the original video and/or the close-up video to meet personalized requirements in different scenarios at different moments of the user.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

Abstract: The present invention provides a torque-resistant curved balloon device, comprising a curved balloon and a kink-resistant fixing strip, wherein the curved balloon bends to one side after being inflated, and the inner curve of the curved balloon is connected to the fixing strip at a plurality of points or a whole section. The present invention strengthens the bending force provided by the curved balloon when bending, and enhances the torque resistance of the curved balloon, so that the curved balloon can bend more stably and predictably in accordance with the expected and desired way during the bending.

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

Abstract: A construction method of fast-setting polymer grouting for rapid control of slope erosion and landslide.