Abstract: Methods, apparatus, systems, and articles of manufacture to improve signal integrity performance in integrated circuit packages are disclosed. An integrated circuit (IC) package includes a substrate; a first conductive pad in a first metal layer in the substrate; and a second conductive pad in a second metal layer in the substrate. The first metal layer is adjacent the second metal layer with no intervening metal layers therebetween. The integrated circuit (IC) package further includes a conductive protrusion extending from the first conductive pad toward the second conductive pad.

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

Abstract: An LED lighting device includes a seat, an optical assembly and a light source, according to one embodiment of the present invention. The seat has a baseplate and a sidewall. A chamber is formed between the baseplate and the sidewall. The optical assembly completely covers a light-emitting side of the LED lighting device. The light source is disposed in the chamber of the seat and includes multiple LED arrays. Each of the LED arrays includes an LED chip. The optical assembly includes an optical unit. The optical unit includes multiple first optical members and multiple second optical members corresponding to the first optical members. The LED arrays correspond to the first optical members. Each of the second optical members includes a set of optical walls. The set of optical walls surrounds one of the first optical members.

Abstract: The present invention provides an LED illumination device, including: a light source carrier including a base, an accommodating space formed on the base; a light emitting unit including a light emitter and a lamp board fixed to the light source carrier; and an optical member covering or at least partially covering the light emitting unit. The light emitting unit and the optical member are both disposed in the accommodating space. The optical member includes a first light distribution unit and a second light distribution unit. At least 70% of a luminous flux generated by the light emitter in operation is directly emitted from the LED illumination device through the second light distribution unit.

Abstract: An LED light bulb is provided. The LED light bulb includes a lamp housing, a bulb base, a stem, first and second conductive supports, a driving circuit, and a flexible LED filament. The flexible filament includes two conductive electrodes, a first LED section, a second LED section, and a conductive section. The first LED section is bent in a first space curved shape. The second LED section is bent in a second space curved shape. The conductive section includes a center point of the flexible LED filament. The flexible LED filament is bent in a third space curved shape comprising the first space curved shape and the second space curved shape.

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

Abstract: Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a first electronic signal over a first conductive path to a first destination and a second electronic signal over a second conductive path to a second destination. A first slow wave structure comprises the first conductive path and a second slow wave structure comprises the second conductive path. The effective relative permittivity of the first slow wave structure is tuned such that the first electronic signal arrives at its destination at a first time and at a first phase, and the effective relative permittivity of the second slow wave structure is tuned such that the second electronic signal arrives at its destination at a second time and at a second phase.

Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, wherein the die comprises a plurality of high density features. An interconnect bridge is embedded in the substrate, wherein the interconnect bridge may comprise a first region disposed on a surface of the interconnect bridge comprising a first plurality of features, wherein the first plurality of features comprises a first pitch. A second region disposed on the surface of the interconnect bridge comprises a second plurality of features comprising a second pitch, wherein the second pitch is greater than the first pitch.

Abstract: This application relates to the field of lighting, and discloses an LED filament including: at least one LED section, each LED section including at least two LED chips, adjacent LED chips being electrically connected to each other; electrodes, electrically connected to the LED section; and a light conversion layer, wrapping the LED section and parts of the electrodes, and including a top layer and a carrying layer, the carrying layer including a base layer and a transparent layer, the base layer including an upper surface and a lower surface opposite to each other, the upper surface of the base layer being in contact with a part of the top layer, and a part of the lower surface of the base layer being in contact with the transparent layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

Abstract: A balloon pulling device, comprising a core tube (11) portion and a balloon (12) portion, wherein the core tube (11) portion may inflate and deflate the balloon (12) portion by using a fluid; the present invention is characterized in that the balloon (12) portion comprises a plurality of expansion segments (13), the expansion segments (13) being larger than the remaining portion of the balloon (12) after being inflated with a fluid such that the entire balloon (12) forms a curved contour. A simple and reliable balloon pulling device capable of retracting at a long distance while being finely adjusted is achieved.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed is a curved balloon catheter retractor, comprising a positioning balloon (11) provided at the head of a catheter (10), and a bendable curved balloon (12) provided at a portion on the catheter (10) that is close to the head, wherein the positioning balloon (11) and the curved balloon (12) are respectively connected to respective injection ports at the tail of the catheter (10) by means of pipelines inside the catheter (10); and a handle (14) is provided at the tail of the catheter (10) for adjusting the position of the catheter (10). In a non-use state, the positioning balloon (11) and the curved balloon (12) are tightly attached to the catheter (10).

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to optical interconnects and optical waveguides within a glass layer of a semiconductor package, where dies that are physically and optically coupled with the glass layer are optically coupled with each other via the optical waveguides. One or more reflectors may be used to direct the optical pathway through the glass layer. Other embodiments may be described and/or claimed.

Abstract: A wide bandwidth signal connector plug, comprising a plurality of signal pins having a first anchor portion and a first mating portion, and a plurality of ground pins having a second anchor portion and a second mating portion. The plurality of ground pins is adjacent to the plurality of signal pins. The plurality of signal pins has a first thickness and the plurality of ground pins has a second thickness that is greater than the first thickness. The first anchor portion has a first width and the second anchor portion has a second width that is greater than the first width.

Abstract: An electronic device comprises a photonic integrated circuit (PIC) including at least one waveguide, an emitting lens disposed on the PIC to emit light from the at least one waveguide in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a reflective surface configured to direct light emitted from the emitting lens in a direction away from the first surface of the PIC.

Abstract: An antenna system according to an embodiment of the present disclosure includes an antenna unit and a metal cavity corresponding to the antenna unit. The metal cavity is grounded and provided with an opening connected with the outside. By introducing the metal cavity, an embodiment of the present invention solves the problem of multi-band mutual coupling caused by a common ground current by using the cavity filter structure with a small size.

Abstract: A construction method of fast-setting polymer grouting for rapid control of slope erosion and landslide.

Abstract: An LED filament and an LED light bulb applying the same are provided. The LED filament includes a at least one LED section, wherein the at least one LED section comprises at least two LED chips electrically connected to each other through a first wire, and at least two conductive electrodes, wherein each of the at least two conductive electrodes is electrically connected to corresponding one of the at least one LED section; and a light conversion layer, covering the at least one LED section and a portion of each of the at least two conductive electrodes, a portion of the first wire is exposed outside the light conversion layer.

Abstract: Techniques and mechanisms for optically coupling a photonic integrated circuit (PIC) chip to an optical fiber via a planar optical waveguide structure. In an embodiment, a PIC chip comprises integrated circuitry, photonic waveguides, and integrated edge-oriented couplers (IECs) which are coupled to the integrated circuitry via the photonic waveguides. The PIC chip forms respective divergent lens surfaces of the IECs, which are each at a respective terminus of a corresponding one of the photonic waveguides. A planar optical waveguide structure, which is adjacent to the IECs, comprises a core which is optically coupled between the PIC chip and an array of optical fibers. In another embodiment, an edge of the PIC forms a stepped structure, wherein an upper portion of the stepped structure comprises the plurality of coplanar IECs, and a lower portion of the stepped structure extends past the plurality of coplanar IECs.