Patents by Inventor Zhiqiang Lin
Zhiqiang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11289523Abstract: An image sensor includes a substrate material, an array of the color filters, an array of waveguides and spacers. The substrate material includes a plurality of photodiodes disposed therein. The array of color filters are disposed over the substrate material. The array of waveguides are disposed over the substrate material. The buffer layer is disposed between the substrate material and the arrays of color filters and waveguides. The spacers are disposed between the color filters in the array of color filters. The spacers are disposed between the waveguides in the array of waveguides. Incident light is adapted to be confined between the spacers. The incident light is adapted to be directed through one of the waveguides and through one of the color filters prior to being directed through the buffer layer into one of the photodiodes in the substrate material.Type: GrantFiled: September 6, 2019Date of Patent: March 29, 2022Assignee: OMNIVISION TECHNOLOGIES, INC.Inventors: Alireza Bonakdar, Zhiqiang Lin
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Publication number: 20220052085Abstract: A pixel cell includes a photodiode disposed proximate to a front side of a semiconductor layer to generate image charge in response to incident light directed through a backside of the semiconductor layer. A cell deep trench isolation (CDTI) structure is disposed along an optical path of the incident light to the photodiode and proximate to the backside of the semiconductor layer. The CDTI structure includes a plurality of portions arranged in the semiconductor layer. Each of the plurality of portions extends a respective depth from the backside towards the front side of the semiconductor layer. The respective depth of each of the plurality of portions is different than a respective depth of a neighboring one of the plurality of portions. Each of the plurality of portions is laterally separated and spaced apart from said neighboring one of the plurality of portions in the semiconductor layer.Type: ApplicationFiled: August 13, 2020Publication date: February 17, 2022Inventors: Hui Zang, Gang Chen, Chao Niu, Zhiqiang Lin
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Patent number: 11211421Abstract: A sensor includes a photodiode disposed in a semiconductor material to receive light and convert the light into charge, and a first floating diffusion coupled to the photodiode to receive the charge. A second floating diffusion is coupled to the photodiode to receive the charge, and a first transfer transistor is coupled to transfer the charge from the photodiode into the first floating diffusion. A second transfer transistor is coupled to transfer the charge from the photodiode into the second floating diffusion, and an inductor is coupled between a first gate terminal of the first transfer transistor and a second gate terminal of the second transfer transistor. The inductor, the first gate terminal, and the second gate terminal form a resonant circuit.Type: GrantFiled: January 23, 2019Date of Patent: December 28, 2021Assignee: OMNIVISION TECHNOLOGIES, INC.Inventors: Xianmin Yi, Jingming Yao, Philip Cizdziel, Eric Webster, Duli Mao, Zhiqiang Lin, Jens Landgraf, Keiji Mabuchi, Kevin Johnson, Sohei Manabe, Dyson H. Tai, Lindsay Grant, Boyd Fowler
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Publication number: 20210356633Abstract: Provided is a wide angle application high reflective mirror having a reflection band partially overlapping in a wavelength range of 800-4000 nm. The mirror comprises a film system in which a plurality of high refractive index film layers and a plurality of low refractive index film layers that are alternately stacked, and the material of the high refractive index film layer is one of SiH, SiOxHy, or SiOxNy, or a mixture thereof. The highly reflective mirror can achieve a reflectance greater than 99% with an incident angle ranging from 0 to 60 degrees over a large angle range.Type: ApplicationFiled: December 9, 2018Publication date: November 18, 2021Inventors: Li WU, Zhe LIU, Guanglong YU, Yu LI, Yan SU, Zhiqiang LIN
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Patent number: 11158661Abstract: An image sensor includes a two-dimensional photodiode-array formed in a semiconductor substrate, a first waveguide, and a first color filter. The first waveguide is aligned to a first photodiode of the photodiode-array, located above a top substrate surface of the semiconductor substrate. A first core of the first waveguide has a first core width that is less than a pitch of the photodiode-array in a first direction and a second direction corresponding to respective orthogonal dimensions of the photodiode-array. The first color filter is on a top waveguide surface of the first waveguide and has a first non-uniform thickness above the first core. The first waveguide is between the top substrate surface and the first color filter.Type: GrantFiled: September 19, 2019Date of Patent: October 26, 2021Assignee: OmniVision Technologies, Inc.Inventors: Alireza Bonakdar, Zhiqiang Lin
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Publication number: 20210274860Abstract: The invention relates to the field of sanitary products, in particular to a mask capable of preventing spectacles against mist. The mask comprises a mask body having an external surface and an internal surface, and a sponge strip fixedly connected to an upper part of the internal surface of the mask body. The side, away from the mask body, of the sponge strip is concave-convex to fit the nose bridge. The invention has the following beneficial effects: the sponge strip can well fit the nose bridge of the face of a wearer in shape, the sponge strip is compressible, the sponge strip will be squeezed by the mask body and the face of the wearer to deform to perfectly fit the face of different wearers; and the sponge is soft, so that the wear comfort of the mask can be improved.Type: ApplicationFiled: March 29, 2020Publication date: September 9, 2021Inventors: Zhijian Lin, Zhiqiang Lin, Yanzhong Xu
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Publication number: 20210255377Abstract: A 3D identification filter (101) is provided, which has a passband partially overlapping with a wavelength range of 800 nm to 1800 nm and a blocking band containing a range of 380 nm to 750 nm, and comprises a substrate (102) and filter film layers (103, 104) coated on both surfaces of the substrate, wherein the filter film layer (103) on one of the surfaces is composed of high refractive index layers, medium refractive index layers, and low refractive index layers that are stacked, and the filter film layer (104) on the other surface is composed of at least two layers of materials that are stacked. The 3D identification filter (101) maintains a high bocking level and a narrow transition band while achieving a small wavelength shift at a large light incident angle.Type: ApplicationFiled: September 12, 2018Publication date: August 19, 2021Inventors: Zhe LIU, Guanglong YU, Yu LI, Yan SU, Li WU, Zhiqiang LIN
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Publication number: 20210242262Abstract: A flare-suppressing image sensor includes a first pixel formed in a substrate and a refractive element located above the first pixel. The refractive element has, with respect to a top surface of the substrate, a height profile having at least two one-dimensional local maxima in each of a first cross-sectional plane and a second cross-sectional plane perpendicular to the first cross-sectional plane. Each of the first and second cross-sectional planes is perpendicular to the top surface and intersects the first pixel.Type: ApplicationFiled: January 30, 2020Publication date: August 5, 2021Inventors: Alireza BONAKDAR, Zhiqiang LIN, Chen-Wei LU
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Publication number: 20210242264Abstract: A light-trapping image sensor includes a pixel array and a lens array. The pixel array is formed in and on a semiconductor substrate and including photosensitive pixels each including a reflective material forming a cavity around a portion of semiconductor material to at least partly trap light that has entered the cavity. The cavity has a ceiling at a light-receiving surface of the semiconductor substrate, and the ceiling forms an aperture for receiving the light into the cavity. The lens array is disposed on the pixel array. Each lens of the lens array is aligned to the aperture of a respective cavity to focus the light into the cavity through the aperture.Type: ApplicationFiled: January 30, 2020Publication date: August 5, 2021Inventors: Alireza BONAKDAR, Zhiqiang LIN, Lindsay GRANT
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Publication number: 20210242265Abstract: An image sensor with quantum efficiency enhanced by inverted pyramids includes a semiconductor substrate and a plurality of microlenses. The semiconductor substrate includes an array of pixels. Each of the pixels is configured to convert light incident on the pixel to an electrical output signal, the semiconductor substrate having a top surface for receiving the light. The top surface forms a plurality of inverted pyramids in each pixel. The plurality of microlenses are disposed above the top surface and aligned to the plurality of inverted pyramids, respectively.Type: ApplicationFiled: January 30, 2020Publication date: August 5, 2021Inventors: Alireza BONAKDAR, Zhiqiang LIN, Bill PHAN, Badrinath PADMANABHAN
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Patent number: 10964744Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.Type: GrantFiled: September 13, 2019Date of Patent: March 30, 2021Assignee: OmniVision Technologies, Inc.Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
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Publication number: 20210091130Abstract: An image sensor includes a two-dimensional photodiode-array formed in a semiconductor substrate, a first waveguide, and a first color filter. The first waveguide is aligned to a first photodiode of the photodiode-array, located above a top substrate surface of the semiconductor substrate. A first core of the first waveguide has a first core width that is less than a pitch of the photodiode-array in a first direction and a second direction corresponding to respective orthogonal dimensions of the photodiode-array. The first color filter is on a top waveguide surface of the first waveguide and has a first non-uniform thickness above the first core. The first waveguide is between the top substrate surface and the first color filter.Type: ApplicationFiled: September 19, 2019Publication date: March 25, 2021Inventors: Alireza BONAKDAR, Zhiqiang LIN
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Publication number: 20210082990Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.Type: ApplicationFiled: September 13, 2019Publication date: March 18, 2021Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
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Publication number: 20210074751Abstract: An image sensor includes a substrate material, an array of the color filters, an array of waveguides and spacers. The substrate material includes a plurality of photodiodes disposed therein. The array of color filters are disposed over the substrate material. The array of waveguides are disposed over the substrate material. The buffer layer is disposed between the substrate material and the arrays of color filters and waveguides. The spacers are disposed between the color filters in the array of color filters. The spacers are disposed between the waveguides in the array of waveguides. Incident light is adapted to be confined between the spacers. The incident light is adapted to be directed through one of the waveguides and through one of the color filters prior to being directed through the buffer layer into one of the photodiodes in the substrate material.Type: ApplicationFiled: September 6, 2019Publication date: March 11, 2021Inventors: Alireza Bonakdar, Zhiqiang Lin
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Publication number: 20210009646Abstract: Provided is a polynucleotide, including a cis-regulatory element and a nucleotide sequence encoding a vestigial like 4 protein, wherein the cis-regulatory element includes an uncoupling protein 1 enhancer and an uncoupling protein 1 promoter. Also provided is a viral vector including said polynucleotide. Also provided is a method of transfecting a cell or a subject with said polynucleotide or said viral vector.Type: ApplicationFiled: July 10, 2020Publication date: January 14, 2021Applicant: MASONIC MEDICAL RESEARCH INSTITUTEInventor: Zhiqiang Lin
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Patent number: 10761385Abstract: A liquid crystal on silicon (LCOS) panel comprises: a silicon substrate having silicon circuit within the silicon substrate; a plurality of metal electrodes disposed on the silicon substrate, where the plurality of metal electrodes are periodically formed on the silicon substrate; a dielectric material disposed in and filling gaps between adjacent metal electrodes; and an oxide layer disposed on the plurality of metal electrodes and the dielectric material in the gaps between adjacent metal electrodes; where the refractive index of the dielectric material is higher than the refractive index of the oxide layer.Type: GrantFiled: December 22, 2017Date of Patent: September 1, 2020Assignee: OmniVision Technologies, Inc.Inventors: Ming Zhang, Libo Weng, Cheng Zhao, Yin Qian, Chia-Chun Miao, Zhiqiang Lin, Dyson H. Tai
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Publication number: 20200235158Abstract: A sensor includes a photodiode disposed in a semiconductor material to receive light and convert the light into charge, and a first floating diffusion coupled to the photodiode to receive the charge. A second floating diffusion is coupled to the photodiode to receive the charge, and a first transfer transistor is coupled to transfer the charge from the photodiode into the first floating diffusion. A second transfer transistor is coupled to transfer the charge from the photodiode into the second floating diffusion, and an inductor is coupled between a first gate terminal of the first transfer transistor and a second gate terminal of the second transfer transistor. The inductor, the first gate terminal, and the second gate terminal form a resonant circuit.Type: ApplicationFiled: January 23, 2019Publication date: July 23, 2020Inventors: Xianmin Yi, Jingming Yao, Philip Cizdziel, Eric Webster, Duli Mao, Zhiqiang Lin, Jens Landgraf, Keiji Mabuchi, Kevin Johnson, Sohei Manabe, Dyson H. Tai, Lindsay Grant, Boyd Fowler
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Patent number: 10665626Abstract: An image sensor comprises a first photodiode and a second photodiode having a smaller full-well capacitance than the first photodiode, wherein the second photodiode is adjacent to the first photodiode; a first micro-lens is disposed above the first photodiode and on an illuminated side of the image sensor; a second micro-lens is disposed above the second photodiode and on the illuminated side of the image sensor; and a coating layer disposed on both the first and second micro-lens, wherein the coating layer forms a flat top surface on the second micro-lens and a conformal coating layer on the first micro-lens.Type: GrantFiled: April 25, 2018Date of Patent: May 26, 2020Inventors: Cheng Zhao, Chen-Wei Lu, Zhiqiang Lin, Dyson Hsin-Chih Tai
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Publication number: 20190333953Abstract: An image sensor comprises a first photodiode and a second photodiode having a smaller full-well capacitance than the first photodiode, wherein the second photodiode is adjacent to the first photodiode; a first micro-lens is disposed above the first photodiode and on an illuminated side of the image sensor; a second micro-lens is disposed above the second photodiode and on the illuminated side of the image sensor; and a coating layer disposed on both the first and second micro-lens, wherein the coating layer forms a flat top surface on the second micro-lens and a conformal coating layer on the first micro-lens.Type: ApplicationFiled: April 25, 2018Publication date: October 31, 2019Applicant: OmniVision Technologies, Inc.Inventors: Cheng Zhao, Chen-Wei Lu, Zhiqiang Lin, Dyson Hsin-Chih Tai
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Publication number: 20190196284Abstract: A liquid crystal on silicon (LCOS) panel comprises: a silicon substrate having silicon circuit within the silicon substrate; a plurality of metal electrodes disposed on the silicon substrate, where the plurality of metal electrodes are periodically formed on the silicon substrate; a dielectric material disposed in and filling gaps between adjacent metal electrodes; and an oxide layer disposed on the plurality of metal electrodes and the dielectric material in the gaps between adjacent metal electrodes; where the refractive index of the dielectric material is higher than the refractive index of the oxide layer.Type: ApplicationFiled: December 22, 2017Publication date: June 27, 2019Applicant: OmniVision Technologies, Inc.Inventors: Ming Zhang, Libo Weng, Cheng Zhao, Yin Qian, Chia-Chun Miao, Zhiqiang Lin, Dyson H. Tai