Patents by Inventor Zhiyuan Wu

Zhiyuan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990368
    Abstract: Embodiments of the present disclosure are related to improved methods for forming an interconnect structure in a substrate. In one implementation, the method includes forming a barrier layer on exposed surfaces of a feature in a dielectric layer, forming a liner layer on the barrier layer, forming a seed layer on the liner layer, forming a metal fill on the seed layer by a metal fill process and overburdening the feature using an electroplating process, performing a planarization process to expose a top surface of the dielectric layer, and selectively forming a cobalt-aluminum alloy cap layer on the barrier layer, the liner layer, the seed layer, and the metal fill by exposing the substrate to a cobalt-containing precursor and an aluminum-containing precursor.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: May 21, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Mehul B. Naik, Zhiyuan Wu
  • Publication number: 20240153816
    Abstract: A method for forming a metal liner layer for an interconnect uses a multi-metal deposition process to produce a reduced thickness liner. The back-end-of-the-line packaging process may include forming a metal liner layer by depositing a ruthenium layer with a first thickness of approximately 5 angstroms or less and depositing a first cobalt layer with a second thickness of approximately 20 angstroms or less. In some embodiments, the ruthenium layer may be deposited on a previously formed barrier layer and then undergoes a treatment process before depositing the first cobalt layer. In some embodiments, the first cobalt layer may be deposited on the ruthenium layer or the ruthenium layer maybe deposited on the first cobalt layer. In some embodiments, the ruthenium layer is deposited on the first cobalt layer and a second cobalt layer is deposited on the ruthenium layer.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: Ge QU, Zhiyuan WU, Jiajie CEN, Feng CHEN
  • Publication number: 20240047971
    Abstract: A hydro-photovoltaic complementary operation chart application method for a clean energy base includes: divide a hydro-photovoltaic complementary operation chart into two sub-operation charts by runoff probability and critical probability; predict runoff and predicted photovoltaic output during the operation cycle, select the sub-operation chart by the runoff probability, determine hydropower output of a reservoir in the current month according to water level of the reservoir at the beginning of the current month and the operation area, and obtain the water level of the reservoir at the end of the current month through the runoff calculation; obtain long-term hydropower output process and reservoir level process in the clean energy base until the hydropower output and water level of the reservoir in all months of the operation cycle are calculated, and calculate hydropower generation probability to complete operation.
    Type: Application
    Filed: September 13, 2023
    Publication date: February 8, 2024
    Inventors: Xu Li, Dacheng Li, Xianfeng Huang, Jian Zhou, Huawei Xiang, Feng Wu, Yun Tian, Di Wu, Chang Xu, Xinglin Duan, Yanqing Zhang, Yuan Zheng, Wenbo Huang, Min Xu, Hong Pan, Zhiyuan Wu, Hucheng Xianyu, Wennan Yuan, Lijun Yin
  • Publication number: 20240020369
    Abstract: A speech control system includes a first client running on a mobile terminal, a server end running on a server, and a second client running on a controlled terminal. The first client obtains identity information of a user, and sends the identity information of the user to the server end. The server end verifies the identity information of the user. The first client further collects speech data of the user, generates a speech control request based on the speech data, and sends the speech control request to the server end. When verification on the identity information succeeds, the server end generates a control instruction based on the speech control request, and sends the control instruction to the second client. The second client indicates the controlled terminal to execute the control instruction.
    Type: Application
    Filed: August 1, 2023
    Publication date: January 18, 2024
    Inventors: Han Li, Zhiyuan Wu, Jun Wang, Lei Wang
  • Patent number: 11784127
    Abstract: Electronic devices and methods of forming electronic devices using a ruthenium or doped ruthenium liner and cap layer are described. A liner with a ruthenium layer and a cobalt layer is formed on a barrier layer. A conductive fill forms a second conductive line in contact with the first conductive line.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: October 10, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Wenjing Xu, Feng Chen, Tae Hong Ha, Xianmin Tang, Lu Chen, Zhiyuan Wu
  • Patent number: 11764157
    Abstract: Electronic devices and methods of forming electronic devices using a ruthenium or doped ruthenium liner and cap layer are described. A liner with a ruthenium layer and a cobalt layer is formed on a barrier layer. A conductive fill forms a second conductive line in contact with the first conductive line.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: September 19, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Wenjing Xu, Feng Chen, Tae Hong Ha, Xianmin Tang, Lu Chen, Zhiyuan Wu
  • Publication number: 20230253248
    Abstract: Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom. The methods include selectively depositing a self-assembled monolayer (SAM) on the bottom of the gap. The SAM comprises a hydrocarbon having a formula of H—C?C—R, wherein R is a linear alkyl chain or aryl group comprising from 1 to 20 carbon atoms or a formula of R?C?CR?, wherein R? and R? independently include a linear alkyl chain or aryl group comprising from 1 to 20 carbon atoms A barrier layer is formed on the SAM before selectively depositing a metal liner on the barrier layer. The SAM is removed after selectively depositing the metal liner on the barrier layer.
    Type: Application
    Filed: March 8, 2023
    Publication date: August 10, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Yang Zhou, Yong Jin Kim, Ge Qu, Zhiyuan Wu, Carmen Leal Cervantes, Feng Chen, Kevin Kashefi, Bhaskar Jyoti Bhuyan, Drew Phillips, Aaron Dangerfield
  • Publication number: 20230104661
    Abstract: A method and system for improving e-commerce that is directed at improving landing pages for consumer products. Using long tail query phrases, the method and system generates more detailed landing pages that will assist in providing more information to consumers.
    Type: Application
    Filed: October 4, 2022
    Publication date: April 6, 2023
    Inventors: Zhiyuan WU, Jing HE, Sebastian BULZAK, Sebastian REGALADO, Ryan WILSON, Mohamed METWALY
  • Publication number: 20230072614
    Abstract: Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom. A self-assembled monolayer (SAM) is formed on the bottom of the gap, and a barrier layer is formed on the SAM before selectively depositing a metal liner on the barrier layer. The SAM is removed after selectively depositing the metal liner on the barrier layer.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Ge Qu, Zhiyuan Wu, Feng Chen, Carmen Leal Cervantes, Yong Jin Kim, Kevin Kashefi, Xianmin Tang
  • Patent number: 11587873
    Abstract: Described are microelectronic devices comprising a dielectric layer formed on a substrate, a feature comprising a gap defined in the dielectric layer, a barrier layer on the dielectric layer, a two metal liner film on the barrier layer and a gap fill metal on the two metal liner. Embodiments provide a method of forming a microelectronic device comprising the two metal liner film on the barrier layer.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: February 21, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Gang Shen, Feng Chen, Yizhak Sabba, Tae Hong Ha, Xianmin Tang, Zhiyuan Wu, Wenjing Xu
  • Publication number: 20230001024
    Abstract: Compounds of Formula IA, IB, II, III, IV, and/or V are described herein along with their methods of use. A compound of the present invention may cross-link under physiological conditions and/or in vivo.
    Type: Application
    Filed: November 6, 2020
    Publication date: January 5, 2023
    Inventors: Jonathan S. Lindsey, Zhiyuan Wu, Hikaru Fujita, Daisuke Sato
  • Publication number: 20220344275
    Abstract: Electronic devices and methods of forming electronic devices using a ruthenium or doped ruthenium liner and cap layer are described. A liner with a ruthenium layer and a cobalt layer is formed on a barrier layer. A conductive fill forms a second conductive line in contact with the first conductive line.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 27, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Wenjing Xu, Feng Chen, Tae Hong Ha, Xianmin Tang, Lu Chen, Zhiyuan Wu
  • Publication number: 20220336271
    Abstract: Embodiments of the present disclosure are related to improved methods for forming an interconnect structure in a substrate. In one implementation, the method includes forming a barrier layer on exposed surfaces of a feature in a dielectric layer, forming a liner layer on the barrier layer, forming a seed layer on the liner layer, forming a metal fill on the seed layer by a metal fill process and overburdening the feature using an electroplating process, performing a planarization process to expose a top surface of the dielectric layer, and selectively forming a cobalt-aluminum alloy cap layer on the barrier layer, the liner layer, the seed layer, and the metal fill by exposing the substrate to a cobalt-containing precursor and an aluminum-containing precursor.
    Type: Application
    Filed: June 23, 2022
    Publication date: October 20, 2022
    Inventors: Mehul B. NAIK, Zhiyuan WU
  • Patent number: 11431407
    Abstract: Disclosed is a hardware-based protection group switching method and optical communication equipment.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: August 30, 2022
    Assignee: Sino-Telecom Technology Co., INC
    Inventors: Lei Hou, Zhiyuan Wu, Hu Xie, Lin Li
  • Patent number: 11373903
    Abstract: Embodiments of the present disclosure are related to improved methods for forming an interconnect structure in a substrate. In one implementation, the method includes providing a substrate comprising a metal region and a dielectric region surrounding the metal region, selectively forming a cobalt-containing alloy cap layer on the metal region by exposing the substrate to a first precursor and a second precursor, the first precursor and the second precursor are selected from a group consisting of an aluminum-containing precursor, a cobalt-containing precursor, a ruthenium-containing precursor, a manganese-containing precursor, and a tungsten-containing precursor, wherein the first precursor is different from the second precursor.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: June 28, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Mehul B. Naik, Zhiyuan Wu
  • Publication number: 20220028795
    Abstract: Electronic devices and methods of forming electronic devices using a ruthenium or doped ruthenium liner and cap layer are described. A liner with a ruthenium layer and a cobalt layer is formed on a barrier layer. A conductive fill forms a second conductive line in contact with the first conductive line.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 27, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Wenjing Xu, Feng Chen, Tae Hong Ha, Xianmin Tang, Lu Chen, Zhiyuan Wu
  • Publication number: 20210351136
    Abstract: Described are microelectronic device comprising a dielectric layer formed on a substrate, a feature 206 comprising a gap defined in the dielectric layer, a barrier layer on the dielectric layer, a two metal liner film on the barrier layer and a gap fill metal on the two metal liner. Embodiments provide a method of forming an microelectronic device comprising the two metal liner film on the barrier layer.
    Type: Application
    Filed: June 23, 2020
    Publication date: November 11, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Gang Shen, Feng Chen, Yizhak Sabba, Tae Hong Ha, Xianmin Tang, Zhiyuan Wu, Wenjing Xu
  • Patent number: 11171046
    Abstract: Methods and apparatus for forming an interconnect structure, the method including selectively depositing two or more capping layers atop a top surface of a via within a low-k dielectric layer, wherein the two or more capping layers include a first layer of ruthenium and a second layer of cobalt.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: November 9, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Feng Chen, Yufei Hu, Wenjing Xu, Gang Shen, Zhiyuan Wu, Tae Hong Ha
  • Publication number: 20210314543
    Abstract: A method of distance measuring includes obtaining a depth map and a stereo pair of images of a scene of interest, and enhancing a precision of the depth map based on disparity values of corresponding points between the images. The images have a higher resolution than the depth map. Enhancing the precision of the depth map includes optimizing an energy function of the images over a predetermined range of disparity values to obtain an optimized energy function; determining the disparity values based on the optimized energy function; and replacing low precision values of the depth map with corresponding high precision values based on the disparity values.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventors: Zhenyu ZHU, Honghui ZHANG, Zhiyuan WU
  • Patent number: 11120560
    Abstract: Methods, systems, and articles of manufacture configured to operate an aerial vehicle are provided. Various embodiments may be implemented with an aerial vehicle. In one exemplary implementation, a method of operating an aerial vehicle may include identifying, from image data, a set of predetermined features based on one or more invariant properties associated with the predetermined features. The predetermined features may be associated with predetermined physical locations. Based on the image locations of the predetermined features within the image data and the predetermined physical locations of the predetermined features, a system may be configured to determine at least one of a location and an orientation of the aerial vehicle. The disclosed embodiments may provide enhanced accuracy, usability, and robustness in tracking the location and orientation of an aerial vehicle under various operation conditions.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: September 14, 2021
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: You Zhou, Zhenyu Zhu, Zhiyuan Wu