Application of antimicrobial agents to medical devices
Invasive medical devices including a substantially non-eluting antimicrobial treatment are disclosed. One or more external and/or internal surfaces of the medical device include a substantially non-eluting copper-coated surface that assists in preventing microbial colonization of the coated surface. This in turn reduces the incidence of infection to the patient originating from the medical device. In one embodiment, a catheter assembly is disclosed and comprises an elongate catheter tube that defines at least one lumen, at least one extension leg including a luer connector, and a bifurcation hub including at least one fluid passageway that provides fluid communication between the extension leg and the lumen. A substantially non-eluting copper coating is disposed on a surface of at least one of the lumen, the extension leg, the luer connector, and the fluid passageway. The coating is applied via an electroless deposition process. A water-shed coating is disposed on the copper coating.
Latest C. R. Bard, Inc. Patents:
This application claims the benefit of U.S. Provisional Patent Application No. 62/140,206, filed Mar. 30, 2015, and titled “Application of Antimicrobial Agents to Indwelling Medical Devices,” which is incorporated herein by reference in its entirety.
BRIEF SUMMARYBriefly summarized, embodiments of the present invention are directed to invasive medical devices that include a substantially non-eluting antimicrobial agent. One or more external and/or internal surfaces of the medical device include a substantially non-eluting copper-coated surface that assists in preventing microbial colonization of the coated surface. This in turn reduces the incidence of infection to the patient originating from the medical device.
In one embodiment, a catheter assembly is disclosed and comprises an elongate catheter tube that defines at least one lumen, at least one extension leg including a luer connector, and a bifurcation hub including at least one fluid passageway that provides fluid communication between the extension leg and the lumen. A substantially non-eluting copper coating is disposed on a surface of at least one of the lumen, the extension leg, the luer connector, and the fluid passageway. The coating is applied via an electroless deposition process. A water-shed coating is disposed on the copper coating.
Note that components associated with invasive medical devices are also contemplated to fall within the embodiments described herein.
These and other features of embodiments of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of embodiments of the invention as set forth hereinafter.
A more particular description of the present disclosure will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. Example embodiments of the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
Reference will now be made to figures wherein like structures will be provided with like reference designations. It is understood that the drawings are diagrammatic and schematic representations of exemplary embodiments of the present invention, and are neither limiting nor necessarily drawn to scale.
For clarity it is to be understood that the word “proximal” refers to a direction relatively closer to a clinician using the device to be described herein, while the word “distal” refers to a direction relatively further from the clinician. For example, the end of a catheter placed within the body of a patient is considered a distal end of the catheter, while the catheter end remaining outside the body is a proximal end of the catheter. Also, the words “including,” “has,” and “having,” as used herein, including the claims, shall have the same meaning as the word “comprising.”
Embodiments of the present disclosure are generally directed to invasive medical devices configured to be indwelling, i.e., for at least a portion of the device to be disposed within the body of a patient so as to provide a conduit or other invasive access to the patient. Examples of such an indwelling medical devices include a catheter or an implantable access port, both for providing central venous access. It is appreciated that an invasive medical device is understood to include medical devices that are partially inserted or fully implanted into the body of a patient, either temporarily or permanently. Note that components associated with invasive medical devices are also contemplated to fall within the embodiments described herein.
In accordance with one embodiment, one or more external and/or internal surfaces of the medical device include a substantially non-eluting copper-coated surface that assists in preventing microbial colonization of the coated surface. For instance, in one embodiment, one or more regions of a fluid path defined by surfaces of the medical device are copper coated so as to prevent the establishment/proliferation of microbes thereon. This in turn reduces the incidence of infection to the patient originating from the indwelling medical device. In other embodiments, other modes of providing copper's antimicrobial effect to the medical device are disclosed.
Reference is first made to
A bifurcation hub 16 is operably connected to the proximal end 12A of the catheter tube 12 and provides one or more fluid pathways between the lumen(s) 14 of the catheter tube and corresponding extension legs 18. Note that the bifurcation hub 16 in one embodiment includes only a single fluid pathway for a single lumen catheter. Each extension leg 18 defines a fluid-carrying lumen and includes a luer connector 19 (or other suitable connector) at a proximal end thereof to enable a syringe or other device to operably connect with the catheter 10.
The catheter tube 12 includes a proximal portion 20 extending distally from the proximal end 12A and a distal portion 30 extending distally from a distal end of the proximal portion to distal end 12B of the catheter tube. A tapered region 24 of the proximal portion 20 extends distally from the bifurcation hub 16 and includes the portion of the catheter tube that is typically disposed at the insertion site of the patient's skin through which the catheter passes before entering a vein or other vessel. Note that the particular configuration of the catheter assembly can vary from what is shown and described herein.
In light of the above, it is appreciated that various components of the catheter 10 define a fluid path through which fluid can travel through the catheter, such as to infuse medicaments into the vein and/or to aspirate blood or other fluids from the vein, via the catheter. In the present embodiment, the fluid path of the catheter is defined by the extension legs 18, the fluid pathways of the bifurcation hub 16, and the lumens 14 of the catheter tube 12. It is appreciated that additional or other components can contribute to defining the fluid path of the catheter in other embodiments, and that other invasive medical devices can include other types of fluid paths.
“Non-eluting” as used herein is understood to mean that only a relatively small amount of release of metallic copper from the copper coating into fluids surrounding the copper coating occurs. For instance, in one embodiment, the substantially non-eluting copper coating 42 releases copper particles resulting in a copper concentration of less than about 1.5 parts per million in a fluid in contact with the copper coating. This release can vary according to various factors, including device surface composition, the type of fluid the copper coating is exposed to, copper coating thickness, the presence of an over-coating atop the copper coating, etc.
In the present embodiment, the bifurcation hub 16 defining the fluid pathways 40 is composed of a thermoplastic polyurethane, such as ISOPLAST® resin available from the Lubrizol Corporation, Wickliffe, Ohio. It is noted that the fluid pathways 40 of the bifurcation hub 16 are locations that are typically difficult for some traditional antimicrobial treatments to reach. As such, inclusion of the coating 42 on a portion or all of the fluid pathways 40 of the bifurcation hub 16—or on other fluid-carrying or other surfaces of the medical device—as described herein can improve the ability of the medical device to resist microbial colonization. It is appreciated that the coating 42 can be applied to medical device surfaces of other than thermoplastic polyurethane, including other plastics (thermoset and thermoplastic) such as polycarbonate, silicone, PVC, polyethylene, polypropylene, as well as metals, ceramic, glass, etc.
In one embodiment, the copper coating is deposited on the interior surfaces of the fluid pathways 40 of the bifurcation hub 16 (or other suitable surfaces of the medical device) via an electroless deposition process, which deposits the copper metallic coating on an electrically non-conductive surface without the use of an electric field. Electroless deposition includes, in the present embodiment, process first including a cleaning of the surfaces on which deposition is to occur, before physically masking the parts of the medical device not desiring to be coated. Next, the surface to be coated is prepared by mechanically etching the surface via silicon carbide high-pressure sand blasting, though other etching procedures can be employed, including chemical etching in one embodiment.
A pre-coat layer of copper, nickel, or another suitable metal or material is deposited on the surface to be coated via electroless deposition. This helps improve the efficiency the subsequent coating. In another embodiment, the pre-coat layer is omitted. The bifurcation hub 16 is then placed in a liquid copper chloride bath where an auto-catalytic reaction forms the relatively thin, uniform coating 42 on the unmasked portions of the hub as a result of an oxido-reduction reaction.
A final water-shed overcoating layer can then be applied in one embodiment to prevent tarnishing via oxidation of the coating 42. In one embodiment, the water-shed layer is applied by immersing the coated component in a solution containing butoxyethanol and butoxyethoxyethanol for a predetermined time. An example of such a solution is TARNIBAN® anti-tarnish manufactured by Technic, Inc., Providence, R.I. Note that other/additional steps can be included in the electroless deposition process.
The above-described electroless deposition process produces the substantially uniform, relatively thin copper coating 42 on the desired surface(s) of the medical device, such as the fluid pathways 40 of the bifurcation hub 16. In one embodiment, the coating 42 has a thickness of about 0.9 micrometers. In another embodiment, the coating varies in thickness from about 0.8 to about 2.6 micrometers, though it is appreciated that other coating thicknesses can also be produced. In one embodiment, the coating 42 is sufficiently thin so as to prevent flaking or rubbing off of the copper. Note that the desired thickness of the coating 42 can vary according to a number of factors including, desired effective life of the coating, the level of microbicidal efficacy desired, limitations on occluding the resultant size of the fluid path, designed indwelling time (e.g., product life) of the medical device, etc. These and other factors can be considered when determining the coating thickness.
As mentioned, the copper-containing coating 42 serves as an antimicrobial surface, which desirably reduces the likelihood of the establishment/proliferation of microbes on the treated surface. In one embodiment, the coating 42 desirably produces at least a 4-log reduction of microbe presence on the treated surface, even after an extended period of time, such as 31 days or more, in one embodiment. The copper coating is substantially non-eluting, and as such serves as a passive barrier to colonization by microbes, including MRSA, Psuedomonas aeriginosa, Entirobacter aregenes, VRE, yeast, etc. Note that the relatively positive electrical charge of the copper coating on the surface of the medical device enables it to serve as a contact killing surface whereon microbes are eliminated after contacting the coated surface, in one embodiment.
Note that the copper coating 42 of the present embodiment is configured to not substantially elute into the medical device or into the fluid carried by the medical device, but rather is intended to maintain the coated surface substantially free of microbes through contact killing of such microbes. Indeed, in one example elution of copper from the coating 42 on a fluid-carrying surface of a luer connector medical device amounted to about 0.210 micrograms when the coating was exposed to a solution of 0.9% saline and 0.157 micrograms ethanol for a period of about 24 hours. This amount represented approximately 0.009% of the total copper content of coating 42 on the luer connector surface, thus proving its substantial non-elution.
It is appreciated that, in addition to electroless deposition, other application techniques can be employed to deposit the coating 42 on the medical device surface, including electroplating, ion beam deposition, sputtering, and others to be described further below. Differing surfaces on which the coating is to be applied can facilitate certain application techniques: electroplating can be employed to apply a copper coating to a plastic surface (e.g., via employing conducting polymers) or metallic surface, for instance. Spray coating can be employed for applying a copper coating to ceramic medical devices and other material types in another embodiment.
It is appreciated that the coating 42 can be employed in conjunction with other antimicrobial measures for the medical device. For example, in one embodiment the copper coating 42 can be applied to the interior surfaces defining the fluid pathways 40 of the bifurcation hub 16, while the interior surfaces of the lumens 14 of the catheter tube 12 can be treated with another antimicrobial solution, such as a different coating. As such, the coating 42 can cooperate with other treatments in other locations of the fluid path to provide antimicrobial protection.
It is appreciated that the above-discussed coating 42 can be employed in a variety of locations, both fluid-carrying and otherwise, on/in the medical device.
It is generally noted that all, or less than all, of a fluid path defined through the catheter 10, including for instance the connectors 19, the extension legs 18, the bifurcation hub 16, and the lumens 14 of the catheter tube 12 can include a copper coating for antimicrobial purposes. Likewise, a portion or all of the outer surfaces of the catheter 10 can include a copper coating for antimicrobial purposes.
It is appreciated that other modes can be employed to provide copper antimicrobial protection to a medical device.
The embodiments described herein are merely examples of medical devices that may benefit from the teachings of the present disclosure. It is appreciated that a variety of medical devices can include the copper coatings and copper-containing surfaces described herein, including PICCs, central venous catheters (“CVCs”), hemodialysis catheters, pulmonary artery catheters, arterial catheters, urinary catheters, peritoneal dialysis catheters, enteral feeding tubes, gastrostomy tubes, nasogastric tubes, endotracheal tubes, tracheostomy tubes, umbilical catheters, needleless connectors, midlines catheters, bowel catheters, intermediate dwell catheters, Swan-Ganz catheters, implantable access ports and other implantable devices, etc.
Afterwards, the needleless connectors were drained of all fluid and were connected to corresponding luer connectors coated with the coating 42 as described above in connection with
After the above incubation, the luer connectors and needleless connectors were separated from one another and subjected to flushing and sonication to recover plaktonic and adherent microbes (as biofilm or in other forms). The resulting microbial quantities were plated an enumerated. The results are shown in
It is appreciated that the copper coating as discussed herein is useful in situations where the surface to be treated is a relatively high durometer plastic, which plastic often is resistant to imbibing typical antimicrobial agents for defeating viruses, bacteria, fungi, etc. Areas of a catheter that have traditionally hard to treat for antimicrobial effect include components that are often made from such high durometer plastics, including the bifurcation hub and its fluid pathways, luer connectors, etc. In one embodiment, the copper coating is employed to reduce antimicrobial colonization on fluid-carrying surfaces, such as the fluid pathways of a bifurcation hub, but the coating can be employed in other areas of a medical device, including non-fluid-carrying surfaces, in other embodiments.
Embodiments of the invention may be embodied in other specific forms without departing from the spirit of the present disclosure. The described embodiments are to be considered in all respects only as illustrative, not restrictive. The scope of the embodiments is, therefore, indicated by the appended claims rather than by the foregoing description. All changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims
1. A medical device, comprising:
- a body defining at least a portion of a fluid path having a surface, the medical device configured to provide access to a venous system of a patient;
- a substantially non-eluting copper coating disposed on at least a portion of the surface; and
- a water-shed layer disposed on the copper coating.
2. The medical device as defined in claim 1, wherein the copper coating includes a thickness that is from 0.8 micrometers to about 2.6 micrometers.
3. The medical device as defined in claim 2, wherein the thickness of the copper coating and presence of the water-shed coating over the copper coating results in release of copper particles in a copper concentration of less than about 1.5 parts per million in an infused medicament or aspirated blood when in contact with the copper coating.
4. The medical device as defined in claim 1, wherein the medical device is an invasive medical device and includes one of a catheter assembly or an implantable vascular access port.
5. The medical device as defined in claim 1, wherein the water-shed layer includes at least one of butoxyethanol or butoxyethoxyethanol.
6. The medical device as defined in claim 1, wherein the medical device includes a needleless connector, and wherein the surface is disposed on an interior portion of the needleless connector.
7. The medical device as defined in claim 1, wherein the medical device includes a luer connector.
8. The medical device as defined in claim 7, wherein at least an outer surface of the luer connector body includes the copper coating.
9. The medical device as defined in claim 7, wherein at least one of an interior surface or an exterior surface of the luer connector includes the copper coating thereon, the luer connector including a valve.
10. The medical device as defined in claim 9, wherein at least a portion of the valve includes the copper coating.
11. The medical device as defined in claim 7, wherein the water-shed layer includes at least one of butoxyethanol or butoxyethoxyethanol.
12. The medical device as defined in claim 7, wherein the luer connector is included with a catheter assembly.
13. A catheter assembly, comprising:
- an elongate catheter tube defining at least one lumen;
- at least one extension leg including a luer connector, the luer connector including a body defining a first portion of a fluid passageway;
- a bifurcation hub including a second portion of the fluid passageway that provides fluid communication between the at least one extension leg and the at least one lumen;
- a substantially non-eluting copper coating disposed on at least an interior surface of the luer connector and an interior surface of a second portion of the fluid passageway of the bifurcation hub, the copper coating having a thickness from about 0.8 micrometers to about 2.6 micrometers; and
- a water-shed coating disposed on the copper coating, the thickness of the copper coating and presence of the water-shed coating over the copper coating resulting in release of copper particles in a copper concentration of less than about 1.5 parts per million in an infused medicament or aspirated blood when in contact with the copper coating.
14. The catheter assembly as defined in claim 13, wherein another antimicrobial agent is included on a surface of at least one of the elongate catheter tube or the at least one extension leg.
15. The catheter assembly as defined in claim 13, wherein the copper coating elutes less than about 0.01% of a total copper content of the copper coating after about 24 hours of fluid contact with the copper coating.
16. The catheter assembly as defined in claim 13, the luer connector including a valve.
17. The catheter assembly as defined in claim 16, wherein at least a portion of the valve includes the copper coating.
3742933 | July 1973 | Bucalo |
4483688 | November 20, 1984 | Akiyama |
4592920 | June 3, 1986 | Murtfeldt |
4933178 | June 12, 1990 | Capelli |
5049139 | September 17, 1991 | Gilchrist |
5474797 | December 12, 1995 | Sioshansi |
5516480 | May 14, 1996 | Krall et al. |
5520664 | May 28, 1996 | Bricault, Jr. |
5681575 | October 28, 1997 | Burrell et al. |
5861191 | January 19, 1999 | Ferralli |
5894042 | April 13, 1999 | Ferralli |
6080490 | June 27, 2000 | Burrell et al. |
6267782 | July 31, 2001 | Ogle et al. |
6287484 | September 11, 2001 | Hausslein et al. |
6322588 | November 27, 2001 | Ogle et al. |
6333093 | December 25, 2001 | Burrell et al. |
6368611 | April 9, 2002 | Whitbourne et al. |
6436422 | August 20, 2002 | Trogolo et al. |
6544536 | April 8, 2003 | Krall et al. |
6585767 | July 1, 2003 | Holley et al. |
6620460 | September 16, 2003 | Oldiges et al. |
6949598 | September 27, 2005 | Terry |
7033339 | April 25, 2006 | Lynn |
7097850 | August 29, 2006 | Chappa et al. |
7147625 | December 12, 2006 | Sarangapani et al. |
7288264 | October 30, 2007 | Sawan et al. |
7347853 | March 25, 2008 | DiFiore |
7357949 | April 15, 2008 | Trogolo et al. |
7476698 | January 13, 2009 | Wagener et al. |
7645824 | January 12, 2010 | Hendriks et al. |
7736730 | June 15, 2010 | Jung et al. |
7762524 | July 27, 2010 | Cawthon |
7820284 | October 26, 2010 | Terry |
7829029 | November 9, 2010 | Zumeris et al. |
7906132 | March 15, 2011 | Ziegler et al. |
7951853 | May 31, 2011 | Ismail et al. |
8178120 | May 15, 2012 | Vandesteeg et al. |
8309216 | November 13, 2012 | Ohrlander et al. |
8361553 | January 29, 2013 | Karandikar et al. |
8382833 | February 26, 2013 | Kokott et al. |
8394448 | March 12, 2013 | Lachner |
8394494 | March 12, 2013 | Ohrlander et al. |
8454984 | June 4, 2013 | Krongauz et al. |
8470453 | June 25, 2013 | Ohrlander et al. |
8497017 | July 30, 2013 | Ohrlander et al. |
8563020 | October 22, 2013 | Uhlmann et al. |
8574203 | November 5, 2013 | Stout |
8579990 | November 12, 2013 | Priewe |
8753561 | June 17, 2014 | Lee et al. |
8764960 | July 1, 2014 | Chung et al. |
8765256 | July 1, 2014 | Ohrlander et al. |
8834686 | September 16, 2014 | McClure et al. |
8841000 | September 23, 2014 | Gong et al. |
9016221 | April 28, 2015 | Brennan et al. |
9017797 | April 28, 2015 | Goelling |
9289378 | March 22, 2016 | Karandikar et al. |
9339588 | May 17, 2016 | Ohrlander et al. |
9393350 | July 19, 2016 | McGrath et al. |
9402933 | August 2, 2016 | Heidenau et al. |
9440043 | September 13, 2016 | Arora |
9522507 | December 20, 2016 | Ganey et al. |
9603964 | March 28, 2017 | Dubey et al. |
9629946 | April 25, 2017 | Johansson et al. |
9878143 | January 30, 2018 | Sansoucy |
20020099449 | July 25, 2002 | Speitling |
20030120197 | June 26, 2003 | Kaneko et al. |
20040039437 | February 26, 2004 | Sparer et al. |
20040220534 | November 4, 2004 | Martens et al. |
20050034723 | February 17, 2005 | Bennett |
20050058835 | March 17, 2005 | Howdle et al. |
20050182152 | August 18, 2005 | Nonninger et al. |
20050234516 | October 20, 2005 | Gueret |
20060083710 | April 20, 2006 | Joerger et al. |
20060134313 | June 22, 2006 | Guggenbichler et al. |
20060182954 | August 17, 2006 | Bowman et al. |
20070129690 | June 7, 2007 | Rosenblatt |
20070196605 | August 23, 2007 | Ong |
20070259427 | November 8, 2007 | Storey et al. |
20080020210 | January 24, 2008 | Griffin et al. |
20090035342 | February 5, 2009 | Karandikar et al. |
20090110750 | April 30, 2009 | Greener |
20090238850 | September 24, 2009 | Greener |
20090324738 | December 31, 2009 | Krongauz |
20100074932 | March 25, 2010 | Talsma |
20100113871 | May 6, 2010 | Dias et al. |
20100190004 | July 29, 2010 | Gibbins et al. |
20100215643 | August 26, 2010 | Clevenger et al. |
20100227052 | September 9, 2010 | Carter et al. |
20110067703 | March 24, 2011 | Martens et al. |
20110104477 | May 5, 2011 | Wagener et al. |
20110152843 | June 23, 2011 | Wedlin et al. |
20110165013 | July 7, 2011 | Trybus et al. |
20110311337 | December 22, 2011 | Amin |
20120024712 | February 2, 2012 | Neumann et al. |
20120070685 | March 22, 2012 | Kloss et al. |
20120078203 | March 29, 2012 | Gaube et al. |
20120083750 | April 5, 2012 | Sansoucy |
20120202043 | August 9, 2012 | Bonn-Savage et al. |
20120294919 | November 22, 2012 | Jaynes et al. |
20130048336 | February 28, 2013 | Malik |
20140154297 | June 5, 2014 | Krongauz et al. |
20140276493 | September 18, 2014 | Leung et al. |
20150196685 | July 16, 2015 | Schwartz et al. |
20150258248 | September 17, 2015 | Baek |
20150290357 | October 15, 2015 | Chu |
20150351851 | December 10, 2015 | Deselle et al. |
20160144602 | May 26, 2016 | Levasseur et al. |
20160250390 | September 1, 2016 | Ohrlander et al. |
0484680 | May 1992 | EP |
1994022522 | October 1994 | WO |
2000015288 | March 2000 | WO |
2007034167 | March 2007 | WO |
2007076413 | July 2007 | WO |
2007101062 | September 2007 | WO |
2014138885 | September 2014 | WO |
2014204407 | December 2014 | WO |
2016040529 | March 2016 | WO |
2016132288 | August 2016 | WO |
2016/160983 | October 2016 | WO |
- EP 16774103.2 filed Oct. 27, 2017 Extended European Search Report dated Mar. 14, 2018.
- “IUD with copper”—http://en.wikipedia.org/wiki/IUD_with_copper, dated Mar. 19, 2015.
- Borkow, G. “Safety of Using Copper Oxide in Medical Devices and Consumer Products” Curren Chemical Biology, vol. 6, pp. 86-92, Jan. 2012.
- M. Gossau et al.—“Effectiveness of antibacterial copper additives in silicone implants”—J. Biomater Appl. 28(2): 187-198, dated Apr. 5, 2012.
- Stojan S. Djokic, Abstract of Chapter “Electroless Deposition—Theory and Applications”—from: Electrodeposition, vol. 48 of Modern Aspects of Electrochemistry pp. 251-289. Dated Mar. 8, 2010.
- Trace elements in human nutrition and health—World Health Organization—Geneva 1996.
Type: Grant
Filed: Mar 30, 2016
Date of Patent: Aug 16, 2022
Patent Publication Number: 20160287758
Assignee: C. R. Bard, Inc. (Franklin Lakes, NJ)
Inventors: Giridhar Thiagarajan (Salt Lake City, UT), Jerrid Matson (Champlin, MN)
Primary Examiner: Nathan R Price
Assistant Examiner: Courtney B Fredrickson
Application Number: 15/085,463
International Classification: A61M 25/00 (20060101); A61L 29/10 (20060101); A61M 1/36 (20060101); A61L 29/06 (20060101); A61L 29/16 (20060101); A61M 39/02 (20060101); A61M 39/16 (20060101); A61M 39/22 (20060101);