High speed electrical connector and printed circuit board thereof

A stacked I/O connector with surface mountable tails and a printed circuit board (PCB) configured to receive the connector. The connector may avoid terminal deformations or scratches when the connector is mounted to the PCB. The PCB may include solder pads on a single surface or both surfaces. The sold pads may be configured for the tails of the connector to be attached with a surface mount soldering technique. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The connector may have row-oriented terminal subassemblies, holes in the connector housing and other features to facilitate reliable manufacture and operation of the connector.

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description
CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 17/195,403 (now U.S. Pat. No. 11,757,215), filed on Mar. 8, 2021, entitled “HIGH SPEED ELECTRICAL CONNECTOR AND PRINTED CIRCUIT BOARD THEREOF,” which is a continuation of U.S. patent application Ser. No. 16/415,456 (now U.S. Pat. No. 10,944,189), filed on May 17, 2019, entitled “HIGH SPEED ELECTRICAL CONNECTOR AND PRINTED CIRCUIT BOARD THEREOF,” which claims priority to and the benefit of Chinese Patent Application No. 201821577530.2, filed on Sep. 26, 2018. The entire contents of these applications are incorporated herein by reference in their entirety.

FIELD OF THE INVENTION

This disclosure relates generally to electronic systems and more specifically to electrical connectors able to carry high-frequency signals and printed circuit boards thereof.

BACKGROUND

Electrical connectors are used in many electronic systems. In general, various electronic devices (e.g., smart phones, tablet computers, desktop computers, notebook computers, digital cameras, and the like) have been provided with assorted types of connectors whose primary purpose is to enable an electronic device to exchange data, commands, and/or other signals with one or more other electronic devices. Electrical connectors are basic components needed to make some electrical systems functional. Signal transmission to transfer information (e.g., data, commands, and/or other electrical signals) often utilize electrical connectors between electronic devices, between components of an electronic device, and between electrical systems that may include multiple electronic devices.

It is generally easier and more cost effective to manufacture an electrical system as separate electronic assemblies, such as printed circuit boards (“PCBs”), which may be communicatively joined together with electrical connectors. In some scenarios, the PCBs to be joined may each have connectors mounted on them. The connectors may be mated together directly to interconnect the PCBs.

To facilitate manufacture of different parts of electronic devices in different places by different companies, aspects of the receptacle connectors and the plug connectors may be standardized, either through a formal standard-setting process or through adoption of a particular design by a large number of manufacturers. An example of an interconnection standard is the SAS or Serial Attached SCSI (Small Computer System Interface) standard. Another example is the SFP or Single Form-Factor Pluggable standard, as well as its variations: SFP+, QSFP, QSFP+, etc. Connectors made according to these pluggable standards are sometimes called I/O connectors, because they mate with plugs terminating cables that carry signals into or out of an electronic device. I/O connectors are commonly made with press fit terminal tails that make connections between the terminals in the connector and traces within a PCB when the terminal tails are pressed into holes in the PCB that pass through the traces.

I/O connectors according to these pluggable standards have one or more ports, each configured to receive a plug terminating a cable. It is sometimes desirable for there to be multiple ports in an electronic device, so that the device may communicate through cables with multiple other devices. The ports may be configured in rows and columns, and I/O connectors are sometimes made in a stacked configuration with 2 ports, one above the other. When multiple stacked connectors are mounted on a surface of a PCB, the ports are arrayed in rows and columns. Rows and columns of ports may also be made by mounting I/O connectors on opposite sides of the PCB, one above the other. This configuration is sometimes called “belly to belly.”

For electronic devices that require a high-density, high-speed connector, techniques may be used to reduce interference between conductive elements within the connectors, and to provide other desirable electrical properties. One such technique involves the use of shield members between or around adjacent signal conductive elements of a connector system. The shields may prevent signals carried on one conductive element from creating “crosstalk” on another conductive element. The shields may also have an impact on an impedance of the conductive elements, which may further contribute to desirable electrical properties of the connector system.

Another technique that may be used to control performance characteristics of a connector entails transmitting signals differentially. Differential signals result from signals carried on a pair of conducting paths, called a “differential pair.” The voltage difference between the conductive paths represents the differential signal. In general, a differential pair is designed with preferential coupling between the conducting paths of the pair. For example, the two conducting paths of a differential pair may be arranged to run closer to each other than to other adjacent signal paths in the connector.

SUMMARY

Aspects of the present application relate to a high speed electrical connector and an applicable printed circuit board thereof.

Some embodiments relate to an electrical connector. The electrical connector comprises a housing comprising a cavity and a first slot and a second slot extending into the cavity in a first direction, a first terminal subassembly comprising a first plurality of terminals held in a first row of terminals, a second terminal subassembly comprising a second plurality of terminals held in a second row of terminals, a third terminal subassembly comprising a third plurality of terminals held in a third row of terminals, and a fourth terminal subassembly comprising a fourth plurality of terminals held in a fourth row of terminals. Each of the first plurality of terminals, the second plurality of terminals, the third plurality of terminals, the fourth plurality of terminals comprises a mating portion, a tail and an intermediate portion joining the mating portion and the tail. The first terminal subassembly, the second terminal subassembly, the third terminal subassembly, and the fourth terminal subassembly are disposed within the cavity with the mating portions extending into a respective slot of the first slot and the second slot. The tails extend at a right angle from respective intermediate portions in four parallel rows in a plane parallel to the first direction.

In some embodiments, the tails in the four parallel rows are spaced, center to center, by 0.7 to 1 mm.

In some embodiments, the tails have a width of 0.25 mm.

In some embodiments, the housing further comprises at least two posts extending through and perpendicular to the plane.

In some embodiments, a plurality of anchor pins attached to the housing. Each anchor pin comprises a pair of opposing spring arms extending through and perpendicular to the plane.

In some embodiments, the tails of the first and fourth terminal subassemblies bend, with respect to intermediate portions of respective terminals, in the first direction. The tails of the second and third terminal subassemblies bend, with respect to intermediate portions of respective terminals, in a second direction opposite the first direction.

In some embodiments, the first terminal subassembly comprises a first row of tails of the four parallel rows. The second terminal subassembly comprises a second row of tails of the four parallel rows. The third terminal subassembly comprises a third row of tails of the four parallel rows. The fourth terminal subassembly comprises a fourth row of tails of the four parallel rows. The first row of tails is adjacent to and offset, in a direction perpendicular to the first direction, from the second row of tails. The third row of tails is adjacent to and offset, in a direction perpendicular to the first direction, from the fourth row of tails.

In some embodiments, the first terminal subassembly comprises a first insulative member holding the first plurality of terminals in the first row of terminals. The second terminal subassembly comprises a second insulative member holding the second plurality of terminals in the second row of terminals. The third terminal subassembly comprises a third insulative member holding the third plurality of terminals in the third row of terminals. The fourth terminal subassembly comprises a fourth insulative member holding the fourth plurality of terminals in the fourth row of terminals. The first insulative member abuts the second insulative member. The third insulative member abuts the fourth insulative member.

In some embodiments, the cavity of the housing is a first cavity. The first insulative member comprises a second cavity. The second insulative member comprises a third cavity. The first terminal subassembly and the second terminal subassembly are positioned with the second cavity aligned with the third cavity. The connector further comprises a ground member disposed in the second cavity and the third cavity, the ground member comprising projecting portions extending towards respective terminals in the first terminal subassembly and the second terminal subassembly.

In some embodiments, the ground member comprises a metal strip. The projecting portions of the ground member comprise spring fingers extending from the metal strip.

In some embodiments, the ground member is a composite lossy member comprising a strip of electrically lossy material. The metal strip is disposed within the strip of lossy material.

In some embodiments, the composite lossy member is a first composite lossy member of a plurality of composite lossy members disposed between the first terminal subassembly and the second terminal subassembly.

In some embodiments, the first insulative member comprises a first projection engaging the housing so as to block movement of the first terminal subassembly in the first direction and a second projection engaging the second insulative member so as to block movement of the second terminal subassembly in the first direction.

In some embodiments, the housing comprises an exterior face between the first slot and the second slot. The exterior face comprises a plurality of openings therethrough.

In some embodiments, the housing between the exterior face and the cavity comprises a lattice defined by walls bounding the plurality of openings.

In a further aspect, an electronic assembly comprises the electrical connector of any of the above mentioned embodiments, a printed circuit board comprising four parallel rows of pads on a surface thereof. The tails in each of the first row of tails, the second row of tails, the third row of tails, the fourth row of tails are soldered to respective pads of the four parallel rows of pads.

Some embodiments relate to an electrical connector. The electrical connector comprises a first plurality of terminals held in a first row, a second plurality of terminals held in a second row parallel to the first row, a third plurality of terminals held in a third row parallel to the first row, a fourth plurality of terminals held in a fourth row parallel to the first row, and a housing comprising a first slot and a second slot, each of the first and second slots extending in a direction parallel to the first row, the second row separated from the first slot in a direction perpendicular to the first row. The first plurality of terminals and the second plurality of terminals are disposed in the first slot. The third plurality of terminals and the fourth plurality of terminals are disposed in the second slot. Each of the first plurality of terminals, the second plurality of terminals, the third plurality of terminals, the fourth plurality of terminals comprises a mating portion, a tail and an intermediate portion joining the mating portion and the tail. Each intermediate portion comprises first and second parts extending in a right angle. The connector comprises a first ground member between the first parts of the intermediate portions of the first and second plurality of terminals, and a second ground member between the second parts of the intermediate portions of the first and second plurality of terminals.

In some embodiments, each of the first and second ground members comprises a strip of electrically lossy material.

In some embodiments, the first plurality of terminals comprise differential pairs of signal terminals separated by ground terminals. The ground terminals of the first plurality of terminals are electrically connected to each other through at least one of the first and second ground members.

In some embodiments, the second plurality of terminals comprise differential pairs of signal terminals separated by ground terminals. The ground terminals of the second plurality of terminals are electrically connected to the ground terminals of the first plurality of terminals through at least one of the first and second ground members.

In some embodiments, a third ground member between the first parts of the intermediate portions of the third and fourth plurality of terminals.

In some embodiments, the third plurality of terminals comprise differential pairs of signal terminals separated by ground terminals. The fourth plurality of terminals comprise differential pairs of signal terminals separated by ground terminals. The ground terminals of the third plurality of terminals are electrically connected to each other and to the ground terminals of the fourth plurality of terminals through the third ground members.

Some embodiments relate to a printed circuit board for receiving an electrical connector, the electrical connector having tails of four parallel rows of terminals extending at a right angle from respective intermediate portions of the four parallel rows of terminals. The printed circuit board comprises a first plurality of solder pads on a first surface of the printed circuit board, the first plurality of solder pads configured to receive a first row of tails of the four parallel rows; a second plurality of solder pads on the first surface, the second plurality of solder pads configured to receive a second row of tails of the four parallel rows; a third plurality of solder pads on the first surface, the third plurality of solder pads configured to receive a third row of tails of the four parallel rows; a fourth plurality of solder pads on the first surface, and the fourth plurality of solder pads configured to receive a fourth row of tails of the four parallel rows. The second plurality of solder pads are adjacent to and offset, in a first direction perpendicular to a second direction that the four parallel rows extend, from the first plurality of solder pads. The fourth plurality of solder pads are adjacent to and offset, in the first direction, from the third plurality of solder pads in the direction. The first plurality of solder pads and the third plurality of solder pads are aligned in the first direction.

In some embodiments, the solder pads of each of the first plurality of solder pad, the second plurality of solder pads, the third plurality of solder pads, and the fourth plurality of solder pads are spaced, center to center, by 0.7 to 1 mm.

In some embodiments, the solder pads have a width greater than respective tails' width.

In some embodiments, the printed circuit board comprises a fifth plurality of solder pads on a second surface of the printed circuit board, the second surface opposite the first surface, the fifth plurality of solder pads aligned to the first row and offset from the first plurality of solder pads; a sixth plurality of solder pads on the second surface, the sixth plurality of solder pads aligned to the second row and offset from the second plurality of solder pads; a seventh plurality of solder pads on the second surface, the seventh plurality of solder pads aligned to the third row and offset from the third plurality of solder pads; and an eighth plurality of solder pads on the second surface, the eighth plurality of solder pads aligned to the fourth row and offset from the fourth plurality of solder pads.

In some embodiments, the printed circuit board comprises first and second through-holes on a first side of the first plurality of solder pad, the second plurality of solder pads, the third plurality of solder pads, and the fourth plurality of solder pads; and third and fourth through-holes on a second side of the first plurality of solder pad, the second plurality of solder pads, the third plurality of solder pads, and the fourth plurality of solder pads, the second side opposite the first side. The first, second, third, and fourth through-holes are configured to receive anchor pins of the connector.

In some embodiments, the first, second, third, and fourth through-holes are not greater in size than the anchor pins of the connector.

In some embodiments, the printed circuit board comprises two locating holes configured to receive respective posts extending from a housing of the connector.

In some embodiments, the two locating holes are greater in size than the posts from the housing of the connector.

The foregoing features may be used, separately or together in any combination, in any of the embodiments discussed herein.

BRIEF DESCRIPTION OF DRAWINGS

Various aspects and embodiments of the present technology disclosed herein are described below with reference to the accompanying figures. It should be appreciated that the figures are not necessarily drawn to scale. Items appearing in multiple figures may be indicated by the same reference numeral. For the purposes of clarity, not every component may be labeled in every figure.

FIG. 1 is a perspective view of an exemplary embodiment of a connector and a printed circuit board configured to receive the connector.

FIG. 2 is a perspective view of the connector of FIG. 1, with a side wall of the housing cut away, illustrating parts of the connector.

FIG. 3 is an exploded view of the connector of FIG. 1.

FIG. 4 is an exploded view of the first signal transmitting portion of FIG. 1.

FIG. 5 is an exploded view of the second signal transmitting portion of FIG. 1.

FIG. 6 is a side view of partial structures of the first signal transmitting portion of FIG. 4 and the second signal transmitting portion of FIG. 5, with insulative members cut away.

FIG. 7 is a perspective view of a metal strip of a ground member of the connector of FIG. 1.

FIG. 8 is a perspective view of the printed circuit board of FIG. 1.

 DETAILED DESCRIPTION

The inventors have recognized and appreciated advantages and techniques for making stacked I/O connectors that are suitable for surface mounting. For example, the inventors have recognized and appreciated that stacked I/O connectors configured for surface mounting may reduce manufacturing defects of devices using those connectors and/or may provide better signal integrity in operation. In contrast to surface mount, connectors with press-fit terminal tails require printed circuit boards (PCBs) including holes configured to receive the press-fit terminal tails. When connectors are mounted to the PCBs, the press-fit pins tend to bend and scratch the plating on the PCBs, which creates manufacturing defects or reduces signal integrity in operation.

Further, the inventors have recognized and appreciated designs for high-speed I/O connectors that facilitate mounting I/O connectors on both the front and back sides of the PCBs, including one above the other in a belly to belly configuration. A large number of holes in the PCB may be required to receive high-speed connectors on both sides, particularly for stacked connector, which increases the difficulty in manufacturing these PCB s and in routing traces within the PCB. The inventors have recognized and appreciated that these difficulties are exacerbated for I/O connectors using press-fit terminal tails, as is conventional, because the holes required for press fit terminals must be sufficiently large to receive the press-fit terminal tails. Making press-fit tails smaller, so that the holes smaller, can increase the risk that the terminal tails will be damaged when the connector is pressed onto the PCB.

The inventors have recognized and appreciated that with surface mountable tails, deformation of the terminal tails and/or scratches on the PCB may be avoided when the connector is mounted to the PCB. Moreover, the holes in the PCB required to make connections between traces in the PCB and surface mount pads can be made smaller than holes that receive press-fit tails, increasing the density of the connector and/or facilitating belly to belly mounting of I/O connectors. Belly to belly mounting may be further facilitated by offsetting rows of terminal tails with respect to each other such that, when I/O connectors with similar footprints are mounted on opposite sides of the PCB, the vias for each connector are offset with respect to each other. The offset configuration may enable the vias making connections to each connector to fit within the same area of the PCB. Such an offset configuration may be simply created as a result of terminal subassemblies, each with a row of terminals.

The PCB may include solder pads on a single surface or both surfaces. The solder pads may be configured for the tails of the connector to be attached to them, such as through a reflow solder operation. As a result, the connector has high density and high speed, requires, requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations.

The inventors have recognized features for an I/O connector, including a stacked I/O connector, to support a robust electronic system when using I/O connectors that are surface mounted to a PCB. The housing of a stacked I/O connector, for example, may be made with openings between ports in combination with terminal subassemblies that enable air flow so as to avoid deformation during a surface mount solder operation. Alternatively or additionally, the I/O connector may have one or more structures that reduce the risk of damage to solder joints when a plug is inserted into the stacked I/O connector or the connectors otherwise stressed during operation.

FIG. 1 shows an electrical assembly 100, including a connector 200 and a printed circuit board 800 configured to receive the connector 200. The connector 200 may include a housing 1, a first signal transmitting portion 2, anchor pins 3, and a second signal transmitting portion 4. The first signal transmitting portion 2, the second signal transmitting portion 4, and the anchor pins 3 may be held together by the housing 1. The housing 1 may be made from a liquid crystal polymer (LCP) and the anchor pins 3 may be made by stamping a copper alloy.

FIG. 2 shows a perspective view of the connector 200, with a side wall of the housing 1 cut away. FIG. 3 is an exploded view of the connector of FIG. 1. The first and second signal transmitting portions 2 and 4 may be arranged as row-oriented arrays, including a plurality of row terminal subassemblies disposed one above the other in a direction perpendicular to a surface of the PCB 800.

Each row terminal subassembly may include a mating interface configured to receive, for example, a card, a mounting interface configured to, for example, mount to a PCB, and a body extending between the mating interface and the mount interface. The body may include a first part connected to the mating interface, and a second part connected to the mounting interface. The first and second parts may extend in a right angle such that a card inserted in one of the signal transmitting portions 2 and 4 extends parallel to a PCB that the connector is mounted to.

In the illustrated example, the first signal transmitting portion 2 includes a first upper row terminal subassembly 21 and a first lower row terminal subassembly 22. The second signal transmitting portion 4 includes a second upper row terminal subassembly 41 and a second lower row terminal subassembly 42. The first upper row terminal subassembly 21 and the first lower row terminal subassembly 22 may be held together in an upper installation slot 11 by the housing 1. The second upper row terminal subassembly 41 and the second lower row terminal subassembly 42 may be held together in a lower installation slot 17 by the housing 1.

Additionally or alternatively, the first upper row terminal subassembly 21 and the first lower row terminal subassembly 22 may be held together before being assembled into the housing 1. The second upper row terminal subassembly 41 and the second lower row terminal subassembly 42 may be held together before being assembled into the housing 1. The first and second upper and lower row terminal subassemblies may include attachment features, or otherwise be attached to one another in some embodiments.

The housing 1 may include the upper installation slot 11 and the lower installation slot 17, insertion slots 12 and 18, recesses 14, 16 and 19, posts 13, and openings 15. The installation slots 11 and 17 may be inside the housing 1. The upper installation slot 11 may extend a shorter length then the lower installation slot 17 such that the mounting interfaces of the first signal transmitting portion 2 and the mounting interfaces of the second signal transmitting portion 4 are offset in a direction perpendicular to a row direction that a row terminal extends. The installation slots 11 and 17 may be bounded by insulative material, such as housing 1, with grooves 111 and 171. The grooves may be positioned to remove insulative material along signal terminals so as to change the effective dielectric constant of material surrounding the signal conductors, which can adjust impedance of those signal terminals.

The insertion slots 12 and 18 may be arranged on the front side of the housing 1. The mating interface of the first signal transmitting portion 2 including, for example, mating portions 2113, 2213 (FIG. 6), may be held in the insertion slot 12. The mating interface of the second signal transmitting portion 4 including, for example, mating portions 4113, 4213 (FIG. 6), may be held in the insertion slot 18. The mating portions may be positioned in this way to make contact with pads on a paddle card of a plug inserted into the insertion slots 12 and 18.

Features, for example, recesses 14 in housing 1, may retain anchor pins 3. The anchor pins 3 each may include a body 31, a mounting hole 32, and spring arms 33. The mounting hole 32 may be located above the terminal body 31. The two spring arms 33 may extend from the terminal body 31 and towards opposite directions. The outside size of the swinging arms 33 may be 1.1 mm. After being soldered to a PCB, the anchor pins 3 may fix the connector to the PCB. Anchor pins 3 may also prevent the connector from floating during surface mounted technology (SMT) soldering of the first signal transmitting portion 2 and the second signal transmitting portion 4 of the connector to the PCB, thus avoiding dry joints.

The recesses 16 and 19 in surfaces of the housing 1 are configured to receive matching structures from the first signal transmitting portion 2 and the second signal transmitting portion 4, holding the signal transmitting portions in hosing 1. In the illustrated example, four anchor pins 3 each is held in a respective recess 14. The four recesses 14 are asymmetrically distributed on the two sides of the housing 1. The recesses 16 includes top recesses 161 and side recesses 162 and 163. The recesses 19 may include recesses 191 and 192.

The openings 15 may be arranged between the installation slots 11 and 17. The openings 15 may extend through surfaces of the housing 1 and substantially parallel to installation slots 11 and 17. The openings 15 may reduce the weight of the housing 1, and may also facilitate ventilation and heat dissipation during a surface mount solder operation. In the illustrated example, the housing 1 includes a lattice defined by walls bounding a plurality of openings 15.

In the illustrated embodiment, airflow through the openings may be enabled by the row-oriented terminal subassemblies in which each subassembly, such as first upper row terminal subassembly 21 and a first lower row terminal subassembly 22, has a row of terminals with space between the terminals. The insulative members holding the row of terminals together covers only a portion of the length of the intermediate portions of the terminals. As a result, air flow through openings 15 and around the terminals—allowing flow from front to back of the receptacle connector.

The posts 13 may extend from the bottom of the housing 1. The housing 1 may include at least two posts 13 such that the connector 200 may be first aligned to a footprint on a PCB (e.g., PCB 800) though the posts 13. After inserting the posts 13 into matching holes in the PCB, the solders pins may be aligned to respective solder pads on the PCB before being soldered to the pads. The posts 13 may have a the diameter of 1.0 mm.

FIG. 4 is an exploded view of the first signal transmitting portion 2. FIG. 5 is an exploded view of the second signal transmitting portion 4. FIG. 6 is a side view of partial structures of the first signal transmitting portion 2 and the second signal transmitting portion 4, with insulative members cut away. FIG. 7 is a perspective view of a metal strip of a ground member of the connector 200.

The first signal transmitting portion 2 may include the first upper row terminal subassembly 21, the first lower row terminal subassembly 22, and plurality of ground members, of which ground members 24 and 25 are numbered. The ground members 24 and 25 may be assembled between the first terminal subassembly 21 and the second terminal subassembly 22, with spring arms 244 close to or pressing against ground terminals in the terminal subassemblies.

The first terminal subassembly 21 may include a plurality of upper row terminals 211, insulative member 212, and insulative member 215. The insulative member 212 and insulative member 215 may be plastics molded over the plurality of upper row terminals 211. The insulative members 212 and 215 may include projections configured to be inserted into the recesses 16, and 19 of the housing 1 such that the first terminal subassembly 21 is fixedly held in the housing 1. In the illustrated example, the insulative member 212 includes projection 213 (FIG. 3) configured to be inserted into recess 161, two projections 216 arranged on two sides of the insulative member 215 configured to be inserted into recesses 163.

The second terminal subassembly 22 may include a plurality of lower row terminals 221, insulative member 222, and insulative member 225. The insulative member 222 and insulative member 225 may be plastic molded over the plurality of lower row terminals 222. The insulative member 212 and insulative member 222 may be assembled together. The insulative member 215 and insulative member 225 may be assembled together. The insulative member 215 and insulative member 225 may be confined in recess 191 of housing 1.

The plurality of upper row terminals 211 each may include solder pin 2111, intermediate portion 2112, and mating portion 2113 that extends between the solder pin 2111 and the mating portion 2113. The solder pins 2111 extend in a right angle from the intermediate portions 2112, and may serve as solder mount terminal tails. The plurality of upper row terminals 211 may include differential pairs of signals terminals separated by ground terminals.

In the illustrated example, the plurality of upper row terminals 211 include nineteen terminals disposed horizontally. The plurality of upper row terminals 211 include ground terminals 2114 and signal terminals 2115. The ground terminals 2114 and signal terminals 2115 are arranged at intervals. The first, fourth, seventh, thirteenth, sixteenth and nineteenth (counted from left to right) of the upper row terminals 211 are ground terminals 2114 and the others are signal terminals 2115. The center-to-center distance between the adjacent upper row terminals 211 may be 0.8 mm.

The plurality of lower row terminals 221 may include solder pin 2211, intermediate portion 2212, and mating portion 2213 that extends between the solder pin 2211 and the mating portion 2213. The solder pins 2211 extend in a right angle from the intermediate portions 2212, and opposite to a direction that solder pins 2111 extend. The solder pins 2211 may also serve as solder mount terminal tails. The plurality of lower row terminals 221 may include differential pairs of signals terminals separated by ground terminals.

In the illustrated example, the plurality of lower row terminals 221 include nineteen terminals disposed horizontally. The lower row terminals 221 include ground terminals 2214 and signal terminals 2215. The ground terminals 2214 and signal terminals 2215 are arranged at intervals. The first, fourth, seventh, thirteenth, sixteenth and nineteenth (counted from left to right) of the lower row terminals 221 are ground terminals 2214 and the others are signal terminals 2215. The central distance between the adjacent lower row terminals 221 may be 0.8 mm.

The upper row terminals 211 and lower row terminals 221 may be made by stamping a copper alloy. The width of the first solder pin 2111 and second solder pin 2211 may be 0.25 mm. The ground member 24 may electrically connect a plurality of ground terminals 2114 and ground terminals 2214, which may reduce the insertion loss and crosstalk interference during signal transmission.

The insulative member 212 of the first terminal subassembly 21 may include a mounting area 214. The insulative member 222 of the second terminal subassembly 22 may include a mounting area 223. The ground member 24 may be fit in the mounting areas 214 and 223, and between the first terminal subassembly 21 and the second terminal subassembly 22.

The first terminal subassembly 21 and second terminal subassembly 22 may include additional ground members in between, for example, ground members 25. The insulative member 215 of the first terminal subassembly may include additional mounting areas, for example, mounting areas 217. The insulative member 225 of the second terminal subassembly 22 may include additional mounting areas, for example, mounting area 226. The ground member 25 may be fit in the mounting areas 217 and 226. The ground member 25 may provide electrical connections between the plurality of ground terminals 2114 and ground terminals 2214, which may further reduce the insertion loss and crosstalk interference during signal transmission.

The ground members 24 and 25 may be made with metal and/or lossy portions. The ground members may have projections extending towards, and in some embodiments, contacting, the ground terminals.

In the illustrated example, the ground members 24 and 25 each includes a metal stripe 241 and a stripe of lossy material 242 molded over the metal stripe 241. The metal stripe 241 includes a body 243 and six spring arms 244 extending from the body 243. The spring arms 244 contact ground terminals 2114 and ground terminal 2214.

Any suitable lossy material may be used for these and other structures that are “lossy.” Materials that conduct, but with some loss, or material which by another physical mechanism absorbs electromagnetic energy over the frequency range of interest are referred to herein generally as “lossy” materials. Electrically lossy materials can be formed from lossy dielectric and/or poorly conductive and/or lossy magnetic materials. Magnetically lossy material can be formed, for example, from materials traditionally regarded as ferromagnetic materials, such as those that have a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The “magnetic loss tangent” is the ratio of the imaginary part to the real part of the complex electrical permeability of the material. Practical lossy magnetic materials or mixtures containing lossy magnetic materials may also exhibit useful amounts of dielectric loss or conductive loss effects over portions of the frequency range of interest. Electrically lossy material can be formed from material traditionally regarded as dielectric materials, such as those that have an electric loss tangent greater than approximately 0.05 in the frequency range of interest. The “electric loss tangent” is the ratio of the imaginary part to the real part of the complex electrical permittivity of the material. Electrically lossy materials can also be formed from materials that are generally thought of as conductors, but are either relatively poor conductors over the frequency range of interest, contain conductive particles or regions that are sufficiently dispersed that they do not provide high conductivity or otherwise are prepared with properties that lead to a relatively weak bulk conductivity compared to a good conductor such as copper over the frequency range of interest.

Electrically lossy materials typically have a bulk conductivity of about 1 Siemen/meter to about 10,000 Siemens/meter and preferably about 1 Siemen/meter to about 5,000 Siemens/meter. In some embodiments material with a bulk conductivity of between about 10 Siemens/meter and about 200 Siemens/meter may be used. As a specific example, material with a conductivity of about 50 Siemens/meter may be used. However, it should be appreciated that the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine a suitable conductivity that provides a suitably low crosstalk with a suitably low signal path attenuation or insertion loss.

Electrically lossy materials may be partially conductive materials, such as those that have a surface resistivity between 1 Ω/square and 100,000 Ω/square. In some embodiments, the electrically lossy material has a surface resistivity between 10 Ω/square and 1000 Ω/square. As a specific example, the material may have a surface resistivity of between about 20 Ω/square and 80 Ω/square.

In some embodiments, electrically lossy material is formed by adding to a binder a filler that contains conductive particles. In such an embodiment, a lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form. Examples of conductive particles that may be used as a filler to form an electrically lossy material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Metal in the form of powder, flakes, fibers or other particles may also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers may be used. For example, metal plated carbon particles may be used. Silver and nickel are suitable metal plating for fibers. Coated particles may be used alone or in combination with other fillers, such as carbon flake. The binder or matrix may be any material that will set, cure, or can otherwise be used to position the filler material. In some embodiments, the binder may be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of the electrically lossy material into the desired shapes and locations as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymer (LCP) and nylon. However, many alternative forms of binder materials may be used. Curable materials, such as epoxies, may serve as a binder. Alternatively, materials such as thermosetting resins or adhesives may be used.

Also, while the above described binder materials may be used to create an electrically lossy material by forming a binder around conducting particle fillers, the invention is not so limited. For example, conducting particles may be impregnated into a formed matrix material or may be coated onto a formed matrix material, such as by applying a conductive coating to a plastic component or a metal component. As used herein, the term “binder” encompasses a material that encapsulates the filler, is impregnated with the filler or otherwise serves as a substrate to hold the filler.

Preferably, the fillers will be present in a sufficient volume percentage to allow conducting paths to be created from particle to particle. For example, when metal fiber is used, the fiber may be present in about 3% to 40% by volume. The amount of filler may impact the conducting properties of the material.

Filled materials may be purchased commercially, such as materials sold under the trade name Celestran® by Celanese Corporation which can be filled with carbon fibers or stainless steel filaments. A lossy material, such as lossy conductive carbon filled adhesive preform, such as those sold by Techfilm of Billerica, Massachusetts, US may also be used. This preform can include an epoxy binder filled with carbon fibers and/or other carbon particles. The binder surrounds carbon particles, which act as a reinforcement for the preform. In some embodiments, the preform may adhere to a metal member through the adhesive in the preform, which may be cured in a heat treating process. In some embodiments, the adhesive may take the form of a separate conductive or non-conductive adhesive layer.

Various forms of reinforcing fiber, in woven or non-woven form, coated or non-coated may be used. Non-woven carbon fiber is one suitable material. Other suitable materials, such as custom blends as sold by RTP Company, can be employed, as the present invention is not limited in this respect.

The second signal transmitting portion 4 may include a second upper row terminal subassembly 41, a second lower row terminal subassembly 42, and a ground member 44.

a second ground member 44, the second ground member 44 is assembly-connected with the second upper row terminal subassembly 41 and the second lower row terminal subassembly 42, and the second upper row terminal subassembly 41 is assembly-connected with the second lower row terminal subassembly 42.

The second upper row terminal subassembly 41 may include a plurality of upper row terminals 411, insulative member 412 and insulative member 415, which may be molded over the upper row terminals 411. The insulative member 412 may include projection 413. The insulative member 412 may include mounting area 414. The insulative member 415 may be confined in locating slot 192 of the housing 1.

The second lower row terminal subassembly 42 may include a plurality of lower row terminals 421 and insulative member 422, which may be molded over the lower row terminals 421. The insulative member 412 and insulative member 422 may be assembled together through the installation slot 17 of the housing 1. The insulative member 422 may include mounting area 423. The ground member 44 may fit in the mounting area 414 and mounting area 423 between the second upper row terminal subassembly 41 and the second lower row terminal subassembly 42. The ground member 44 may be structurally the same as the ground member 24.

In the illustrated example, each upper row terminal 411 comprises solder pin 4111, intermediate portion 4112 and mating portion 4113 connected in series. In the illustrated embodiment, there are nineteen upper row terminal 411 in a row. The upper row terminals 411 may be ground terminals 4114 or signal terminals 4115. The terminal 4114 and terminal 4115 are arranged at intervals, such as in a repeating pattern of a pair of signal terminals followed by a ground terminal. Each lower row terminal 421 comprises solder pin 4211, connecting body 4212 and mating portion 4213 in series. There are nineteen lower row terminal 421 in a row. The lower row terminals 421 may be ground terminals 4214 and signal terminals 4215. The ground terminals 4214 and signal terminals 4215 are arranged at intervals, and may have the same pattern of ground and signal terminals as the upper row. Solder pin 4111 and solder pin 4211 point in opposite directions. The ground member 44 electrically connects ground terminal 4114 and ground terminal 4214.

The center-to-center spacing between the adjacent upper row terminals 411 may be 0.8 mm. The first, fourth, seventh, thirteenth, sixteenth and nineteenth (counted from left to right) of the upper row terminals 411 may be terminals 4114 and the others may be terminals 4115. The center-to-center spacing between the adjacent lower row terminals 421 may be 0.8 mm. The first, fourth, seventh, thirteenth, sixteenth and nineteenth (counted from left to right) of the lower row terminals 421 may be terminals 4214 and the others may be terminals 4215. The upper row terminals 411 and lower row terminals 421 may be made by stamping a copper alloy. The width of the solder pin 4111 and solder pin 4211 may be 0.25 mm. The ground member 44 may electrically connect terminals 4114 and terminals 4214 to reduce the insertion loss and crosstalk during signal transmission.

FIG. 8 is a perspective view of the printed circuit board 800. The PCB 800 may be configured to receive the connector 200. The PCB 800 may include a board body 5, which may include locating holes 51 configured to receive posts 13, solder pads 52 configured to receive solder pins 2111 and solder pins 2211, solder pad 53 configured to receive solder pins 4111 and solder pins 4211, and holes 54, which may be through holes, configured to receive anchor pins 3.

In the illustrated example, the diameter of the locating holes 51 is 1.1 mm and two locating holes are provided. The diameter of the through holes 54 is 1.05 mm and four holes 54 are provided. Two rows of solder pads 52 and two rows of solder pads 53 are respectively provided, with nineteen solder pads in each row. The width of the solder pads 52 is 0.35 mm and the width of the solder pads 53 is 0.35 mm, which may be greater than a respective solder pin's width such that low-resistance solder joints may be formed. The center-to-center spacing in a horizontal direction between adjacent the solder pads 52 or solder pads 53 is 0.8 mm. The solder pads 52 and solder pads 53 are distributed on the front side of the PCB. Although the solder pads 52 and 53 are illustrated on the front side, the PCB may include additional solder pads on its back side for a connector with a belly to belly configuration.

Solder pins are adopted for the terminals of the first signal transmitting portion 2 and the second signal transmitting portion 4 to be soldered to a PCB. The solder pins 2111 and solder pins 2211 may be surface-mounted on solder pads 52 of the PCB 800. Solder pins 4111 and solder pins 4211 are surface-mounted on solder pads 53 of the PCB 800. In contrast to conventional mounting of a connector with press-fits, the connector has high density and high speed, and requires a smaller mounting area on a PCB, relaxes the limitations in routing PCB traces, and reduces the electrical performance deterioration caused by PCB trace routing limitations. The terminals 2214 and terminals 2215 are distributed at intervals, improving signal integrity and alleviating signal crosstalk during signal transmission.

In the embodiment illustrated in FIG. 8 pads 53 are in two parallel rows, corresponding to a row to receive solder pins 4111 and another row to receive solder pins 4211. Those rows are offset from each other in the row direction. The row of solder pins 4111 is offset from the row of solder pins 4211 by the same amount. Such an offset in the solder pins 4111 with respect to solder pins 4211 may result from the entirety of each of the terminals 411 being substantially in the same plane and each of the terminals 421 being substantially in the same plane, but the row of terminals 411 being offset from the row of terminals 421. In such a configuration, the mating portions, as well as the intermediate portions of terminals 411 will also be offset from the terminals 421. Alternatively, the terminals 411 and/or 421 may not be substantially within a plane. The solder pins 4111 and/or solder pins 4211 may bend out of the plane containing the mating portions of their respective terminals, for example. As a result, the mating portions of terminals 411 and 421 may be aligned, in a direction perpendicular to the surface of PCB 800, though other portions of opposing terminals may be offset in the row direction.

Similar offsets for some or all of the terminals in rows 211 and 221, which are mounted to pads 52, which are also arrayed in two rows on PCB 800. As with pads 53, the two rows of pads 52 are offset with respect to each other.

It should be understood that various alterations, modifications, and improvements may be made to the structures, configurations, and methods discussed above, and are intended to be within the spirit and scope of the invention disclosed herein.

Further, although advantages of the present invention are indicated, it should be appreciated that not every embodiment of the invention will include every described advantage. Some embodiments may not implement any features described as advantageous herein. Accordingly, the foregoing description and attached drawings are by way of example only.

It should be understood that some aspects of the present technology may be embodied as one or more methods, and acts performed as part of a method of the present technology may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than shown and/or described, which may include performing some acts simultaneously, even though shown and/or described as sequential acts in various embodiments.

Various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.

Further, terms denoting direction have been used, such as “left”, “right”, “forward” or “up”. These terms are relative to the illustrated embodiments, as depicted in the drawings, for ease of understanding. It should be understood that the components as described herein may be used in any suitable orientation.

Use of ordinal terms such as “first,” “second,” “third,” etc., in the description and the claims to modify an element does not by itself connote any priority, precedence, or order of one element over another, or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one element or act having a certain name from another element or act having a same name (but for use of the ordinal term) to distinguish the elements or acts.

All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.

The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”

As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.

As used herein in the specification and in the claims, the phrase “equal” or “the same” in reference to two values (e.g., distances, widths, etc.) means that two values are the same within manufacturing tolerances. Thus, two values being equal, or the same, may mean that the two values are different from one another by ±5%.

The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.

Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. Use of terms such as “including,” “comprising,” “comprised of,” “having,” “containing,” and “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.

The terms “approximately” and “about” if used herein may be construed to mean within ±20% of a target value in some embodiments, within ±10% of a target value in some embodiments, within ±5% of a target value in some embodiments, and within ±2% of a target value in some embodiments. The terms “approximately” and “about” may equal the target value.

The term “substantially” if used herein may be construed to mean within 95% of a target value in some embodiments, within 98% of a target value in some embodiments, within 99% of a target value in some embodiments, and within 99.5% of a target value in some embodiments. In some embodiments, the term “substantially” may equal 100% of the target value.

Claims

1. An I/O connector comprising:

a first plurality of terminals held in a first row;
a second plurality of terminals held in a second row parallel to the first row;
a plurality of ground members, each of the plurality of ground members comprising a plurality of contact locations separated in a direction parallel to the first row; and
a housing comprising a first slot extending in the direction parallel to the first row, wherein: terminals of the first plurality of terminals and the second plurality of terminals each comprises a mating portion, a tail and an intermediate portion joining the mating portion and the tail, at least the mating portions of the first plurality of terminals and the second plurality of terminals are disposed in the first slot, the intermediate portions of the first plurality of terminals and the second plurality of terminals each comprises a first part and a second part bent at an angle with respect to the first part, the first plurality of terminals and the second plurality of terminals comprise terminals configured as signal terminals or ground terminals, and contact locations of the plurality of ground members are connected to the ground terminals of the first plurality of terminals at a first plurality of locations at the first parts of the intermediate portions and at a second plurality of locations at the second parts of the intermediate portions.

2. The I/O connector of claim 1, wherein:

each of the plurality of ground members comprises a strip of material having a bulk conductivity between 1 and 5,000 Siemens/meter.

3. The I/O connector of claim 1, wherein:

the contact locations of at least one of the plurality of ground members are connected to the ground terminals of the first plurality of terminals at the first parts of the intermediate portions, and
the contact locations of at least another one of the plurality of ground members are connected to the intermediate portions of the ground terminals of the first plurality of terminals at the second parts of the intermediate portions.

4. The I/O connector of claim 1, wherein:

the first plurality of terminals comprise signal terminals configured as differential pairs of signal terminals separated by ground terminals.

5. The I/O connector of claim 4, wherein:

the second plurality of terminals comprise signal terminals configured as differential pairs of signal terminals separated by ground terminals; and
the ground terminals of the second plurality of terminals are electrically connected to the ground terminals of the first plurality of terminals through at least two of the plurality of ground members.

6. The I/O connector of claim 1, wherein:

the contact locations of at least a third one of the plurality of ground members are connected to the ground terminals of the first plurality of terminals.

7. The I/O connector of claim 6, further comprising:

a third plurality of terminals comprising signal terminals configured as differential pairs of signal terminals separated by ground terminals; and
a fourth plurality of terminals comprising signal terminals configured as differential pairs of signal terminals separated by ground terminals.

8. The I/O connector of claim 1, wherein:

the plurality of ground members comprise metal members extending parallel to the first row.

9. The I/O connector of claim 8, wherein:

the contact locations of the plurality of ground members comprise spring fingers.

10. The I/O connector of claim 8, wherein:

a first ground member of the plurality of ground members is connected to the intermediate portions of the ground terminals of the first plurality of terminals at the first parts of the intermediate portions, and
a second ground member of the plurality of ground members is connected to the intermediate portions of the ground terminals of the first plurality of terminals at the second parts of the intermediate portions.

11. The I/O connector of claim 10, wherein:

the first and second ground members comprise body portions separated from the signal terminals of the first plurality of terminals, and
the contact locations of the first and second ground members comprise projections extending towards the ground terminals of the first plurality of terminals.

12. The I/O connector of claim 1, wherein:

the tails of the first plurality of terminals and the tails of the second plurality of terminals comprise solder pins configured for soldering to a pad on a surface of a printed circuit board,
the solder pins of the first plurality of terminals extend in a first direction, and
the solder pins of the second plurality of terminals extend in a second direction, opposite the first direction.

13. The I/O connector of claim 12, wherein:

the housing comprises a mounting face and the tails of the first plurality of terminals and the second plurality of terminals are exposed at the mounting face;
the housing comprises at least one post extending from the mounting face; and
the I/O connector further comprises a plurality of anchor pins attached to the housing, each of the anchor pins comprising a pair of spring arms extending towards opposite directions.

14. An electrical connector comprising:

a housing comprising first and second slots each extending in a row direction and separated from each other in a direction perpendicular to the row direction;
a first terminal subassembly comprising a first plurality of terminals and a first insulative member molded over the first plurality of terminals to hold the first plurality of terminals in a first row of terminals;
a second terminal subassembly comprising a second plurality of terminals and a second insulative member molded over the second plurality of terminals to hold the second plurality of terminals in a second row of terminals;
a third terminal subassembly comprising a third plurality of terminals and a third insulative member molded over the third plurality of terminals to hold the third plurality of terminals in a third row of terminals;
a fourth terminal subassembly comprising a fourth plurality of terminals and a fourth insulative member molded over the fourth plurality of terminals to hold the fourth plurality of terminals in a fourth row of terminals; and
a first ground member, a second ground member and a third ground member, each of the first, second and third ground members being separate from one another and comprising a plurality of first portions and a plurality of second portions joining the first portions, wherein: the terminals of the first plurality of terminals, the second plurality of terminals, the third plurality of terminals, the fourth plurality of terminals each comprises a mating portion, a solder pin and an intermediate portion joining the mating portion and the solder pin, the mating portions of the first and second terminal subassemblies extend into the first slot, the mating portions of the third and fourth terminal subassemblies extend into the second slot, the solder pins are configured for soldering to a pad on a surface of a printed circuit board, the terminals of the first plurality of terminals, the second plurality of terminals, the third plurality of terminals, and the fourth plurality of terminals comprise terminals configured as signal terminals and ground terminals, the plurality of second portions of the first and second ground members comprise body portions separated from the signal terminals of the first plurality of terminals, the plurality of first portions of the first and second ground members comprise contact portions connected to ground terminals of the first plurality of terminals, the plurality of second portions of the third ground member comprise body portions separated from the signal terminals of the third plurality of terminals, and the plurality of first portions of the third ground member comprise contact portions connected to ground terminals of the third plurality of terminals.

15. The electrical connector of claim 14, wherein:

the terminals of the first plurality of terminals, the second plurality of terminals, the third plurality of terminals, and the fourth plurality of terminals comprise signal terminals configured as differential pairs of signal terminals separated by ground terminals.

16. The electrical connector of claim 15, wherein:

the first and second ground members connect the ground terminals of the first plurality of terminals at different locations along a length direction of the first plurality of terminals.

17. An electrical connector, comprising:

a housing comprising a slot extending in a row direction;
a first terminal subassembly comprising a first plurality of terminals and a first insulative member molded over the first plurality of terminals to hold the first plurality of terminals in a first row of terminals;
a second terminal subassembly comprising a second plurality of terminals and a second insulative member molded over the second plurality of terminals to hold the second plurality of terminals in a second row of terminals;
a third terminal subassembly comprising a third plurality of terminals and a third insulative member molded over the third plurality of terminals to hold the third plurality of terminals in a third row of terminals;
a fourth terminal subassembly comprising a fourth plurality of terminals and a fourth insulative member molded over the fourth plurality of terminals to hold the fourth plurality of terminals in a fourth row of terminals; and
a plurality of ground members spaced apart from one another, each of the plurality of ground members comprising contact portions and body portions joining the contact portions, wherein:
ground members of the plurality of ground members are disposed within openings of the first insulative member, the second insulative member, the third insulative member, and the fourth insulative member.

18. The electrical connector of claim 17, wherein:

the terminals of the first plurality of terminals and the second plurality of terminals each comprises a mating portion, a solder pin and an intermediate portion joining the mating portion and the solder pin,
the mating portions of the first and second terminal subassemblies extend into the slot, and
the mating portions of the first plurality of terminals are offset, in the row direction, from the mating portions of the second plurality of terminals.

19. The electrical connector of claim 18, wherein:

the intermediate portions of the first plurality of terminals are offset, in the row direction, from the intermediate portions of the second plurality of terminals.

20. The electrical connector of claim 17, wherein:

solder pins of the first plurality of terminals and of the second plurality of terminals extend at a right angle relative to respective mating portions of the first plurality of terminals and the second plurality of terminals.
Referenced Cited
U.S. Patent Documents
5167531 December 1, 1992 Broschard, III et al.
5281152 January 25, 1994 Takahashi et al.
5318463 June 7, 1994 Broschard, III et al.
5336109 August 9, 1994 Hillbish et al.
5453016 September 26, 1995 Clark et al.
6159040 December 12, 2000 Chang et al.
6589061 July 8, 2003 Korsunsky et al.
7070446 July 4, 2006 Henry et al.
7214074 May 8, 2007 Osada
7258573 August 21, 2007 Lee
7448897 November 11, 2008 Dawiedczyk et al.
7494383 February 24, 2009 Cohen et al.
7540747 June 2, 2009 Ice et al.
7540781 June 2, 2009 Kenny et al.
7543142 June 2, 2009 Sydir et al.
7554096 June 30, 2009 Ward et al.
7575471 August 18, 2009 Long
7581990 September 1, 2009 Kirk et al.
7585186 September 8, 2009 McAlonis et al.
7585188 September 8, 2009 Regnier
7588464 September 15, 2009 Kim
7588467 September 15, 2009 Chang
7594826 September 29, 2009 Kobayashi et al.
7604490 October 20, 2009 Chen et al.
7604502 October 20, 2009 Pan
7674133 March 9, 2010 Fogg et al.
7690946 April 6, 2010 Knaub et al.
7699644 April 20, 2010 Szczesny et al.
7699663 April 20, 2010 Little et al.
7722401 May 25, 2010 Kirk et al.
7731537 June 8, 2010 Amleshi et al.
7753731 July 13, 2010 Cohen et al.
7758357 July 20, 2010 Pan et al.
7764504 July 27, 2010 Phillips et al.
7771233 August 10, 2010 Gailus
7781294 August 24, 2010 Mauder et al.
7789676 September 7, 2010 Morgan et al.
7794240 September 14, 2010 Cohen et al.
7794278 September 14, 2010 Cohen et al.
7806698 October 5, 2010 Regnier
7806729 October 5, 2010 Nguyen et al.
7828595 November 9, 2010 Mathews
7871294 January 18, 2011 Long
7871296 January 18, 2011 Fowler et al.
7874873 January 25, 2011 Do et al.
7887371 February 15, 2011 Kenny et al.
7887379 February 15, 2011 Kirk
7896659 March 1, 2011 Westman et al.
7906730 March 15, 2011 Atkinson et al.
7914304 March 29, 2011 Cartier et al.
7927143 April 19, 2011 Helster et al.
7985097 July 26, 2011 Gulla
8018733 September 13, 2011 Jia
8057267 November 15, 2011 Johnescu
8083553 December 27, 2011 Manter et al.
RE43427 May 29, 2012 Dawiedczyk et al.
8182289 May 22, 2012 Stokoe et al.
8215968 July 10, 2012 Cartier et al.
8216001 July 10, 2012 Kirk
8251745 August 28, 2012 Johnescu
8267721 September 18, 2012 Minich
8272877 September 25, 2012 Stokoe et al.
8358504 January 22, 2013 McColloch et al.
8371875 February 12, 2013 Gailus
8382524 February 26, 2013 Khilchenko et al.
8465320 June 18, 2013 Long
8469738 June 25, 2013 Long
8475210 July 2, 2013 Wang
8480413 July 9, 2013 Minich et al.
8540525 September 24, 2013 Regnier et al.
8550861 October 8, 2013 Cohen et al.
8597045 December 3, 2013 Zhu
8657627 February 25, 2014 McNamara et al.
8678860 March 25, 2014 Minich et al.
8715003 May 6, 2014 Buck et al.
8715005 May 6, 2014 Pan
8740644 June 3, 2014 Long
8764488 July 1, 2014 Zeng
8771016 July 8, 2014 Atkinson et al.
8830679 September 9, 2014 Scholeno
8864521 October 21, 2014 Atkinson et al.
8870471 October 28, 2014 Ito et al.
8926377 January 6, 2015 Kirk et al.
8944831 February 3, 2015 Stoner et al.
8998642 April 7, 2015 Manter et al.
9004942 April 14, 2015 Paniauqa
9011177 April 21, 2015 Lloyd et al.
9022806 May 5, 2015 Cartier, Jr. et al.
9028201 May 12, 2015 Kirk et al.
9028281 May 12, 2015 Kirk et al.
9065230 June 23, 2015 Milbrand, Jr.
9077115 July 7, 2015 Yang
9083130 July 14, 2015 Casher et al.
9118151 August 25, 2015 Tran et al.
9124009 September 1, 2015 Atkinson et al.
9210817 December 8, 2015 Briant
9219335 December 22, 2015 Atkinson et al.
9225085 December 29, 2015 Cartier, Jr. et al.
9246262 January 26, 2016 Brown
9246280 January 26, 2016 Neer
9257794 February 9, 2016 Wanha et al.
9276358 March 1, 2016 Ista
9300074 March 29, 2016 Gailus
9337585 May 10, 2016 Yang
9368916 June 14, 2016 Heyvaert et al.
9389368 July 12, 2016 Sharf
9450344 September 20, 2016 Cartier, Jr. et al.
9461378 October 4, 2016 Chen
9484674 November 1, 2016 Cartier, Jr. et al.
9509101 November 29, 2016 Cartier, Jr. et al.
9509102 November 29, 2016 Sharf et al.
9520680 December 13, 2016 Hsu
9520689 December 13, 2016 Cartier, Jr. et al.
9653829 May 16, 2017 Long
9666998 May 30, 2017 de Boer et al.
9668378 May 30, 2017 Phillips
9671582 June 6, 2017 Yeh
9692188 June 27, 2017 Godana et al.
9705255 July 11, 2017 Atkinson et al.
9711901 July 18, 2017 Scholeno
9748698 August 29, 2017 Morgan et al.
9761974 September 12, 2017 L'Esperance et al.
9829662 November 28, 2017 Kurashima
9831588 November 28, 2017 Cohen
9843135 December 12, 2017 Guetig et al.
9859658 January 2, 2018 Champion
9899774 February 20, 2018 Gailus
9915560 March 13, 2018 Ho et al.
9929500 March 27, 2018 Ista
9972945 May 15, 2018 Huang
10020614 July 10, 2018 Bucher
10109968 October 23, 2018 Khazen
10122129 November 6, 2018 Milbrand, Jr. et al.
10128627 November 13, 2018 Kazav
10153571 December 11, 2018 Kachlic
10186814 January 22, 2019 Khilchenko et al.
10211577 February 19, 2019 Milbrand, Jr. et al.
10243304 March 26, 2019 Kirk
10276995 April 30, 2019 Little
10283910 May 7, 2019 Chen
10348040 July 9, 2019 Cartier, Jr. et al.
10367283 July 30, 2019 L'Esperance et al.
10367308 July 30, 2019 Little
10374355 August 6, 2019 Ayzenberg et al.
10381767 August 13, 2019 Milbrand, Jr. et al.
10431936 October 1, 2019 Horning et al.
10446960 October 15, 2019 Guy Ritter et al.
10511118 December 17, 2019 Beltran et al.
10511128 December 17, 2019 Kirk et al.
10551580 February 4, 2020 Regnier et al.
10555437 February 4, 2020 Little
10588243 March 10, 2020 Little et al.
10601181 March 24, 2020 Lu et al.
10630002 April 21, 2020 Huang et al.
10630010 April 21, 2020 Tracy et al.
10651606 May 12, 2020 Little
10777921 September 15, 2020 Lu et al.
10797417 October 6, 2020 Scholeno et al.
10847930 November 24, 2020 Ayzenberg et al.
10862240 December 8, 2020 Bakshan et al.
10873149 December 22, 2020 Chen
10916894 February 9, 2021 Kirk et al.
10931050 February 23, 2021 Cohen
10944189 March 9, 2021 Xu et al.
11189971 November 30, 2021 Lu
11757215 September 12, 2023 Xu et al.
20080246555 October 9, 2008 Kirk et al.
20080248658 October 9, 2008 Cohen et al.
20080248659 October 9, 2008 Cohen et al.
20080248660 October 9, 2008 Kirk et al.
20080318455 December 25, 2008 Beaman et al.
20080318476 December 25, 2008 Weber et al.
20090011620 January 8, 2009 Avery et al.
20090011641 January 8, 2009 Cohen et al.
20090011643 January 8, 2009 Amleshi et al.
20090011645 January 8, 2009 Laurx et al.
20090035955 February 5, 2009 McNamara
20090061661 March 5, 2009 Shuey et al.
20090117386 May 7, 2009 Vacanti et al.
20090149045 June 11, 2009 Chen et al.
20090203259 August 13, 2009 Nguyen et al.
20090239395 September 24, 2009 Cohen et al.
20090258516 October 15, 2009 Hiew et al.
20090291593 November 26, 2009 Atkinson et al.
20090305533 December 10, 2009 Feldman et al.
20090305553 December 10, 2009 Thomas et al.
20100018738 January 28, 2010 Chen et al.
20100048058 February 25, 2010 Morgan et al.
20100078738 April 1, 2010 Chambers et al.
20100081302 April 1, 2010 Atkinson et al.
20100099299 April 22, 2010 Moriyama et al.
20100144167 June 10, 2010 Fedder et al.
20100248544 September 30, 2010 Xu et al.
20100273359 October 28, 2010 Walker et al.
20100291806 November 18, 2010 Minich et al.
20100294530 November 25, 2010 Atkinson et al.
20110003509 January 6, 2011 Gailus
20110034075 February 10, 2011 Feldman et al.
20110067237 March 24, 2011 Cohen et al.
20110081114 April 7, 2011 Togami
20110104948 May 5, 2011 Girard, Jr. et al.
20110130038 June 2, 2011 Cohen et al.
20110212649 September 1, 2011 Stokoe et al.
20110212650 September 1, 2011 Amleshi et al.
20110230095 September 22, 2011 Atkinson et al.
20110230096 September 22, 2011 Atkinson et al.
20110256739 October 20, 2011 Toshiyuki et al.
20110287663 November 24, 2011 Gailus et al.
20120003848 January 5, 2012 Casher et al.
20120052712 March 1, 2012 Wang
20120058665 March 8, 2012 Zerebilov
20120077380 March 29, 2012 Minich et al.
20120094536 April 19, 2012 Khilchenko et al.
20120115371 May 10, 2012 Chuang et al.
20120156929 June 21, 2012 Manter et al.
20120164860 June 28, 2012 Wang
20120184154 July 19, 2012 Frank et al.
20120202363 August 9, 2012 McNamara et al.
20120202370 August 9, 2012 Mulfinger et al.
20120202386 August 9, 2012 McNamara et al.
20120202387 August 9, 2012 McNamara
20120214343 August 23, 2012 Buck et al.
20120214344 August 23, 2012 Cohen et al.
20130012038 January 10, 2013 Kirk et al.
20130017733 January 17, 2013 Kirk et al.
20130034999 February 7, 2013 Szczesny et al.
20130065454 March 14, 2013 Milbrand, Jr.
20130078870 March 28, 2013 Milbrand, Jr.
20130078871 March 28, 2013 Milbrand, Jr.
20130090001 April 11, 2013 Kagotani
20130109232 May 2, 2013 Paniaqua
20130143442 June 6, 2013 Cohen et al.
20130164970 June 27, 2013 Regnier et al.
20130196553 August 1, 2013 Gailus
20130217263 August 22, 2013 Pan
20130225006 August 29, 2013 Khilchenko et al.
20130273781 October 17, 2013 Buck et al.
20130288513 October 31, 2013 Masubuchi et al.
20130316590 November 28, 2013 Hon
20130340251 December 26, 2013 Regnier et al.
20140004724 January 2, 2014 Cartier, Jr. et al.
20140004726 January 2, 2014 Cartier, Jr. et al.
20140004746 January 2, 2014 Cartier, Jr. et al.
20140035755 February 6, 2014 Ward
20140057498 February 27, 2014 Cohen
20140154912 June 5, 2014 Hirschy
20140193993 July 10, 2014 Meng
20140273557 September 18, 2014 Cartier, Jr. et al.
20140273627 September 18, 2014 Cartier, Jr. et al.
20150056856 February 26, 2015 Atkinson et al.
20150072561 March 12, 2015 Schmitt et al.
20150093083 April 2, 2015 Tsai et al.
20150111427 April 23, 2015 Wu et al.
20150132990 May 14, 2015 Nong Chou et al.
20150236451 August 20, 2015 Cartier, Jr. et al.
20150236452 August 20, 2015 Cartier, Jr. et al.
20150255926 September 10, 2015 Paniagua
20150280368 October 1, 2015 Bucher
20150288110 October 8, 2015 Tanguchi et al.
20150380868 December 31, 2015 Chen et al.
20160000616 January 7, 2016 Lavoie
20160004022 January 7, 2016 Ishii
20160054527 February 25, 2016 Tang et al.
20160104990 April 14, 2016 Laurx et al.
20160131859 May 12, 2016 Ishii et al.
20160149343 May 26, 2016 Atkinson et al.
20160156133 June 2, 2016 Masubuchi et al.
20160172794 June 16, 2016 Sparrowhawk et al.
20160174412 June 16, 2016 Karaaslan et al.
20160211618 July 21, 2016 Gailus
20160211623 July 21, 2016 Sharf et al.
20160336692 November 17, 2016 Champion et al.
20170054234 February 23, 2017 Kachlic
20170077643 March 16, 2017 Zbinden et al.
20170285282 October 5, 2017 Regnier et al.
20180062323 March 1, 2018 Kirk et al.
20180089966 March 29, 2018 Ward
20180145438 May 24, 2018 Cohen
20180166828 June 14, 2018 Gailus
20180198220 July 12, 2018 Sasame et al.
20180212385 July 26, 2018 Little
20180219331 August 2, 2018 Cartier, Jr. et al.
20180278000 September 27, 2018 Regnier
20180287280 October 4, 2018 Ratkovic
20180309214 October 25, 2018 Lloyd et al.
20190013617 January 10, 2019 Ayzenberg et al.
20190115677 April 18, 2019 Kachlic
20190181582 June 13, 2019 Beltran et al.
20190319395 October 17, 2019 Bakshan et al.
20190326703 October 24, 2019 Chen
20190334292 October 31, 2019 Cartier, Jr. et al.
20200021052 January 16, 2020 Milbrand, Jr. et al.
20200076132 March 5, 2020 Yang et al.
20200076455 March 5, 2020 Sharf
20200091637 March 19, 2020 Scholeno et al.
20200099149 March 26, 2020 Xu et al.
20200220289 July 9, 2020 Scholeno et al.
20200235529 July 23, 2020 Kirk et al.
20200244025 July 30, 2020 Winey et al.
20200259294 August 13, 2020 Lu
20200266584 August 20, 2020 Lu
20200266585 August 20, 2020 Paniagua et al.
20200274267 August 27, 2020 Zerebilov
20200274295 August 27, 2020 Briant
20210098927 April 1, 2021 Si et al.
20210159643 May 27, 2021 Kirk et al.
20210175670 June 10, 2021 Cartier, Jr. et al.
20210203096 July 1, 2021 Cohen
20210234314 July 29, 2021 Johnescu et al.
20210234315 July 29, 2021 Ellison et al.
20210242632 August 5, 2021 Trout et al.
20220052467 February 17, 2022 Xu et al.
20220094099 March 24, 2022 Liu et al.
20220102916 March 31, 2022 Liu et al.
Foreign Patent Documents
101312275 November 2008 CN
101316012 December 2008 CN
201222548 April 2009 CN
201252183 June 2009 CN
101552410 October 2009 CN
101600293 December 2009 CN
201374433 December 2009 CN
101752700 June 2010 CN
101790818 July 2010 CN
101120490 November 2010 CN
201690009 December 2010 CN
101964463 February 2011 CN
201846527 May 2011 CN
102106041 June 2011 CN
102106046 June 2011 CN
102148462 August 2011 CN
102195173 September 2011 CN
102232259 November 2011 CN
102239605 November 2011 CN
102282731 December 2011 CN
102292881 December 2011 CN
101600293 May 2012 CN
102570100 July 2012 CN
102598430 July 2012 CN
102738621 October 2012 CN
102859805 January 2013 CN
202695788 January 2013 CN
202695861 January 2013 CN
103036081 April 2013 CN
103594871 February 2014 CN
103969768 August 2014 CN
204190038 March 2015 CN
104577577 April 2015 CN
205043936 February 2016 CN
205212085 May 2016 CN
102820589 August 2016 CN
105826740 August 2016 CN
106099546 November 2016 CN
109994892 July 2019 CN
111555069 August 2020 CN
213636403 July 2021 CN
2169770 March 2010 EP
2388867 November 2011 EP
2405537 January 2012 EP
2009-043717 February 2009 JP
2009-110956 May 2009 JP
2010-266729 November 2010 JP
1656986 April 2020 JP
1668637 September 2020 JP
1668730 September 2020 JP
10-2015-0067010 June 2015 KR
10-2015-0101020 September 2015 KR
10-2016-0038192 April 2016 KR
M357771 May 2009 TW
200926536 June 2009 TW
M403141 May 2011 TW
M494411 January 2015 TW
I475770 March 2015 TW
M518837 March 2016 TW
WO 2008/124052 October 2008 WO
WO 2008/124054 October 2008 WO
WO 2008/124057 October 2008 WO
WO 2008/124101 October 2008 WO
WO 2009/111283 September 2009 WO
WO 2010/030622 March 2010 WO
WO 2010/039188 April 2010 WO
WO 2011/100740 August 2011 WO
WO 2011/106572 September 2011 WO
WO 2011/139946 November 2011 WO
WO 2011/140438 November 2011 WO
WO 2011/140438 December 2011 WO
WO 2012/106554 August 2012 WO
WO 2013/059317 April 2013 WO
WO 2015/112717 July 2015 WO
WO 2016/008473 January 2016 WO
WO 2018/039164 March 2018 WO
WO 2021/070273 April 2021 WO
Other references
  • [No Author Listed], Cable Systems. Samtec. Aug. 2010. 148 pages.
  • [No Author Listed], Common Management Interface Specification. Rev 4.0. MSA Group. May 8, 2019. 265 pages.
  • [No Author Listed], Electronics Connector Overview. FCI. Sep. 23, 2009. 78 pages.
  • [No Author Listed], EMI Shielding Compounds Instead of Metal. RTP Company. Last Accessed Apr. 3, 20210. 2 pages.
  • [No Author Listed], EMI Shielding Solutions and EMC Testing Services from Laird Technologies. Laird Technologies. Last accessed Apr. 30, 2021. 1 page.
  • [No Author Listed], FCI—High Speed Interconnect Solutions, Backpanel Connectors. FCI. [last accessed Apr. 30, 2021). 2 pages.
  • [No Author Listed], High Speed Backplane Connectors. Tyco Electronics. Product Catalog No. 1773095. Revised Dec. 1, 2008—40 pages.
  • [No Author Listed], HOZOX EMI Absorption Sheet and Tape. Molex. Laird Technologies. 2013. 2 pages.
  • [No Author Listed], INF-8628 Specification for QSFP-DD 8X Transceiver (QSFP Double Density) Rev 0.0 Jun. 27, 2016. SNIA SFF TWG Technology Affiliate. 1 page.
  • [No Author Listed], Molex Connectors as InfiniBand Solutions. Design World. Nov. 19, 2008. 7 pages. https://www.designworldonline.com/molex-connectors-as-infiniband-solutions/. [last accessed May 3, 2021].
  • [No Author Listed], OSFP MSA Specification for OSFP Octal Small Form Factor Pluggable Module. Revision 3.0 OSFP MSA. Mar. 14, 2020. 99 pages.
  • [No Author Listed], Photograph of Molex Connector. Oct. 2021. 1 page.
  • [No Author Listed], Photograph of TE Connector. Oct. 2021. 1 page.
  • [No Author Listed], Pluggable Input/Output Solutions. Tyco Electronics Catalog 1773408-1. Revised Feb. 2009. 40 pages.
  • [No Author Listed], QSFP-DD MSA QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiver. Revision 5.1. QSFP-DD MSA. Aug. 7, 2020. 84 pages.
  • [No Author Listed], QSFP-DD Specification for QSFP Double Density 8X Pluggable Transceiver Specification, Rev. 2.0. QSFP-DD MSA. Mar. 13, 2017. 106 pages.
  • [No Author Listed], RTP Company—EMI/RFI Shielding Compounds (Conductive) Data Sheets. RTP Company. Last accessed Apr. 30, 2021. 4 pages.
  • [No Author Listed], SFF Committee SFF-8436 Specification for QSFP+ 4X 10 Gb/s Pluggable Transceiver. Revision 4.9. SFF Committee. Aug. 31, 2018. 88 pages.
  • [No Author Listed], SFF Committee SFF-8665 Specification for QSFP+ 28 Gb/s 4X Pluggable Transceiver Solution (QSFP28). Revision 1.9. SFF Committee. Jun. 29, 2015. 14 pages.
  • [No Author Listed], SFF-8075 Specification for PCI Card Version of SFP Cage. Rev 1.0. SFF Committee. Jul. 3, 2001. 11 pages.
  • [No Author Listed], SFF-8431 Specifications for Enhanced Small Form Factor Pluggable Module SFP+. Revision 4.1. SFF Committee. Jul. 6, 2009. 132 pages.
  • [No Author Listed], SFF-8432 Specification for SFP+ Module and Cage. Rev 5.1. SFF Committee. Aug. 8, 2012. 18 pages.
  • [No Author Listed], SFF-8433 Specification for SFP+ Ganged Cage Footprints and Bezel Openings. Rev 0.7. SFF Committee. Jun. 5, 2009. 15 pages.
  • [No Author Listed], SFF-8477 Specification for Tunable XFP for ITU Frequency Grid Applications. Rev 1.4. SFF Committee. Dec. 4, 2009. 13 pages.
  • [No Author Listed], SFF-8663 Specification for QSFP+ 28 Gb/s Cage (Style A) Rev 1.7. Oct. 19, 2017. SNIA SFF TWG Technology Affiliate. 18 pages.
  • [No Author Listed], SFF-8672 Specification for QSFP+ 4x 28 Gb/s Connector (Style B). Revision 1.2. SNIA. Jun. 8, 2018. 21 pages.
  • [No Author Listed], SFF-8679 Specification for QSFP+ 4X Base Electrical Specification. Rev 1.7. SFF Committee. Aug. 12, 2014. 31 pages.
  • [No Author Listed], SFF-8682 Specification for QSFP+ 4X Connector. Rev 1.1. SNIA SFF TWG Technology Affiliate. Jun. 8, 2018. 19 pages.
  • [No Author Listed], Shielding Theory and Design. Laird Technologies. Last accessed Apr. 30, 2021. 1 page.
  • [No Author Listed], Shielding Theory and Design. Laird Technologies. Last accessed Apr. 30, 2021. 2 pages. URL:web.archive.org/web/20030226182710/http://www.lairdtech.com/catalog/staticdata/shieldingtheorydesign/std_3.htm.
  • [No Author Listed], Shielding Theory and Design. Laird Technologies. Last accessed Apr. 30, 2021. 2 pages. URL:web.archive.org/web/20021223144443/http://www.lairdtech.com/catalog/staticdata/shieldingtheorydesign/std_2.htm.
  • [No Author Listed], Typical conductive additives—Conductive Compounds. RTP Company. https://www.rtpcompany.com/products/conductive/additives.htm. Last accessed Apr. 30, 2021. 2 pages.
  • [No Author Listed], Z-Pack HM-Zd Connector, High Speed Backplane Connectors. Tyco Electronics. Catalog 1773095. 2009;5-44.
  • Atkinson et al., High Frequency Electrical Connector, U.S. Appl. No. 15/645,931, filed Jul. 10, 2017.
  • Decision Invalidating CN Patent Application No. 201610952606.4 dated Sep. 18, 2021, which issued as CN Utility Model Patent No. 107069274B, and Certified Translation.
  • Do et al., A Novel Concept Utilizing Conductive Polymers on Power Connectors During Hot Swapping in Live Modular Electronic Systems. IEEE Xplore 2005; downloaded Feb. 18, 2021;340-345.
  • In re Certain Electrical Connectors and Cages, Components Thereof, and Prods. Containing the Same, Inv. No. 337-TA-1241, Order No. 31 (Oct. 19, 2021): Construing Certain Terms of the Asserted Claims of the Patents at Issue.
  • In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Luxshare Respondents' Initial Post-Hearing Brief. Public Version. Nov. 23, 2021. 348 pages.
  • In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Luxshare Respondents' Reply Post-Hearing Brief. Public Version. Dec. 6, 2021. 165 pages.
  • In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Complainant Amphenol Corporation's Corrected Initial Post-Hearing Brief. Public Version. Jan. 5, 2022. 451 pages.
  • In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Complainant Amphenol Corporation's Post-Hearing Reply Brief. Public Version. Dec. 6, 2021. 159 pages.
  • In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Notice of Prior Art. Jun. 3, 2021. 319 pages.
  • In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Respondents' Pre-Hearing Brief. Redacted. Oct. 21, 2021. 219 pages.
  • Invalidity Claim Charts Based on CN 201112782Y (“Cai”). Luxshare Respondents' Supplemental Responses to Interrogatories Nos. 13 and 14, Exhibit 25. May 7, 2021. 147 pages.
  • Invalidity Claim Charts Based on U.S. Pat. No. 6,179,651 (“Huang”). Luxshare Respondents' Supplemental Responses to Interrogatories Nos. 13 and 14, Exhibit 26. May 7, 2021. 153 pages.
  • Invalidity Claim Charts Based on U.S. Pat. No. 7,261,591 (“Korsunsky”). Luxshare Respondents' Supplemental Responses to Interrogatories Nos. 13 and 14, Exhibit 27. May 7, 2021. 150 pages.
  • McAlexander, CV of Joseph C. McAlexander III . Exhibit 1009. 2021. 31 pages.
  • McAlexander, Declaration of Joseph C. McAlexander III in Support of Petition for Inter Partes Review of U.S. Pat. No. 10,381,767. Exhibit 1002. Nov. 4, 2021. 85 pages.
  • Palkert (ed), QSFP-DD Overview. Mar. 14, 2017. 19 pages. URL:http://www.qsfp-dd.com.
  • Petition for Inter Partes Review. Luxshare Precision Industry Co., Ltd v. Amphenol Corp. U.S. Pat. No. 10,381,767. IPR2022-00132. Nov. 4, 2021. 112 pages.
  • Silva et al., Conducting Materials Based on Epoxy/Graphene Nanoplatelet Composites With Microwave Absorbing Properties: Effect of the Processing Conditions and Ionic Liquid. Frontiers in Materials. Jul. 2019;6(156):1-9. doi: 10.3389/fmats.2019.00156.
  • Tracy, Rev. 3.0 Specification IP (Intellectual Property). Mar. 20, 2020. 8 pages.
Patent History
Patent number: 12567687
Type: Grant
Filed: Aug 4, 2023
Date of Patent: Mar 3, 2026
Patent Publication Number: 20240106140
Assignee: Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. (Shenzhen)
Inventors: Qigui Xu (Shenzhen), E Zhao (Shenzhen), Zhigang Sheng (Shenzhen), Shengxian Zhou (Shenzhen)
Primary Examiner: Thanh Tam T Le
Application Number: 18/365,875
Classifications
Current U.S. Class: Grounding Of Coupling Part (439/108)
International Classification: H01R 12/71 (20110101); H01R 12/51 (20110101); H01R 12/53 (20110101); H01R 12/57 (20110101); H01R 12/75 (20110101); H01R 13/6461 (20110101); H05K 1/184 (20260101);