Flash eprom memory cell having increased capacitive coupling and method of manufacture thereof

Abstract

A flash EPROM cell (10) is disclosed having increased capacitive coupling between a floating gate (28) and a control gate (32). Vertical structural elements (34a and 34b) are formed on field oxide regions (20) on opposing sides of the flash EPROM cell channel 20, in the channel width direction. The structural elements (34a and 34b) include relatively vertical faces. The floating gate (28) conformally cover the channel 20 and the vertical faces of the structural elements (34a and 34b). The control gate (32) conformally covers the floating gate (28). The vertical displacement introduced by the structural elements (34a and 34b) increases the overlap area between the floating gate (28) and the control gate (32) without increasing the overlap area of the floating gate (28) and the channel 20, resulting in increased capacitive coupling between the control gate (32) and the floating gate (28). A process is disclosed which enables the formation of the above structural elements (34a and 34b) with dimensions that are smaller than those normally achievable by the minimum resolution of lithography equipment.

Description

TECHNICAL FIELD

[0001] The present invention relates generally to the manufacture of integrated circuits and more particularly to integrated circuits employing floating gates and control gates that are capacitively coupled to one another.

BACKGROUND OF THE INVENTION

[0002] Currently, many non-volatile memory devices have information storage cells that employ “floating” gate structures. Floating gates are created by electrically isolating an electron storing structure by one or more dielectric layers. Charge can then be placed on, or removed from the floating gate. The resulting charge on the floating gate is used to alter the memory cell parameters For example, a single transistor storage cell is created by situating the floating gate in-between a control gate and its corresponding transistor channel. According to the charge on the floating gate, the threshold of the transistor is altered. For many non-volatile memories a cell is “programmed” by placing electrons on a floating gate, and “erased” by removing electrons from the gate.

[0003] A discussion of electron transport mechanisms used in the programming and erasure of non-volatile memories is set forth in U.S. Pat. No. 4,328,565, issued to Eliyahou Harari, on May 4, 1982. Harari notes that for erasable programmable read only memories (EPROMs), channel hot electron injection is used to place electrons on floating gates, while the application of ultraviolet light, or Fowler-Nordheim tunneling, can be used to remove electrons from the floating gate. Hot electron injection usually involves raising the control gate and drain to a relatively high potential with respect to the source. Fowler-Nordheim tunneling is accomplished by applying a strong electric field between the floating gate and the control gate or substrate. For example, a negative gate voltage between the source and the control gate. Harari notes that an important factor in programming EPROM cells is the capacitive coupling between the control gate and the floating gate. In addition, Harari indicates that the capacitive coupling is dependent upon the geometric overlap between the floating gate and the control gate, and the nature of the dielectric therebetween. (This dielectric is often referred to as the “inter-poly”dielectric in those structures that employ polysilicon floating gates and control gates. For the purposes of this description the dielectric separating the control gate from the floating gate will be referred to in this description as an “intergate” dielectric.)

[0004] U.S. Pat. No. 4,713,677 issued to Tigelaar et al. on Dec. 15, 1987 notes that the tunneling voltage increases as the capacitive coupling between the control gate and floating gate increases. Tigelaar et al. discloses an electrically erasable PROM (EEPROM) wherein the capacitive coupling between the floating gate and control gate is increased by a trench capacitor adjacent to the active area on the floating gate.

[0005] Other approaches for increasing the capacitive coupling between the control gate and the floating gate are known in the prior art. U.S. Pat. No. 4,169,291 issued to Bernward Rössler on Sep. 25, 1979 illustrates a “V-MOS” EPROM cell. The geometric overlap between the floating gate and the control gate is increased by forming the transistor within a groove etched into the substrate.

[0006] U.S. Pat. No. 5,143,860 issued to Mitchell et al. on Sep. 1, 1992 discloses an EPROM cell having sidewall floating gates. The sidewall floating gate arrangement increases the surface area of the floating gate that is adjacent to the control gate, and thus increases the capacitive coupling between the two.

[0007] U.S. Pat. No. 5,343,063 issued to Yuan et al. on Aug. 30, 1994 discloses a read only memory cell in which a floating gate is conformally formed within a thick dielectric trench. The control gate is then formed over the floating gate. The overlap area is increased due to the vertical extent of the thick dielectric trenches.

[0008] U.S. Pat. No. 5,378,643 issued to Ajika et al. on Jan. 3, 1995 discloses a flash EEPROM (EPROM) in which the control gate is formed by two layers of polysilicon, with the two layers surrounding the floating gate. By surrounding the floating gate with the control gate, effective overlap area between the control gate and the floating gate is increased.

[0009] U.S. Pat. No. 5,382,540 issued to Sharma et al. on Jan. 17, 1995 discloses a flash EEPROM (EPROM) in which the source, channel and drain are formed in epitaxial silicon pillars. The floating gates are formed by polysilicon sidewalls that surround the pillars. The control gate is formed over the entire pillar structure. The unique Sharma et al. device also increases capacitive coupling between the control gate and the floating gate by maximizing the surface area between the two.

[0010] The conventional one transistor (1-T) flash EPROM cell is set forth in U.S. Pat. No. 4,698,787 issued to Mukherjee et al. on Oct. 6, 1987.

[0011] Commonly owned, co-pending U.S. patent application Ser. No. 08/456,080 entitled DRAM CELL WITH SELF-ALIGNED CONTACT AND METHOD OF FABRICATING SAME discloses a dynamic random access memory (DRAM) cell in which the DRAM capacitor area is increased by an initial, “thick” conductive layer.

[0012] While the prior art provides a number of approaches to increasing the surface area between a floating gate and its associated control gate, such approaches require complicated process technologies that substantially deviate from the current 1-T cell manufacturing processes. Further, increasing the overlap area between floating gates and control gates by trenches and similar techniques can result in poor intergate dielectric integrity, limiting the endurance and reliability of the device.

SUMMARY OF THE INVENTION

[0013] It is an object of the present invention to provide a non-volatile memory cell having increased capacitive coupling between a control gate an its associated floating gate(s).

[0014] It is another object of the present invention to provide a non-volatile memory cell having increased capacitive coupling between a control gate an its associated floating gate(s) that can be easily substituted for conventional, non-volatile memory cells.

[0015] It is another object of the present invention to provide a method of manufacturing a non-volatile memory cell having increased capacitive coupling between a control gate an its associated floating gate(s) that is easily integrated into conventional non-volatile memory fabrication processes.

[0016] The present invention includes an EPROM, EEPROM or flash EPROM cell having a vertically extending structure adjacent to a transistor channel. A floating gate is formed that overlaps both the channel and the vertically extending structure. A control gate is formed over the floating gate. The addition of the vertically extending structure increases the overlap area between the control gate and floating gate, which, in turn, increases the capacitive coupling between the two.

[0017] According to one aspect of the present invention, the vertically extending structure is formed from an initial, relatively thick layer of polysilicon.

[0018] According to another aspect of the present invention, the vertically extending structure is patterned from a deposited layer using the floating gate etch mask.

[0019] According to another aspect of the present invention, a 1-T flash EPROM includes a channel separated by field oxide regions in the channel width direction. Relatively thick polysilicon structures are formed on the opposing field oxide regions, and a floating gate conformally overlaps the thick polysilicon structures and the channel. A control gate conformally covers the floating gate.

[0020] According to another aspect of the present invention, the vertically extending structures are formed from a dielectric layer.

[0021] According to another aspect of the present invention, the floating gate is a multi-layered structure. A first floating gate layer is formed over a tunnel dielectric. The vertically extending structure is formed on the first floating gate layer, and a second floating gate layer overlaps the vertically extending structure and exposed portions of the first floating gate layer.

[0022] An advantage of the present invention is that it provides a one transistor flash EPROM cell wherein the polysilicon coupling between the control gate and the floating gate can be increased without increasing the size of the EPROM cell along the channel width direction.

[0023] Another advantage of the present invention is that it provides a one transistor flash EPROM cell that can be reduced in size along the transistor channel width direction.

[0024] Yet another advantage of the present invention is that it provides a method of fabricating a one transistor flash EPROM cell that does not require complicated trench etching steps.

[0025] Yet another advantage of the present invention is that it provides a one transistor flash EPROM cell that can be fabricated using conventional one transistor flash EPROM fabrication process.

[0026] Other objects and advantages of the present invention will become apparent in light of the following description thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIGS. 1a-1c illustrate a flash EPROM cell according to a preferred embodiment.

[0028] FIG. 2 is a flow chart illustrating a method of manufacturing a flash EPROM according to the preferred embodiment.

[0029] FIGS. 3-12 illustrate a method of fabricating a flash EPROM cell according to the preferred embodiment.

[0030] FIG. 13 sets forth a side cross sectional view of an EPROM cell according to an alternate embodiment of the present invention.

[0031] FIGS. 14a-14d set forth top plan views illustrating selective steps in the fabrication of the flash EPROM cell of FIG. 13.

[0032] FIG. 15 is a side cross sectional view illustrating a second alternate embodiment of the present invention.

[0033] FIG. 16 is a flow chart illustrating a method of manufacturing a flash EPROM according the second alternate embodiment.

[0034] FIGS. 17a-17d illustrate a method of fabricating a flash EPROM cell according to the second alternate embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] The preferred embodiment of the present invention is a one-transistor (1-T) stacked gate non-volatile memory (NVM) cell. The NVM cell is intended to be employed as one of many such cells arranged in rows and columns to form an EPROM, EEPROM or flash EPROM array. The array is divided into sectors (or blocks) composed of a number of sub-arrays, with the cells of the same sub-array row have floating gates that are capacitively coupled to the same control gate. Cells of the same sub-array column, have drain regions that are commonly coupled to the same bit lines. Array sectors have commonly coupled source nodes.

[0036] Referring now to FIGS. 1a-1c, the NVM cell, according to a preferred embodiment, is set forth generally in three views. FIG. 1a is a top plan. FIG. 1b is a side cross sectional view taken along line b-b of FIG. 1a (the channel width direction) FIG. 1c is a side cross sectional view taken along line c-c of FIG. 1a (parallel to the channel length). The NVM cell is designated by the general reference character 10 and is formed on a semiconductor substrate 12. Formed within the substrate 12 is a source region 14 and a drain region 16. In the preferred embodiment, NVM cells of the same array column are separated by alternating source regions and drain regions, these regions each being shared by two adjacent EPROM cells 10. Active areas within the semiconductor substrate 12 are separated by isolation devices. In the preferred embodiment, the substrate 12 is p-doped, and the isolation devices are field oxide regions 20 created by an isolation process, such as a local oxidation of silicon (LOCOS) step. Source and drain regions (14 and 16) are formed by ion implanting an n-type dopant. Also set forth in FIGS. 1a-1c is a portion of the bit line 18. In the preferred embodiment, the bit line 18 extends in the channel width direction (the direction of line c-c) and commonly couples the drain regions 16 of NVM cells in a given sub-array column.

[0037] The preferred embodiment 10 includes many conventional flash EPROM cell elements; a channel region 22 is formed in the substrate between field oxide regions 20, and a stacked gate structure 24 is disposed over the channel region 12. The stacked gate structure 24, as in the case of conventional 1-T flash EPROM cells, includes a tunnel dielectric 26, formed on the surface of the channel region 22, a floating gate 28, an intergate dielectric 30, and a control gate 32. In the preferred embodiment the tunnel dielectric 26 is thermally grown silicon dioxide, and the floating gate 28 is doped polysilicon. The inter-gate dielectric 30 is a composite layer of ONO, and the control gate 32 is formed from a doped layer of polysilicon. Unlike conventional flash EPROM cells, the preferred embodiment further includes a first vertical structural element 34a and a second vertical structural element 34b.

[0038] The structural elements (34a and 34b) are formed on field oxide regions 20 on opposing sides of the channel region 22. The structural elements (34a and 34b) extend in a vertical direction away from the substrate. In the preferred embodiment, the structural elements (34a and 34b) are formed from a layer of polysilicon that has a thickness that is typically greater than that of the floating gate 28 or the control gate 32. The comparative vertical thickness of the structural elements (34a and 34b) should not be construed as limiting the invention. The floating gate 28 extends over the channel region 20 conformally covering the tunnel dielectric 26 and both the structural elements (34a and 34b). As a result, the overall exposed surface area of the floating gate 28 is increased due to the vertical displacement caused by the structural elements (34a and 34b). The floating gate 28 is completely covered by the intergate dielectric 30. The control gate 32, separated from the floating gate 28 by the intergate dielectric 30, is shown to follow the same general shape as the floating gate 28, and so also includes more surface area than conventional 1-T flash EPROM cells. Thus, the vertical displacement of the structural elements (34a and 34b) adds to the overall surface area between the control gate 30 and the floating gate 28, increasing the capacitive coupling between the two.

[0039] Referring particularly to FIG. 1c, it is noted that, in the preferred embodiment, the floating gate 28 and control gate 32 do not conformally cover the structural element 34b along the direction of line c-c. This particular arrangement arises out of a desire to have a process that is easily integrated into existing flash EPROM fabrication processes, and the desire to have as dense an array as possible. If higher capacitive coupling were desired, at the cost of larger cell sizes and/or process complexity, the stacked gate structure 24 could overlap the structural element 34a, 34b or both, in the direction of line c-c (the channel length direction).

[0040] Having generally described a NVM cell 10 according to a preferred embodiment, the fabrication process for the NVM cell 10 will now be described. Referring now to FIG. 2, a flow diagram is set forth illustrating, generally, the NVM fabrication steps according to a preferred embodiment. The process is designated by the general reference character 100. In addition, FIGS. 3-11 provide side cross sectional views to illustrate the various steps on the process set forth in FIG. 2. FIGS. 3-11 each include an a, b and c part. These parts follow the views set forth in FIG. 1 (i.e., FIG. 1a is taken along the same line as FIGS. 3a, 4a. . . , 11a, FIG. 1b is taken along the same line as FIGS. 3b, 4b. . . , 11b, etc.).

[0041] The process 100 begins with an isolation process such as a LOCOS step 102. Field oxide regions 20 are formed in the substrate 20, separated by thin layer of sacrificial oxide 36. The active regions are established by a subsequent ion implantation (step 104), used to establish the threshold voltage of the NVM cell. The NVM cell following steps 102 and 104 is set forth in FIGS. 3a-3c. The isolation process is designed to achieve an acceptable field threshold voltage to route high voltages in the periphery, and field oxide thickness that gives rise to high coupling coefficients.

[0042] As set forth in FIGS. 4a-4b, unlike conventional flash EPROM fabrication methods for 1-T cells, following the channel implant (step 104) a first, relatively thick layer of polysilicon (poly 1) 38 is deposited (step 106).In the preferred embodiment the poly 1 is deposited using a conventional polysilicon deposition process resulting in amorphous or polycrystalline grain structures. Doping of the poly 1 is governed by subsequent oxide growth, and can be done in situ, or using ion implantation. Typical deposition temperatures are ˜570° C. for amorphous silicon, and ˜630° C. for polycrystalline silicon. An in situ doping technique using phosphoryl trichloride (POCl3), or ion implant may be used to dope the poly 1 layer. For ion implantation, typical implant doses are 5×1015/cm2. The resulting preferred vertical thickness of the poly 1 layer is between 0.3 and 0.5 &mgr;m.

[0043] Referring now to FIGS. 5a-5c in conjunction with FIG. 2, following the deposition of the poly 1 38 layer, a poly 1 etch mask 40 of photoresist is created over the poly 1 38, and the poly 1 38 is subjected to an anisotropic etch (step 108). The poly 1 etch mask 40 includes an etch mask opening 42 that exposes the channel region 22. The anisotropic etch etches through the poly layer 38 along the channel region and exposes the underlying sacrificial oxide 36 and sloping “bird's beak” portions of the field oxide 20. The poly 1 38 is thus patterned into poly 1 slabs 44a and 44b that begin at the edge of the channel region 22, and extend away from the channel region 22 on top of the field oxide 20. In the preferred embodiment, the poly 1 etch mask opening 42 is minimally dimensioned. As a result, taking into account misalignment tolerances, and poly 1 critical dimensions, the poly 1 slabs 44a and 44b are as close as is possible to the channel region 22 of the NVM cell.

[0044] Referring now to FIGS. 6a-6b, following the poly 1 etch (step 108), the exposed sacrificial oxide 36 is etched away (step 110) to create a cleaned active area 46. In the preferred embodiment, the sacrificial oxide etch is a wet chemical etch of 10:1 hydrofluoric acid (HF). The poly 1 etch mask 40 is then stripped off.

[0045] In step 112, as shown in FIGS. 7a-7c, the tunnel oxide 26 is grown on the active area 46. It is noted that this step also produces a first oxide layer 48 on the poly 1 slabs 44a and 44b.

[0046] Referring now to FIGS. 8a-8c, following the growth of the tunnel oxide 26, a second layer of polysilicon 50 (poly 2) is deposited (step 114). The poly 2 layer 50 conformally covers the poly 1 slabs 44a and 44b, being separated therefrom by the first oxide layer 48. This conformal covering includes the vertical faces of the poly 1 slabs 44a and 44b which oppose one another from across the channel region 22. In the preferred embodiment, the poly 2 layer is deposited using the conventional deposition techniques described for the poly 1 layer. The poly 2 layer has a smaller vertical thickness, being in the range of 500-1500 Å.

[0047] Step 116 of FIG. 2, involves patterning a first floating gate structure, referred to in this description as a floating gate “slab.” In the preferred embodiment this step includes the simultaneous etching of both the poly 1 and poly 2 layers (38 and 50). As set forth in FIG. 9a-9c, a poly 2 etch mask 52 of photoresist is developed along the channel length of the EPROM cell. The poly 2 etch mask 52 overlaps portions of the poly 1 slabs 44a and 44b. It is noted that the mask would be the same mask that is used to pattern the floating gate in a conventional 1-T cell flash EPROM process. This enables the present invention to be readily integrated into the existing flash EPROM processes. Referring back to FIG. 2, the NVM cell is subjected to an anisotropic etch which etches through the poly 1 and poly 2 layers (38 and 50) down to the field oxide 20. This results in minimally dimensioned poly 1 rail structures (54a and 54b) that extend in the vertical direction from the field oxide 20, and run parallel to the cell channel width. It is noted that the poly 1 rail structures can actually be smaller than the minimum resolution of the photolithographic equipment (such as a “stepper”) for a given technology. The floating gate slab 56 that is created conformally covers the poly 1 rails (54a and 54b) and the cell channel region 22. In the preferred embodiment, an anisotropic reactive ion etch step is used to etch through the poly 1 and poly 2. The poly 2 etch mask 52 is subsequently stripped.

[0048] The process 100 continues with the creation of an intergate dielectric 58 (step 118). The intergate dielectric 58 covers the exposed areas of the floating gate slab 56, as well as the exposed vertical surfaces of the poly 1 rails 54a and 54b. As previously described, in the preferred embodiment, the intergate dielectric layer is a composite layer of ONO. This layer is produced by a first oxidation step which oxidizes the exposed polysilicon surfaces following the poly 1-poly 2 etch (step 116). A layer of silicon nitride is then deposited. The silicon nitride is subsequently oxidized to produce another layer of silicon dioxide. In the preferred embodiment, the bottom oxide layer has a thickness in the range of 50-150 Å, and is formed by a dry oxidation at ˜1000° C. The middle nitride layer is formed by conventional silicon nitride deposition techniques. The top oxide layer has a thickness in the range of 20-70 Å.

[0049] Referring once again to FIG. 2, following step 118, the entire NVM cell array is covered by an array protect mask 59 (step 120). With the array protected from etch steps, initial gate areas for peripheral transistor structures are formed by etching channel regions, and growing gate oxide for MOS transistor devices peripheral to the NVM cell array The NVM cell following steps 118 and 120 is set forth in FIGS. 10a-10c.

[0050] Once the intergate dielectric is formed, a third layer of polysilicon 60 (poly 3) is deposited (step 122). The poly 3 layer 60 conformally covers the intergate dielectric 58, and so follows the general shape of the floating gate slab 56, and vertical edges of the poly 1 rail structure (54a and 54b). The NVM cell following this step is set forth in FIGS. 11a-11c. In the preferred embodiment, the poly 3 layer has a thickness in the range of 1 k-2 k Å. The layer has a polycrystalline grain structure and is deposited at a temperature in the range ˜630° C. Doping is achieved either by in situ doping, or by ion implantation. In the preferred embodiment, following the deposition of the third layer of polysilicon, a layer of silicide is formed. According to well understood techniques, a layer of tungsten is deposited and annealed with the third polysilicon layer to create a WSi2/poly 3 layer.

[0051] FIGS. 12a-12c illustrate the process 100 following a stack etch step (step 124). In the stack etch step 124, a stack etch mask 62 is formed from photoresist over the WSi2/poly 3 layer. The stack etch mask 62 defines the word lines of the array, and runs in strips, defining the NVM cell channel length. Once the etch mask 62 is formed, an anisotropic stack etch is applied. The stack etch etches through the exposed portions of the WSi2/poly 3 layer, the floating gate slab, and the poly 1 rail structures, down to the field oxide (or tunnel oxide if an active area is underneath). The etching of the poly rail structures results in the two opposing structural elements 34a and 34b associated with each NVM cell. The etching of the floating gate slab 56 creates the floating gate 28. The etching of the poly 3 layer results in the overlying control gates 32.

[0052] The fabrication process 100 of the preferred embodiment concludes with conventional flash EPROM fabrication steps (set forth as the general step 126 in FIG. 2). The stacked gate structure that results following the stack etch (step 122) has spacers formed thereon after appropriate sealing oxidation. Self-aligned common source regions can then be etched. Subsequent dielectric contact and metallization steps follow. As these steps are well understood in the art, they have been omitted so as to not unnecessarily complicate the description of the invention.

[0053] Referring now to FIG. 13, an alternate embodiment is set forth in side cross sectional view. The alternate embodiment is a 1-T flash EPROM cell and is designated by the general reference character 200. Like the preferred embodiment of FIGS. 1a-1c, the alternate embodiment 200 is fabricated on a semiconductor substrate 212 that includes field oxide regions 220. The EPROM 200 has the same general configuration as the preferred embodiment; a channel region 222 formed between opposing field oxide regions 220, structural elements 234a and 234b formed on the field oxide 220, a floating gate 228 conformally covering opposing structural elements (234a and 234b) and the channel region 222, and a control gate 232 conformally covering the floating gate 228. The floating gate 228 is separated from the channel region 222 by a tunnel dielectric 226 and from the control gate by an intergate dielectric 230. Unlike the preferred embodiment, the structural elements 234a and 234b of the alternate embodiment are usually wider than those of the preferred embodiment, being etched in the channel width direction during the initial poly 1 etch step using stepper minimum resolution as the limitation. Further, the floating gate 228 completely covers both vertical surfaces of the structural elements 234a and 234b along the channel width direction.

[0054] Referring now to FIGS. 14a-14d, a series of top plan views are set forth illustrating the fabrication of the alternate embodiment. FIG. 14a sets forth the flash EPROM cell following the poly 1 etch step (step 108 in the process flow of FIG. 2). The relatively thick layer of poly 1 has been etched into poly 1 rail structures 254a and 254b that run parallel to the active region of the substrate 212 on field oxide regions 220. Thus, unlike the previously described embodiment, the poly 1 layer is patterned into rail like structures before the poly 2 deposition.

[0055] FIG. 14b illustrates the flash EPROM cell following the deposition and etch of a poly 2 layer 250 (steps 114 and 116 in FIG. 2). Unlike the previous embodiment, step 116 does not involve etching through the poly 1 rail structures (254a and 254b), as the resulting floating gate slab 256 completely overlaps both vertical edges of the poly 1 rail structures (254a and 254b). Thus, as shown in FIG. 13, the is floating gate slab 256 has four vertical faces (as opposed to the two vertical faces of the previously described embodiment of FIG. 1)

[0056] FIG. 14c illustrates the flash EPROM cell following the deposition of a poly 3 layer 260. The poly 3 layer 260 conformally covers the floating gate slab 256, including the four floating gate slab 256 vertical faces.

[0057] FIG. 14d illustrates the flash EPROM cell following a stack etch step (step 122). The stack etch is essentially the same as that previously described. The resulting EPROM cell however, provides more surface area overlap between the control gate 232 and the floating gate 228, providing for even more capacitive coupling than the previously described embodiment.

[0058] FIG. 15 is a side cross sectional view illustrating a second alternate embodiment of the present invention. Like the previously described embodiments, the flash EPROM cell 300 is formed on a substrate 312 and coupled to a bit line 318 by a drain region (not shown). Isolation oxide regions 320 and a channel region 322 are formed on the substrate. The EPROM cell 300 is a stacked gate structure 324, and so includes a tunnel dielectric 326 formed over the channel region 322, a floating gate 328 formed over the tunnel dielectric, an intergate dielectric 330 formed over the floating gate 328, and a control gate 332 formed over the intergate dielectric 330.

[0059] The second alternate embodiment differs from the previous embodiments in that structural members (334a and 334b) are formed from a dielectric layer. Further, the floating gate 328 is formed from two layers and so includes a first floating gate member 336a and a second floating gate member 336b. The first and second floating gate members (336a and 336b) are joined over the channel region 322 and split between the structural members (334a and 334b). This arrangement results in a first floating gate part 337a extending over the first structural member 334a, and a second floating gate part 337b extending over the second structural member 334b. A third floating gate part 337d extends beneath the first structural member 334a and a fourth floating gate part 337d extends beneath the second structural member 334b.

[0060] FIG. 16 and FIGS. 17a-17d set forth a manufacturing method for the second alternate embodiment. The method 400 begins with the same initial steps as the preferred embodiment. A LOCOS step (step 402) and channel implant (step 404). Unlike the preferred embodiment the sacrificial oxide is then etched (step 406) and the tunnel oxide formed (step 408). A poly 1 layer is then deposited (step 410). The flash EPROM cell following step 410 is set forth in FIG. 17a. The poly 1 layer 338a is disposed over isolation oxide regions 320 and the tunnel dielectric 326. The channel region 322 and substrate 312 are also illustrated. It is noted that the poly 1 layer 338a in the particular embodiment of FIGS. 17a-17d is thinner than the previously described embodiments. The poly 1 is deposited and doped in the same fashion as the poly 1 layer of the first embodiment described.

[0061] A structural oxide layer is then deposited over the poly 1 layer (step 412). The structural oxide layer is then etched using a mask similar to that set forth in FIG. 5b. The EPROM cell following the structural oxide etch is set forth in FIG. 17b. The etch results in two structural oxide slabs (339a and 339b) and exposes that portion of the poly 1 layer 338a situated over the channel region 322. The preferred structural oxide thickness is approximately 0.5 &mgr;m.

[0062] The method 400 continues with the deposition of a poly 2 layer 338b (step 416). The poly 2 layer 338b is disposed over the structural oxide slabs (339a and 339b) and extends down the faces thereof and makes contact with the poly 1 layer 338a. The poly 2 layer 338b is deposited in the same manner as the poly 2 layer of the embodiment described in FIG. 2. The flash EPROM cell following the deposition of the poly 2 layer is illustrated in FIG. 17c.

[0063] The flash EPROM method of manufacture proceeds with a floating gate “slab” etch (step 418). This step uses the same mask as illustrated in FIG. 9b. The poly 1 layer 338a, the poly 2 layer 338b, and the structural oxide slabs (339a and 339b) are etched through, resulting in minimally dimensioned oxide structural elements (334a and 334b). As will be recalled, this approach, as in the case of the method set forth in FIG. 2, results in structural elements having dimensions smaller than the minimum resolution of photolithographic equipment.

[0064] After the formation of the floating gate “slabs,” the method 400 proceeds with the same steps as the previously described method 200. A intergate dielectric is formed on the floating gate slabs (step 420). The array of flash cells is protected by an array mask, and gate oxides are grown for peripheral circuits (step 422). A layer of poly 3 350 is then deposited (step 424). The flash cell following the deposition of poly 3 350 is set forth in FIG. 17d. The poly 3 350 conformally covers the remaining poly 2, and the exposed, generally vertical sides of the oxide structural elements (334a and 334b). The poly 3 is deposited with the same conventional techniques described for the poly 3 layer of embodiment set forth in FIG. 2. A stack etch follows (step 426) along with conventional fabrication steps to result in a flash EPROM having cells with the structure set forth in FIG. 15. It is understood that the embodiments set forth herein are only some of the possible embodiments of the present invention, and that the invention may be changed, and other embodiments derived, without departing from the spirit and scope of the invention. Accordingly, the invention is intended to be limited only by the appended claims.

Claims

1. A non-volatile memory (NVM) cell, comprising:

a substrate;

a first dielectric formed on said substrate;

at least one vertical area enhancing structure extending in a direction vertically upward with respect tom said substrate;

a floating gate overlapping at least a portion of the vertical area enhancing structure so as to extend in a vertical direction with respect to said substrate;

an intergate dielectric formed over said floating gate; and

a control gate formed over at least a first portion of said floating gate, the portion of said floating gate overlapping said vertical area enhancing structure.

2. The NVM cell of

claim 1, wherein:

said first dielectric includes field oxide; and

said vertical area enhancing structure is formed on the field oxide.

3. The NVM cell of

claim 1, wherein:

said first dielectric includes a tunnel dielectric, the tunnel dielectric being intermediate a portion of said floating gate and said substrate.

4. The NVM cell of

claim 1, wherein:

said vertical area enhancing structure is formed from a layer of polysilicon.

5. The NVM cell of

claim 1, wherein:

said first dielectric layer includes a tunnel dielectric between opposing field oxide regions;

said vertical area enhancing structure is formed on at least one of the opposing field oxide regions; and

said floating gate overlaps the vertical area enhancing structure and the tunnel dielectric.

6. The NVM cell of

claim 1, wherein:

said substrate includes an active area having a channel region disposed between a source region and a drain region;

said first dielectric includes isolation oxide defining a peripheral edge of the active area; and

said vertical area enhancing structure is disposed on the isolation oxide.

7. The NVM cell of

claim 6, wherein:

the isolation oxide is thermally grown silicon dioxide.

8. The NVM cell of

claim 1 wherein:

said floating gate includes at least a first floating gate layer and a second floating gate layer, the first floating gate layer being formed on said first dielectric;

said vertical area enhancing structure being formed on at least a portion of the first floating gate layer; and

said second floating gate layer being formed over at least a portion of said vertical area enhancing structure, and making contact with the first floating gate layer.

9. The NVM cell of

claim 8 wherein:

said vertical area enhancing structure is formed from a dielectric layer.

10. In a semiconductor device having electrically programmable cells with a floating gate and a control gate, an electrically programmable cell having increased capacitive coupling, comprising:

a plurality of first dielectric formations disposed over a semiconductor substrate;

a plurality of vertical structures;

a plurality of floating gate members, each said floating gate member having a first floating gate portion disposed over one of said first dielectric formations, and a second floating gate portion disposed over one of said vertical structures;

a plurality of control gate members, each said control gate including a first control gate portion disposed over at least one of the first floating gate portions, and a second control gate portion disposed over at least one of the second floating gate portions; and

a plurality of second dielectric formations separating said control gates members from said floating gate members.

11. The semiconductor device of

claim 10, wherein:

said plurality of floating gate members are arranged in rows and columns to form an array; and

each said control gate member includes a plurality of first control gate portions and second control gate portions that overlap the floating gate members of one row of the array.

12. The semiconductor device of

claim 10, wherein:

said plurality of first dielectric formations are tunnel dielectric formations, each tunnel dielectric formation including a first end; and

each said vertical structure is associated with at least one first dielectric formation and includes a first structure proximate the first end of its associated tunnel dielectric formation.

13. The semiconductor device of

claim 12, wherein:

each tunnel dielectric includes a second end opposite the first end; and

each said vertical structure includes a second structure proximate the second end of its associated tunnel dielectric formation.

14. The semiconductor device of

claim 10, wherein:

said structural formations are formed from deposited polycrystalline silicon (polysilicon).

15. The semiconductor device of

claim 10 wherein:

said floating gate members are formed from deposited polysilicon.

16. The semiconductor device of

claim 10 wherein:

said control gate members are formed from deposited polysilicon.

17. The semiconductor device of

claim 10 wherein:

each said floating gate member includes a third portion disposed below at least one associated vertical structure.

18. The semiconductor device of

claim 17 wherein:

each said vertical structure includes opposing first and second structures; and

each said floating gate member is associated with a vertical structure,

the first portion of each floating gate member is intermediate the first and second structures of its associated vertical structure,

the second portion of each floating gate member includes a first part and a second part, the first part being coupled to the first floating gate portion and extending over the first structure, the second part being coupled to the first floating gate portion and extending over the second structure, and

the third portion of each floating gate member includes a third and fourth part, the third part being coupled to the first floating gate portion and extending below the first structure, the fourth part being coupled to the first floating gate portion and extending below the second structure.

19. The semiconductor device of

claim 17 wherein:

said vertical structures are formed from a layer of dielectric.

20. A method for forming a programmable cell member employing a floating gate and a control gate having increased capacitive coupling therebetween, comprising the steps of:

(a) forming a channel region on a semiconductor substrate;

(b) forming a vertically extending structural member proximate the channel region;

(c) forming a floating gate over the first dielectric layer and the structural member;

(d) forming an intergate dielectric layer over at least a portion of the floating gate; and

(e) forming a control gate over the intergate dielectric layer.

21. The method of

claim 20, wherein:

step (a) includes forming an active region intermediate a first oxide isolation region and a second oxide isolation region.

22. The method of

claim 21, wherein:

step (b) includes forming a first structural member on the first oxide isolation region and a second structural member on the second isolation oxide region.

23. The method of

claim 20, wherein:

step (a) includes forming a channel region having opposing sides; and

step (b) includes the substeps of

(b1) depositing a first structural layer, and

(b2) etching the first structural layer so as to form vertically extending structural members proximate the opposing sides of the channel region.

24. The method of

claim 20, wherein:

step (c) includes the substeps of

(c1) forming a tunnel dielectric over the channel region; and

(c2) forming a floating gate over at least a portion of the tunnel dielectric.

25. The method of

claim 20, wherein:

step (c) includes the substeps of

(c1) depositing a first conductive layer over the vertically extending structural member, and

(c2) etching through the first conductive layer and the vertically extending structural member with a floating gate mask to form a floating gate that overlaps minimally dimensioned structural members.

26. The method of

claim 20, wherein:

step (c) includes the substep of

(c0) depositing a first conductive layer before step (b);

step (b) includes forming the vertically extending structural member over at least a portion of the first conductive layer; and

step (c) further includes the substep of

(c1) depositing a second conductive layer over exposed portion of the first conductive layer and the vertically extending structural member.

27. The method of

claim 18, wherein:

step (c) includes depositing a first conductive layer; and

step (e) includes the substeps of

(e1) depositing a second conductive layer, and

(e2) etching through the first conductive and the second conductive layer to form stacked gate structures.