Thermal gradient enhanced CVD deposition at low pressure
A method wherein a thermal gradient over a substrate enhances Chemical Vapor Deposition (CVD) at low pressures. An upper heat source is positioned above the substrate and a lower heat source is positioned below the substrate. The upper and lower heat sources are operated to raise the substrate temperature to 400-700° and cause a heat gradient of 100-200° C. between the upper and lower heat sources. This heat gradient causes an increase in the deposition rate for a given reactant gas flow rate and chamber pressure. The preferred parameters for implementation of the present invention for poly crystalline silicon deposition include the temperature of the upper heat source 100-200° C. above the lower heat source, a substrate temperature in the range of 400-700° C., a reactant gas pressure between 250 and 1000 mTorr, and a gas flow rate of 200-800 sccm. The substrate is rotated, with 5 RPM being a typical rate. A deposition rate of 2000 angstroms per minute deposition of poly crystalline silicon is achieved with a 200° C. temperature differential, substrate temperature of 650° C., pressure of 250 mTorr and silane flow of 500 sccm.
This application is a continuation in part of U.S. application Ser. No. 09/396,588 filed Sep. 15, 1999 (which claims the benefit of U.S. Provisional Application Ser. No. 60/100,594 filed Sep. 16, 1998), which is a continuation in part of (a) U.S. application Ser. No. 08/909,461 filed Aug. 11, 1997, (b) U.S. application Ser. No. 09/228,835 filed Jan. 12, 1999 (which claims the benefit of U.S. Application Ser. No. 60/071,572 filed Jan. 15, 1998), and (c) U.S. Application Ser. No. 228,840 filed Jan. 12, 1999 (which claims the benefit of U.S. Provisional Application Ser. No. 60/071,571 filed Jan. 15, 1998). The disclosures of the foregoing applications are hereby incorporated by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to methods and apparatus for chemical vapor deposition onto a substrate, and more particularly to a method that deposits silicon at a high rate due to enhanced mass transport by thermal diffusion, i.e., the “Soret effect”, by using a temperature gradient above the substrate surface.
2. Description of the Prior Art
The semiconductor industry has been depositing poly crystalline silicon for a number of years. The method of choice for most applications is a Low Pressure Chemical Vapor Deposition (LPCVD) process. The LPCVD process is a well studied art wherein poly crystalline silicon deposition is accomplished by placing a substrate in a vacuum chamber, heating the substrate and introducing silane or any similar precursor such as disilane, dichiorosilane, silicon tetrachloride and the like, with or without other gases. The reactant gases are usually pre-heated prior to passing over a wafer when a rapid deposition is required. The pre-heating pre-activates the reactants and increases the rate of subsequent deposition. A disadvantage of this process is that it causes gas reactions that deplete the supply of available reactants which partially defeats the effect of pre-activation in increasing the deposition rate. Deposition rates of approximately 10 to 100 angstroms per minute are typical for low-pressure processes (less than 1 Torr) in a hot wall low pressure reactor. Deposition rates of 20 to 300 angstroms per minute are achieved in a vertical flow reactor with deposition rates as high as 500 angstroms per minute. Silicon deposition rates over 10,000 angstroms per minute have been reported, however these high deposition rates do not produce poly crystalline silicon films that are useful in manufacturing semiconductor devices because the resulting poly crystalline silicon has undesirable features such as large grain size, non uniform thickness, etc. Deposition rates of approximately 3000 angstroms per minute of useful semiconductor quality poly crystalline silicon are achieved with a higher pressure process (25 to 350 Torr) as described in detail in U.S. Pat. No. 5,607,724.
A typical prior art CVD system is illustrated in
There are other problems associated with the reactor of
A prior art vertical flow reactor 30 is illustrated in
Current demands of semiconductor processing require rapid film deposition with uniform and repeatable film thickness, and the smoothest film surface possible with controlled grain size. In addition, the time the substrate is above 600° C. must be held to a minimum, as heating the substrate to elevated temperatures, i.e. greater than 600° C. results in unwanted diffusion of dopants. Because of this, a high deposition rate is important to reduce the time that the substrate is above 600° C. Good film uniformity and repeatability is necessary to ensure consistent electrical performance, and smooth films are required for sub-micron lithography processes.
SUMMARYIt is therefore an object of the present invention to provide a method and apparatus for the Chemical Vapor Deposition (CVD) of various materials at a high rate.
It is a further object of the present invention to provide a method and apparatus for the CVD of various materials at a high deposition rate with improved uniformity.
It is another object of the present invention to provide a method and apparatus for the CVD of various materials at a high rate, with improved uniformity and reduced surface roughness.
Briefly, a preferred embodiment of the present invention includes a method wherein a substrate is placed in a reaction chamber and rotated to ensure uniform heating and a uniform flow of reactant gases over the substrate surface. Upper lamps positioned above the substrate and lower lamps below the substrate are activated to apply heat to an upper thermal plate and a lower thermal plate which in turn heat the wafer upper and lower surfaces. The upper and lower lamps are operated to raise the substrate temperature to 500-700° C. for silicon deposition, or any other temperature required for the deposition of other materials, and to provide a heat gradient between the upper and lower thermal plates and thus cause a thermal gradient between the upper substrate deposition surface and the upper thermal plate. This heat gradient causes a large increase in the deposition rate for a given reactant gas flow rate and chamber pressure. The preferred parameters for implementation of the present invention include the temperature of the upper thermal plate adjusted to be 100-200° C. above the temperature of the lower thermal plate, the substrate temperature in the range of 400-700° C., the reactant gas pressure between 250 and 1000 mTorr, and the gas flow rate in the range of 200-800 sccm. The substrate rotation is approximately 5 RPM, however the speed of rotation is not critical. For example, a deposition rate of about 2000 angstroms per minute is achieved with a 100-200° C. temperature differential between the thermal plates, substrate temperature about 650° C., pressure of 250 mTorr and silane flow of 500 sccm.
An advantage of the present invention is that it provides a higher deposition rate CVD method with good film quality.
A further advantage of the present invention is that it provides a CVD deposition method with a deposition rate five times more rapid than prior art methods providing comparable film quality.
IN THE DRAWING
Referring now to
The process gas is then injected 78, preferably achieving a chamber pressure in the range of 250 to 1000 mTorr. The gas is preferably injected at a rate of 200-800 sccm and at a velocity greater than 100 cm/sec across the substrate surface, with the gas stream restricted to a narrow region (0.5-1.5 inches) above the substrate. The process gas injection and temperature conditions are then maintained for the length of time required to deposit the desired film thickness, at which point a shutdown procedure 80 is implemented wherein the process gas is turned off and evacuated from the chamber, and the rotation is stopped and the substrate removed from the chamber.
The sequence of operations shown in
The very high rate of deposition enabled by the present invention at relatively low overall chamber pressures can move the reaction into the regime where the deposition rate approaches or exceeds the crystallization rate, resulting in the growth of very small crystals and therefore very smooth poly crystalline silicon films with a minimum surface roughness. The method can also be used to accelerate the deposition of intrinsically slow processes such as α-Si.
The other advantage over conventional batch CVD systems is the reduced thermal budget. As semiconductor device geometries are reduced to submicron sizes, the thermal budget must be reduced accordingly. A hot wall CVD system requires the substrates to be at elevated temperatures typically for two or more hours, while the present invention requires the substrate to be at elevated temperatures typically for two to three minutes depending on the required film thickness.
Referring now to
In the reactor of
The deposition time for a 3000 Angstrom layer of poly crystalline silicon is typically one to two minutes, with operational conditions generally as indicated in
Performance characteristics of the method of the present invention using the reactor of
Although the present invention has been described above in terms of a specific embodiment, it is anticipated that alterations and modifications thereof will no doubt become apparent to those skilled in the art. It is therefore intended that the following claims be interpreted as covering all such alterations and modifications as fall within the true spirit and scope of the invention.
Claims
1-12. (Cancelled)
13: An apparatus for depositing materials onto a wafer, comprising: a wafer carrier disposed between first and second thermal plates, and heaters for first and second thermal plates that are controlled to provide a temperature gradient between the first and second thermal plates, wherein the temperature between the first and second thermal plates increases with increasing distance away from the second thermal plate toward the first thermal plate.
14: The apparatus according to claim 13 further comprising gas injectors that provide a flow of process gas between the first and second thermal plates.
15: The apparatus according to claim 13 wherein the heaters comprise resistance heaters.
16: The apparatus according to claim 13 wherein the heaters comprise a first lamp for providing heat to the first thermal plate and a second lamp for providing heat to the second thermal plate.
17: The apparatus according to claim 16, wherein the first lamp supplies a different amount of heat energy than the second lamp.
18: The apparatus according to claim 17, wherein the temperature gradient includes a temperature difference in the range of 100° C. to 200° C. between the first and second thermal plates.
19: The apparatus according to claim 13 further comprising gas injectors that provide a flow of process gas between the first and second thermal plates at a flow rate in the range of 200 sccm to 800 sccm.
20: The apparatus according to claim 13, further comprising a deposition chamber in which the wafer carrier and the first and second thermal plates are disposed.
21: The apparatus according to claim 20, wherein the deposition chamber comprises a single wafer deposition chamber.
22: An apparatus for depositing materials onto a wafer, comprising a wafer carrier disposed between first and second thermal plates, heaters for first and second thermal plates that are controlled to provide a temperature gradient between the first and second thermal plates, and gas injectors that provide a flow of process gas between the first and second thermal plates at a flow rate in the range of 200 sccm to 800 sccm.
23: The apparatus according to claim 22, wherein the gas injectors are temperature controlled.
24: The apparatus according to claim 22, wherein the gas injectors supply process gas over the wafer carrier at a gas velocity in excess of 100 cm/sec.
25: The apparatus according to claim 22, wherein the temperature between the first and second thermal plates increases with increasing distance away from the second thermal plate toward the first thermal plate.
26: The apparatus according to claim 25, wherein the temperature gradient has a magnitude in the range of 50-100° C. per inch.
27: The apparatus according to claim 22 wherein the heaters comprise a first lamp for providing heat to the first thermal plate and a second lamp for providing heat to the second thermal plate.
28: The apparatus according to claim 27, wherein the first lamp supplies a different amount of heat energy than the second lamp.
29: The apparatus according to claim 28, wherein the temperature gradient includes a temperature difference in the range of 100° C.-200° C. between the first and second thermal plates.
30: The apparatus according to claim 22, further comprising a deposition chamber in which the wafer carrier and the first and second thermal plates are disposed.
31: The apparatus according to claim 30, wherein the deposition chamber comprises a single wafer deposition chamber.
32: The apparatus according to claim 22 wherein the heaters comprise resistance heaters.
Type: Application
Filed: Aug 13, 2004
Publication Date: Jan 20, 2005
Inventors: Robert Cook (Livermore, CA), Daniel Brors (Livermore, CA)
Application Number: 10/918,498