Electrochemical deposition chambers for depositing materials onto microfeature workpieces
An electrochemical deposition chamber comprises a head assembly and a vessel under the head assembly. The head assembly includes a workpiece holder configured to position a microfeature workpiece at a processing location and electrical contacts arranged to provide electrical current to a layer on the workpiece. The vessel has a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, a detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment system releasably coupling the detachable unit to the fixed unit. The electrochemical deposition chamber also includes an electrode in the detachable unit.
The present application claims the benefit of U.S. Application No. 60/476,786 filed on Jun. 6, 2003; 60/476,333 filed on Jun. 6, 2003; 60/476,881 filed on Jun. 6, 2003; and 60/476,776 filed on Jun. 6, 2003, all of which are incorporated herein in their entirety, including appendices, by reference. Additionally, U.S. Application No. 60/501,566 filed on Sep. 9, 2003 is also incorporated herein in its entirety by reference.
TECHNICAL FIELDThe present invention is directed toward apparatus and methods for processing microfeature workpieces having a plurality of microdevices integrated in and/or on the workpiece. The microdevices can include submicron features. Particular aspects of the present invention are directed toward electrochemical deposition chambers having a fixed unit, a detachable unit that can be quickly removed from the fixed unit, and an electrode in the detachable unit.
BACKGROUNDMicrodevices are manufactured by depositing and working several layers of materials on a single substrate to produce a large number of individual devices. For example, layers of photoresist, conductive materials, and dielectric materials are deposited, patterned, developed, etched, planarized, and otherwise manipulated to form features in and/or on a substrate. The features are arranged to form integrated circuits, micro-fluidic systems, and other structures.
Wet chemical processes are commonly used to form features on microfeature workpieces. Wet chemical processes are generally performed in wet chemical processing tools that have a plurality of individual processing chambers for cleaning, etching, electrochemically depositing materials, or performing combinations of these processes.
One concern of integrated wet chemical processing tools is that the processing chambers must be maintained and/or repaired periodically. In electrochemical deposition chambers, for example, consumable electrodes degrade over time because the reaction between the electrodes and the electrolytic solution decomposes the electrodes. The consumable electrodes accordingly change causing variations in the electrical field. As a result, consumable electrodes must be replaced periodically to maintain the desired deposition parameters across the workpiece. The electrical contacts that contact the workpiece also may need to be cleaned or replaced periodically.
One problem with repairing or maintaining existing electrochemical deposition chambers is that the tool must be taken offline for an extended period of time to replace the electrodes or service other components in the processing chambers 30. In a typical application, the electrodes are removed while the processing chamber 30 remains in-situ on the platform. To remove the worn electrodes, the lift/rotate unit 32 is generally moved out of the way and other components above the electrodes are removed from the chamber 30 to provide access to the electrodes through the top of the chamber. The worn electrodes are then disconnected and removed through the top of the chamber, and new electrodes are installed in the chamber 30. Finally, the other components are reinstalled in the chamber 30 above the electrodes. This process requires a significant amount of time to disassemble and then reassemble the chamber 30. This process is also extremely cumbersome because there is only a limited amount of space to access the electrodes through the top opening of the chamber 30. Moreover, after the electrodes have been replaced, the robot 44 and the lift- rotate unit 32 are recalibrated to operate with the processing chamber. Thus, replacing worn electrodes requires a significant amount of time during which the tool cannot process workpieces.
This is not the only problem with existing electrochemical deposition tools. For example, when only one processing chamber 30 of the tool 10 does not meet specifications, it is often more efficient to continue operating the tool 10 without stopping to repair the one processing chamber 30 until more processing chambers do not meet the performance specifications. The loss of throughput of a single processing chamber 30, therefore, is not as severe as the loss of throughput caused by taking the tool 10 offline to repair or maintain a single one of the processing chambers 30.
The practice of operating the tool 10 until at least two processing chambers 30 do not meet specifications severely impacts the throughput of the tool 10. For example, if the tool 10 is not repaired or maintained until at least two or three processing chambers 30 are out of specification, then the tool operates at only a fraction of its full capacity for a period of time before it is taken offline for maintenance. This further increases the operating costs of the tool 10 because the throughput not only suffers while the tool 10 is offline to replace the electrodes and recalibrate the robot 44, but the throughput is also reduced while the tool is online because it operates at only a fraction of its full capacity. Moreover, as the feature sizes of devices decrease, the electrochemical deposition chambers 30 must consistently meet much higher performance specifications. This causes the processing chambers 30 to fall out of specifications sooner, which results in shutting down the tool more frequently. Therefore, the downtime associated with replacing the electrodes is significantly increasing the cost of operating electrochemical deposition tools.
SUMMARYThe present invention is directed toward electrochemical deposition chambers with at least one electrode in a quick-release detachable unit that reduces the downtime for replacing worn electrodes. In several embodiments of the inventive electrochemical deposition chambers, one or more consumable electrodes are housed within a detachable unit that can be quickly removed and replaced with another detachable unit. Worn electrodes can accordingly be quickly replaced with new electrodes by simply removing the detachable unit with the worn electrodes and installing a replacement detachable unit with new electrodes. The detachable unit is generally a lower portion of the chamber that is accessible without having to move the lift-rotate unit or otherwise open the chamber from above. The detachable units are also coupled to the chamber by a quick-release mechanism that can be easily accessible. As such, the downtime for repairing or maintaining electrodes is greatly reduced by locating the electrodes in quick-release detachable units that can be removed and replaced in only a few minutes compared to the several hours it normally takes for replacing electrodes on existing electrochemical deposition chambers.
In one embodiment, an electrochemical deposition chamber comprises a head assembly and a vessel under the head assembly. The head assembly includes a workpiece holder configured to position a microfeature workpiece at a processing location and electrical contacts arranged to provide electrical current to a layer on the workpiece. The vessel has a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, a detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment system releasably coupling the detachable unit to the fixed unit. The electrochemical deposition chamber also includes an electrode in the detachable unit. In several particular embodiments, the detachable unit further includes a fluid inlet for providing the processing fluid to the vessel and a fluid outlet for discharging processing fluid from the vessel.
BRIEF DESCRIPTION OF THE DRAWINGS
As used herein, the terms “microfeature workpiece” or “workpiece” refer to substrates' on or in which microdevices are formed integrally. Typical microdevices include microelectronic circuits or components, thin-film recording heads, data storage elements, microfluidic devices, and other products. Micromachines or micromechanical devices are included within this definition because they are manufactured using much of the same technology as used in the fabrication of integrated circuits. The substrates can be semiconductive pieces (e.g., doped silicon wafers or gallium arsenide wafers), nonconductive pieces (e.g., various ceramic substrates) or conductive pieces.
Several embodiments of electrochemical deposition chambers for processing microfeature workpieces are particularly useful for electrolytically depositing metals or electrophoretic resist in or on structures of a workpiece. The electrochemical deposition chambers in accordance with the invention can accordingly be used in tools with wet chemical processing chambers for etching, rinsing, or other types of wet chemical processes in the fabrication of microfeatures in and/or on semiconductor substrates or other types of workpieces. Several embodiments of electrochemical deposition chambers and integrated tools in accordance with the invention are set forth in
A. Embodiments of Wet Chemical Processing Chambers
The vessel 102 includes a fixed unit 110 mounted to the deck 106 and a detachable unit 120 carried by the fixed unit 110. The fixed unit 110 can include a chassis 112, a first flow system 114 (shown schematically), and a mounting fixture 116. The chassis 112 can be a dielectric housing that is chemically compatible with the processing fluid. The chassis 112, for example, can be a high density polymer or other suitable material. The first flow system 114 can be configured to provide the desired flow to the processing site 109. In electrochemical deposition chambers, the first flow system 114 can be configured to provide a flow that has a substantially uniform velocity in a direction normal to the workpiece along the processing site 109. The mounting fixture 116 can be flanges or a ring projecting outwardly from the chassis 112 to engage the top surface of the deck 106. The mounting fixture 116 can be configured to precisely locate the fixed unit 110 relative to the deck 106. The fixed unit 110 can further include a processing component 118 to impart a property to the processing fluid flowing through the fixed unit 110. For example, the processing component 118 can be an electric field shaping element or field shaping module that shapes the electric field in the processing site 109. The field shaping element can be a static dielectric insert that controls the current density in the processing site 109. The field shaping element can also be a dynamic member that moves to alter or otherwise control the electrical field at the processing site 109 during a plating cycle. The processing component 118 can also be a filter, membrane, or any combination of these types of structures.
The detachable unit 120 of the vessel 102 includes a container 122 and a second flow system 124 (shown schematically) configured to direct the processing fluid to and/or from the first flow system 114 of the fixed unit 110. The second flow system 124 can include an inlet 126 to deliver processing fluid to the vessel 102 and an outlet 127 through which processing fluid exits the vessel 102. The first and second flow systems operate together to provide a desired flow of processing fluid through the vessel 102. The first and second flow systems 114 and 124 can be configured to provide a forward flow relative to the processing component 126. In a forward flow system, at least a portion of the processing fluid passes the electrode 130 in the detachable unit 120 before the processing fluid reaches the processing site 109. The first and second flow systems can also be configured to provide a reverse flow in which at least a portion of the processing fluid passes the electrode after the processing fluid has passed through the processing site 109.
The chamber 100 can also include one or more electrodes 130 (shown schematically) and optional processing components 150 (shown schematically) disposed in the detachable unit 120. The processing component 150 can be a filter and/or a membrane. Several embodiments of electrodes, filters, and membranes are described below.
The vessel 102 also includes an interface element 160 to prevent leaking or to otherwise control the flow of processing fluid between the fixed unit 110 and the detachable unit 120. The interface element 160 can be a seal positioned between the fixed unit 110 and the detachable unit 120. The seal can include at least one orifice to allow the processing fluid to flow between the first flow system 114 in the fixed unit 110 and the second flow system 124 in the detachable unit 120. In many embodiments, the interface element 160 is a gasket with a pattern of orifices to allow fluid to flow between the first and second flow systems 114 and 124. The interface element 160 is typically a compressible member that prevents liquid from leaking between the various flow channels of the flow systems. The interface element 160 can also be made from a dielectric material that electrically isolates different fluid flows as they flow between the first and second flow systems 114 and 124. Suitable materials for the interface element 160 include VITON® closed cell foams, closed cell silicon, elastomers, polymers, rubber and other materials.
The vessel 102 also includes an attachment assembly 170 for attaching the detachable unit 120 to the fixed unit 110. The attachment assembly 170 can be a quick-release unit, such as a clamp or a plurality of clamps, that securely holds the detachable unit 120 to the fixed unit 110. The attachment assembly 170 can be configured to move from a first position in which the detachable unit 120 is secured to the fixed unit 110 and a second position in which the detachable unit 120 can be removed from the fixed unit 110. In several embodiments, as the attachment assembly 170 moves from the second position to the first position, the attachment assembly 170 drives the detachable unit 120 toward the fixed unit 110. This motion compresses the interface element 160 and positions the detachable unit 120 at a desired location with respect to the fixed unit 110. The attachment assembly 170 can be a clamp ring, a plurality of latches, a plurality of bolts, or other types of fasteners.
In the embodiment shown in
The detachable unit 120 can include a rim 190 having a lower surface 192 and an upper surface 194. The lower surface 192 and the upper surface 194 can be inclined upwardly with increasing radius. The upper surface 194, more specifically, can be inclined at an angle to mate with the guide surface 183 of the fixed unit 110. The detachable unit 120 can further include a seal surface 195 configured to retain the interface element 160, slide channels 196a and 196b, and a bottom surface 197.
The attachment assembly 170 can include a first rim 172 configured to engage the lower surface 192 of the detachable unit 120 and a second rim 174 configured to engage the bearing surface of the bearing ring 184. The attachment assembly 170 can include a latch (shown in
One advantage of the processing chamber 100 illustrated in
B. Embodiments of Multiple Electrode Electrochemical Deposition Vessels
The fixed unit 402 includes a chassis 410 having a flow system 414 to direct the flow of processing fluid through the chassis 410. The flow system 414 can be a separate component attached to the chassis 410, or the flow system 414 can be a combination of fluid passageways formed in the chassis 410 and separate components attached to the chassis 410. In this embodiment, the flow system 414 includes an inlet 415 that receives a flow of processing fluid from the detachable unit 404, a first flow guide 416 having a plurality of slots 417, and an antechamber 418. The slots 417 in the first flow guide 416 distribute the flow radially to the antechamber 418.
The flow system 414 further includes a second flow guide 420 that receives the flow from the antechamber 418. The second flow guide 420 can include a sidewall 421 having a plurality of openings 422 and a flow projector 424 having a plurality of apertures 425. The openings 422 can be horizontal slots arranged radially around the sidewall 421 to provide a plurality of flow components projecting radially inwardly toward the flow projector 424. The apertures 425 in the flow projector can be a plurality of elongated slots or other openings that are inclined upwardly and radially inwardly. The flow projector 424 receives the radial flow components from the openings 422 and redirects the flow through the apertures 425. It will be appreciated that the openings 422 and the apertures 425 can have several different configurations. For example, the apertures 425 can project the flow radially inwardly without being canted upwardly, or the apertures 425 can be canted upwardly at a greater angle than the angle shown in
The fixed unit 402 can also include a field shaping insert 440 for shaping the electrical field(s) and directing the flow of processing fluid at the processing site. In this embodiment, the field shaping insert 440 has a first partition 442a with a first rim 443a, a second partition 442b with a second rim 443b, and a third partition 442c with a third rim 443c. The first rim 443a defines a first opening 444a. The first rim 443a and the second rim 443b define a second opening 444b, and the second rim 443b and the third rim 443c define a third opening 444c. The fixed unit 402 can further include a weir 445 having a rim 446 over which the processing fluid can flow into a recovery channel 447. The third rim 443c and the weir 445 define a fourth opening 444d. The field shaping unit 440 and the weir 445 are attached to the fixed unit 402 by a plurality of bolts or screws 448, and a number of seals 449 are positioned between the fixed unit 402 and both the field shaping unit 440 and the weir 445.
The detachable unit 404 includes a flow system having an inlet 515 that provides the flow to the inlet 415 of the fixed unit 402 and an outlet 516 that receives the fluid flow from the compartments 513. In the specific embodiment shown in
The vessel 400 also includes an interface element 530 between the fixed unit 402 and the detachable unit 404. In this embodiment, the interface element 530 is a seal having a plurality of openings 532 to allow fluid communication between the channels 520a-d and the corresponding compartments 513. The seal is a dielectric material that electrically isolates the electric fields within the compartments 513 and the corresponding channels 520a-d.
The vessel 400 can further include a plurality of electrodes disposed in the detachable unit 404. In the embodiment shown in
Referring to
The vessel 400 is expected to significantly:reduce the downtime associated with replacing multiple electrodes compared to existing electrochemical deposition chambers. Referring to
The embodiment of the chamber 400 shown in
C. Embodiments of Carriages for Installing/Removing Detachable Units
The chambers 100, 400 and 800 described above can further include carriages under the chambers to install and remove the detachable units. Several embodiments of carriages are described below in the context of the detachable unit 404, but it will be appreciated that the carriages can work with any detachable units of the invention.
The carriage 900 further enhances the process of replacing one detachable unit with another. First, the carriage 900 ensures that the detachable unit 404 is generally aligned with fixed unit 402. Second, the carriage ensures that the inlet 515 and the outlet 516 are aligned with the supply line and exit line. Third, the carriage makes it easier to install and remove the detachable unit 404 because the operator does not need to hold the detachable unit 404 against the fixed unit 402 while simultaneously operating the attachment assembly 170. Therefore, the carriage is expected to further reduce the time the replace one detachable unit with another.
D. Embodiments of Wet Chemical Processing Tools
The electrochemical processing chambers described above can be used in wet chemical processing tools having a plurality of electrochemical deposition chambers, other types of wet chemical processing chambers, annealing stations, metrology stations, and other types of processing equipment.
The frame 1610 of the tool 1600 has a plurality of posts and cross-bars that are welded together in a manner known in the art. The mounting module 1620 is at least partially housed within the frame 1610. In one embodiment, the mounting module 1620 is carried by the frame 1610, but the mounting module 1620 can stand directly on the floor of the facility or other structures in other embodiments.
The mounting module 1620 is a rigid, stable structure that maintains the relative positions between the wet chemical processing chambers 1670, the lift- rotate units 1680, and the transport system 1690. One aspect of the mounting module 1620 is that it is much more rigid and has a significantly greater structural integrity compared to the frame 1610 so that the relative positions between the wet chemical processing chambers 1670, the lift-rotate units 1680, and the transport system 1690 do not change over time. Another aspect of the mounting module 1620 is that it includes a dimensionally stable deck 1630 with positioning elements at precise locations for positioning the processing chambers 1670 and the lift-rotate units 1680 at known locations on the deck 1630. In one embodiment (not shown), the transport system 1690 can be mounted directly to the deck 1630. In other embodiments, the mounting module 1620 also has a dimensionally stable platform 1650 and the transport system 1690 is mounted to the platform 1650. The deck 1630 and the platform 1650 are fixedly positioned relative to each other so that positioning elements on the deck 1630 and positioning elements on the platform 1650 do not move relative to each other. The mounting module 1620 accordingly provides a system in which wet chemical processing chambers 1670 and lift-rotate units 1680 can be removed and replaced with interchangeable components in a manner that accurately positions the replacement components at precise locations on the deck 1630.
The tool 1600 is particularly suitable for applications that have demanding specifications which require frequent maintenance of the wet chemical processing chambers 1670, the lift-rotate units 1680, or the transport system 1690. A wet chemical processing chamber 1670 can be repaired or maintained by simply detaching the chamber from the processing deck 1630 and replacing the chamber 1670 with an interchangeable chamber having mounting hardware configured to interface with the positioning elements on the deck 1630. Because the mounting module 1620 is dimensionally stable and the mounting hardware of the replacement processing chamber 1670 interfaces with the deck 1630, the chambers 1670 can be interchanged on the deck 1630 without having to recalibrate the transport system 1690. This is expected to significantly reduce the downtime associated with repairing or maintaining processing chambers 1670 so that the tool can maintain a high throughput in applications that have stringent performance specifications. This aspect of the tool 1600 is particularly useful when the fixed unit 110 (
The transport system 1690 retrieves workpieces from a load/unload module 1698 attached to the mounting module 1620. The transport system 1690 includes a track 1692, a robot 1694, and at least one end-effector 1696. The track 1692 is mounted to the platform 1650. More specifically, the track 1692 interfaces with positioning elements on the platform 1650 to accurately position the track 1692 relative to the chambers 1670 and the lift-rotate units 1680 attached to the deck 1630. The robot 1694 and end-effectors 1696 can accordingly move in a fixed, dimensionally stable reference frame established by the mounting module 1620. The tool 1600 can further include a plurality of panels 1699 attached to the frame 1610 to enclose the mounting module 1620, the wet chemical processing chambers 1670, the lift-rotate units 1680, and the transport system 1690 in a cabinet. In other embodiments, the panels 1699 on one or both sides of the tool 1600 can be removed in the region above the processing deck 1630 to provide an open tool.
E. Embodiments of Dimensionally Stable Mounting Modules
The deck 1630 can further include a plurality of positioning elements 1634 and attachment elements 1635 arranged in a precise pattern across the first panel 1631. The positioning elements 1634 can be holes machined in the first panel 1631 and dowels or pins that are positioned in the machined holes. In other embodiments, the positioning elements 1634 can be pins, such as cylindrical pins or conical pins, that are not positioned in holes on the deck 1630, but still project upwardly from the first panel 1631 to be received by mating structures in the wet chemical processing chambers 1670. The deck 1630 has a first set of positioning elements 1634 located at each chamber receptacle 1633 to accurately position the individual wet chemical processing chambers at precise locations on the mounting module 1620. The deck 1630 can also include a second set of positioning elements 1634 near each receptacle 1633 to accurately position individual lift-rotate units 1680 at precise locations on the mounting module 1620. The attachment elements 1635 can be threaded holes in the first panel 1631 that receive bolts to secure the chambers 1670 and the lift-rotate units 1680 to the deck 1630.
The mounting module 1620 also includes exterior side plates 1660 along longitudinal outer edges of the deck 1630, interior side plates 1661 along longitudinal inner edges of the deck 1630, and endplates 1662 and 1664 attached to the ends of the deck 1630. The transport platform 1650 is attached to the interior side plates 1661 and the end plates 1662 and 1664. The transport platform 1650 includes positioning elements 1652 for accurately positioning the track 1692 (
The panels and bracing of the deck 1630 can be made from stainless steel, other metal alloys, solid cast materials, or fiber-reinforced composites. For example, the panels and plates can be made from Nitronic 50 stainless steel, Hastelloy 625 steel alloys, or a solid cast epoxy filled with mica. The fiber- reinforced composites can include a carbon-fiber or Kevlar® mesh in a hardened resin. The material for the panels 1631 and 1632 should be highly rigid and compatible with the chemicals used in the wet chemical processes. Stainless steel is well-suited for many applications because it is strong but not affected by many of the electrolytic solutions or cleaning solutions used in wet chemical processes. In one embodiment, the panels and plates 1631, 1632, 1660, 1661, 1662 and 1664 are 0.125 to 0.375 inch thick stainless steel, and more specifically they can be 0.250 inch thick stainless steel. The panels and plates, however, can have different thickness in other embodiments.
The bracing 1640 can also be stainless steel, fiber-reinforced composite materials, other metal alloys, and/or solid cast materials. In one embodiment, the bracing can be 0.5 to 2.0 inch wide stainless steel joists, and more specifically 1.0 inch wide by 2.0 inches tall stainless steel joists. In other embodiments the bracing 1640 can be a honey-comb core, a light-weight foamed metal or other type of foam, polymers, fiber glass or other materials.
The mounting module 1620 is constructed by assembling the sections of the deck 1630, and then welding or otherwise adhering the end plates 1662 and 1664 to the sections of the deck 1630. The components of the deck 1630 are generally secured together by the through-bolts 1642 without welds. The outer side plates 1660 and the interior side plates 1661 are attached to the deck 1630 and the end plates 1662 and 1664 using welds and/or fasteners. The platform 1650 is then securely attached to the end plates 1662 and 1664, and the interior side plates 1661.
The mounting module 1620 provides a heavy-duty, dimensionally stable structure that maintains the relative positions between the positioning elements 1634 on the deck 1630 and the positioning elements 1652 on the platform 1650 within a range that does not require the transport system 1690 to be recalibrated each time a replacement processing chamber 1670 or lift-rotate unit 1680 is mounted to the deck 1630. The mounting module 1620 is generally a rigid structure that is sufficiently strong to maintain the relative positions between the positioning elements 1634 and 1652 when the wet chemical processing chambers 1670, the lift-rotate units 1680, and the transport system 1690 are mounted to the mounting module 1620. In several embodiments, the mounting module 1620 is configured to maintain the relative positions between the positioning elements 1634 and 1652 to within 0.025 inch. In other embodiments, the mounting module is configured to maintain the relative positions between the positioning elements 1634 and 1652 to within approximately 0.005 to 0.015 inch. As such, the deck 1630 often maintains a uniformly flat surface to within approximately 0.025 inch, and in more specific embodiments to approximately 0.005-0.015 inch.
F. Embodiments of Wet Chemical Processing Chambers
The collar 1672 includes a plurality of interface members 1674 that are arranged in a pattern to be aligned with the positioning elements 1634 on the deck 1630. The positioning elements 1634 and the interface members 1674 are also configured to mate with one another to precisely position the collar 1672, and thus the chamber 1670, at a desired operating location on the deck 1630 to work with lift-rotate unit 1680 and the transport system 1690. As explained above, the positioning elements 1634 can be a set of precisely machined holes in the deck 1630 and dowels received in the holes. The interface members 1674 can accordingly be holes precisely machined in the collar 1672 to mate with the dowels. The dowels can be pins with cylindrical, spherical, conical or other suitable shapes to align and position the collar 1672 at a precise location relative to the deck 1630. The collar 1672 can further include a plurality of fasteners 1675 arranged to be aligned with the attachment elements 1635 in the deck 1630. The fasteners 1675 can be bolts or other threaded members that securely engage the attachment elements 1635 to secure the collar 1672 to the deck 1630. The collar 1672 accordingly holds the processing vessel 102 at a fixed, precise location on the deck.
From the foregoing, it will be appreciated that specific embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the present invention is not limited except as by the appended claims.
Claims
1. An electrochemical deposition chamber for depositing material onto microfeature workpieces having submicron features, comprising:
- a head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site;
- a fixed unit having a first flow system to provide a processing fluid to the processing site and a mounting fixture for fixedly attaching the fixed unit to a support member of a tool;
- a detachable unit having a second flow system in fluid communication with the first flow system of the fixed unit;
- a seal to prevent leaking of the processing fluid between the fixed unit and the detachable unit;
- an attachment assembly releasably coupling the detachable unit to the fixed unit; and
- at least a first electrode in the detachable unit and at least a first electrical connector coupled to the first electrode.
2. The chamber of claim 1, further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
3. The chamber of claim 1, further comprising a filter in the first flow system and/or the second flow system.
4. The chamber of claim 1, further comprising a membrane in the first flow system and/or the second flow system, wherein the membrane is configured to conduct electrical current.
5. The chamber of claim 1, wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
6. The chamber of claim 1 wherein:
- the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface contacting one side of the seal; and
- the detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface contacting another side of the seal.
7. The chamber of claim 1 wherein the fixed unit further comprises a field shaping module that shapes an electrical field in the processing fluid induced by the electrode.
8. The chamber of claim 1 further comprising:
- a second electrode arranged concentrically with the first electrode in the detachable unit; and
- a field shaping module in the fixed unit, wherein the field shaping module is composed of a dielectric material and has a first opening facing a first section of the processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the processing site through which ions influenced by the second electrode can pass.
9. The chamber of claim 8 further comprising a second electrical connector coupled to the second electrode, and the first and second electrodes are operable independently from each other.
10. The chamber of claim 1 further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
- a filter in the fixed unit and/or the detachable unit.
11. The chamber of claim 1 further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
- a membrane in the fixed unit and/or the detachable unit that conducts electrical current.
12. The chamber of claim 1 wherein the detachable unit is positioned externally underneath the fixed unit.
13. The chamber of claim 1 wherein the detachable unit further includes an externally accessible fluid fitting through which the processing fluid can flow.
14. An electrochemical deposition chamber for depositing material onto microfeature workpieces having submicron features, comprising:
- a head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site and electrical contacts arranged to provide electrical current to a layer on the workpiece;
- a vessel having a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, an externally accessible detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment assembly releasably coupling the detachable unit to the fixed unit; and
- an electrode in the detachable unit.
15. The chamber of claim 14, further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
16. The chamber of claim 14, further comprising a filter in the vessel.
17. The chamber of claim 14, further comprising a membrane in the vessel configured to conduct electrical current.
18. The chamber of claim 14, wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
19. The chamber of claim 14 wherein:
- the interface element comprises a gasket between the fixed unit and the detachable unit; and
- an externally accessible fluid fitting through which processing fluid can flow.
20. The chamber of claim 14, further comprising:
- a flow system in the vessel configured to direct a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
- a field shaping module in the vessel that shapes an electrical field in the processing fluid induced by the electrode.
21. The chamber of claim 14, further comprising:
- a second electrode arranged concentrically with the first electrode in the detachable unit; and
- a field shaping module in the vessel, the field shaping module being composed of a dielectric material, and the field shaping module having a first opening facing a first section of a workpiece processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the workpiece processing site through which ions influenced by the second electrode can pass.
22. The chamber of claim 14, further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in the processing fluid generated by the first and second electrodes;
- a flow system in the vessel having a wall that directs a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
- filter in the vessel in fluid communication with the processing fluid.
23. The chamber of claim 14 wherein:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in a processing fluid within the vessel generated by the first and second electrodes;
- a flow system in the vessel having a wall that directs the processing fluid to be at least substantially normal to a workpiece at the processing site; and
- a membrane in the vessel that conducts an electrical current in the processing fluid.
24. An integrated tool for wet chemical processing of microfeature workpieces, comprising:
- a frame;
- a mounting module carried by the frame, the mounting module having a plurality of positioning elements and attachment elements;
- an electrochemical deposition chamber comprising a head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site, a fixed unit having a first flow system to provide a processing fluid to the processing site and a mounting fixture for fixedly attaching the fixed unit to a support member of a tool, a detachable unit having a second flow system in fluid communication with the first flow system of the fixed unit, a seal to prevent leaking of the processing fluid between the fixed unit and the detachable unit, an attachment assembly releasably coupling the detachable unit to the fixed unit, and at least a first electrode in the detachable unit;
- a transport system carried by the mounting module for transporting the workpiece within the tool, the transport system having a second interface member engaged with one of the positioning elements and a second fastener engaged with one of the attachment elements; and
- wherein the mounting module is configured to maintain relative positions between positioning elements such that the transport system does not need to be recalibrated when the processing chamber is replaced with another processing chamber.
25. The tool of claim 24 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel superimposed under the first panel, joists between the first and second panel, and bolts through the first panel, the joists and the second panel.
26. The tool of claim 24 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel juxtaposed to the first panel, and bracing between the first and second panels.
27. The tool of claim 24, further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
28. The tool of claim 24, further comprising a filter in the first flow system and/or the second flow system.
29. The tool of claim 24, further comprising a membrane in the first flow system and/or the second flow system, wherein the membrane is configured to conduct electrical current.
30. The tool of claim 24, wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
31. The tool of claim 24 wherein:
- the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface contacting one side of the seal; and
- the detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface contacting another side of the seal.
32. The tool of claim 24 wherein the fixed unit further comprises a field shaping module that shapes an electrical field in the processing fluid induced by the electrode.
33. The tool of claim 24 further comprising:
- a second electrode arranged concentrically with the first electrode in the detachable unit; and
- a field shaping module in the fixed unit, wherein the field shaping module is composed of a dielectric material and has a first opening facing a first section of the processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the processing site through which ions influenced by the second electrode can pass.
34. The tool of claim 33 further comprising a second electrical connector coupled to the second electrode, and the first and second electrodes are operable independently from each other.
35. The tool of claim 24 further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
- a filter in the fixed unit and/or the detachable unit.
36. The tool of claim 24 further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the fixed unit, the field shaping module being composed of a dielectric material configured to shape electrical fields in the processing fluid generated by the first and second electrodes; and
- a membrane in the fixed unit and/or the detachable unit that conducts electrical current.
37. An integrated tool for wet chemical processing of microfeature workpieces, comprising:
- a frame;
- a mounting module carried by the frame, the mounting module having a plurality of positioning elements and attachment elements;
- an electrochemical deposition chamber comprising a head assembly and a vessel, the head assembly having a workpiece holder configured to position a microfeature workpiece at a processing site and electrical contacts arranged to provide electrical current to a layer on the workpiece, and the vessel having a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, an externally accessible detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, an electrode in the detachable unit, and an attachment assembly releasably coupling the detachable unit to the fixed unit;
- a transport system carried by the mounting module for transporting the workpiece within the tool, the transport system having a second interface member engaged with one of the positioning elements and a second fastener engaged with one of the attachment elements; and
- wherein the mounting module is configured to maintain relative positions between positioning elements such that the transport system does not need to be recalibrated when the processing chamber is replaced with another processing chamber.
38. The tool of claim 37 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel superimposed under the first panel, joists between the first and second panel, and bolts through the first panel, the joists and the second panel.
39. The tool of claim 37 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel juxtaposed to the first panel, and bracing between the first and second panels.
40. The tool of claim 37, further comprising a second electrode in the detachable unit and a dielectric divider between the first electrode and the second electrode.
41. The tool of claim 37, further comprising a filter in the vessel.
42. The tool of claim 37, further comprising a membrane in the vessel configured to conduct electrical current.
43. The tool of claim 37, wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
44. The tool of claim 37 wherein:
- the interface element comprises a gasket between the fixed unit and the detachable unit;
- the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface contacting one side of the gasket; and
- the detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface contacting another side of the gasket.
45. The tool of claim 37, further comprising:
- a flow system in the vessel configured to direct a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
- a field shaping module in the vessel that shapes an electrical field in the processing fluid induced by the electrode.
46. The tool of claim 37, further comprising:
- a second electrode arranged concentrically with the first electrode in the detachable unit; and
- a field shaping module in the vessel, the field shaping module being composed of a dielectric material, and the field shaping module having a first opening facing a first section of a workpiece processing site through which ions influenced by the first electrode can pass and a second opening facing a second section of the workpiece processing site through which ions influenced by the second electrode can pass.
47. The tool of claim 37, further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in the processing fluid generated by the first and second electrodes;
- a flow system in the vessel having a wall that directs a flow of processing fluid to be at least substantially normal to a workpiece at the processing site; and
- filter in the vessel in fluid communication with the processing fluid.
48. The tool of claim 37, further comprising:
- a second electrode concentric with the first electrode in the detachable unit and a dielectric divider between the first and second electrodes;
- a field shaping module in the vessel, the field shaping module being configured to shape electrical fields in a processing fluid within the vessel generated by the first and second electrodes;
- a flow system in the vessel having a wall that directs the processing fluid to be at least substantially normal to a workpiece at the processing site; and
- a membrane in the vessel that conducts an electrical current in the processing fluid.
49. A method for electrochemically depositing material onto a workpiece in an electrochemical deposition chamber comprising a head assembly having a workpiece holder and a vessel having a fixed unit with a processing location, a first detachable unit releasably attached to the fixed unit, and a first electrode in the first detachable unit, the method comprising:
- depositing a layer onto a first workpiece having submicron features by positioning the first workpiece at the processing location of the fixed unit to contact a processing fluid in the vessel and establishing an electrical field between the first workpiece and the first electrode;
- replacing the first electrode by releasing the first detachable unit from the fixed unit, removing the detachable unit from underneath the fixed unit, positioning a second detachable unit with a second electrode underneath the fixed unit, and releasably attaching the second detachable unit to the fixed unit; and
- depositing a layer onto a second workpiece having submicron features by positioning the second workpiece at the processing location of the fixed unit to contact a processing fluid in the vessel and establishing an electrical field between the second workpiece and the second electrode.
50. A method of servicing an electrochemical chamber for depositing material onto a workpiece having submicron features, the method comprising:
- providing an electrochemical deposition chamber comprising a head assembly having a workpiece holder and a vessel having a fixed unit with a processing location, a first detachable unit releasably attached to the fixed unit, and a first electrode in the first detachable unit;
- removing the first detachable unit from the fixed unit by disconnecting the detachable unit from the fixed unit at an external location outside of the fixed unit; and
- releasably attaching a second detachable unit having a second electrode to a portion of the fixed unit.
Type: Application
Filed: Jun 3, 2004
Publication Date: Feb 17, 2005
Inventors: Kyle Hanson (Kalispell, MT), Kert Dolechek (Kalispell, MT), Paul McHugh (Kalispell, MT), Gregory Wilson (Kalispell, MT)
Application Number: 10/859,749