Heat dissipating assembly with heat pipes

Abstract

A heat dissipation assembly includes a base, plural of fins and two heat pipes. The base includes a body and two heat-conducting portions extending slantwise from two sides of the body. A void is defined in the base surrounded by the body and the heat-conducting portions. Two grooves are defined in an upper surface of the body. The fins are attached on the heat-conducting portions. A through hole is defined in each of two sides of each fin. One end of each heat pipe is securely received in the groove of the body and the other end of each heat pipe is extended through the holes of the fins, for transferring heat from the body to the fins effectively.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to cooling of electronic devices, and particularly to heat dissipating assemblies incorporating heat pipes.

2. Prior Art

Developments in today's highly information-intensive society have led to remarkable improvements in performances of electronic devices. During operation of many contemporary electronic devices, large amounts of heat are produced. A conventional heat sink formed by extrusion is frequently no longer able to satisfactorily remove heat from modem high-speed electronic devices.

As thermal loads of electronic devices continue to increase, more effective ways to cool such devices have been sought. One apparatus developed to cool high-speed electronic devices is illustrated in FIG. 3. A heat dissipating assembly 50 comprises a base 52 and a plurality of fins 54. The base 52 comprises two acclivitous surfaces. The fins 54 are fixed on the acclivitous surfaces of the base 52. The base 52 has a large volume which results in it can absorb heat from an electronic device speedily. A contact surface between the fins 54 and the base 52 is slant and larger than that of a common heat dissipating assembly which has a flat contact surface between the fins and the base thereof, which results in the heat can be efficiently transferred to the fins 54 from the base 52. However, the base 52 of the heat dissipating assembly 50 has a great weight and it is prone to damage the electronic device.

Another apparatus developed to cool high-speed electronic devices is illustrated in FIG. 4. The heat dissipating assembly 60 comprises a base 62, two heat pipes 64 and plural of fins 66. Two holes are defined in the middle of the base 62, and the heat pipes 64 are soldered in the holes. As the heat dissipating assembly illustrated in FIG. 3, the base 62 of the heat dissipating assembly 60 still has a great weight. A solder is stacked unevenly in the holes, which leads the heat pipes 64 not intimately contacting the base 62. Furthermore, the heat pipes 64 can't transfer heat from the base 62 to the fins 66 directly.

Therefore, an improved heat dissipating assembly for an electronic device which overcomes the above problems is desired.

BRIEF SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a heat dissipating assembly which has a light base.

Another object of the present invention is to provide a heat dissipating assembly which utilizes a plurality of heat pipes to attain optimal heat transfer efficiency.

To achieve the above-mentioned objects, a heat dissipation assembly comprises a base, plural of fins and two heat pipes. The base comprises a body and two heat-conducting portions extending slantwise from two sides of the body. A void is defined in the base surrounded by the body and the heat-conducting portions. Two grooves are defined in an upper surface of the body. The fins are attached on the heat-conducting portions. A through hole is defined in each of two sides of each fin. One end of each heat pipe is securely received in the groove of the body and the other end of each heat pipe is extended through the corresponding holes of the fins, for transferring heat from the body to the fins effectively.

Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention together with the attached drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view of a heat dissipating assembly in accordance with the present invention;

FIG. 2 is an assembled view of FIG. 1;

FIG. 3 is an assembled view of a conventional heat dissipating assembly; and

FIG. 4 is an assembled view of another conventional heat dissipating assembly.

DESCRIPTION OF THE INVENTION

Referring to FIGS. 1 and 2, a heat dissipating assembly in accordance with the present invention comprises a base 10, plural of fins 30 and two heat pipes 40.

The base 10 comprises a body 12 and two heat-conducting portions 14 extending slantwise from two sides of the body 12. A void 16 is defined in the base 10 surrounded by the body 12 and the heat-conducting portions 14. An airflow channel 17 is defined between top ends of the heat-conducting portions 14 to allow cooling air to come into the void 16 through the channel 17 to cool the base 10 directly. A bottom surface of the base 10 is for contacting a CPU (not shown). An upper surface of the body 12 defines two grooves 18 communicating with the void 16.

The fins 30 are laminose-shaped. A trapeziform cutout 32 is defined in a bottom of each fin 30. The cutouts 32 of the fins 30 cooperatively form a space for receiving the base 10 therein. Each fin 30 has two hems 34 extending therefrom at opposite sides of the cutout 32 for keeping uniform distance between two adjacent fins 30. The hems 34 are soldered to the heat-conducting portions 14 to thereby attach the fins 30 to the base 10. A through hole 36 is defined in each of two sides of each fin 30.

The heat pipes 40 both are U-shaped. Working fluid is filled in each heat pipe 40. One end of the heat pipe 40 is securely received in a corresponding groove 18 of the body 12 by soldering. The other end of the heat pipe 40 is extended through the corresponding holes 36 of the fins 30, for transferring the heat from the body 12 to the fins 30 effectively.

In use, the working fluid of the heat pipes 40 evaporates when absorbing heat from the body 12 of the base 10, and then condenses and releases the heat to the fins 30 effectively.

The heat dissipating assembly of the present invention comprises at least the following advantages. Solder is spread on the one end of the heat pipe 40 or the grooves 18 of the body 12. The one end of the heat pipe 40 is placed in the groove 18 from top to down, and then the heat pipe 40 is pressed downwardly and soldered to the base 10. Thus, the solder is spread between the heat pipes 40 and the body 12 in the grooves 18 uniformly, which reduces heat resistance. In addition, the base 10 has the void 16, which reduces the weight of the base 10.

It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.

Claims

1. A heat dissipating assembly comprising:

plural of fins cooperatively defining a space;

a base located in the space, a void defined in the base; and

at least a heat pipe, one end of the at least a heat pipe received in the base, an opposite end of the at least a heat pipe extending through the fins.

2. The heat dissipating assembly as described in claim 1, wherein each fin defines a cutout in a bottom thereof to cooperatively define the space.

3. The heat dissipating assembly as described in claim 1, wherein the base defines at least a groove communicating with the void, said one end of the at least a heat pipe being received in the at least a groove.

4. The heat dissipating assembly as described in claim 3, wherein the base comprises a body and two heat-conducting portions extending from the body, said void being defined between the body and the heat-conducting portions.

5. The heat dissipating assembly as described in claim 4, wherein the two heat-conducting portions extend slantwise from two sides of the body.

6. The heat dissipating assembly as described in claim 5, wherein the fins comprise a plurality of hems formed on opposite side of the space and attached on the heat-conducting portions.

7. The heat dissipating assembly as described in claim 4, wherein an airflow channel is defined between top ends of the two heat-conducting portions to allow cooling air to enter into the void.

8. The heat dissipating assembly as described in claim 1, wherein each fin defines at least a through hole for extension of the at least a heat pipe.

9. A heat dissipating assembly, comprising:

a base defining a void therein and at least a groove communicating with the void;

plural of fins arranged on the base; and

at least a heat pipe, one end of the at least a heat pipe received in the groove of the base, an opposite end of the at least a heat pipe extending through the fins.

10. The heat dissipating assembly as described in claim 9, wherein the base comprises a body and two heat-conducting portions extending from the body, said void being defined between the body and the heat-conducting portions.

11. The heat dissipating assembly as described in claim 10, wherein the groove is defined in an upper surface of the body.

12. The heat dissipating assembly as described in claim 10, wherein the fins are attached on the heat-conducting portions.

13. The heat dissipating assembly as described in claim 10, wherein the two heat-conducting portions extend slantwise from two sides of the body.

14. The heat dissipating assembly as described in claim 10, wherein an airflow channel is defined between top ends of the two heat-conducting portions.

15. The heat dissipating assembly as described in claim 9, wherein each fin defines at least a through hole for extension of the at least a heat pipe.

16. A heat dissipation assembly comprising:

a fin assembly including a plurality of spaced parallel fins cooperatively defining a space in one side face of said fin assembly;

a base configured to be snugly received in the space;

a void defined in said base with an opening for ventilating communication with a fan which is located on another side face of the fin assembly; and

a heat pipe defining a section which is attached to said base and exposed to said void.

17. The heat dissipation assembly as described in claim 16, wherein an opposite section of the heat pipe extends through said fin assembly in a perpendicular manner.

18. The heat dissipation assembly as described in claim 16, wherein said base is of a triangular configuration with said opening at the uppermost apex.