Encapsulation (epo) Patents (Class 257/E33.059)
  • Patent number: 12038596
    Abstract: The invention refers to a backlighting device for a (1) lighting assembly of a vehicle. The backlighting device comprises at least one printed circuit board and at least one light guide body. The light guide body receives the light, emitted by a light source. The printed circuit board blocks and deflects the light emitted by the light source to the light guide body. The printed circuit board has at least one opening to receive the light guide body.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: July 16, 2024
    Assignee: Methode Electronics Malta Ltd.
    Inventors: Michael Geppert, Elie Assy, Johann Barbara
  • Patent number: 12038156
    Abstract: A light source module is provided. The light source module includes a lead frame, a light source, a cup part, and a reflector. The light source is disposed on the lead frame, wherein the light source provides a light. The cup part is disposed on the lead frame, wherein the cup part includes an opening, a plurality of thick-wall portions and a plurality of thin-wall portions. The thick-wall portions and the thin-wall portions surround the light source and define a space. The reflector covers the opening. At least a portion of the light is reflected by the reflector, and is emitted through the thick-wall portions and the thin-wall portions.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: July 16, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Shu-Wei Chen, Jia-Jhang Kuo, Ching-Chi Chiang
  • Patent number: 12040435
    Abstract: Provided is a light-emitting device that includes a solid-state light source emitting excitation light and a phosphor layer having a first refractive index, provided on a light-emitting surface side of the solid-state light source, and having a first reflection film on its side surface. The light-emitting device further includes a low refractive layer provided on the phosphor layer and having a second refractive index less than the first refractive index, and a sealing member encapsulating the phosphor layer and the low refractive layer and having a third refractive index greater than or equal to the second refractive index.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 16, 2024
    Assignee: SONY CORPORATION
    Inventors: Takahiro Koyama, Toyoharu Oohata
  • Patent number: 12027505
    Abstract: An optoelectronic device including a support including a face; light-emitting diodes lying on the face and comprising including semiconductor elements in the form of wires, cones or truncated cones; for each light-emitting diode, an encapsulation block at least partially transparent to the radiation emitted by the light-emitting diodes and covering the light-emitting diode, the maximum thickness of the encapsulation block being comprised between 1 ?m and 30 ?m, interstices of air being present between the encapsulation blocks covering adjacent diodes; and an electrically conductive layer covering the encapsulation blocks, wherein the refractive index of the encapsulation block covering at least one of the light-emitting diodes is comprised between 1.3 and 1.6.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: July 2, 2024
    Assignee: Aledia
    Inventors: Tiphaine Dupont, Ivan-Christophe Robin
  • Patent number: 12027504
    Abstract: The present application provides a method for improving colour difference of an LED display screen, comprising: drilling and polishing circuit surfaces of a plurality of LED substrates; performing screen printing on the circuit surfaces of the plurality of LED substrates, and performing oil skimming on a mesh screen during the screen printing every other preset printing cycle in such a way that an ink on the mesh screen has a viscosity within a predetermined viscosity range; performing an exposure setting process on the plurality of LED substrates that have been screen printed to obtain a plurality of LED printed circuit boards; and finally assembling the plurality of LED printed circuit boards to form an LED display screen.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: July 2, 2024
    Inventors: Guoke Huang, Hua Xiang, Jun Yang, Xiaofeng Yu
  • Patent number: 12021017
    Abstract: The present application provides a semiconductor package and a manufacturing method thereof. The semiconductor package includes a semiconductor die, a package substrate and bonding wires. The semiconductor die has I/O pads arranged at an active side. The package substrate is provided with a first side attached to the active side of the semiconductor die and a second side facing away from the semiconductor die, and has an opening penetrating through the package substrate. The I/O pads are overlapped with the opening. A width of the opening at the second side of the package substrate is greater than a width of the opening at the first side of the package substrate. The bonding wires connect the I/O pads to the second side of the package substrate through the opening of the package substrate.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: June 25, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Wu-Der Yang
  • Patent number: 12015109
    Abstract: A display panel and a display device. The display panel includes a substrate, at least three different light-emitting units disposed on the substrate, and at least three different buffer encapsulation layers disposed on the side of the at least three different light-emitting units facing away from the substrate. The at least three different light-emitting units emit at least three different colors. The thickness of at least one buffer encapsulation layer corresponding to at least one light-emitting unit among the at least three different light-emitting units is different from the respective thicknesses of the other buffer encapsulation layers corresponding to the other light-emitting units among the at least three different light-emitting units.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 18, 2024
    Assignee: KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD
    Inventors: Chunliang Yao, Xiaokang Zhou, Mengzhen Li, Huashan Bao
  • Patent number: 12013491
    Abstract: An optical device includes: a first mirror having a first reflecting surface extending in a first direction and a second direction perpendicular to the first direction; a second mirror having a second reflecting surface; an optical waveguide layer that is located between the first and second mirrors and propagates light in the first direction; and an optical element that is disposed on the first mirror and emits incident light in a direction different from an incident direction. The optical element emits (1) incident light entering from the optical waveguide layer through the first mirror in a direction whose first direction component is smaller than that of an incident direction of the incident light by refraction and/or diffraction or (2) incident light entering from the outside in a direction whose first direction component is larger than that of an incident direction by refraction and/or diffraction.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: June 18, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazuki Nakamura, Yasuhisa Inada, Taku Hirasawa
  • Patent number: 12002790
    Abstract: A pixel includes a first electrode and a second electrode facing each other, an insulating layer on the first and second electrodes, a plurality of light-emitting elements located on the insulating layer between the first electrode and the second electrode, a first contact electrode electrically connected to the first electrode, and a second contact electrode electrically connected to the second electrode. Here, a first gap having a constant width in a first direction and a second gap having a width in the first direction that gradually changes along a second direction are located between the first electrode and the second electrode or between the first contact electrode and the second contact electrode.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: June 4, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hee Keun Lee, Jin Taek Kim, Seung Min Lee, Jung Hwan Yi, Baek Hyeon Lim, Kyung Tae Chae
  • Patent number: 12002908
    Abstract: A light-emitting packaging device includes a substrate, a light-emitting diode (LED) chip, an optical element, and a covering member. The LED chip is disposed on the substrate. The optical element is spacedly disposed on the LED chip opposite to the substrate, and has an upper surface and a lower surface that are respectively distal from and proximal to the LED chip. The covering member is made from a fluorine-containing resin, and is configured to cover the LED chip and at least a portion of the upper surface of the optical element.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: June 4, 2024
    Assignee: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
    Inventors: Junpeng Shi, Qiuxia Lin, Weng-Tack Wong, Changchin Yu
  • Patent number: 11996502
    Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: May 28, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Kenji Ozeki, Atsushi Kojima, Chinami Nakai
  • Patent number: 11990573
    Abstract: A light emitting device including a fluorescent material with reduced hue, and a method of manufacturing the light emitting device are provided. A light emitting device 100 includes: a light emitting element 1; a first light-transmissive member 3 covering the light emitting element 1; and a light diffusing member 5 contained in the first light-transmissive member 3. The light diffusing member 5 includes hollow particles. The surface of the first light-transmissive member 3 has irregular shapes attributed to the light diffusing member 5. The first light-transmissive member 3 is covered with a second light-transmissive member 4. The second light-transmissive member 4 has a convex structure in which the center is the uppermost point. The irregular shapes attributed to the light diffusing member 5 are covered with the second light-transmissive member 4.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: May 21, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Shoichi Kashihara, Masanobu Sato
  • Patent number: 11990487
    Abstract: A reflective member having transflective and substantially opaque regions is disclosed. The transflective region may serve as a sensor opening region. When viewing the member from a first direction, the difference between a total light reflectance of the member at the substantially opaque region and at the sensor opening region is less than five percent. Additionally, when viewing the member from the first direction, the difference between a color reflectance of the member at the substantially opaque region and at the sensor opening region is less than 5 delta C* units. A sensor disposed in a second direction of the sensor opening region of the member is operable to receive light through the member at the sensor opening region. The second direction is opposite the first direction.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 21, 2024
    Assignee: GENTEX CORPORATION
    Inventors: Brian R. Olson, George A. Neuman, Mario F. Saenger Nayver, John S. Anderson
  • Patent number: 11984545
    Abstract: A method of manufacturing a light emitting device includes disposing at least one light emitting element on a recessed part of a resin package. The resin package having the recessed part includes a resin molding with a white pigment having a particle size from 0.1 ?m to 50 ?m and at least one lead electrode. The resin molding is disposed on a portion of a main face of the at least one lead electrode and is not in contact with a rear face of the at least one lead electrode. There is no gap at a joint face between the resin molding and the at least one lead electrode. The at least one light emitting element is disposed on the main face of the at least one lead electrode.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: May 14, 2024
    Assignee: SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
    Inventors: Naoyuki Urasaki, Kanako Yuasa
  • Patent number: 11978836
    Abstract: A display module is provided that includes a substrate and a molding part. The substrate includes a first surface disposed with a plurality of LEDs, and a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body. The molding part covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Taehyeun Ha, Jaehoo Park
  • Patent number: 11978831
    Abstract: A light emitting device includes a light-transmissive ceramic substrate, a light emitting element mounted on the ceramic substrate, a wiring arranged inside the ceramic substrate and electrically connected to the light emitting element, a base material faced to the ceramic substrate, and a seal member hermetically sealing a gap between the ceramic substrate and the base material. The light emitting element is arranged in a space surrounded by the ceramic substrate, the base material, and the seal member. The wiring includes a wiring layer extending in a planar direction of the ceramic substrate.
    Type: Grant
    Filed: June 12, 2021
    Date of Patent: May 7, 2024
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Michio Horiuchi, Masaya Tsuno
  • Patent number: 11973165
    Abstract: A method for manufacturing a light emitting device includes: preparing a light-shielding frame defining a through-hole, and having at least one convex portion; supplying a light reflecting resin so that the convex portion is at least partially covered; preparing a light-transmissive member having a first surface with an outer periphery smaller than an inner periphery of the first main surface, a first side surface contiguous with the first surface, a second side surface located outside of the first side surface, and a third surface contiguous with the first and second side surfaces; bringing the third surface into contact with the convex portion, or with the light reflecting resin in contact with the convex portion, so that the light reflecting resin is disposed between the first side surface and an inside surface of the light-shielding frame; curing the light reflecting resin; and joining light emitting elements and the light-transmissive member.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: April 30, 2024
    Assignee: NICHIA CORPORATION
    Inventor: Masaki Nagao
  • Patent number: 11959606
    Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: April 16, 2024
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Cheng-Ying Lee, Ming-Sung Tsai
  • Patent number: 11955589
    Abstract: A light-emitting device comprises a carrier, which comprises a plurality of side surfaces, an insulating layer, an upper conductive layer arranged on the insulating layer, a lower conductive layer arranged under the insulating layer, and a plurality of conductive through holes arranged between and connected to the upper conductive layer and the lower conductive layer; a plurality of light-emitting units arranged on and electrically connected to the upper conductive layer; and a transparent unit fully covering the plurality of light-emitting units, and exposing the lower conductive layer, wherein the plurality of conductive through holes are not completely buried within the insulating layer, and each conductive through hole is sandwiched by two adjacent ones of the plurality of side surfaces.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: April 9, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Tzu-Hsiang Wang
  • Patent number: 11948850
    Abstract: In one aspect of the semiconductor module, the sealing material on the lower side of the die stage is thinner than the sealing material on the upper side of the semiconductor element, a bent portion that forms a step with respect to vertical direction in the first lead is provided in a region sealed by the sealing material in the first lead, the side where the die stage is present of the step is positioned below the side where the die stage is not present of the step due to the step, the side where the die stage is not present of the step in the first lead protrudes from one end side of the sealing material, and a groove is provided on an upper side surface, a lower side surface, or both of them of the bent portion of the first lead.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 2, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Akitoshi Shirao
  • Patent number: 11943971
    Abstract: In a display device in which an OLED is formed by a separate coating method, improving the accuracy of vapor deposition position and reducing display defects are established. In the array substrate, a display unit that displays an image configured with a plurality of pixels is formed. A first convex portion and a second convex portion are provided on a surface of a boundary region between the pixels of the array substrate. A first organic layer including a layer exhibiting a first emission color is stacked on the pixel electrode of the pixel, and second organic layers including a layer exhibiting a second emission color are stacked on the pixel electrode of the pixels. The first organic layer is provided to cover only the first convex portion. The second organic layers are provided not to cover any one of the first convex portion and the second convex portion.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: March 26, 2024
    Assignee: Japan Display Inc.
    Inventor: Masamitsu Furuie
  • Patent number: 11942757
    Abstract: The present disclosure relates to optical systems and methods for their manufacture. An example method includes coupling a first surface of a light-emitter substrate to a reference surface of a carrier substrate. The method also includes registering a mold structure with respect to the reference surface of the carrier substrate. Furthermore, the method includes using the mold structure to form an optical material over at least a portion of the light-emitter substrate. The optical material is shaped according to a shape of the mold structure and includes at least one registration feature. The method also includes coupling an optical lens element to the optical material such that the optical lens element is registered to the at least one registration feature.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: March 26, 2024
    Assignee: Waymo LLC
    Inventors: Paul Karplus, Matthew Last
  • Patent number: 11936990
    Abstract: A photographing method, a storage medium, and an electronic device (100). The electronic device (100) comprises a display screen (21) and a camera module (22), and the display screen (21) comprises a liquid crystal panel (211), a backlight module (212), and electrochromic glass (213) which are stacked. When an HDR image needs to be captured, image acquisition is performed on a current scene by means of the camera module (22), an acquired image is analyzed, then the light transmittance of the liquid crystal panel (211) is adjusted according to brightness distribution information, and finally, secondary image acquisition is performed by means of the camera module (22) to obtain a target image.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: March 19, 2024
    Assignee: JRD COMMUNICATION (SHENZHEN) LTD.
    Inventors: Bo Yang, Guangyue Luo
  • Patent number: 11926254
    Abstract: An optical element, comprising a light guide body. The light guide body comprises a plurality of light-incident parts arranged along a length extension direction of the light guide body, a light guide part and a light-emitting part; each light-incident part is provided with at least one light-incident unit; the light guide part is configured to guide light received by each light-incident unit to be emitted toward the light-emitting part; the shape of a forward projection plane of the light-emitting part is of a strip shape. The optical element can reduce the occupied space and improve the space utilization rate, facilitates reducing positioning mounting errors, has an appearance with a narrow and elongated shape, and can be applied in vehicle lamp modules, vehicle lamps and vehicles.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 12, 2024
    Assignee: HASCO VISION TECHNOLOGY CO., LTD.
    Inventors: He Zhu, Wenhui Sang, Cong Li, Dapan Zhang, Zhiping Qiu
  • Patent number: 11920954
    Abstract: A sensor is disclosed. The sensor includes: an elongated and hollow housing having a first opening formed in a longitudinal direction of the housing, and a second opening formed at one end thereof; a cap closing the second opening; an elongated cover covering the first opening and having one end coupled to the cap; a first receiving groove formed on the housing at a position adjacent to the first opening and facing the cover; a second receiving groove formed on the cap at a position facing the cover; a front sealing member inserted into the first receiving groove and the second receiving groove, and coming into contact with the cover; a groove formed on the cap at a position adjacent to the second opening and facing one end of the housing; and a side sealing member inserted into the groove and coming into contact with the one end of the housing.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: March 5, 2024
    Assignee: AUTONICS CORPORATION
    Inventor: Doick Hwang
  • Patent number: 11923399
    Abstract: A micro light-emitting diode display panel includes a substrate, at least one light-emitting element, a reflective layer and a light-absorbing layer. The at least one light-emitting element is disposed on the substrate to define at least one pixel, and each light-emitting element includes micro light-emitting diodes. The reflective layer is disposed on the substrate and located between the micro light-emitting diodes. The reflective layer has cavities surrounding the micro light-emitting diodes, such that a thickness of a portion of the reflective layer close to any one of the micro light-emitting diodes is greater than a thickness of a portion of the reflective layer away from the corresponding micro light-emitting diode. The light-absorbing layer is at least disposed in the cavities of the reflective layer.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: March 5, 2024
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Sheng-Yuan Sun, Loganathan Murugan, Po-Wei Chiu, Yun-Li Li
  • Patent number: 11908987
    Abstract: A display device includes a substrate and a display element layer disposed on the substrate and emitting light. The display element layer includes a first electrode electrically connected to a portion of a first light emitting element, a second electrode electrically connected to another portion of the first light emitting element, and at least one insulating structure disposed on the substrate and having a convex shape protruding from the substrate. The first light emitting element is disposed in a space of the at least one insulating structure. A method of manufacturing the display device is also disclosed.
    Type: Grant
    Filed: November 17, 2022
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kwang Soo Bae, Dong Uk Kim, Beom Soo Park, Min Jeong Oh, Young Je Cho
  • Patent number: 11908984
    Abstract: The present disclosure relates to a light-emitting device. The light-emitting device includes a substrate, a first light-emitting chip, a first wavelength conversion member, and a barrier member. The first light-emitting chip is mounted on the substrate. The first wavelength conversion member covers the upper surface of the first light-emitting chip. A first reflective member covers the side surface of the first wavelength conversion member. Further, the barrier member includes an outer wall surrounding the side surfaces of the first light-emitting chip and the first reflective member.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: February 20, 2024
    Assignee: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Hye In Kim, Jung Hun Son
  • Patent number: 11903129
    Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
  • Patent number: 11895381
    Abstract: An image pickup apparatus for endoscope includes: an image pickup member provided with a plurality of image pickup side faces; a first optical member provided with first side faces; a first bonding layer bonding together the image pickup member and the first optical member; a second optical member provided with second side faces; and a second bonding layer bonding together the second optical member and the first optical member, in which a plurality of first side faces include first near side faces closer to an optical axis than are the second side faces and the image pickup side faces, and the image pickup apparatus for endoscope further includes a sealing resin covering the first near side faces, at least part of the first bonding layer, and the second bonding layer.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: February 6, 2024
    Assignee: OLYMPUS CORPORATION
    Inventor: Jumpei Yoneyama
  • Patent number: 11867372
    Abstract: A vehicle light guide body includes an incident surface that light from the light source enters, a first reflective surface that internally reflects the light that has entered from the incident surface to form nearly parallel light, a second reflective surface that internally reflects the light from the first reflective surface, a third reflective surface provided in a position located in front of the second reflective surface in a front-rear direction and in a portion in at least one of end faces in a left-right direction, a light shielding part that shields a part of the light reflected by the second reflective surface, and a light emitting surface that emits the light that has been internally reflected by the second reflective surface and has passed through the light shielding part to illuminate a headlight pattern in front of a vehicle.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 9, 2024
    Assignee: Ichikoh Industries, Ltd.
    Inventor: Kei Onoma
  • Patent number: 11871607
    Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: January 9, 2024
    Assignees: Universal Display Corporation, The Trustees of Princeton University
    Inventors: Prashant Mandlik, Ruiqing Ma, Jeffrey Silvernail, Julia J. Brown, Lin Han, Sigurd Wagner, Luke Walski
  • Patent number: 11871643
    Abstract: A display device may include a first electrode, a second electrode, an emission layer, an intervening layer, and a first encapsulation layer. The second electrode may overlap the first electrode. The emission layer may be disposed between the first electrode and the second electrode, may overlap the first electrode, and may include a light emitting material. The intervening layer may directly contact the second electrode, may be spaced from each of the first electrode and the emission layer, and may include a fluorine compound. A first section of the first encapsulation layer may overlap the emission layer. The intervening layer may be positioned between the second electrode and a second section of the first encapsulation layer.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: January 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae Sik Kim, Jae Ik Kim, Jung Sun Park, Seung Yong Song, Duck Jung Lee, Yeon Hwa Lee, Joon Gu Lee, Kyu Hwan Hwang
  • Patent number: 11859786
    Abstract: The present invention relates to a vehicle lamp and, more particularly, to a vehicle lamp using a semiconductor light-emitting device. The present invention provides a vehicle lamp comprising: a substrate; first and second bar-shaped light sources arranged parallel to one side of the substrate and extending along one direction thereof; and a lens disposed on one surface of the substrate and extending along the one direction so as to overlap with the first and second light sources, wherein the cross-section of the lens, which is perpendicular to the extending directions of the two light sources and cut along a virtual plane perpendicular to the substrate, includes a part of an ellipse.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: January 2, 2024
    Assignee: LG ELECTRONICS INC.
    Inventor: Hooyoung Song
  • Patent number: 11859293
    Abstract: Methods to partially decrease reflectivities of at least two regions on a mirror platform relative to a reflectivity of a third region are taught. A first region is defined on a surface of the mirror platform. The first region is a media display device viewing area. A second region is defined on the surface of the mirror platform. The second region is a back lit area. A first material is selectively disposed onto a rear surface of the mirror platform outside of the first region and outside of the second region. The first material increases the reflectivity of the mirror platform outside of the first region and outside of the second region. When the mirror platform is viewed from a front side a reflectivity of a third region, which is outside of the first region and outside of the second region, is greater than a reflectivity of either the first region or the second region; and a reflectivity of the first region is different than a reflectivity of the second region.
    Type: Grant
    Filed: April 4, 2021
    Date of Patent: January 2, 2024
    Assignee: ELECTRIC MIRROR, LLC
    Inventors: James V. Mischel, Jr., James V. Mischel, Sr.
  • Patent number: 11854788
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: December 26, 2023
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 11837684
    Abstract: Submount structures for light-emitting diode (LED) packages are provided. Submounts may include a base material that is configured to provide high thermal conductivity and a ceramic layer on the base material that is configured to provide high reflectivity for one or more LED chips that are mounted thereon. In certain aspects, the base material may include a ceramic base having a ceramic material that is different than a material of the ceramic layer. In certain aspects, submounts may also include additional ceramic layers configured to provide high reflectivity. In certain aspects, LED packages include electrical traces that are arranged either on one or more ceramic layers or at least partially embedded within one or more ceramic layers. The arrangement of such ceramic layers may provide increased reflectivity in areas where it may be difficult for other reflective materials to be present, such as gaps formed between tightly spaced electrical traces.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: December 5, 2023
    Assignee: CreeLED, Inc.
    Inventors: David Suich, Daniel E. Stasiw, Samuel Richard Harrell, Jr.
  • Patent number: 11837688
    Abstract: In an embodiment a pixel for a multi-pixel LED module includes a first light-emitting semiconductor chip having a first upper chip side and a first lead-frame section having a first upper side, a first contacting protrusion and a second contacting protrusion, wherein the first contacting protrusion and the second contacting protrusion extend from the first upper side, and wherein the first light-emitting semiconductor chip is embedded in an electrically insulating material such that the first upper side is covered by the electrically insulating material and the first upper chip side and the contacting protrusions are exposed.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: December 5, 2023
    Assignee: OSRAM OLED GmbH
    Inventor: Michael Zitzlsperger
  • Patent number: 11837616
    Abstract: The present technology relates to an imaging element, a method of manufacturing the imaging element, and an electronic apparatus that make it possible to suppress generation of a void in an infrared cutoff filter layer. The imaging element includes: a light receiving sensor that performs photoelectric conversion of incoming light; a cover glass that protects a top surface side serving as a light incidence surface of the light receiving sensor; a frame that is disposed in an outer peripheral portion between the light receiving sensor and the cover glass, and is formed with use of an inorganic material; and an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame. The present technology is applicable to, for example, an imaging element having a CSP structure, and the like.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: December 5, 2023
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Taichi Natori
  • Patent number: 11828969
    Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; a plurality of light emitting devices on the substrate; a first reflective layer on the substrate; a resin layer on the first reflective layer; and a second reflective layer on the resin layer. The resin layer includes a first surface from which light emitted from the plurality of light emitting devices is emitted, and a second surface opposite to the first surface, wherein the first surface of the resin layer includes a first exit surface having a first curvature, and a second exit surface having a flat surface or a second curvature, wherein a maximum distance from the second surface to the first exit surface may be greater than a maximum distance from the second surface to the second exit surface.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: November 28, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seong Jin Kim, Hyun Ho Choi
  • Patent number: 11830898
    Abstract: The present technology relates to an imaging element, a method of manufacturing the imaging element, and an electronic apparatus that make it possible to suppress generation of a void in an infrared cutoff filter layer. The imaging element includes: a light receiving sensor that performs photoelectric conversion of incoming light; a cover glass that protects a top surface side serving as a light incidence surface of the light receiving sensor; a frame that is disposed in an outer peripheral portion between the light receiving sensor and the cover glass, and is formed with use of an inorganic material; and an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame. The present technology is applicable to, for example, an imaging element having a CSP structure, and the like.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: November 28, 2023
    Assignee: Sony Semiconductor Solutions Corporation
    Inventor: Taichi Natori
  • Patent number: 11830857
    Abstract: A light-emitting device and a method for manufacturing the light-emitting device is disclosed. Such a light-emitting device comprises a substrate, a plurality of cells disposed on the substrate, and a plurality of semiconductor dice, wherein each of the plurality of cells accommodates at least one of the plurality of dice. Each of the plurality of cells may be filled with an encapsulant, phosphor or a mixture of an encapsulant with phosphor to control light characteristics of the light-emitting device. In an alternative aspect, cells may be filled with an encapsulant, and comprise a transparent cover coated with or filled with phosphors to control light characteristics of the light-emitting device.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: November 28, 2023
    Assignee: BRIDGELUX, INC.
    Inventors: Rene Peter Helbing, Tao Xu
  • Patent number: 11824148
    Abstract: Disclosed is a semiconductor light emitting device including: A semiconductor light emitting device comprising: a semiconductor light emitting device chip including a plurality of semiconductor layers, and electrodes electrically connected to the plurality of semiconductor layers, the plurality of semiconductor layers including an active layer adapted to generate light by recombination of electrons and holes; an encapsulating member of a lens shape made of a light-transmitting thermoplastic resin having at least 90% transmissivity for light of a wavelength band ranging from 100 nm to 400 nm, for surrounding the semiconductor light emitting device chip; and an external substrate including conductive layers electrically connected to the electrodes of the semiconductor light emitting device chip. The encapsulating member is formed in a way that all faces of the encapsulating member are exposed to outside, except for a portion of the lower face thereof in contact with the external substrate.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: November 21, 2023
    Assignee: Elphoton Inc.
    Inventors: Kyoung Min Kim, Bong Hwan Kim, Jung Woo Han
  • Patent number: 11817307
    Abstract: The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: November 14, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Guangcai Yuan, Zhijun Lv, Haixu Li, Xiaoxin Song, Feng Zhang, Wenqu Liu, Liwen Dong, Zhao Cui, Libo Wang, Detian Meng
  • Patent number: 11810485
    Abstract: An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: November 7, 2023
    Assignee: InnoLux Corporation
    Inventors: Chin-Lung Ting, Chung-Kuang Wei, Li-Wei Mao, Chi-Liang Chang, Chia-Hui Lin
  • Patent number: 11812630
    Abstract: A display device includes a substrate, a switching element on the substrate, a pixel electrode disposed on the switching element and connected to the switching element, a light emitting layer on the pixel electrode, a common electrode on the light emitting layer, and a sealing portion on the common electrode. The sealing portion includes an organic layer, and at least one first composite inorganic layer disposed between the organic layer and the common electrode. The at least one first composite inorganic layer includes a first inorganic layer between the common electrode and the organic layer, and a second inorganic layer between the first inorganic layer and the organic layer. A refractive index of the first inorganic layer and a refractive index of the second inorganic layer are different from each other, and the first inorganic layer and the second inorganic layer contact each other.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: November 7, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Wooyong Sung, Junghan Seo, Kwanhyuck Yoon
  • Patent number: 11784457
    Abstract: A packaged electronic device structure includes a substrate having a major surface. A semiconductor device is connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface. A package body encapsulates a portion of the semiconductor device, wherein the side surface of the semiconductor device is exposed through a side surface of the package body. In some examples, the side surface of the semiconductor device is an active surface. In some examples, the package body comprises a molded structure that contacts and overlaps the first major surface of the semiconductor device.
    Type: Grant
    Filed: September 12, 2021
    Date of Patent: October 10, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ramakanth Alapati, Darrell Paul Baker, Anthony B. Taguinod
  • Patent number: 11784292
    Abstract: A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: October 10, 2023
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Min Jang, Chang Youn Kim
  • Patent number: 11777068
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: October 3, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Patent number: 11778854
    Abstract: Provided is an organic electroluminescent display device, including a substrate, an organic light-emitting device on the substrate, and an encapsulation layer formed on the organic light-emitting device and the substrate. The encapsulation layer includes an inorganic layer and a polymer organic layer alternatingly stacked with an intermediate layer formed of a first organic monomer between the inorganic layer and the polymer organic layer, and one surface of the intermediate layer is bonded to the inorganic layer through bonding sites on a surface of the inorganic layer and another surface of the intermediate layer is bonded to the organic layer by polymerization.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: October 3, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Min-Ho Oh, Yoon-Hyeung Cho, Yong-Tak Kim, So-Young Lee, Jong-Woo Kim, Ji-Young Moon