Uniformity correction system having light leak and shadow compensation
A system and method for uniformity correction having light leak and shadow compensation is provided. The system includes multiple correction elements and an optical compensation plate. Adjacent correction elements are separated by a gap. The optical compensation plate includes a pattern having multiple gap compensation segments. The pattern has an attenuation which is different than the attenuation of the remaining portions of the optical compensation plate. The location of each compensation segment on the compensation plate corresponds to the location of the corresponding gap between adjacent correction elements in the illumination slot. The width of each compensation segment is dependent upon the angle of the light incident on the correction system. The pattern can be located on the top surface or on the bottom surface of the compensation plate. In addition, the compensation plate can be located above or below the plurality of correction elements.
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This application is a continuation of U.S. application Ser. No. 11/492,067, filed Jul. 25, 2006, which is a continuation of U.S. application Ser. No. 11/022,837, filed Dec. 28, 2004, now U.S. Pat. No. 7,088,527 that issued on Aug. 8, 2006, both of which are incorporated by reference herein in their entirety.
FIELD OF THE INVENTIONThe present invention is generally related to uniformity correction in lithography systems.
BACKGROUND OF THE INVENTIONConventional lithography systems include, among other things, an illumination system to produce a uniform intensity distribution of a received laser beam. It is desirable that the resulting illumination be as uniform as possible and that any uniformity errors be kept as small as possible. Illumination uniformity influences the ability of an illumination system to produce uniform line widths across an entire exposure field. Illumination uniformity errors can significantly impact the quality of devices produced by the lithography system.
Techniques for correcting uniformity include correction systems that have multiple correction elements such as plates inserted from opposites of an illumination slot. These correction elements have non-zero attenuation (e.g., 90%). However, due to various constraints, a gap exists between adjacent correction elements. The gaps between adjacent correction elements generate unwanted optical effects such as gap ripples and shadows. Because each gap unwanted optical effects such as gap ripples and shadows. Because each gap has a 0% attenuation (or 100% transmission) and the correction elements have non-zero attenuation, light through the gaps generate streaks or bands of greater intensity on the substrate. The bands of greater intensity impact the width of lines in the exposure field. Furthermore, each correction element has a finite thickness. Thus, each correction elements has a plurality of edges. If light is coming in on an angle (i.e., larger sigma), part of the light reflects off the edge, casting a shadow on the substrate.
Therefore, what is needed is a uniformity correction system that compensates for optical effects created by gaps between adjacent correction elements, that provides increased uniformity across the slot, and that improves critical dimensions.
SUMMARY OF THE INVENTIONThe present invention is directed to a system and method for uniformity correction having light leak and shadow compensation. In accordance with an aspect of the present invention, the system for uniformity correction includes a plurality of correction elements and an optical compensation plate. In an embodiment, the correction elements are moveable within an illumination slot. Adjacent correction elements are separated by a gap. The optical compensation plate includes a pattern having multiple gap compensation segments. The pattern has an attenuation which is different than the attenuation of the remaining portions of the optical compensation plate.
Each gap compensation segment corresponds to one of the gaps between adjacent correction elements. The location of each gap compensation segment on the optical compensation plate substantially corresponds to the location of the corresponding gap between adjacent correction elements in the illumination slot. The width of each gap compensation segment is dependent upon the angle of the light incident on the correction system. In aspect of the invention, the width of each gap compensation segment is larger than the width of the corresponding gap. A gap compensation segment can have any length. In an aspect of the invention, a gap compensation segment extends from a first edge of the optical compensation plate to a second edge of the optical compensation plate.
In an aspect of the invention, the pattern is on the top (or upper) surface of the optical compensation plate. In an alternate aspect of the invention, the pattern is on the bottom (or lower) surface of the optical compensation plate. The pattern can be formed from any material having an attenuation.
In an aspect of the invention, the optical compensation plate is located above the plurality of correction elements. In an alternate aspect of the invention, the optical compensation plate is located below the plurality of correction elements.
The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present invention and, together with the description, further serve to explain the principles of the invention and to enable a person skilled in the pertinent art to make and use the invention.
The present invention will now be described with reference to the accompanying drawings. In the drawings, like reference numbers can indicate identical or functionally similar elements. Additionally, the left-most digit(s) of a reference number may identify the drawing in which the reference number first appears.
DETAILED DESCRIPTION OF THE INVENTIONLithography system 100 includes an illumination system 110, a uniformity correction system 120, a contrast device 130, projection optics 150, a substrate stage 160, and a correction module 170.
Illumination system 110 illuminates contrast device 130. Illumination system 110 may use any type of illumination (e.g., quadrapole, annular, etc.) as required by the lithography system. In addition, illumination system 110 may support the modification of various illumination properties such as partial coherence or fill geometry. The details of illumination systems are well known to those skilled in the art and thus are not explained further herein.
Contrast device 130 is used to image a pattern onto a portion of a substrate 165 (e.g., wafer or glass plate) held by substrate stage 160. In a first embodiment, contrast device 135 is a static mask such as a reticle and substrate 165 is a wafer. In a second maskless embodiment, contrast device 130 is a programmable array. The programmable array may include a spatial light modulator (SLM) or some other suitable micro-mirror array. Alternatively, the SLM can comprise a reflective or transmissive liquid crystal display (LCD) or a grating light value (GLV). In the second embodiment, substrate 165 may be a piece of glass, flat panel display, or similar.
Projection optics 150 is configured to project an image of the pattern (defined by the contrast device) on the substrate. The details of projection optics 150 are dependent upon the type of lithography system used. Specific functional details of projection optics are well known to those skilled in the art and therefore are not explained further herein.
Substrate stage 160 is located at the image plane 180. Substrate stage 160 supports a substrate 165. In an embodiment, the substrate is a resist coated wafer. In an alternate embodiment, the substrate is a piece of glass, flat pane display or similar.
Uniformity correction system 120 is a device that controls illumination levels within specific sections of illumination fields associated with system 100. The uniformity correction system 120 is positioned between the illumination optics 110 and the contrast device stage 130 at the correction plane. In an embodiment, the correction plane is located proximate to the contrast device stage (e.g., reticle stage). In alternative embodiments, the correction plane can be located at any position between illumination optics 110 and contrast device stage 130.
As can be seen in
In an embodiment of the invention, optical compensation plate 250 has 0% attenuation (i.e., 100% transmission). As would be appreciated by a person of skill in the art, an optical compensation plate having other attenuation values could be used with the present invention.
As can be seen in
The gaps between adjacent correction elements generate unwanted optical effects such as gap ripples and shadows. An example of these effects is illustrated in
As can be seen in
As shown in
Optical compensation plate 550 has a first surface and a second surface. In an embodiment, pattern 552 is on the first surface. In an alternative embodiment, pattern 552 is on the second surface. In a further embodiment, pattern 552 is included within optical compensation plate.
Pattern 552 can be formed of any material having a non-zero attenuation. For example, pattern 552 may be a coating comprised of a series of dots. As would be appreciated by persons of skill in the art, pattern 552 can be coupled to optical compensation plate 550 by a variety of methods.
Each gap compensation segment 554a-j corresponds to a gap between adjacent correction elements.
The width of each gap compensation segment 554 is dependent upon the angle of the incident light. For example, if the incident light has a small sigma, the gap compensation segment 554 can have a width equal to or slightly larger than the width of the gap between adjacent correction elements. If the incident light has a large sigma, the gap compensation segment has a greater width. In general, the width of each gap compensation segment 554 is greater than the width of the gap between adjacent correction elements.
The length of each gap compensation segment 554 is dependent on a variety of factors including the configuration of the correction elements and the maximum depth of insertion of each element. As can be seen in
Although
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims
1. A lithography apparatus, comprising:
- an illumination system configured to generate a beam of radiation;
- a uniformity correction system configured to process the beam of radiation and including: a plurality of correction elements, wherein adjacent one of the correction elements are spaced apart, and a plate including a plurality of segments, each of the plurality of segments having an attenuation different than an attenuation of the plate and corresponding to a space between the adjacent correction elements;
- a patterning device configured to pattern the processed beam; and
- a projection system configured to project the patterned beam onto a target area of a substrate.
2. The lithography apparatus of claim 1, wherein the plate is parallel to the plurality of correction elements.
3. The lithography apparatus of claim 1, wherein at least one dimension of a segment in the plurality of segments is determined by the angle of light incident on the uniformity correction system.
4. The lithography apparatus of claim 1, wherein the plate has a first surface and a second surface and wherein the plurality of segments is on the first surface.
5. The lithography apparatus of claim 1, wherein the plate has a first surface and a second surface and wherein the plurality of segments is on the second surface.
6. The lithography apparatus of claim 1, wherein the plurality of segments are included within the body of the plate.
7. The lithography apparatus of claim 1, wherein the plurality of segments have a non-zero attenuation and the plate has a zero attenuation.
8. A lithography apparatus, comprising:
- an illumination system configured to generate a beam of radiation;
- a uniformity correction system configured to control an illumination level within the beam of radiation, including: a plurality of correction elements arranged in a tilted configuration, wherein when the plurality of correction elements are inserted to a maximum depth in a correction slot, a plurality of parallel gaps extending substantially across the width of the correction slot are created, and a compensation plate including a plurality of parallel compensation segments extending substantially across the width of the compensation plate, wherein each of the plurality of compensation segments corresponds to one of the plurality of the plurality of parallel gaps;
- a patterning device configured to pattern the beam of radiation received from the uniformity correction system; and
- a projection system configured to project the patterned beam onto a target area of a substrate.
9. The lithography apparatus of claim 8, wherein the plurality of parallel compensation segments has a first attenuation and the compensation plate has a second attenuation.
10. The lithography apparatus of claim 8, wherein the plate is parallel to the plurality of correction elements.
11. The lithography apparatus of claim 8, wherein at least one dimension of a segment in the plurality of parallel segments is determined by the angle of light incident on the uniformity correction system.
12. The lithography apparatus of claim 8, wherein the compensation plate has a first surface and a second surface and wherein the plurality of parallel segments is on the first surface.
13. The lithography apparatus of claim 8, wherein the compensation plate has a first surface and a second surface and wherein the plurality of parallel segments is on the second surface.
14. The lithography apparatus of claim 8, wherein the plurality of parallel segments are included within the body of the compensation plate.
15. The lithography apparatus of system of claim 9, wherein the first attenuation is non-zero attenuation and the second attenuation is zero.
16. A lithography apparatus, comprising:
- an illumination system configured to generate a beam of radiation;
- a uniformity correction system configured to control an illumination level within the beam of radiation, including: a plurality of correction members, movable within an illumination slot, wherein each correction member is separated from an adjacent correction member by a gap; and an optical compensation plate, wherein the optical compensation plate includes a pattern having an attenuation, the pattern having a plurality of pattern segments, wherein the arrangement of the pattern on the optical compensation plate corresponds to the arrangement of the gaps between adjacent correction members when each correction member is inserted to a maximum depth in the illumination slot;
- a patterning device configured to pattern the beam of radiation received from the uniformity correction system; and
- a projection system configured to project the patterned beam onto a target area of a substrate.
17. The lithography apparatus of claim 16, wherein the attenuation of the pattern is greater than an attenuation of the optical compensation plate.
18. The lithography apparatus of claim 16, wherein the optical compensation plate is placed beneath the plurality of correction members.
19. The lithography apparatus of claim 16, wherein the optical compensation plate is placed above the plurality of correction members.
Type: Application
Filed: Nov 20, 2007
Publication Date: Jun 12, 2008
Applicant: ASML Holding N.V. (Veldhoven)
Inventor: Roberto B. Wiener (Bethel, CT)
Application Number: 11/984,622
International Classification: G02B 9/00 (20060101); G03B 27/54 (20060101);