System and methods to laminate passives onto substrate
A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.
Preformed passive electrical components may be embedded within an integrated circuit (IC) substrate in order to provide decoupling, RF tuning or voltage regulation. Such components must be electrically connected to conductive traces formed within the substrate.
A dielectric layer is initially deposited on a substrate at 210. The substrate may comprise any ceramic, organic, and/or other suitable material. The substrate may comprise any portion of an IC package substrate, including but not limited to a core, metallization layers and/or other dielectric layers. Accordingly, the dielectric layer may be deposited upon any suitable layer of a substrate at 210.
Next, at 220, portions of the dielectric layer are removed to create a plurality of separated non-removed portions of the dielectric layer.
One or more passive electronic components are then deposited into each of the non-removed portions at 230. Any system to deposit the components may be utilized at 230, including but not limited to surface mounter 350 of
Next, at 240, the separated non-removed portions of the dielectric layer are cured.
Subsequent processing may include depositing a next dielectric layer onto dielectric layer 310, via formation, and/or patterning. Substrate 300 may be singulated to separate each non-removed portion into individual IC package substrates.
Process 400 of
A plurality of portions of the dielectric layer are cured at 420. The plurality of portions are separated by a plurality of non-cured portions.
One or more passive electronic components are then deposited into each of the uncured portions at 430. Although any system may deposit the components at 430,
One or more passive electronic components are then deposited into each of the plurality of mounting portions at 630.
The several embodiments described herein are solely for the purpose of illustration. The various features described herein need not all be used together, and any one or more of those features may be incorporated in a single embodiment. Some embodiments may include any currently or hereafter-known versions of the elements described herein. Therefore, persons skilled in the art will recognize from this description that other embodiments may be practiced with various modifications and alterations.
Claims
1. A method comprising:
- depositing a dielectric layer onto a substrate;
- removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer;
- depositing one or more passive electronic components into each of the plurality of separated non-removed portions; and
- curing the separated non-removed portions of the dielectric layer.
2. A method according to claim 1, wherein removing the portions comprises:
- laser scribing the plurality of separated non-removed portions.
3. A method according to claim 1, further comprising:
- singulating the substrate,
- wherein the substrate comprises a panel comprising a plurality of integrated circuit dice.
4. A method according to claim 1, further comprising:
- depositing a second dielectric layer onto the dielectric layer.
5. A method according to claim 1, wherein the dielectric layer is partially cured before being deposited on the substrate.
6. A method comprising:
- depositing a dielectric layer onto a substrate;
- curing a plurality of portions of the dielectric layer, the plurality of cured portions separated by a plurality of uncured portions of the dielectric layer;
- depositing one or more passive electronic components into respective ones of each of the plurality of uncured portions; and
- curing the uncured portions of the dielectric layer.
7. A method according to claim 6, wherein curing the plurality of portions of the dielectric layer comprises:
- exposing the plurality of portions to energy to which the plurality of uncured portions is not exposed.
8. A method according to claim 6, further comprising:
- singulating the substrate,
- wherein the substrate comprises a panel comprising a plurality of integrated circuit dice.
9. A method according to claim 6, further comprising:
- depositing a second dielectric layer onto the dielectric layer.
10. A method according to claim 6, wherein the dielectric layer is partially cured before being deposited on the substrate.
11. A method comprising:
- depositing a dielectric layer onto a substrate;
- modifying the dielectric layer to create a plurality of mounting portions separated by a plurality of non-mounting portions, the non-mounting portions extending higher above the substrate than the mounting portions;
- depositing one or more passive electronic components onto each of the plurality of mounting portions; and
- curing the plurality of mounting portions and the plurality of non-mounting portions of the dielectric layer.
12. A method according to claim 11, wherein modifying the dielectric layer to create a plurality of mounting portions comprises:
- compressing the plurality of non-mounting portions.
13. A method according to claim 11, further comprising:
- singulating the substrate,
- wherein the substrate comprises a panel comprising a plurality of integrated circuit dice.
14. A method according to claim 11, further comprising:
- depositing a second dielectric layer onto the dielectric layer.
15. A method according to claim 11, wherein the dielectric layer is partially cured before being deposited on the substrate.
Type: Application
Filed: Dec 20, 2006
Publication Date: Jun 26, 2008
Patent Grant number: 7838419
Inventors: Huankiat Seh (Phoenix, AZ), Yongki Min (Phoenix, AZ), Islam Salama (Chandler, AZ)
Application Number: 11/642,350
International Classification: H05K 3/30 (20060101);