Thermal Conduction Patents (Class 361/704)
  • Patent number: 10349531
    Abstract: Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz?3.6 ?m, and Sz/Sa?14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: July 9, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Nobuaki Miyamoto, Michiya Kohiki
  • Patent number: 10349558
    Abstract: A method of manufacturing a heat dissipating device includes steps of providing a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a collar portion, with the through hole formed on the fin body, with the collar portion extending from a periphery of the through hole and having a first U-shaped protruding ear, with the first U-shaped protruding ear having a first opening, with the heat pipe having a heat dissipating end and a heat absorbing end, and with the heat dissipating end opposite to the heat absorbing end; inserting the heat dissipating end into the through hole and the collar portion; and punching the collar portion to shrink the first opening of the first U-shaped protruding ear, such that the collar portion fixes the heat dissipating end in a tight-fitting manner.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: July 9, 2019
    Assignee: Cooler Master (Hui Zhou) Co., Ltd.
    Inventors: Chia-Yu Lin, Qingsong Zhang, Tao Song
  • Patent number: 10347559
    Abstract: A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: July 9, 2019
    Assignee: MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventors: Wei Fan, Xiang Liu, John Mariner
  • Patent number: 10327324
    Abstract: A circuit board includes a heat storage body, an insulating layer provided on the heat storage body, a wiring board provided on the insulating layer, and a heat generating component provided on the wiring board. The insulating layer is provided independently of the wiring board. The wiring board is provided with a heat transfer metal portion penetrating through the wiring board and facing the heat generating component. The insulating layer is provided with a heat transfer resin portion penetrating through the insulating layer and facing the heat transfer metal portion. The heat transfer resin portion and a part of the insulating layer are interposed between the heat transfer metal portion and the heat storage body.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: June 18, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Nobuyuki Matsui, Makoto Ohno, Hiroyuki Yamada
  • Patent number: 10321565
    Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface attached to the second surface of the electronic device.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: June 11, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Ching-Chi Kuo, Yi-Hwa Hsieh
  • Patent number: 10319609
    Abstract: A heat sink can be attached to a heat-producing electronic device by aligning an adhesive material to a surface of the heat sink, applying the adhesive material to the surface to form an outer perimeter and applying, within the outer perimeter, a thermally conductive material to the surface. The surface of the heat sink and a surface of the heat-producing electronic device can then be aligned, and the heat sink can be assembled to the heat-producing electronic device by bringing the heat-producing electronic device surface into contact with the adhesive material. The heat sink can then be affixed to the heat-producing electronic device by applying a compressive force to the assembly to activate the adhesive material.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: June 11, 2019
    Assignee: International Business Machines Corporation
    Inventors: Karl Stathakis, Phillip V. Mann, Mark K. Hoffmeyer
  • Patent number: 10310170
    Abstract: A display device comprises a light source, an optical member, a display panel, and a frame. The frame supports the display panel. The frame has a first protruding portion that contacts with an area of a rear facing surface of the optical member within a predetermined distance from a center portion of the optical member. The first protruding portion has an overall rectangular shape with a step part at at least one corner of the overall rectangular shape.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 4, 2019
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventors: Akira Yokawa, Yuki Kita, Akihiro Fujikawa, Yasuyuki Fukumoto, Yasuhiro Mori, Yuto Suzuki, Hirofumi Horiuchi, Hirohiko Tsuji, Takahito Yamanaka, Hideo Yonezawa, Akifumi Kono
  • Patent number: 10271439
    Abstract: The present disclosure relates to a closed type display apparatus. In an embodiment, the closed type display apparatus includes a front housing, a rear housing, and a closed space which is defined by the front housing and the rear housing and in which first and second circuit boards used in the display apparatus are disposed; wherein, a metal cover is formed as at least a portion of the rear housing, and a higher heating device of the first circuit board is disposed to be adjacent to the metal cover. The present disclosure also relates to a method of assembling a closed type display apparatus.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: April 23, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yan Ren, Lei Cao, Nannan Hu, Zifeng Wang, She Lin
  • Patent number: 10251256
    Abstract: The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: April 2, 2019
    Assignee: Shindengen Electric Manufacturing Co., Ltd.
    Inventors: Kosuke Ikeda, Yuji Morinaga, Osamu Matsuzaki
  • Patent number: 10244658
    Abstract: A heat conductive sheet includes a heat dissipating sheet, a first heat insulating layer provided above the heat dissipating sheet, a first sheet provided above the first heat insulating layer, and a second sheet provided below the heat dissipating sheet. The first sheet includes a first protruding portion protruding from the heat dissipating sheet viewing from above. The second sheet includes a second protruding portion protruding from the heat dissipating sheet viewing from above. A thermal conductivity of the first heat insulating layer is lower than any of a thermal conductivity of the first sheet, a thermal conductivity of the second sheet, and a thermal conductivity of the heat dissipating sheet. The first protruding portion overlaps and the second protruding portion viewing from above.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: March 26, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Koji Matsuno, Kazuhiko Kubo
  • Patent number: 10241365
    Abstract: The invention relates to a backlighting device (14), particularly for head-up display. Said device includes: at least one light-emitting diode (16), emitting light beams; an optical system (20) for shaping light beams; and a light diffuser (22), receiving the shaped light beams and said diffuser also comprises a heat sink (18) formed of at least two parts including a base plate (50) and at least one strip (52) that is attached onto said base plate. The strip comprises at least one fold (90) for forming at least one cooling fin (80) and at least one area (60) intended for thermal contact with said base plate (50).
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: March 26, 2019
    Assignee: VALEO COMFORT AND DRIVING ASSISTANCE
    Inventor: Lenaic Pierre
  • Patent number: 10229884
    Abstract: A semiconductor device includes a lead frame. One end portion of the lead frame is disposed outside a case, the other end portion of the lead frame is disposed over a front surface of an insulating board inside the case and near a semiconductor element, and the lead frame is formed in the case. Furthermore, the semiconductor device includes a temperature transducer disposed on a side of the other end portion of the lead frame opposite a laminated substrate and near a side portion of a semiconductor element. As a result, the temperature transducer is disposed near the side portion of the semiconductor element in the semiconductor device. Therefore, the temperature of the semiconductor element is properly detected. In addition, the length in the vertical direction of the case of the semiconductor device is reduced and miniaturization is realized.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: March 12, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Naoki Saegusa
  • Patent number: 10224257
    Abstract: It is an object of the present invention to provide a semiconductor module that reduces an excessive stress on a sealed object due to the expansion and contraction of a sealing gel to thus improve the reliability. A semiconductor module according to the present invention includes: a semiconductor element bonded to a metal pattern on an insulating substrate contained in a case; a sealing gel sealing the insulating substrate and the semiconductor element within the case; and a sealing-gel-expansion suppressing plate disposed in the upper portion of the sealing gel to be at least partially in contact with the sealing gel. The sealing-gel-expansion suppressing plate includes a surface facing the sealing gel and inclined to the upper surface of the sealing gel.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: March 5, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Goro Yasutomi, Kazuhiro Morishita, Ryutaro Date
  • Patent number: 10211176
    Abstract: A semiconductor package includes a substrate, through-electrodes penetrating the substrate, first bumps spaced apart from each other in a first direction parallel to a top surface of the substrate and electrically connected to the through-electrodes, respectively, and at least one second bump disposed between the first bumps and electrically insulated from the through-electrodes. The first bumps and the at least one second bump constitute one row in the first direction. A level of a bottom surface of the at least one second bump from the top surface of the substrate is a substantially same as levels of bottom surfaces of the first bumps from the top surface of the substrate.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: February 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ae-nee Jang, KyungSeon Hwang, SunWon Kang
  • Patent number: 10205277
    Abstract: A card-type storage device and a slot device, which are capable of preventing lowering of the reliability due to repeated insertion and removal of the storage device. A card medium includes card thermal contacts each having a contact surface which intersects with a thickness direction of the card medium. A first card upper guide surface restricts the position of the card medium in the thickness direction to a first position. An escape portion restricts the position of the card medium in the thickness direction to a different position from the first position. A second card upper guide surface links the first card upper guide surface and the escape portion.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: February 12, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masafumi Kimura, Fumihiro Kajimura, Go Naito, Kyosuke Sato
  • Patent number: 10194565
    Abstract: An electromagnetic interference (EMI) shielding apparatus includes a cage structure having an opening at a first end and a second end opposite to first end. The cage structure is configured to contain one or more electrical components that emit electromagnetic energy and a connector for the one or more electrical components. The first end is configured to receive a pluggable module that is to connect to the one or more electrical components. The EMI shielding apparatus further includes a filler assembly disposed in the opening. The filler assembly is biased to close the opening of the cage structure when a pluggable module is not inserted/plugged in the opening.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: January 29, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: Xiaoxia Zhou, Hailong Zhang, Jianquan Lou, Huasheng Zhao, Luli Gong
  • Patent number: 10170341
    Abstract: A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: January 1, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Li-Hui Cheng, Po-Hao Tsai
  • Patent number: 10152098
    Abstract: A foldable electronic device includes a upper housing, a lower housing, and at least one energy module which further included thermoelectric materials which may convert heat to electric power. The energy module may supply power to at least one of heat generating component in the portable electronic device. A heat remover composed of graphene may be in thermal contact with the at least one of the components. The heat remover may also disposed over a surface of the energy module and may be formed one or more heat conduction path depends on the position of the upper and lower housings.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: December 11, 2018
    Assignee: AZTRONG INC.
    Inventors: Kung Shiuh Huang, Kuan-Tsae Huang, June Wu
  • Patent number: 10115671
    Abstract: This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: October 30, 2018
    Assignee: SnapTrack, Inc.
    Inventors: Ravindra V. Shenoy, Kwan-Yu Lai, Philip Jason Stephanou, Mario Francisco Velez, Jonghae Kim, Evgeni Petrovich Gousev
  • Patent number: 10107269
    Abstract: An actuator includes a shape-memory alloy (SMA), a power supply that transmits electrical current, a heat source positioned proximate to the SMA, a heat sink positioned proximate to the SMA, and a control module. The control module causes the power supply to transmit the electrical current to the heat source in response to receiving a first signal, thereby causing the heat source to heat the SMA via induction heating. The control module also causes the power supply to cease transmitting the electrical current to the heat source in response to receiving a second signal, thereby causing the heat source to stop heating the SMA. The control module also causes the power supply to transmit the electrical current to the heat sink in response to receiving the second signal, thereby causing the heat sink to cool the SMA via magneto-thermal convection cooling.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: October 23, 2018
    Assignee: THE BOEING COMPANY
    Inventor: Moushumi Shome
  • Patent number: 10104809
    Abstract: A system for managing heat transfer is provided by the present disclosure, which in one form includes a cavity having an inner wall portion, at least one heat-generating component disposed within the cavity, and a plurality of heat conducting members disposed adjacent one another. Each heat conducting member includes a resilient core and an outer shell wrapped around at least a portion of the resilient core. The outer shell is made of a material having a relatively high thermal conductivity, and the plurality of heat conducting members are positioned between the heat-generating component and the inner wall portion of the cavity.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: October 16, 2018
    Assignee: AeroVironment Inc.
    Inventors: Uchenna Ofoma, Bart Dean Hibbs
  • Patent number: 10104763
    Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: October 16, 2018
    Assignee: 3M Innovative Properties Company
    Inventors: Mihee Lee, Jung-Ju Suh
  • Patent number: 10098254
    Abstract: A method of manufacturing a semiconductor device, including preparing a heat-dissipating base, performing a first initial warping or a second initial warping of the heat-dissipating base, soldering a laminated substrate, including a circuit board provided on an insulating board, on the heat-dissipating base after the first or second initial warping, and soldering a semiconductor chip on the circuit board. The first initial warping includes performing shot peening on the rear surface of the heat-dissipating base to form a hardened layer, and subsequently plating the front and rear surfaces of the heat-dissipating base, including the hardened layer formed thereon, with a metal material. The second initial warping includes plating the front and rear surfaces of the heat-dissipating base with the metal material to form a plating layer, and subsequently performing the shot peening on the rear surface of the heat-dissipating base, including the plating layer formed thereon, with the metal material.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: October 9, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takeshi Yokoyama, Takashi Saito
  • Patent number: 10028412
    Abstract: In a configuration that a thermal grease is applied between a circuit board having an electronic component mounted thereon and a case body containing the board to thermally connect both by the thermal grease, the application has not been easy since the thermal grease is high in initial viscosity. A thermal grease is made of a material that has a viscosity not impeding applicability at the initial stage (before application), for example, a viscosity of about 50-400 (Pa·s), and that increases to about 600-3,000 (Pa·s) in viscosity after application.
    Type: Grant
    Filed: January 20, 2014
    Date of Patent: July 17, 2018
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Yoshiyasu Negishi, Yoshio Kawai, Takayuki Fukuzawa
  • Patent number: 9972605
    Abstract: A method for fabricating a fan-out wafer level package includes disposing a first semiconductor chip on a dummy substrate, forming a mold substrate on the first semiconductor chip and the dummy substrate, removing the dummy substrate to expose the first semiconductor chip, disposing a second semiconductor chip on the exposed first semiconductor chip, forming an insulating layer on the second semiconductor chip, the first semiconductor chip, and the mold substrate, and forming a plurality of redistribution lines that electrically connects the first semiconductor chip and the second semiconductor chip through the insulating layer.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: May 15, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Yonghwan Kwon
  • Patent number: 9954409
    Abstract: A power supply is provided. The power supply device includes a power module and a capacitor. The power module includes inverting circuitry and is configured to deliver electrical power to an electric machine. The capacitor is disposed adjacent to the power module and is arranged to limit voltage variation at the inverting circuitry input due to ripple current. The inverting circuitry and the capacitor are surrounded by a monolithic non-metal casing that provides voltage isolation between the power module and the capacitor.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 24, 2018
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Chingchi Chen, Michael W. Degner, Edward Chan-Jiun Jih
  • Patent number: 9943010
    Abstract: Air in a thermally insulated space, which has been expanded by heat resulting from heating treatment for curing a thermosetting potting material, is prevented from entering the potting material. A casing has a partition wall that partitions an opening into a heat-generating-electronic-component placement section, where a heat generating electronic component is placed, and an adjacent section that is adjacent to the heat-generating-electronic-component placement section, when a heat releasing member is fixed to the opening. The heat-generating-electronic-component placement section is filled with a thermosetting potting material for moisture prevention up to a height which allows at least the heat generating electronic component to be buried in the potting material. The adjacent section has in the casing a communicating portion that communicates with a position which is apart from the heat-generating-electronic-component placement section filled with the potting material.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: April 10, 2018
    Assignee: Calsonic Kansei Corporation
    Inventors: Yuuji Daimon, Norio Fujii, Hideki Sunaga, Haruo Suzuki, Yuuzou Shimamura
  • Patent number: 9942952
    Abstract: The present invention relates to graphene and, more particularly, to a method for manufacturing a graphene electromagnetic wave blocking plate capable of blocking electromagnetic waves by using graphene, and a microwave oven using same. The present invention includes: a step of forming a first graphene layer and a second graphene layer above and below a catalytic metal layer; a step of attaching a supporting substrate onto the second graphene layer; a step of forming a pattern on at least either one of the first graphene layer or the catalytic metal layer; and a step of removing the supporting substrate.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: April 10, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Mynghee Jung, Jinsan Moon
  • Patent number: 9917935
    Abstract: Disclosed is a housing for a portable handheld electronic device such as a cellphone. The device has a housing, having a left side and right side. The housing can be layered, such as in a sandwich configuration. The layers can be secured together via one or more fasteners that extend through at least front and rear plates of the housing.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: March 13, 2018
    Assignee: Houdinix LLC
    Inventors: Stephen G. Pizzo, Peter Jarred Land, James H. Jannard, Hector Ortega
  • Patent number: 9854664
    Abstract: An assembly for providing electromagnetic interference (EMI) shielding and for dissipating heat from electronic components. The assembly including: a metallic frame including a wall extending upwardly from a circuit board; an EMI shield having a top with holes and having sidewalls that surround the top, extend downwardly, and are attachable to the wall of the frame in a first latched position and in a second, un-latched position; a layer of thermally-conductive, viscous heat sink grease on the top of the EMI shield and filling holes in the top of the EMI shield, heat sink grease in the holes being in direct physical contact with the top surface of the at least one electronic component when the EMI shield is in the second, un-latched position; and a heat sink on top of and in direct physical contact with the heat sink grease on top of the EMI shield.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: December 26, 2017
    Assignee: Continental Automotive Systems, Inc.
    Inventor: Thomas Brey
  • Patent number: 9854718
    Abstract: The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: December 26, 2017
    Assignee: CLEAN WAVE TECHNOLOGIES, INC.
    Inventors: Rudolph Garriga, Michael Kubic
  • Patent number: 9850932
    Abstract: Methods and systems for attaching a device to a substrate for operation of the device under variable conditions includes attaching a device to a substrate, disposing a removable material over a first portion of the device, positioning a second portion of the device adjacent to the substrate, operably attaching a retainer to the substrate adjacent to the device with a part of the retainer disposed over the removable material, and removing the removable material to form a gap between the device and the retainer so that the device is retained on the substrate, and wherein the gap allows the device to move freely relative to the retainer and the substrate in response to changes in temperature.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: December 26, 2017
    Assignee: UNIVERSITY OF MAINE SYSTEM BOARD OF TRUSTEES
    Inventors: Scott Moulzolf, Alberto Canabal, Thomas Moonlight, Mauricio Pereira Da Cunha, George Harris
  • Patent number: 9838558
    Abstract: A digital video camera, including a heat management system, which includes at least one inlet and at least one outlet in the housing to enable air to flow through the housing. The heat management system also includes a first heat sink thermally connected to an image sensor(s), and a second heat sink thermally connected to a data processing unit(s), and a centrifugal fan. The centrifugal fan is configured to draw air into the front of the fan in an axial direction and push air radially out in a sideways direction, whereby air travels through the inlet(s) over the first heat sink and then over the second heat sink to the outlet(s).
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: December 5, 2017
    Assignee: Blackmagic Design Pty Ltd
    Inventors: Grant Petty, Simon Kidd, John Vanzella, Michael Cornish, Shannon Smith, Suan Heng Yeo, Nathan Lee
  • Patent number: 9828834
    Abstract: A method of controlling corrosion in a subsea pipeline is disclosed which includes supplying a low dose inhibitor stream (LDHI) comprised of a quaternary amine and drying with a desiccant.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: November 28, 2017
    Assignee: Multi-Chem Group, LLC
    Inventors: Danny Durham, James Russum, Nathan Davis, Curtis Conkle
  • Patent number: 9831163
    Abstract: A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated on a first surface of the core substrate such that the insulating resin layer is covering a first surface of the metal block in the cavity, and a second build-up layer including an insulating resin layer and laminated on a second surface of the core substrate such that the insulating resin layer is covering a second surface of the metal block in the cavity. The second build-up layer includes via conductors connected to the second surface of the metal block and common lands connecting the via conductors in parallel.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: November 28, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Yukinobu Mikado, Mitsuhiro Tomikawa, Koji Asano, Kotaro Takagi
  • Patent number: 9788410
    Abstract: In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A? and 95B? within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: October 10, 2017
    Assignee: TDK CORPORATION
    Inventors: Tomohiko Uchiyama, Yasuhiro Murai
  • Patent number: 9781820
    Abstract: A device includes: a substrate; a heat-generating component which is mounted on a first surface of the substrate; a heat sink which is thermally coupled with the heat-generating component; and a frame which is attached on the first surface of the substrate. The heat sink includes a first fin extending in a direction away from the first surface, and the frame includes a second fin which is arranged on the frame, and the second fin extends in a direction away from the first surface. The first fin extends higher than bottom side of the second fin toward top side of second fin.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 3, 2017
    Assignee: NEC CORPORATION
    Inventor: Yuki Matsumoto
  • Patent number: 9778710
    Abstract: Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: October 3, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Gyun Kim, Woong-Chan Kim, Chang-Youl Lee, Tae-Doo Choung
  • Patent number: 9756753
    Abstract: A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and a non-flat portion is provided to a region having a size greater than or equal to an outside diameter of a connector of an external connector line connected to the connector terminal in the casing portion.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: September 5, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Kosaku Arita
  • Patent number: 9756737
    Abstract: Radio frequency system (250) which includes a first and second sub-assembly (100, 200), each formed of a plurality of layers of conductive material (504, 508, 516) disposed on a substrate (102) and arranged in a stack. The stacked layers form signal processing components (108, 110) and at least one peripheral wall (104, 204) surrounding a walled area (118, 218) of each substrate. The second sub-assembly is positioned on the first sub-assembly with a first walled area of a first substrate aligned with a second walled area of a second substrate.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: September 5, 2017
    Assignee: Harris Corporation
    Inventor: John E. Rogers
  • Patent number: 9754869
    Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: September 5, 2017
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Alejandro Aldrin II Agcaoili Narag, Ravi Palaniswamy, Bee Leng Tan, Antonny Enojo Flor
  • Patent number: 9754857
    Abstract: A system for cooling a heat producing device is provided. The system can include an air mover (110) wherein at least a portion of the discharge airflow (115) is directed radially outward. The system can also include a thermal conduit (120) and a thermal member (130). The thermal member can have a first surface (135), a second surface (140) and at least one integrally formed heat exchange surface (150). At least a portion of the heat exchange surface (150) can be at least partially disposed in the air mover discharge airflow (115). At least a portion of the first surface (135) can be disposed proximate the thermal conduit (120). At least a portion of the second surface (140) can be disposed proximate the air mover (110).
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: September 5, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark S Tracy, Earl W Moore
  • Patent number: 9735113
    Abstract: A semiconductor device has a first semiconductor die stacked over a second semiconductor die which is mounted to a temporary carrier. A plurality of bumps is formed over an active surface of the first semiconductor die around a perimeter of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. A plurality of conductive vias is formed through the encapsulant around the first and second semiconductor die. A portion of the encapsulant and a portion of a back surface of the first and second semiconductor die is removed. An interconnect structure is formed over the encapsulant and the back surface of the first or second semiconductor die. The interconnect structure is electrically connected to the conductive vias. The carrier is removed. A heat sink or shielding layer can be formed over the encapsulant and first semiconductor die.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: August 15, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: HeeJo Chi, NamJu Cho, JunWoo Myung
  • Patent number: 9735087
    Abstract: Disclosed herein are a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: August 15, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Sen Chang, Tsung-Hsien Chiang, Yen-Chang Hu, Ching-Wen Hsiao
  • Patent number: 9723741
    Abstract: A housing arrangement of a power electronics device includes one power module or several identical power modules, each module with at least one part connected to a hazardous voltage, the arrangement further including a housing part having room for at least one power module. Each power module includes an enclosure part which essentially surrounds the power module and includes electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part. The power modules and the enclosure part of the power modules are arranged such that when the power module is installed to the housing part the power module is electrically insulated from the housing part and external connections of the power module are directed to the front side of the housing part.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: August 1, 2017
    Assignee: VACON OY
    Inventors: Devin Dilley, Marc Hoffman, Dan Isaksson
  • Patent number: 9716296
    Abstract: A lithium ion battery pack includes a plurality of prismatic lithium polymer cells and one or more graphite heat spreaders. Each spreader has at least two major surfaces and is made of one of a sheet of a compressed mass of exfoliated graphite particles, a graphitized polyimide sheet, or combinations thereof.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: July 25, 2017
    Assignee: Advanced Energy Technologies LLC
    Inventors: Ryan J. Wayne, Jonathan Andrew Taylor, Julian Norley, Bradley E. Reis, Mark Pollock, Ian Andrew McCallum, Thomas W. Weber, Robert A. Reynolds, III, Martin David Smalc, Elliot G. Fishman
  • Patent number: 9712903
    Abstract: A microphone holder holds a microphone in which an upper surface and a lower surface of a step portion are formed on an outer surface of a housing, and the microphone holder includes: a holder which is formed in a cylindrical shape having openings on upper and lower sides and in which a plurality of through passages penetrating a wall of the cylindrical shaped body is provided; a sliding portion provided movably in a circumferential direction along the openings of the holder; a lock ring configured to cover the through passage formed to the holder, from an outer side by a lock plate extending from the sliding portion; and a contact member which is movably held in the through passage and can contact on an upper surface side of the step portion of the microphone.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: July 18, 2017
    Assignee: KABUSHIKI KAISHA AUDIO-TECHNICA
    Inventor: Tatsuya Ikeda
  • Patent number: 9691673
    Abstract: There is provided a power module semiconductor device allowing reduction in size and weight of a thin type SiC power module. The power module semiconductor device includes: a ceramic substrate; a first pattern of a first copper plate layer disposed on a surface of the ceramic substrate; a first semiconductor chip disposed on the first pattern; a first pillar connection electrode disposed on the first pattern; and an output terminal connected to the first pillar connection electrode.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: June 27, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Hirotaka Otake, Toshio Hanada
  • Patent number: 9647535
    Abstract: A power-supply apparatus is provided which includes a transformer, a primary semiconductor unit, a secondary semiconductor unit, and a secondary electronic device. Each of the primary semiconductor unit and the secondary semiconductor units has a plurality of semiconductor devices installed therein. The transformer, the primary semiconductor unit, the secondary semiconductor unit, and the secondary electronic device are electrically joined through connecting conductors. The transformer is laid on the primary semiconductor unit to make a first stack. Similarly, the secondary electronic device is laid on the secondary semiconductor unit. This permits the power-supply apparatus to be reduced in overall size thereof and minimizes adverse effects of electromagnetic noise to ensure the high efficiency in power supply operation.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: May 9, 2017
    Assignee: DENSO CORPORATION
    Inventors: Yuuichi Handa, Katsutoyo Misawa, Yuuki Takemoto, Shotaro Yamasaki, Shuji Kurauchi
  • Patent number: 9606588
    Abstract: A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: March 28, 2017
    Assignee: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, David R. Collins, Timothy Scott McCann, Perry D. Franz, Jeffrey M. Glanzman