Thermal Conduction Patents (Class 361/704)
  • Patent number: 11506458
    Abstract: An enclosed heat sink with a side wall structure is provided. The side wall structure includes a welding body having a first welding plane and a side wall structure having a second welding plane. The first welding plane and the second welding plane are pressured and welded to each other, such that the welding body and the side wall structure encapsulate a cavity. A width of the second welding plane is smaller than a width between two side surfaces of the side wall structure.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: November 22, 2022
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Reui-Jen Yang, Tze-Yang Yeh
  • Patent number: 11493709
    Abstract: Aspects described herein include an apparatus comprising a receptacle comprising a cage dimensioned to receive a pluggable optical module into an interior volume, An opening is defined in an exterior surface of the cage. The apparatus further comprises a heat sink assembly rigidly attached to the cage. The heat sink assembly comprises a thermal interface material extending through the opening into the interior volume. The thermal interface material is configured to compress when the pluggable optical module is received into the interior volume and contacts the thermal interface material.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: November 8, 2022
    Assignee: Cisco Technology, Inc.
    Inventors: Yao Tsan Tsai, Yong Guo Chen, Hua Yang
  • Patent number: 11469215
    Abstract: A chip package structure is provided. The chip package structure includes a wiring structure. The chip package structure includes a first chip structure over the wiring structure. The chip package structure includes a first molding layer surrounding the first chip structure. The chip package structure includes a second chip structure over the first chip structure and the first molding layer. The chip package structure includes a second molding layer surrounding the second chip structure and over the first chip structure and the first molding layer. The chip package structure includes a third chip structure over the second chip structure and the second molding layer. The chip package structure includes a third molding layer surrounding the third chip structure and over the second chip structure and the second molding layer. The chip package structure includes a fourth molding layer surrounding the second molding layer and the third molding layer.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: October 11, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Yu Chen, An-Jhih Su
  • Patent number: 11443998
    Abstract: An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: September 13, 2022
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: Christopher William Blackburn, Jeffery Walter Mason, Nathan Lincoln Tracy, Clarence Leon Yu, Michael David Herring
  • Patent number: 11437362
    Abstract: A multi-cavity package includes a single metal flange having first and second opposing main surfaces. The multi-cavity package also includes a circuit board attached to the first main surface of the single metal flange. The circuit board includes a first surface facing the single metal flange, and a second surface facing away from the first surface. The circuit board also includes a plurality of openings exposing different regions of the first main surface of the single metal flange. The circuit board also includes a lateral extension that overhangs the single metal flange. A corresponding method of manufacturing is also provided.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 6, 2022
    Assignee: Wolfspeed, Inc.
    Inventors: Saurabh Goel, Alexander Komposch, Cynthia Blair, Cristian Gozzi
  • Patent number: 11429163
    Abstract: A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: August 30, 2022
    Assignee: Western Digital Technologies, Inc.
    Inventors: Shaomin Xiong, Hussam Zebian, Haoyu Wu, Toshiki Hirano, Jeff Wilke, Timothy Skarzynski
  • Patent number: 11419248
    Abstract: The present invention provides a display module and a display device. By disposing a second heat dissipation layer between a first heat dissipation layer and a first substrate, and connecting the first heat dissipation layer with the second heat dissipation layer, heat in a driving chip is transmitted to the second heat dissipation layer and then directly transmitted to the first heat dissipation layer, thereby the display module allows the heat to be quickly distributed throughout the panel and reducing the temperature in the areas corresponding to the driving chip. Therefore, the present invention solves the technical problem that areas corresponding to driving chips have higher temperature when current display modules are in operation.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 16, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Chihshun Tang
  • Patent number: 11411344
    Abstract: The electronic device unit includes: a control target device; and an electronic control device, the control target device including: a control target housing; a control target component; and an inner connector, the electronic control device including: an electronic circuit including a circuit board and an electronic control component; and a first connector, which is electrically connected to the electronic control component. The control target housing has formed therein an opening, which allows the electronic control device to be placed in and taken out of the control target housing. When the first connector is connected to the inner connector, the electronic control device is located inside the control target housing.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 9, 2022
    Assignees: Mitsubishi Electric Corporation, NIPPON TANSHI CO., LTD.
    Inventors: Fumiaki Arimai, Hiroyoshi Nishizaki, Shinya Enomoto, Osamu Nishimura, Masaru Fujino
  • Patent number: 11406042
    Abstract: Electronic module for the mounting of electronic components comprising a housing that is bounded in a longitudinal direction by two end faces, each with an opening. The housing can be fitted via the openings with at least one first circuit board, equipped with electronic components, and with at least one second circuit board, equipped with plug and/or clamp connectors. On an inner side of one housing wall, the housing comprises at least one dome, configured in a longitudinal direction, on which the at least one first circuit board can be attached essentially transversely to the longitudinal direction. At two opposite-facing inner sides and/or two opposite-facing domes, the housing furthermore comprises a retaining groove in which to insert at least one second circuit board in a longitudinal direction.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: August 2, 2022
    Assignee: SINN Power GmbH
    Inventors: Philipp Sinn, Dominik Schwaiger
  • Patent number: 11372043
    Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: June 28, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Xiaopeng Qu, Amy R. Griffin, Wesley J. Orme
  • Patent number: 11375320
    Abstract: A thermoacoustic device includes a stage coupled to a bar, wherein the stage includes a first heating component on a first terminus of the stage. The stage further includes a first cooling component on a second terminus of the stage. A thermal conductivity of the stage is higher than a thermal conductivity of the bar. A heat capacity of the stage is higher than a heat capacity of the bar.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 28, 2022
    Assignees: Purdue Research Foundation, Notre Dame Du Lac
    Inventors: Fabio Semperlotti, Haitian Hao, Carlo Scalo, Mihir Sen
  • Patent number: 11375645
    Abstract: A power module of the present invention includes a power device for converting and outputting a frequency of an input power source, and a housing accommodating the power device therein and forming flow paths for a cooling fluid on both sides of the power device such that the cooling fluid can contact both sides of the power device. Accordingly, both plate surfaces of the power device can be in direct contact with the cooling fluid so as to be quickly cooled.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 28, 2022
    Assignee: LG Electronics Inc.
    Inventors: Namjoon Cho, Taejin Kim, Gilsu Lee
  • Patent number: 11348877
    Abstract: The proposed design concerns RF shielding can that has the benefits of an RF can, but without compromising the thermal design of the system.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: May 31, 2022
    Assignee: Starry, Inc.
    Inventors: Ana Lo, Andrew Baisch
  • Patent number: 11342734
    Abstract: A circuit assembly includes: a substrate formed with a ground pattern and a through-hole; a metal member that is inserted into the through-hole and electrically connected to the ground pattern; a heat dissipation member made of metal, that is overlaid on the substrate and can be connected to an external ground potential; and conductive paste that connects the metal member and the heat dissipation member.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: May 24, 2022
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shun Takamizawa, Koki Uchida
  • Patent number: 11337344
    Abstract: A shielding member includes a frame body and an outer cover. Two sides of a first end of the frame body respectively include a first shaft portion. Two sides of the frame body respectively include a first side plate. The frame body is covered by the outer cover. Two sides of a first end of the outer cover respectively include a second shaft portion, and each of the second shaft portions is pivotally connected to the corresponding first shaft portion. Two sides of the outer cover respectively include a second side plate, and each of the second side plates covers an outer side of the corresponding first side plate. Accordingly, the frame body and the outer cover are assembled to form a one-piece metallic shielding member. The structure of the shielding member is simple, the manufacturing for the shielding member is easy, and the cost for manufacturing the shielding member is reduced.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: May 17, 2022
    Assignee: Advanced-Connectek Inc.
    Inventors: Wen-Yu Wang, Ming-Yung Chang, Tzu-Hao Li, Yu-Xuan Tung
  • Patent number: 11330738
    Abstract: An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 10, 2022
    Assignee: XILINX, INC.
    Inventors: Gamal Refai-Ahmed, Chi-Yi Chao, Huayan Wang, Suresh Ramalingam, Volker Aue
  • Patent number: 11300432
    Abstract: This disclosure provides a thermal-dispersion type thermal mass flowmeter having a sleeve and a measuring module. Two ends of the sleeve are respectively a fixed end and a measuring end. The measuring module is accommodated in the sleeve. The measuring module has a bracket. A heater, a first temperature sensor, and a second temperature sensor are arranged on the bracket. The first temperature sensor is thermally connected to an internal surface of the sleeve, the second temperature sensor and the heater are thermally connected to the measuring end, and the second temperature sensor and the heater are arranged on the central axis of the sleeve.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: April 12, 2022
    Assignee: FINETEK CO., LTD.
    Inventors: Yao-Hao Yang, Hsin-Hung Lin, Jia-Hao Kang
  • Patent number: 11304343
    Abstract: A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface mounted in thermal communication with a heat source. The lower block having an inclined upper surface configured to be in thermal communication with a block directly above, having a complemental inclined surface. These blocks are elastically coupled. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block, and to a cold plate cooling source. The cold plate also has internal fins and flowing liquid for heat dispersion.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: April 12, 2022
    Inventors: Nan Chen, He Zhao, Yunshui Chen
  • Patent number: 11304338
    Abstract: A system, method, and apparatus for a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface that is configured to be engaged in thermal communication with a heat source. The lower block also having an inclined upper surface, that is configured to be in thermal communication with a block directly above, having a complemental inclined surface, wherein the blocks are elastically coupled with elastic components. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block and to a cooling source.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: April 12, 2022
    Inventors: Nan Chen, He Zhao, Yunshui Chen
  • Patent number: 11296009
    Abstract: A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Rolf Laido, Divya Swamy Bandaru, Thomas Boyd, Jorge Contreras Perez, Shelby A. Ferguson, Mustafa Haswarey
  • Patent number: 11282640
    Abstract: A DC link capacitor cooling system having an integrated heat sink disposed across a bottom surface of a DC link capacitor with a dielectric thermal interface material covering the integrated heat sink, and a chassis contacting the dielectric thermal interface material, wherein the chassis has an active fluid coolant domain therein.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: March 22, 2022
    Assignee: KARMA AUTOMOTIVE LLC
    Inventors: Khanh Nguyen, Geng Niu
  • Patent number: 11272625
    Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: March 8, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
  • Patent number: 11262817
    Abstract: Disclosed is a direct cooling-type display device having a double-sided display, the display device being configured to implement efficient heat radiation and comprising: a first display; a second display provided such that the back surface thereof faces the back surface of the first display; a housing for mounting the first display; an inlet port formed in the housing so as to form a path along which external air flows in; a first discharge port formed in a first area in which the first display is provided; a second discharge port formed in a second area in which the second display is provided; a first temperature measurement portion for measuring the temperature in the second area; a first outlet fan for discharging air in the first are through the first discharge port; a second outlet fan for discharging air in the second area through the second discharge port; a first backflow prevention portion provided in the first discharge port so as to prevent air from flowing from outside the housing into the same t
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: March 1, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Injae Chin
  • Patent number: 11259445
    Abstract: An electronic component module assembly includes a printed wiring board, and a stiffener assembly affixed to a first side of the printed wiring board. The stiffener assembly includes an outer stiffener secured to the printed wiring board, an inner stiffener removably located in an opening of the outer stiffener. The inner stiffener has one or more inner stiffener pockets formed therein, and one or more electronic components are installed in one or more inner stiffener pockets, and electrically connected to the printed wiring board.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: February 22, 2022
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventor: Hebri Vijayendra Nayak
  • Patent number: 11255613
    Abstract: The present technology provides a non-cylindrical structure for transporting media, including gases, liquids, solids, or energy comprising a layer of thermal pyrolytic graphite (TPG) surrounded by an outer layer and an inner layer comprising a metal, a ceramic, a glass, or a plastic. In particular, the present technology relates to a non-cylindrical tube or a pipe having an inner layer, an outer layer, and a layer of TPG between the inner layer and the outer layer wherein the TPG layer is configured to manage the direction of heat conduction.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: February 22, 2022
    Assignee: Momentive Performance Materials Quartz, Inc.
    Inventors: Wei Fan, Creighton Tomek, Gregory Shaffer
  • Patent number: 11257742
    Abstract: A wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are stacked on and contact one another. The conductive through via extends through the dam portions.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: February 22, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Syu-Tang Liu, Tsung-Tang Tsai
  • Patent number: 11243032
    Abstract: Heat sink devices that use a phase change material (PCM) as a heat sink material, and methods of using such devices in thermal management applications. Such a heat sink device includes a base wall, a top wall spaced apart from the base wall, and an internal structure in intimate thermal and physical contact with the base wall and the top wall. The internal structure includes multiple compartments defined and separated by fins that extend between the base and top walls. At least one PCM is within the compartments and the fins serve as thermal enhancement structures to augment the surface area to volume ratio of the heat sink device.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: February 8, 2022
    Assignee: Purdue Research Foundation
    Inventors: Collier Stephen Miers, Amy Marie Marconnet
  • Patent number: 11240906
    Abstract: A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: February 1, 2022
    Assignee: ADVANTECH CO., LTD.
    Inventors: Yu-Chin Liu, Wen-Yuan Yi
  • Patent number: 11233000
    Abstract: A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: January 25, 2022
    Assignee: MagnaChip Semiconductor, Ltd.
    Inventors: Jae Sik Choi, Do Young Kim, Jin Won Jeong, Hye Ji Lee
  • Patent number: 11232994
    Abstract: A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: January 25, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Nobutake Tsuyuno, Hiromi Shimazu, Akihiro Namba, Akira Matsushita, Hiroshi Houzouji, Atsuo Nishihara, Toshiaki Ishii, Takashi Hirao
  • Patent number: 11217459
    Abstract: The present invention relates to a package-before-etch three-dimensional package structure electrically connected by plated copper pillars and a process thereof. The process comprises the following steps: taking a metal carrier; preplating a surface of the metal carrier with a copper layer; forming an outer metal pin by means of electroplating; performing plastic packaging with epoxy resin; forming a metal circuit layer by means of electroplating; forming a conductive metal pillar by means of electroplating; surface-mounting a chip; performing plastic packaging; surface-mounting a passive device; performing plastic packaging; etching and windowing the carrier; forming an anti-oxidant metal layer by means of electroplating; and performing cutting to obtain a finished product. The integration level and the reliability can be improved.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: January 4, 2022
    Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Haishen Kong, Yubin Lin, Jinxin Shen, Xinfu Liang, Qingyun Zhou
  • Patent number: 11205637
    Abstract: A semiconductor package may include a first semiconductor chip on and electrically connected to a wiring substrate, an intermediate layer on the first semiconductor chip and covering an entire surface of the first semiconductor chip, a second semiconductor chip on the intermediate layer and electrically connected to the wiring substrate, a mold layer on the wiring substrate and covering the first semiconductor chip and the second semiconductor chip, the mold layer including one or more inner surfaces defining a mold via hole that exposes a portion of a surface of the intermediate layer, an electromagnetic shielding layer on the one or more inner surfaces of the mold layer and further on one or more outer surfaces of the mold layer, and a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: December 21, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Won-keun Kim, Kyung-suk Oh, Ji-han Ko, Kil-soo Kim, Yeong-seok Kim, Joung-phil Lee, Hwa-il Jin, Su-jung Hyung
  • Patent number: 11183487
    Abstract: A packaged semiconductor device including an integrated passive device-containing package component disposed between a power module and an integrated circuit-containing package and a method of forming the same are disclosed. In an embodiment, a device includes a first package component including a first integrated circuit die; a first encapsulant at least partially surrounding the first integrated circuit die; and a redistribution structure on the first encapsulant and coupled to the first integrated circuit die; a second package component bonded to the first package component, the second package component including an integrated passive device; and a second encapsulant at least partially surrounding the integrated passive device; and a power module attached to the first package component through the second package component.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: November 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Hui Lai, Shu-Rong Chun, Kuo-Lung Pan, Tin Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu, Yu-Chia Lai
  • Patent number: 11158890
    Abstract: A battery pack for an electric vehicle or a hybrid vehicle may include a housing, a stack of battery cells disposed within the housing, and a cooling subassembly. The housing typically holds the cell stack together, and the cooling subassembly typically cools the cell stack to prevent damage to the battery cells and to maintain the performance of the battery cells. The cooling subassembly may include a cold plate defining a liquid flow channel and one or more thermoelectric devices (TEDs) that are operable to cool the cell stack when current is supplied thereto. Heat spreaders may be employed within the battery pack, and exemplary configurations of components to thermally and mechanically couple the cooling subassembly are described.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: October 26, 2021
    Assignee: Hyliion Inc.
    Inventors: David Scott Thomas, Alex Ho Yang, Timothy Hughes
  • Patent number: 11145568
    Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Jaejin Lee, Hao-Han Hsu
  • Patent number: 11140793
    Abstract: Electronic module comprising a protective casing defining an internal volume and an electronic board placed in the internal volume, the electronic module comprising: means, for detecting a predetermined environmental condition of the internal volume, means for generating a cool zone inside the internal volume, which means are arranged such that the cool zone is separated from the electronic board; a control unit that is linked to the means for detecting an environmental condition and to the means for generating a cool zone and arranged to trigger the means for generating a cool zone when the means for detecting a predetermined environmental condition in the internal volume detect an environmental condition that is liable to result in the moisture in the air contained in the internal volume condensing on the electronic board.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: October 5, 2021
    Assignees: SAFRAN ELECTRONICS & DEFENSE, SAFRAN ELECTRICAL & POWER
    Inventors: Fran├žois Guillot, Jean-Marc Blineau, Philippe Avignon, Serge Roques, Franck Albero
  • Patent number: 11107962
    Abstract: A heat sink and power interconnect for a UV LED array are provided. A first circuit is disposed on a surface of a first substrate. A UV LED array is positioned thereon. A second substrate and second circuit are spaced apart from the first substrate and a first heat sink is positioned adjacent thereto. An aperture passes through each of the first substrate, the second substrate, and the heat sink. An electrical insulator lines the aperture with an electrically and thermally conductive liner positioned adjacent to the electrical insulator. A fastener is positioned in the aperture and electrically interconnects the first circuit and the second circuit through the electrically and thermally conductive liner and electrically communicates with an external power supply. The fastener carries one or more of a power or an electrical signal, and dissipates heat through the electrically and thermally conductive liner to the heat sink.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 31, 2021
    Assignee: Soulnano Limited
    Inventors: Hung Hsin Hsieh, Cho Hang Wong
  • Patent number: 11108180
    Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: August 31, 2021
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine
  • Patent number: 11089142
    Abstract: The present disclosure discloses a process of processing a middle frame of a mobile phone, which includes: providing at least two metal components, each of the metal components defining a riveting groove; providing a metal middle plate having a riveting projection at edges thereof; correspondingly mounting each of the metal components on the edges of the metal middle plate to form a border frame surrounding the metal middle plate, respectively; the riveting projection being received in the riveting groove of the metal component, the riveting projection being in clearance fit with the riveting groove; and applying a force to the border frame to deform at least one of the riveting groove and the riveting projection, such that the riveting projection is latched in the riveting groove, and the border frame and the metal middle plate are connected to form the middle frame of the mobile phone.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: August 10, 2021
    Assignee: GUANGDONG EVERWIN PRECISION TECHNOLOGY CO., LTD.
    Inventors: Xiangsheng Ren, Lidong Wang
  • Patent number: 11086081
    Abstract: The present disclosure relates to conductive cooling of a small form-factor pluggable (SFP) transceiver. For example, an SFP transceiver assembly may include a cooling block and a thermally conductive pad having a thermally conductive material. The SFP transceiver assembly may include a spring finger that contacts the thermally conductive pad while the SFP transceiver is inserted into the SFP transceiver assembly to allow heat to be conducted from the SFP transceiver to the cooling block via the thermally conductive pad to conductively cool the SFP transceiver.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: August 10, 2021
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventor: Steven Watts
  • Patent number: 11075142
    Abstract: A cooling apparatus for a power semiconductor includes a cooler having a cooling path so that a cooling medium flows therein, and an auxiliary cooling plate of a multi-layered structure joined to a surface of the cooler with which the power semiconductor comes into contact. A method of manufacturing the cooling apparatus includes providing an auxiliary cooling plate of a multi-layered structure, providing a cooler having a cooling path so that a cooling medium flows therein, and joining the auxiliary cooling plate to a surface of the cooler with which the power semiconductor comes into contact, wherein the providing a cooler and the joining the auxiliary cooling plate are performed together in the same brazing process, so that a manufacture of the cooler and the joining the auxiliary cooling plate are simultaneously performed.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 27, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Seok-Jun Kim
  • Patent number: 10986745
    Abstract: An insulated housing, in a cylindrical structure, includes an inner metal layer, an insulating layer and an outer metal coating. The insulating layer is positioned between the inner metal layer and the outer metal coating. In any end of the cylindrical structure, both a distance from the end of the inner metal layer to the end of the cylindrical structure and a distance from the end of the outer metal coating to the end of the cylindrical structure are not equal to zero, and the distance from the end of the inner metal layer to the end of the cylindrical structure is larger than the distance from an end of the outer metal coating to the end of the cylindrical structure. The inner metal layer is composed of one first metal cylinder and two second metal cylinders respectively disposed on the both ends of the first metal cylinder.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 20, 2021
    Assignee: Delta Electronics, Inc.
    Inventors: Wei Zhou, Yicong Xie, Weiqiang Zhang
  • Patent number: 10983293
    Abstract: Hot-pluggable optical modules for high-density optical signaling are provided. The modules comprise a dual-purpose heat spreader configured to function as a thermal component and including trenches accommodating optical infrastructure. The dual-purpose heat spreader includes a trench for routing optical fibers to and from a plurality of optical connectors, each disposed on a branch of the fiber harness assembly and configured to mate with a socket on a module board through an opening in the dual-purpose heat spreader.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: April 20, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Everett R. Salinas, Wade D. Vinson
  • Patent number: 10973145
    Abstract: The present invention relates to a fixing apparatus for fixing one or more printed circuit boards to a housing wall having a frame part that comprises at least one locking means for fixing the frame part to the housing wall and at least one wedge body displaceably supported within the frame part, wherein the wedge body is displaceable into a position relative to the frame part in which a compressive force applied to the frame part by the wedge body deforms the outer frame wall at least regionally outwardly.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: April 6, 2021
    Assignee: Liebherr-Elektronik GmbH
    Inventor: Hubert Grau
  • Patent number: 10971428
    Abstract: A semiconductor baseplate is disclosed. Specific implementations of a baseplate may include a planar portion including a plurality of recesses therein, the planar portion may be made of a first material, and a plurality of pegs where each peg of the plurality of pegs may be configured to fit within each recess of the plurality of recesses, the plurality of pegs may be made of a second material, where the first material and the second material may be bonded together.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 6, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Atapol Prajuckamol, Francis J. Carney, Chee Hiong Chew, Yushuang Yao
  • Patent number: 10881025
    Abstract: An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 ?m to 50 ?m, each second thermal conductive member has a maximum width ranged from 0 ?m to 5 ?m, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm3 and 1.0 g/cm3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: December 29, 2020
    Assignee: CTRON ADVANCED MATERIAL CO., LTD.
    Inventors: Yi-Hau Shiau, Ming-Hsiang He
  • Patent number: 10879209
    Abstract: Encapsulated stress mitigation layers and assemblies having the same are disclosed. An assembly that includes a first substrate, a second substrate, an encapsulating layer disposed between the first and second substrates, and a stress mitigation layer disposed in the encapsulating layer such that the stress mitigation layer is encapsulated within the encapsulating layer. The stress mitigation layer has a lower melting temperature relative to a higher melting temperature of the encapsulating layer. The assembly includes an intermetallic compound layer disposed between the first substrate and the encapsulating layer such that the encapsulating layer is separated from the first substrate by the intermetallic compound layer. The stress mitigation layer melts into a liquid when the assembly operates at a temperature above the low melting temperature of the stress mitigation layer and the encapsulating layer maintains the liquid of the stress mitigation layer within the assembly.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: December 29, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Naoya Take
  • Patent number: 10855027
    Abstract: A card-type storage device and a slot device, which are capable of preventing lowering of the reliability due to repeated insertion and removal of the storage device. A card medium includes card thermal contacts each having a contact surface which intersects with a thickness direction of the card medium. A first card upper guide surface restricts the position of the card medium in the thickness direction to a first position. An escape portion restricts the position of the card medium in the thickness direction to a different position from the first position. A second card upper guide surface links the first card upper guide surface and the escape portion.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 1, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masafumi Kimura, Fumihiro Kajimura, Go Naito, Kyosuke Sato
  • Patent number: 10796925
    Abstract: Disclosed herein is a ceramic circuit substrate for a power module obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively. Also disclosed herein are methods for manufacturing a ceramic circuit substrate for a power module.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 6, 2020
    Assignee: Denka Company Limited
    Inventors: Akimasa Yuasa, Kouji Nishimura
  • Patent number: 10770333
    Abstract: Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a plurality of pads on the first side of the substrate; and applying die attach material to the plurality of pads. The method may include bonding a wafer including a plurality of semiconductor die to the substrate at one or more die pads included in each die. The method may also include singulating the plurality of semiconductor die, overmolding the plurality of semiconductor die and the first side of the substrate with an overmold material, and removing the substrate to expose the plurality of pads and to form a plurality of semiconductor packages coupled together through the overmold material. The method also may include singulating the plurality of semiconductor packages to separate them.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: September 8, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Darrell D. Truhitte, James P. Letterman, Jr.