Light emitting device
A light emitting device including a housing, a light emitting unit, and a heatsink is provided. The housing has a projection end and a heat dissipation end, and a first opening and a second opening are respectively formed in the projection end and the heat dissipation end. The light emitting unit is disposed inside the housing, and is corresponding to the heat dissipation end, for projecting a light toward the projection end and through the first opening. The heatsink is fixed to the heat dissipation end of the housing, and in contact with one side of the light emitting unit that faces the second opening, for dissipating the heat generated by the light emitting unit to the outside air.
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1. Field of Invention
The present invention relates to a light emitting device, and more particularly, to a light emitting device with heat dissipation ability.
2. Related Art
Light fixtures seen in daily life, such as traffic lights, lamps, displays of electronic devices, are all assembled with a light emitting element unit to serve as a light source. However, after a light tube or light bulb generally employed is used for a long time, the illumination performance thereof is decayed due to heat generated, thus reducing the life-span of the tube of bulb, so the tube or bulb has to be replaced frequently.
Along with the development in optoelectronics, light emitting diodes (LEDs), which have characteristics of small volume, rapid response, long life-span, and low power consumption, have gradually replaced the conventional light emitting units such as the bulbs, and become the most important light emitting units used widely.
However, a high power LED means the rapid heat generation, and as the LED has a very small volume, the heat flux on the surface of the LED increased significantly. If the heat generated is not removed in time, the illumination performance of the LED may decay greatly, or the LED may burn out due to over-temperature. In the prior art, a heat dissipation method for the LED is to use a metal housing for the LED being disposed therein and conducting heat generated by the LED to the outside air. As the heat transfer between the housing and LED is carried out through thermal conduction, and as the contact area between the housing and the LED is rather small due to small volume of the LED, the heat transfer rate of thermal conduction is limited, this cannot meet the requirements of high-power LED.
To effectively dissipate the heat generated by the LEDs, various types of heat dissipation devices, such as fans, heatsinks, heat spreaders are used to dissipate the heat generated. ROC Patent No. M278217 discloses a “Heat Dissipation Structure of LED Projection Lamp”, in which the LED is disposed on a third heat dissipation body, and the third heat dissipation body is sandwiched between a first heat dissipation body and a second heat dissipation body. The first and second heat dissipation bodies are bonded together by bolts, thus fixing the LED between the first and second heat dissipation bodies. Heat generated by the LED is directly conducted to the third heat dissipation body, and then conducted to the first and second heat dissipation bodies to be dissipated to the outside air. However, the structure of ROC Patent No. M278217 is composed of a plurality of heat dissipation bodies, resulting in a light emitting device having a too large volume and requiring increased manufacturing cost.
SUMMARY OF THE INVENTIONAn object of the present invention is to provides a light emitting device to solve the problems in the prior art that the heat dissipation of the illumination device is limited, and a heat dissipation structure with large volume and high manufacturing cost is required.
According to the present invention, a light emitting device is provided, which includes a housing, a light emitting unit, and a heatsink. The housing has a projection end and a heat dissipation end opposite to each other. A first opening and a second opening are respectively formed in the projection end and the heat dissipation end. The light emitting unit is disposed inside the housing corresponding to the heat dissipation end, for projecting a light toward the projection end and through the first opening. The heatsink is fixed to the heat dissipation end of the housing, and in contact with one side of the light emitting unit that faces the second opening, for dissipating the heat generated by the light emitting unit to the outside air.
The advantage of the present invention is that, the heatsink is fixed to the housing to be directly in contact with the light emitting unit inside the housing through the opening without additional heat transfer elements; such that the volume of the light emitting device is reduced while high heat dissipation rate is achieved without the need for multiple heatsinks.
Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
The present invention will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the present invention, and wherein:
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The material of the fins 142 and the bottom plate 141 of the embodiments of the present invention includes, but is not limited to, metal materials with a high thermal conductivity coefficient, such as aluminum, aluminum alloy, copper, or copper alloy, so as to rapidly conduct and dissipate the heat generated by the light emitting unit 130.
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Moreover, the light emitting element 132 includes, but is not limited to, light emitting elements such as an LED or a light bulb. The present invention uses an LED for detailed illustration of the drawings, but is not limited to using the LED.
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Compared with light emitting devices in the prior art, the light emitting device of the present invention needs only one heatsink, which is firmly fixed at an opening of the housing of the light emitting device through various fixing methods, and is in contact with the light emitting unit, so as to dissipate the high heat generated by the light emitting unit, and reduce the overall volume of the light emitting device, thus achieving the purpose of miniaturization.
The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Claims
1. A light emitting device, comprising:
- a housing, having a projection end and a heat dissipation end, wherein a first opening is formed in the projection end, and a second opening is formed in the heat dissipation end;
- a light emitting unit, disposed inside the housing corresponding to the heat dissipation end, for projecting a light toward the projection end and through the first opening; and
- a heatsink, fixed to the heat dissipation end and in contact with one side of the light emitting unit, for dissipating heat generated by the light emitting unit.
2. The light emitting device as claimed in claim 1, further comprising a lens assembly, fixed to the projection end to cover the first opening, for refracting the light of the light emitting unit.
3. The light emitting device as claimed in claim 1, wherein the housing has a flange, protruding from an inner circumferential surface of the housing, and located corresponding to the heat dissipation end of the housing, for supporting the light emitting unit.
4. The light emitting device as claimed in claim 1, wherein the light emitting unit further includes a circuit board disposed inside the housing and corresponding to the heat dissipation end of the housing, and at least one light emitting element, disposed on the circuit board, for projecting the light toward the first opening, wherein the heatsink contacts one side of the circuit board that faces the second opening.
5. The light emitting device as claimed in claim 1, wherein the heatsink comprises a bottom plate fixed to the heat dissipation end of the housing and in contact with the light emitting unit, and a set of fins disposed on one side of the bottom plate that faces outward of the housing and located outside the housing.
6. The light emitting device as claimed in claim 5, further comprising a latching member, pressed against the fins of the heatsink and latched to the housing, for fixing the heatsink to the heat dissipation end of the housing.
7. The light emitting device as claimed in claim 6, wherein the latching member has at least one latching hole, and the housing has at least one bump formed thereon for being inserted into the latching hole, such that the latching member is latched to the housing.
8. The light emitting device as claimed in claim 5, further comprising a latching member, pressed against the bottom plate of the heatsink and latched to the housing, for fixing the heatsink to the heat dissipation end of the housing.
9. The light emitting device as claimed in claim 8, wherein the latching member has at least one latching hole, and the housing has at least one bump formed thereon, for being inserted into the latching hole, such that the latching member is latched to the housing.
10. The light emitting device as claimed in claim 5, wherein the housing further has at least one fixing hole formed in the heat dissipation end of the housing, and at least one of the fins has a collar formed by extending an edge of the fin, for a fixing bolt passing through the collar to be fixed in the fixing hole, so as to fix the heatsink to the heat dissipation end of the housing.
11. The light emitting device as claimed in claim 10, wherein the fixing hole is a screw hole, and the fixing bolt is a bolt with screw thread corresponding to the screw hole.
12. The light emitting device as claimed in claim 10, wherein the fixing bolt is engaged in the fixing hole.
13. The light emitting device as claimed in claim 5, wherein a screw thread is formed on the inner circumferential surface of the housing corresponding to the heat dissipation end, and an outer peripheral of the bottom plate has a screw corresponding to that of the housing for being screwed with the thread, such that the bottom plate is fixed to the heat dissipation end of the housing, so as to fix the heatsink to the heat dissipation end of the housing.
14. The light emitting device as claimed in claim 5, wherein at least one retaining slot is formed on the inner circumferential surface of the housing, and at least one engaging member is formed on the outer edge of the bottom plate for being engaged into the retain slot, so as to fix the heatsink to the housing.
15. The light emitting device as claimed in claim 5, wherein a diameter of the bottom plate is larger than a diameter of the second opening for being fixed inside the housing in a tight fitting manner, so as to fix the heatsink to the heat dissipation end of the housing.
16. The light emitting device as claimed in claim 5, wherein at least one of the fins has a collar formed by extending an edge of the fin, and the housing further has at least one fixing hole formed to connect both ends of the housing, for a fixing bolt passing through the fixing hole to be fixed in the collar, so as to fix the heatsink to the heat dissipation end of the housing.
17. The light emitting device as claimed in claim 10, wherein a screw thread is formed inside the collar, and the fixing bolt is a bolt with screw thread corresponding to the collar.
18. The light emitting device as claimed in claim 16, wherein the fixing bolt is engaged in the collar.
19. The light emitting device as claimed in claim 1, wherein at least one heat conduction medium is applied between the heatsink and the light emitting unit, for conducting the heat generated by the light emitting unit.
Type: Application
Filed: Feb 9, 2007
Publication Date: Aug 14, 2008
Applicant: Cooler Master Co., Ltd. (Taipei County)
Inventors: Chang Hung Peng (Chung-Ho City), Chung Chin Huang (Chung-Ho City)
Application Number: 11/704,182