Heat Sink Patents (Class 361/709)
  • Patent number: 11910516
    Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 20, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hongki Moon, Yoonsun Park, Seunghoon Kang, Kyungha Koo, Seyoung Jang, Woojune Jung
  • Patent number: 11889667
    Abstract: A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: January 30, 2024
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Akash Changarankumarath Pradeepkumar, Alfredo R. Munoz, Michael W. Degner, Edward Chan-Jiun Jih, Guangyin Lei
  • Patent number: 11756858
    Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: September 12, 2023
    Assignees: Industrial Technology Research Institute, DIODES TAIWAN S.A R.L.
    Inventors: Wei-Kuo Han, Chia-Yen Lee, Jing-Yao Chang, Tao-Chih Chang
  • Patent number: 11756915
    Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 12, 2023
    Assignees: Huyndai Motor Company, Kia Motors Corporation
    Inventors: Tae Hwa Kim, Myung Ill You
  • Patent number: 11737367
    Abstract: A piezoelectric device includes: a base having at least one hole, a heat conductive portion disposed in the at least one hole and in contact with a wall of the at least one hole, and at least one piezoelectric sensor disposed on the base. A thermal conductivity of the heat conductive portion is greater than a thermal conductivity of the base. Each piezoelectric sensor includes: a first electrode, a piezoelectric pattern made of a piezoelectric material and a second electrode that are sequentially stacked in a thickness direction of the base.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 22, 2023
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feng Zhang, Wenqu Liu, Zhijun Lv, Liwen Dong, Xiaoxin Song, Zhao Cui, Detian Meng, Libo Wang
  • Patent number: 11664160
    Abstract: A power semiconductor device has a substrate on which power semiconductor switches are arranged and has a circuit board which includes conductive first plug-in connection contacts, a capacitor, a capacitor holding element that includes a reception device for receiving the capacitor, a temperature sensor for the capacitor, a temperature sensor holding element that has a plug-in region for conductive second plug-in connection contacts. There are temperature sensor connecting lines which electrically connect the temperature sensor and the second plug-in connection contacts to one another, at least one section of a temperature sensor connecting line being configured as a conductor track on the temperature sensor holding element, the second plug-in connection contacts forming an electrically conductive plug-in connection with the first plug-in connection contacts.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: May 30, 2023
    Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
    Inventor: Markus Dienstbier
  • Patent number: 11647608
    Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: May 9, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yiying Jian, Dingfang Li, Xinhu Gong, Gaoliang Xia
  • Patent number: 11632983
    Abstract: Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: April 25, 2023
    Assignee: JUUL Labs, Inc.
    Inventors: Joshua Fu, Christopher Loental, Marko Markovic, Alexander Weiss, Alexander Ringrose, David Carlberg, Robyn Nariyoshi, Devin Spratt, Nicholas J. Hatton, Yen Jen Chang, Chen Yu Li, Barry Tseng, Prince Wang, Thomas Germann, Andreas Schaefer
  • Patent number: 11632832
    Abstract: A lighting system including monitoring of input power and output power parameters to a set of lighting loads to detect power faults and/or anomalies. The set of sensing circuits include primary side and secondary side sensing circuits that communicate with a set of monitoring circuits to process the information supplied by the sensing circuits. If a fault and/or anomaly is sensed or detected, a signal is transmitted to provide an alert.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 18, 2023
    Inventors: Jason Neudorf, Steven Lyons, Kyle Hathaway
  • Patent number: 11622063
    Abstract: Example implementations include a camera and a thermal management apparatus for a camera including an outer housing walls, an inner bracket for mounting a camera component. The camera and thermal management apparatus further includes a thermal bridge assembly for selectively increasing a thermal conductivity between the inner bracket and the outer housing walls.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: April 4, 2023
    Assignee: JOHNSON CONTROLS TYCO PP HOLDINGS LLP
    Inventor: Steven W. Schieltz
  • Patent number: 11616262
    Abstract: A battery and capacitor assembly for a hybrid vehicle includes a plurality of battery cells, a plurality of capacitor cells, a cooling plate, a pair of end brackets, and a housing. The plurality of capacitor cells are arranged adjacent to the plurality of battery cells such that the plurality of battery cells and the plurality of capacitor cells form a cell stack. The pair of end brackets are disposed at opposite ends of the cell stack and are attached to the cooling plate. The pair of end brackets compress the plurality of battery cells and the plurality of capacitor cells. The housing is attached to the cooling plate and encloses the cell stack and the pair of end brackets.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: March 28, 2023
    Assignee: Gentherm Incorporated
    Inventors: Michael Peter Ciaccio, Brian Moorhead
  • Patent number: 11588413
    Abstract: Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: February 21, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Niki Kitahama, Ryohei Hayashi, Jiro Yoshizawa, Yasuhiro Komiya
  • Patent number: 11532538
    Abstract: The present disclosure relates to a component structure, a power module and a power module assembly structure having the component structure. The component structure comprises: a first bus bar, having one end extending to a first plane to form a first connecting terminal; a second bus bar, comprising a front portion of the second bus bar and a rear portion of the second bus bar, wherein the front portion of the second bus bar is laminated in parallel with the first bus bar, and the rear portion of the second bus bar is extended to a second plane to form a second connecting terminal; and an external circuit comprising a third bus bar, wherein the third bus bar is settled in parallel with the rear portion of the second bus bar, to reduce a parasitic inductance between the first connecting terminal and the second connecting terminal.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: December 20, 2022
    Assignee: Delta Electronics (Shanghai) CO., LTD
    Inventors: Shouyu Hong, Juan Cheng, Tao Wang, Zhenqing Zhao
  • Patent number: 11515804
    Abstract: An electric circuit for a power converter having a substrate having a first face on which electronic components are mounted and a second face intended to cooperate with a cooling system, the substrate having a stack of conductive layers made of electrically and thermally conductive material and at least one insulating layer made of electrically insulating material, two successive conductive layers being separated by an insulating layer, and the conductive and insulating layers extending in parallel planes and being mechanically associated together. Each conductive layer has two opposite faces parallel to the plane in which the first face of the substrate extends and includes, on at least one of its two faces, at least one boss extending in a direction perpendicular to the plane, the at least one boss passing through at least one other conductive layer and opening out onto the first or the second face of the substrate.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: November 29, 2022
    Assignees: SAFRAN ELECTRICAL & POWER, ELVIA PRINTED CIRCUIT BOARDS
    Inventors: Philippe Poret, Olivier Belnoue
  • Patent number: 11502022
    Abstract: A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: November 15, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shigenobu Tochiyama, Yuhei Nagashima, Masayoshi Tamura
  • Patent number: 11398665
    Abstract: The present disclosure relates to a heat-radiating mechanism for an antenna device, and particularly, includes: a plurality of communication elements generating predetermined heat upon electrical operation, a heat-radiating combined case having the plurality of communication elements accommodated in one surface thereof and a plurality of heat-radiating ribs integrally formed on the other surface thereof, and an antenna board mounted with the plurality of communication elements on one surface of the heat-radiating combined case, in which the plurality of heat-radiating ribs are formed such that the rising airflow formed by being heat-radiated from the relatively lower portion of the heat-radiating combined case is exhausted to be inclined upward to the left and right outsides of the heat-radiating combined case in the width direction from the relatively upper position, thereby improving the heat-radiating performance of the antenna device.
    Type: Grant
    Filed: November 28, 2020
    Date of Patent: July 26, 2022
    Assignee: KMW, INC.
    Inventors: Chang Woo Yoo, Min Sik Park, Jun Woo Yang
  • Patent number: 11394310
    Abstract: In a power conversion device, a distance between an output terminal of a first switching module and a cathode terminal of a first diode module in a first direction is arranged to be substantially equal to a distance between an output terminal of a second switching module and an anode terminal of a second diode module in the first direction.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: July 19, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kohei Matsui
  • Patent number: 11373924
    Abstract: Disclosed is a power module capable of maximizing heat dissipation performance through application of a thick lead frame and a ceramic coating layer to upper and lower sides of a semiconductor device.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 28, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jun Hee Park, Hyun Koo Lee
  • Patent number: 11330683
    Abstract: A lighting system including monitoring of input power and output power parameters to a set of lighting loads to detect power faults and/or anomalies. The set of sensing circuits include primary side and secondary side sensing circuits that communicate with a set of monitoring circuits to process the information supplied by the sensing circuits. If a fault and/or anomaly is sensed or detected, a signal is transmitted to provide an alert.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: May 10, 2022
    Inventors: Jason Neudorf, Steven Lyons, Kyle Hathaway
  • Patent number: 11322871
    Abstract: An electrical connector assembly includes a seat unit and a cover unit. The seat unit defines a receiving cavity for receiving the CPU. The cover unit is pivotably mounted upon one end of the seat unit. The cover unit includes a first cover and a second cover surrounding the first cover. The first cover includes a first frame equipped with therein a floating heat sink which is located above and aligned with the receiving cavity. The heat sink forms a pair of side extensions sandwiched between a pair of pressing blocks and the first frame in a vertical direction and essentially downwardly pressed by the pair of pressing blocks of the first cover in a resilient manner. Resilient mechanism is provided between the pressing block and the heat sink to result in a downward force constantly urge the heat sink downwardly against the first frame.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: May 3, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chun-Chieh Yang, Wei-Chih Lin, Hsiu-Yuan Hsu
  • Patent number: 11315889
    Abstract: Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: April 26, 2022
    Assignee: DEXERIALS CORPORATION
    Inventors: Yusuke Kubo, Sergey Bolotov
  • Patent number: 11293332
    Abstract: A vehicle electronic control unit water block is provided. The vehicle electronic control unit water block comprises a mounting plate, cooling plate, at least one heat sink, at least one heat sink fin set, and at least one lift plate. The mounting plate and cooling plate define a cooling chamber therein having a first, second and third flow channel. The cooling liquid flows through the first and second flow channels having the at least one lift plate and at least one heat sink therein with a generally minimal and even liquid flow resistance distribution. The at least one lift plate corresponds to an elevated position of the at least one heat sink, such that the volume of cooling liquid flow is even over the lift plates and the thickness of the heat sink is minimized.
    Type: Grant
    Filed: January 19, 2020
    Date of Patent: April 5, 2022
    Assignee: Cooler Master Co., Ltd.
    Inventor: Po wen Tu
  • Patent number: 11276536
    Abstract: A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion that is in surface contact with at least one of the upper case and the lower case, wherein at least one side of the bottom portion contacts a portion made of a plastic material having heat dissipation and insulation properties in the upper case and the lower case.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 15, 2022
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Min Ho Won, Seung Jae Hwang
  • Patent number: 11234342
    Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 25, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Mehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara, Damaruganath Pinjala
  • Patent number: 11209893
    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: December 28, 2021
    Assignee: Intel Corporation
    Inventor: Mark MacDonald
  • Patent number: 11183439
    Abstract: A package structure for power devices includes a heat dissipation insulating substrate, a plurality of power devices, a heat dissipation baseplate, and a thermal interface layer. The heat dissipation insulating substrate has a first surface and a second surface which are opposite to each other, and the power devices are coupled to the first surface of the heat dissipation insulating substrate. The heat dissipation baseplate is disposed at the second surface of the heat dissipation insulating substrate, wherein at least one of a surface of the heat dissipation baseplate and the second surface of the heat dissipation insulating substrate has at least one plateau, and the plateau is at least disposed within a projected area of the plurality of power devices. The thermal interface layer is disposed between the second surface of the heat dissipation insulating substrate and the surface of the heat dissipation baseplate.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: November 23, 2021
    Assignee: ACTRON TECHNOLOGY CORPORATION
    Inventors: Hsin-Chang Tsai, Ching-Wen Liu
  • Patent number: 11171077
    Abstract: A semiconductor device is assembled using a lead frame having leads that surround a central opening. The leads have proximal ends near to the central opening and distal ends spaced from the central opening. A heat sink is attached to a bottom surface of the leads and a semiconductor die is attached to a top surface of the leads, where the die is supported on the proximal ends of the leads and spans the central opening. Bond wires electrically connect electrodes on an active surface of the die and the leads. An encapsulant covers the bond wires and at least the top surface of the leads and the die. The distal ends of the leads are exposed to allow external electrical communication with the die.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: November 9, 2021
    Assignee: NXP USA, INC.
    Inventors: You Ge, Meng Kong Lye, Zhijie Wang
  • Patent number: 11149942
    Abstract: One aspect of this disclosure provides a finger baffle for a heating furnace. This embodiment includes an elongated support plate having a length, and at least one finger baffle extending outwardly and in a vertically oriented direction from the elongated support plate. The at least one finger baffle has a width that extends along the length of the elongated support plate. The finger baffle may be employed in a high-efficiency gas furnace.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: October 19, 2021
    Assignee: Lennox Industries Inc.
    Inventors: Shiblee S. M. Noman, John W. Whitesitt
  • Patent number: 11127653
    Abstract: A latch assembly for latching a heat sink onto a printed circuit board (PCB). The latch assembly includes a clamp having a connector for connecting the latch assembly to the heat sink. A spring is mounted to the clamp for biasing the clamp away from the heat sink. A handle is rotatably connected to the clamp, and a cam extends from the handle. A hook is moveably mounted to the clamp and has a cam surface engaged with the cam. The hook has an engagement portion for engaging the PCB. Rotation of the handle causes (i) rotation of the hook, which causes the engagement portion to engage the PCB, followed by (ii) movement of the cam along the cam surface, which causes translation of the clamp toward the PCB against the bias of the spring, which causes the heat sink to contact an IC for dissipating heat from the IC.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: September 21, 2021
    Assignee: Southco, Inc.
    Inventor: Richard E. Schlack
  • Patent number: 11122674
    Abstract: A printed circuit board includes a first, second, and third conductive layer. The printed circuit boards also includes a first non-conductive layer between the first and second conductive layers and a second non-conductive layer between the second and third conductive layers. The printed circuit board further includes a dielectric layer between the second conductive layer and the second non-conductive layer and a coin for heat dispersion located underneath the dielectric layer. The printed circuit board also includes a cavity for receiving a component and a plating within the cavity to connect the coin with the second conductive layer. The plating extends less than 50 um above the second conductive layer.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: September 14, 2021
    Inventors: Pui Yin Yu, Xin Hua Zeng, Jian Ying Xue, Hong Tu Zhang
  • Patent number: 11071225
    Abstract: An integrated smart relay assembly includes a case and an electronic solid-state switch disposed inside the case and a gate driver circuit electrically connected to the electronic solid-state switch. The gate driver circuit is configured to drive the electronic solid-state switch with a predetermined gate voltage and a predetermined gate current. The relay assembly further includes a protection circuit electrically connected to the gate driver circuit. The protection circuit is configured to protect the electronic solid-state switch against over-voltage, short circuit, and overheating. The relay assembly further includes a communication interface integrated with the electronic solid-state switch. Each of the protection circuit, electronic solid-state switch, and the communication interface is disposed inside the case.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: July 20, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Chandra S. Namuduri, Rashmi Prasad
  • Patent number: 11046190
    Abstract: A pressing member is used for pressing semiconductor modules and cooling pipes which are alternately disposed, and includes a plate and an elastic member. The plate includes a contact plate section that faces an end surface of the fixed unit in the fixed direction and contacts with the end surface of the fixed unit, and plate ribs standing in the fixed direction from an end portion of the contact plate section in a width direction of the contact plate section. The elastic member is disposed in a side of the plate opposite to a side of the plate where the fixed unit is disposed, the elastic member pressing the plate towards a fixed unit side in the fixed direction. The contact plate section has an inner plate surface including a concave surface formed at a portion apart from the plate ribs in a contact region.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: June 29, 2021
    Assignee: DENSO CORPORATION
    Inventors: Kazuki Sakamoto, Hideaki Tachibana, Hiroki Umeda
  • Patent number: 11027354
    Abstract: A power conversion assembly for use in a welding power supply includes a power magnetics module and a power electronics module. The power magnetics module includes at least one transformer disposed on a first wind tunnel housing. The power electronics module is separate from and electrically coupled to the power magnetics module. The power electronics module includes switching circuitry and one or more heat sinks to remove heat from the switching circuitry. The switching circuitry and the heat sinks are disposed on a second wind tunnel housing coupled to the first wind tunnel housing.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: June 8, 2021
    Assignee: Illinois Tool Works Inc.
    Inventors: Jason Alan Dunahoo, Ronald Dewayne Woodward, Benjamin David Romenesko, Chris J. Roehl, Craig Steven Knoener, Joshua Thomas Stiever
  • Patent number: 10985636
    Abstract: A semiconductor device includes: a plurality of control modules that controls a rotating electric machine. Each control module includes at least two sets of arms, each set including high-side and low-side switching elements that provide an inverter. A plurality of arms of each control module are coupled in parallel to each other with respect to a bus bar coupled to one power source. Each control module includes a metal plate on which the high-side and low-side switching elements are mounted, and mediates an electric coupling with the power source. Each metal plate includes a first metal plate on which one set of arms is disposed, a second metal plate on which another set of arms is disposed, and a coupling plate that couples the first and second metal plates.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: April 20, 2021
    Assignee: DENSO CORPORATION
    Inventors: Masayoshi Nishihata, Nobumasa Ueda, Hiroki Kiyose
  • Patent number: 10916953
    Abstract: A housing for an electricity charging station includes a base frame having a mounting rack, a cover connected to the base frame, two doors hinged on the base frame, a base connected to the base frame, two faceplates inserted into the base and two cable panels embedded in the base. A corresponding electricity charging station and a corresponding method for producing or assembling such a housing.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: February 9, 2021
    Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
    Inventors: Volker Reber, Bekim Basha, David Köhler, Karsten Hähre, Camila Zies, Christian Metzger
  • Patent number: 10845409
    Abstract: A substrate inspection device includes: a holding member configured to hold a probe card; a plate-shaped chuck facing the probe card and configured to place a substrate thereon; and an inspection chamber in which the holding member and the chuck are disposed. The substrate is brought into contact with the probe card by moving the chuck closer to the holding member. A sealed space is formed between the holding member and the chuck. A contact state between the probe card and the substrate are maintained by decompressing the sealed space. A gas introduction path is provided separately from the inspection chamber and configured to introduce a gas in a partitioned space into the sealed space, and the partitioned space is filled with a dry gas.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: November 24, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Hiroshi Yamada, Jun Fujihara
  • Patent number: 10797569
    Abstract: A semiconductor device includes: a plurality of control modules to control a rotating electric machine. The plurality of control modules are circularly arranged around a rotary shaft of the rotating electric machine. Each control module includes at least one switching element supplied with a current from a bus bar coupled to a power source. The at least one switching element in one of the control modules under a structural condition of arrangement has a lower resistance than another switching element.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: October 6, 2020
    Assignee: DENSO CORPORATION
    Inventors: Masayoshi Nishihata, Nobumasa Ueda, Hiroki Kiyose
  • Patent number: 10770371
    Abstract: A base plate (1) made of a metal has a through-hole (2). An insulating substrate (3) is provided on the base plate (1). A semiconductor chip (4) is provided on the insulating substrate (3). A case (8) has a screw-hole (9) communicating with the through-hole (2), covers the insulating substrate (3) and the semiconductor chip (4), and is disposed on the base plate (1). A screw (11) made of a metal is inserted into the through-hole (2) and the screw-hole (9) to fix the case (8) to the base plate (1). A flexible material (12) having flexibility is filled in a cavity between a bottom surface of the screw-hole (9) in the case (8) and a distal end of the screw (11).
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: September 8, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoichi Hironaka, Masuo Koga
  • Patent number: 10681849
    Abstract: An unmanned aerial vehicle (UAV) includes a heat dissipation device, an inertial measurement unit (IMU), and a control module. The heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow, and the heat conduction plate directly constitutes a portion of a sidewall of the air duct. The IMU module is received within the air duct. The control module is located outside the air duct and disposed at a side of the heat conduction plate that faces away from the IMU module. Heat generated by the IMU module is taken away directly by the airflow within the air duct.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: June 9, 2020
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Yin Tang, Xifeng Zhao, Tao Zhao, Xiaokai Guo, Yanxin Huang
  • Patent number: 10615248
    Abstract: Structure and method for a backside capacitor using through-substrate vias (TSVs) and backside metal plates. The structure includes: a substrate, a device layer over the substrate, a first plurality of metal layers connected to the device layer, where the device layer and the first plurality of metal layers are disposed on a first side of the substrate, and a second plurality of metal layers disposed on a second side of the substrate opposite the first side, where the second plurality of metal layers form at least one capacitor and where a plurality of through-substrate vias (TSVs) extend between the first plurality of metal layers and the second plurality of metal layers.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: April 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Hassan Naser, Daniel Stasiak
  • Patent number: 10602635
    Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: March 24, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: John Ditri, Jay H. Ambrose
  • Patent number: 10444799
    Abstract: An electronic device housing comprises a housing wall with a surface and a nanotube coating coated upon the surface of the housing wall.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: October 15, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bach Lien Nguyen, Hui-Leng Lim, Michael James Pescetto
  • Patent number: 10447170
    Abstract: Provided herein are systems and methods related to an inverter module of a drivetrain system of an electric vehicle. The inverter module can include multiple power modules to form a three phase inverter module to power an electric vehicle. The power modules can be arranged or organized within the inverter module to reduce a footprint of the inverter module and reduce an inductance of the inverter module. The power modules can be arranged within the inverter module in a row like or queue like formation such that a first row of power modules is disposed along a first side of the inverter module and a second row of power modules is disposed along a second side of the inverter module. The positioning of the power modules can reduce an inductance value of the paralleled power loop formed by the multiple power modules, reducing an inductance of the inverter module.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: October 15, 2019
    Assignee: SF Motors, Inc.
    Inventors: Tong Wu, Zhong Nie, Duanyang Wang
  • Patent number: 10412848
    Abstract: A power supply device 1 includes a main circuit board 20, a power component 22 connected to the main circuit board 20, a filter component 24 connected to the main circuit board 20, and a casing 10 which houses the main circuit board 20, the power component 22, and the filter component 24. The casing 10 includes a base plate 11 which includes a flat surface 11a in which a fin 14 for heat dissipation is provided on a bottom-surface side, and a protruding part 15 which protrudes from the flat surface toward the fin. The power component 22 and the main circuit board 20 are placed on the flat surface, and the filter component 24 is housed in the protruding part 15.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: September 10, 2019
    Assignee: TDK CORPORATION
    Inventors: Kengo Tsujimoto, Kouji Utsui, Akira Ikezawa
  • Patent number: 10403995
    Abstract: An electrical connector comprises an interface element attachable to a circuit board and a plurality of peripheral connectors. The interface element has an inner contact electrically contacting the circuit board and a connecting interface. The peripheral connectors are each individually matable with the connecting interface. The peripheral connectors include a peripheral plug connector having a plurality of plug connector pins and a peripheral lead connector having a plurality of wires.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: September 3, 2019
    Assignee: TE Connectivity Germany GmbH
    Inventors: Daniel Walldorf, Calogero Mauro Buscemi, Markus Strelow, Chistian Schrettlinger, Frank Wolf, Steffen Burger, Chris Buechling, Mike Laub, Ulrich Buchmann
  • Patent number: 10405462
    Abstract: A system and method to ensure the proper operation of a power supply unit in an electronic device. The electronic device has a chassis with a length and a width that includes one area having electronic components. A system fan is located in the chassis relative to the electronic components to generate air flow in the direction of the length of the chassis through the electronic components. A power supply unit is located in parallel to the system fan relative to the width of the chassis. The power supply unit includes an AC input, a DC output and an internal fan. A controller is operable to control the system fan to reduce the air flow when the power supply unit turns on AC power to the AC input, or wakes up from a cold redundant state and outputs DC power from the DC output.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 3, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Yueh-Chang Wu, Jhih-Bin Guan
  • Patent number: 10405465
    Abstract: An electrical device includes an electrical component configured to generate heat during operation of the electrical device. A thermal management coating is configured to transfer heat from the electrical component by thermal conduction. The thermal management coating comprises a non-carbon based topological insulator.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 3, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Jeffrey H. Hunt, Wayne R. Howe, Angela W. Li
  • Patent number: 10302081
    Abstract: An electric pump includes a motor portion having a rotary drive force by a power supply, a pump portion being operated by the motor portion, and a control portion controlling an electric power being supplied to the motor portion. The motor portion, the pump portion, and the control portion are integrally formed. The control portion includes a control circuit board controlling the electric power supplied to the motor portion, the control portion including a case containing the control circuit board, the control portion including a temperature sensor being provided at a board surface of the control circuit board, the board surface being disposed at a position facing an inner surface of an area of the case, the area being exposed to external air.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: May 28, 2019
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Takeru Yamamoto, Yoshiaki Ushita, Takashi Matsumoto
  • Patent number: 10295767
    Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 21, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Patent number: 10283429
    Abstract: A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 7, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, Denso Corporation
    Inventors: Shingo Iwasaki, Tomomi Okumura