Heat Sink Patents (Class 361/709)
  • Patent number: 10412848
    Abstract: A power supply device 1 includes a main circuit board 20, a power component 22 connected to the main circuit board 20, a filter component 24 connected to the main circuit board 20, and a casing 10 which houses the main circuit board 20, the power component 22, and the filter component 24. The casing 10 includes a base plate 11 which includes a flat surface 11a in which a fin 14 for heat dissipation is provided on a bottom-surface side, and a protruding part 15 which protrudes from the flat surface toward the fin. The power component 22 and the main circuit board 20 are placed on the flat surface, and the filter component 24 is housed in the protruding part 15.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: September 10, 2019
    Inventors: Kengo Tsujimoto, Kouji Utsui, Akira Ikezawa
  • Patent number: 10405462
    Abstract: A system and method to ensure the proper operation of a power supply unit in an electronic device. The electronic device has a chassis with a length and a width that includes one area having electronic components. A system fan is located in the chassis relative to the electronic components to generate air flow in the direction of the length of the chassis through the electronic components. A power supply unit is located in parallel to the system fan relative to the width of the chassis. The power supply unit includes an AC input, a DC output and an internal fan. A controller is operable to control the system fan to reduce the air flow when the power supply unit turns on AC power to the AC input, or wakes up from a cold redundant state and outputs DC power from the DC output.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 3, 2019
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Yueh-Chang Wu, Jhih-Bin Guan
  • Patent number: 10403995
    Abstract: An electrical connector comprises an interface element attachable to a circuit board and a plurality of peripheral connectors. The interface element has an inner contact electrically contacting the circuit board and a connecting interface. The peripheral connectors are each individually matable with the connecting interface. The peripheral connectors include a peripheral plug connector having a plurality of plug connector pins and a peripheral lead connector having a plurality of wires.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: September 3, 2019
    Assignee: TE Connectivity Germany GmbH
    Inventors: Daniel Walldorf, Calogero Mauro Buscemi, Markus Strelow, Chistian Schrettlinger, Frank Wolf, Steffen Burger, Chris Buechling, Mike Laub, Ulrich Buchmann
  • Patent number: 10405465
    Abstract: An electrical device includes an electrical component configured to generate heat during operation of the electrical device. A thermal management coating is configured to transfer heat from the electrical component by thermal conduction. The thermal management coating comprises a non-carbon based topological insulator.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 3, 2019
    Inventors: Jeffrey H. Hunt, Wayne R. Howe, Angela W. Li
  • Patent number: 10302081
    Abstract: An electric pump includes a motor portion having a rotary drive force by a power supply, a pump portion being operated by the motor portion, and a control portion controlling an electric power being supplied to the motor portion. The motor portion, the pump portion, and the control portion are integrally formed. The control portion includes a control circuit board controlling the electric power supplied to the motor portion, the control portion including a case containing the control circuit board, the control portion including a temperature sensor being provided at a board surface of the control circuit board, the board surface being disposed at a position facing an inner surface of an area of the case, the area being exposed to external air.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: May 28, 2019
    Inventors: Takeru Yamamoto, Yoshiaki Ushita, Takashi Matsumoto
  • Patent number: 10295767
    Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 21, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Patent number: 10283429
    Abstract: A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 7, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, Denso Corporation
    Inventors: Shingo Iwasaki, Tomomi Okumura
  • Patent number: 10258950
    Abstract: A method of making a package for a fuel unit, a fuel unit including the package, and a hydrogen generator including one or more of the fuel units are disclosed. The package includes a package strip made by forming apertures in a nonconductive substrate strip, forming conductor sections in a conductor strip, aligning the substrate and conductor strips, bonding the conductor sections to the substrate strip to cover the apertures, and removing non-bonded portions of the conductor strip. A package enclosing a hydrogen generating reactant is formed by securing a segment of the package strip to itself, to one or more other segments and/or to one or more other package components. One or more conductor sections in the package strip are in thermal contact with one or more quantities of reactant composition so heat can be transferred thermally decompose the reactant composition and generate hydrogen gas.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: April 16, 2019
    Inventors: Thomas J. Kmetich, Chad E. Law, Richard A. Langan
  • Patent number: 10249554
    Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 2, 2019
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Stefan Schroeder
  • Patent number: 10229863
    Abstract: The invention relates to a phase module (1) for a power converter (2) comprising at least one switching element (10) and a heatsink (13). In order to improve the cooling properties of a phase module (1), it is proposed that the switching element (10) is connected to the heatsink (13), wherein the connection between switching element (10) and heatsink (13) is a non-detachable connection. The invention further relates to a power converter (2) comprising at least one phase module (1) of this type and a method for producing a phase module (1) of this type, wherein in order to produce a connection between the switching element (10) and the heatsink (13), the switching element (10) is soldered, sintered or glued onto the heatsink (13).
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: March 12, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventors: Roland Lorz, Rainer Sommer
  • Patent number: 10177070
    Abstract: A flexible graphite sheet support structure forms a thermal management arrangement for device having a heat source. The flexible graphite sheet support structure includes first and second spaced apart support members and a flexible graphite sheet secured to the spaced apart support members forming a free standing flex accommodating section that spans between them. Curve retention members having convex curved surfaces are used to keep the flex accommodating section in a bell shaped curve while preventing the flexible graphite sheet from exceeding a minimum bend radius. The thermal management arrangement formed by the flexible graphite sheet support structure enables the flexible graphite sheet to move heat from one support structure to the other while reducing the transmission of vibration between them and allowing relative movement between the spaced apart support structures.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 8, 2019
    Assignee: NeoGraf Solutions, LLC
    Inventors: Frank P. Dornauer, Greg P. Kramer, Martin D. Smalc
  • Patent number: 10177110
    Abstract: An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: January 8, 2019
    Assignee: Renesas Electronics Corporation
    Inventor: Koji Bando
  • Patent number: 10178812
    Abstract: A heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow and including a mounting window formed on a sidewall of the air duct, an air inlet formed at a first end of the air duct, and an air outlet formed at a second end of the air duct. The heat conduction plate is disposed at the mounting window and covers the mounting window.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: January 8, 2019
    Inventors: Yin Tang, Xifeng Zhao, Tao Zhao, Xiaokai Guo, Yanxin Huang
  • Patent number: 10144360
    Abstract: A bracket and restraints control module assembly attached to the tunnel in the floor of a vehicle. The bracket includes a base plate and an intermediate plate supporting the restraints control module. The intermediate plate defines a plurality of holes and is secured by a limited slip connector assembly that extend through laterally elongated slots defined by the base plate and holes in the intermediate plate, respectively. The connector assembly is tightened to a predetermined level of torque so that the intermediate plate can slide relative to the base plate on upper and lower slide surfaces when a collision force of sufficient magnitude is applied to the bracket and RCM assembly.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: December 4, 2018
    Inventors: Mohamed Ridha Baccouche, Saied Nusier, David James Bauch, Mahmoud Yousef Ghannam
  • Patent number: 10143116
    Abstract: In accordance with presently disclosed embodiments, an uninterruptable power supply (UPS) is provided. The UPS utilizes two chambers, one which is pneumatically sealed to house control electronics, and one that is not sealed that houses transformers. The pneumatically sealed compartment is cooled through a heat exchanger or air conditioner as well as through a heat sink. The chamber which houses the transformers is cooled by a fan which circulates air from outside the chamber through the chamber and out vents in a wall of the chamber. The UPS may utilizes a series of ducts to direct air flow into the chamber housing the transformers in such a way that the air enters the bottom of the chamber past the control electronics and through vents near the front of the chamber. The UPS may utilize a series of ducts to direct air flow past the heat sink attached to the pneumatically sealed chamber.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: November 27, 2018
    Assignee: Toshiba International Corporation
    Inventor: William Lewis McCollum
  • Patent number: 10123442
    Abstract: A high power density power supply includes a plurality of cooling fans in a casing. Two sides of the cooling fans are provided with a first filter circuit board and a plurality of power modules, respectively. The first filter circuit board includes a first filter thereon. A plurality of second filter circuit boards are provided on top of the cooling fans, respectively. A second filter is disposed beneath each of the second filter circuit boards. The first filter, the second filter and the power modules are staggered each other, which takes advantage of the upper and lower spaces of the power supply to provide a good heat flow path so that the cooling fans can perform heat dissipation effectively for the power modules. The high power density power supply can achieve a better cooling effect in the casing of the same size.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: November 6, 2018
    Inventor: Mu-Chun Lin
  • Patent number: 10008953
    Abstract: An uninterruptible power-supply system is a power converter having a PN laminated bus bar and a plurality of power conversion units and supplying power from a commercial power supply via a converter and an inverter. The power conversion units each have positive side terminals connected to each other and negative side terminals connected to each other through the PN laminated bus bar. At least one power conversion unit constitutes a phase of the converter. At least another one power conversion unit constitutes a phase of the inverter and has the positive side terminal lying adjacent to and connected through the PN laminated bus bar to the positive side terminal of the corresponding power conversion unit constituting the phase of the converter and the negative side terminal lying adjacent to and connected to the negative side terminal of the corresponding power conversion unit constituting the phase of the converter.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: June 26, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Kamizuma, Yukio Hattori, Tetsuya Kawashima, Akira Mima, Daisuke Matsumoto, Yuuichi Mabuchi
  • Patent number: 9986665
    Abstract: A power conversion apparatus includes a first power converter, second power converter, a case, and partitioning portion. The first power converter performs power conversion. The second power converter performs power conversion. The case houses the first power converter and the second power converter. The partitioning portion partitions the first power converter and the second power converter housed in the case, and forms a coolant flow passage through which a coolant flows. The first power converter includes a first heat-generating component. The second power converter includes a second heat-generating component. The first heat-generating component and the second heat-generating component are each joined to the partitioning portion at a position at which the first heat-generating component and the second heat-generating component do not overlap each other in a perpendicular direction perpendicular to a coolant flow direction of the coolant flow passage.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: May 29, 2018
    Inventor: Kazuhiro Kosaka
  • Patent number: 9894805
    Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: February 13, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Yong Kim, Yu-Sung Kim, Chung-Hyun Ryu, Sung-Ki Lee
  • Patent number: 9877380
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: January 23, 2018
    Assignee: E. SOLUTIONS GmbH
    Inventors: Martin Wanner, Meik Wilhelm Widmer, Thomas Woerz
  • Patent number: 9865529
    Abstract: A semiconductor module including a circuit block that has an electrically insulating layer, a plurality of circuit patterns formed on one surface of the electrically insulating layer, and a plurality of power semiconductors mounted on the circuit patterns. The semiconductor module further includes a heat spreader formed on the other surface of the electrically insulating layer, and a capacitor having two electrodes, one of which is electrically connected to at least one of the circuit patterns, and the other of which is electrically connected to the heat spreader.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: January 9, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Tadahiko Sato
  • Patent number: 9795066
    Abstract: An inverter is provided. In the inverter, an electronic device is disposed inside a first enclosure; a heat radiator and a cooling fan are disposed inside a second enclosure; a magnetic element is disposed outside the first enclosure and the second enclosure. In this way, the cooling effect on the electronic device inside the first enclosure and the heat radiator inside the second enclosure are increased as they may be less affected by the heat generated by the magnetic element. It is also beneficial to heat dissipation of the magnetic element. The cooling fan blows the heat radiator for heat dissipation; the magnetic element does not block the relatively cold air flowing through the heat radiator. Therefore, a less obstructed air duct is formed, and the dissipation effect is improved.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: October 17, 2017
    Inventors: Puyun Dong, Yonghong Li, Hao Zhou, Jianhua Mao
  • Patent number: 9723743
    Abstract: An electrical service interface system include an energy storage device and inverter mounted to a transformer tower, wherein each of the energy storage device and inverter include guide wheels configured to rollably mount the energy storage device and inverter to corresponding guide rails mounted to a support pad, and to align the energy storage device to the inverter, and the inverter to the transformer tower. In an installed configuration, the energy storage device electrically and mechanically couples to the inverter via a DC connector and one or more latching mechanisms, and the inverter mechanically and electrically couples to the transformer tower via an AC connector and one or more latching mechanisms.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: August 1, 2017
    Inventor: Thomas Owen Bialek
  • Patent number: 9634468
    Abstract: A switchgear cabinet comprising a cabinet frame, first and second current converter devices, and an electrical connection clamping device. The first current converter device has first DC voltage positive and negative potential connection elements. The second current converter device has second DC voltage positive and negative potential connection elements. The electrical connection clamping device has an electrically conductive first clamping element and an electrically conductive second clamping element which is electrically insulated from the electrically conductive first clamping element, and a pressure-generating device which generates a pressure that pushes the second clamping element towards the first clamping element. The first clamping element is mechanically connected to the cabinet frame by an electrically non-conductive insulation body such that the first clamping element is electrically insulated from the cabinet frame.
    Type: Grant
    Filed: August 22, 2015
    Date of Patent: April 25, 2017
    Assignee: Semikron Elekronik GmbH & Co., KG
    Inventors: Aurélien Gaumon, Yann Lissilour, Sébastien Touzard
  • Patent number: 9589925
    Abstract: Disclosed is a method for bonding with a silver paste, the method including: coating a silver paste on a semiconductor device or a substrate, the silver paste containing silver and indium; disposing the semiconductor on the substrate; and heating the silver paste to form a bonding layer, wherein the semiconductor device and the substrate are bonded to each other through the bonding layer, and wherein the indium is contained in the silver paste at 40 mole % or less.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: March 7, 2017
    Inventors: Kyoung-Kook Hong, Hyun Woo Noh, Youngkyun Jung, Dae Hwan Chun, Jong Seok Lee, Su Bin Kang
  • Patent number: 9585292
    Abstract: A power converter includes a power semiconductor module, a first flow path forming body and a second flow path forming body that forms a housing space for storing the power semiconductor module and the first flow path forming body, in which the first flow path forming body is configured of a first side wall section, a second side wall section, and a bottom surface section, the first side wall section forms a first flow path space between one surface of the power semiconductor module and the first side wall section, the second side wall section forms a second flow path space between the other surface of the power semiconductor module and the second side wall section, and cooling refrigerant flows through the housing space, the first flow path space, and the second flow path space.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: February 28, 2017
    Inventors: Keisuke Horiuchi, Yosei Hara, Morio Kuwano, Atsuo Nishihara, Kinya Nakatsu
  • Patent number: 9565795
    Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: February 7, 2017
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 9528506
    Abstract: An inverter substrate in which heat generating components which make up an inverter control unit are mounted on a rear surface side thereof is accommodated in a case which is made of a material having a good thermal conductivity in such a manner that the heat generating components are closely contact with a base of the case. The case is provided between a pair of air tanks which are disposed parallel to each other at an interval and on a lower side of at least either of an electric motor and compressors in such a manner as to be oriented downwards so that the base is located at an upper position. An air flow generated by cooling fans which are driven by the electric motor is introduced to flow along the base of the case to thereby cool the heat generating components via the case.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: December 27, 2016
    Assignee: MAX CO., LTD.
    Inventors: Tsutomu Yoshida, Tomohiko Serita
  • Patent number: 9520345
    Abstract: A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames, so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portions can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: December 13, 2016
    Inventors: Hiroshi Ishino, Tomokazu Watanabe
  • Patent number: 9508688
    Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip disposed to overlap with a portion of the first semiconductor chip and connected to the first semiconductor chip through first coupling structures. The semiconductor package may include an interposer disposed to overlap with another portion of the first semiconductor chip and may be connected to the first semiconductor chip through second coupling structures. A first surface of the interposer may face the first semiconductor chip, and the interposer may include second internal interconnectors extending from the second coupling structures on the first surface to a second surface of the interposer opposite to the first face. External interconnectors may be disposed on the second surface of the interposer and are connected to the second internal interconnectors.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: November 29, 2016
    Assignee: SK HYNIX INC.
    Inventor: Jong Hoon Kim
  • Patent number: 9425065
    Abstract: A semiconductor device includes an insulating substrate, a wiring pattern formed on the insulating substrate, a semiconductor chip secured to the wiring pattern, a junction terminal formed of the same material as the wiring pattern and electrically connected to the semiconductor chip, one end of the junction terminal being secured to the insulating substrate, the other end of the junction terminal extending upward away from the insulating substrate, and a control circuit for transmitting a control signal for the semiconductor chip, the control circuit being electrically connected to the junction terminal.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: August 23, 2016
    Inventors: Takami Otsuki, Taichi Obara, Akira Goto
  • Patent number: 9317078
    Abstract: A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: April 19, 2016
    Inventors: Lawrence K. W. Lam, Ruei-Fu Weng, Thompson Cheuk-Wai Tang, Richard S. Chen
  • Patent number: 9306479
    Abstract: A variable speed fan motor, including: a variable speed motor and a motor controller. The motor controller includes a microprocessor, an inverter circuit, a gear detection circuit, and a power supply unit. The gear detection circuit includes a plurality of Hall current sensing units. Each second power input line is connected with a first input end of each of the Hall current sensing units. Second input ends of the Hall current sensing units are connected in parallel, and are connected with a second AC input end of the power supply unit. An output end of the Hall current sensing unit is connected with an input end of the microprocessor. The microprocessor selects operating parameters according to an energized signal of the second power input lines and controls the variable speed motor to operate in accordance with the selected operating parameters.
    Type: Grant
    Filed: March 16, 2013
    Date of Patent: April 5, 2016
    Inventors: Yunsheng Chen, Yong Zhao
  • Patent number: 9293870
    Abstract: An electronic control module which has a housing, a cavity formed as part of the housing, and a connector. The control module also includes a plurality of pins, and a portion of the housing is integrally formed around the pins such that a first end of each of the pins are part of the connector, and a second end of each of the pins is located in the cavity. The control module also has a cover with a large portion and a small portion. A sealant is disposed between part of the cover and the housing to provide a seal between the cover and the housing. The small portion of the cover is bendable relative to the large portion to allow an inspection of the pins after the pins are press-fitted into the circuit board as the cover is connected to the housing.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 22, 2016
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Lukasz Koczwara, James D Baer, Edward Hribar, Raymond Lewandowski
  • Patent number: 9121579
    Abstract: A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of the seat so that some packaging steps can be omitted, and the manufacturing process is simplified. The seat is made of metal having good thermal conductivity instead of plastic materials. The consumption of the package material is reduced, and the heat-dissipation efficiency is increased in the present invention.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: September 1, 2015
    Inventors: Jon-Fwu Hwu, Yung-Fu Wu, Kui-Chiang Liu
  • Patent number: 9105597
    Abstract: An electric power converter that can easily be assembled is provided. An electric power converter includes a semiconductor stacking unit, a frame and a spring unit. The semiconductor stacking unit has a configuration in which the semiconductor modules and coolers are stacked. The spring unit is inserted between one end of the semiconductor stacking unit in a stacking direction, and a support provided on the frame, and fixes the semiconductor stacking unit while applying pressure thereto. The spring unit is provided with a first plate, a second plate, and a coil spring sandwiched between the first and second plates. A recess is provided in the first plate so as to have a gap between the first plate and the end surface of the semiconductor stacking unit. A penetrating passage through which the entire spring unit passes along a bottom of the recess is provided in the spring unit.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: August 11, 2015
    Inventors: Ryouji Hironaka, Hitoshi Imura
  • Patent number: 9063305
    Abstract: A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: June 23, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Laurence R. McColloch, David J. K. Meadowcroft, Seng-Kum Chan
  • Publication number: 20150146380
    Abstract: An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is separated from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip.
    Type: Application
    Filed: July 24, 2014
    Publication date: May 28, 2015
    Inventors: Xing-Xian LU, Pei-Ai YOU, Gang LIU, Jin-Fa ZHANG
  • Patent number: 9042112
    Abstract: A converter power unit comprises: a heat sink; n power switch modules on the heat sink; a first group of laminated bus bars comprising a first and a second bus bar; a capacitor group comprising m capacitor; a second group of laminated bus bars comprising a third and a fourth bus bar, the first bus bar is connected with the third bus bar, the second bus bar is connected with the fourth bus bar; providing that vertical projection areas projected by an area occupied by the n power switch modules and projected by the capacitor group on a first plane perpendicular to an axial direction of the capacitor group are defined as a first and a second projection areas respectively, the first and the second projection area have an overlapped area. The present application can reduce the stray inductances in the commutating loop of the converter.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 26, 2015
    Inventors: Wei Guan, Jian Jiang, Bagao Li, Kaitian Yan, Hongyang Wu
  • Patent number: 9036351
    Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least one heat sink draws heat from the cradle.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: May 19, 2015
    Assignee: Xyber Technologies, LLC
    Inventor: Mario Facusse
  • Patent number: 9036354
    Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: May 19, 2015
    Assignee: Flextronics, AP, LLC
    Inventors: Dason Cheung, Murad Kurwa, Richard Loi
  • Patent number: 9030825
    Abstract: The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: May 12, 2015
    Assignee: LSIS Co., Ltd.
    Inventor: Min Heo
  • Patent number: 9029814
    Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 12, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Ryotaro Matui, Hideaki Yokoyama
  • Publication number: 20150116944
    Abstract: An electrical assembly that includes a circuit board, an electrical device, a heat spreader, and a solder sphere. The electrical device is a surface mount type package attached to the circuit board. The heat spreader overlies and extends beyond the outline of the device, and is in thermal contact the top side of the surface mount type package. A contact surface of the heat spreader is spaced apart from a mounting surface of the circuit board by a distance based on a height of the top side above the mounting surface. The solder sphere has a pre-reflow diameter sufficient to couple the contact surface to the mounting surface after the solder sphere is reflowed.
    Type: Application
    Filed: October 29, 2013
    Publication date: April 30, 2015
  • Publication number: 20150116945
    Abstract: A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle ? relative to a normal to a surface of the second heatsink.
    Type: Application
    Filed: April 26, 2013
    Publication date: April 30, 2015
    Inventor: Masanori Minamio
  • Patent number: 9017808
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: April 28, 2015
    Assignee: The Research Foundation for The State University of New York
    Inventors: Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang
  • Patent number: 9007772
    Abstract: An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base. A slot is defined in each retaining portion. Each fin includes a main plate and a pivoting portion formed at a bottom the main plate. The pivoting portions are respectively and pivotably received in the slots of the base.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: April 14, 2015
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Lei Liu, Guo-Yi Chen
  • Patent number: 9007773
    Abstract: Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: April 14, 2015
    Assignee: Flextronics AP, LLC
    Inventors: Gary Warren, Darren Van Roon, Steve Steane, Reginald C. Grills
  • Patent number: 9001512
    Abstract: A heat spreader for a resistive element is provided, the heat spreader having a body portion that is arranged over a top surface of the resistive element and electrically insulated from the resistive element. The heat spreader also includes one or more leg portion that extends from the body portion and are associated with the heat sink in a thermally conductive relationship.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: April 7, 2015
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Todd L. Wyatt, Thomas L. Veik
  • Patent number: 8995933
    Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: March 31, 2015
    Assignee: Motorola Solutions, Inc.
    Inventors: John M. Waldvogel, Herman J. Miller