Heat Sink Patents (Class 361/709)
  • Patent number: 11330683
    Abstract: A lighting system including monitoring of input power and output power parameters to a set of lighting loads to detect power faults and/or anomalies. The set of sensing circuits include primary side and secondary side sensing circuits that communicate with a set of monitoring circuits to process the information supplied by the sensing circuits. If a fault and/or anomaly is sensed or detected, a signal is transmitted to provide an alert.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: May 10, 2022
    Inventors: Jason Neudorf, Steven Lyons, Kyle Hathaway
  • Patent number: 11322871
    Abstract: An electrical connector assembly includes a seat unit and a cover unit. The seat unit defines a receiving cavity for receiving the CPU. The cover unit is pivotably mounted upon one end of the seat unit. The cover unit includes a first cover and a second cover surrounding the first cover. The first cover includes a first frame equipped with therein a floating heat sink which is located above and aligned with the receiving cavity. The heat sink forms a pair of side extensions sandwiched between a pair of pressing blocks and the first frame in a vertical direction and essentially downwardly pressed by the pair of pressing blocks of the first cover in a resilient manner. Resilient mechanism is provided between the pressing block and the heat sink to result in a downward force constantly urge the heat sink downwardly against the first frame.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: May 3, 2022
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chun-Chieh Yang, Wei-Chih Lin, Hsiu-Yuan Hsu
  • Patent number: 11315889
    Abstract: Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: April 26, 2022
    Assignee: DEXERIALS CORPORATION
    Inventors: Yusuke Kubo, Sergey Bolotov
  • Patent number: 11293332
    Abstract: A vehicle electronic control unit water block is provided. The vehicle electronic control unit water block comprises a mounting plate, cooling plate, at least one heat sink, at least one heat sink fin set, and at least one lift plate. The mounting plate and cooling plate define a cooling chamber therein having a first, second and third flow channel. The cooling liquid flows through the first and second flow channels having the at least one lift plate and at least one heat sink therein with a generally minimal and even liquid flow resistance distribution. The at least one lift plate corresponds to an elevated position of the at least one heat sink, such that the volume of cooling liquid flow is even over the lift plates and the thickness of the heat sink is minimized.
    Type: Grant
    Filed: January 19, 2020
    Date of Patent: April 5, 2022
    Assignee: Cooler Master Co., Ltd.
    Inventor: Po wen Tu
  • Patent number: 11276536
    Abstract: A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: an upper case having at least one electric element mounted on one surface thereof; a lower case coupled to the upper case; and at least one bus bar electrically connected to the electric element, disposed between the upper case and the lower case, and including a bottom portion that is in surface contact with at least one of the upper case and the lower case, wherein at least one side of the bottom portion contacts a portion made of a plastic material having heat dissipation and insulation properties in the upper case and the lower case.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 15, 2022
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Min Ho Won, Seung Jae Hwang
  • Patent number: 11234342
    Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 25, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Mehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara, Damaruganath Pinjala
  • Patent number: 11209893
    Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: December 28, 2021
    Assignee: Intel Corporation
    Inventor: Mark MacDonald
  • Patent number: 11183439
    Abstract: A package structure for power devices includes a heat dissipation insulating substrate, a plurality of power devices, a heat dissipation baseplate, and a thermal interface layer. The heat dissipation insulating substrate has a first surface and a second surface which are opposite to each other, and the power devices are coupled to the first surface of the heat dissipation insulating substrate. The heat dissipation baseplate is disposed at the second surface of the heat dissipation insulating substrate, wherein at least one of a surface of the heat dissipation baseplate and the second surface of the heat dissipation insulating substrate has at least one plateau, and the plateau is at least disposed within a projected area of the plurality of power devices. The thermal interface layer is disposed between the second surface of the heat dissipation insulating substrate and the surface of the heat dissipation baseplate.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: November 23, 2021
    Assignee: ACTRON TECHNOLOGY CORPORATION
    Inventors: Hsin-Chang Tsai, Ching-Wen Liu
  • Patent number: 11171077
    Abstract: A semiconductor device is assembled using a lead frame having leads that surround a central opening. The leads have proximal ends near to the central opening and distal ends spaced from the central opening. A heat sink is attached to a bottom surface of the leads and a semiconductor die is attached to a top surface of the leads, where the die is supported on the proximal ends of the leads and spans the central opening. Bond wires electrically connect electrodes on an active surface of the die and the leads. An encapsulant covers the bond wires and at least the top surface of the leads and the die. The distal ends of the leads are exposed to allow external electrical communication with the die.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: November 9, 2021
    Assignee: NXP USA, INC.
    Inventors: You Ge, Meng Kong Lye, Zhijie Wang
  • Patent number: 11149942
    Abstract: One aspect of this disclosure provides a finger baffle for a heating furnace. This embodiment includes an elongated support plate having a length, and at least one finger baffle extending outwardly and in a vertically oriented direction from the elongated support plate. The at least one finger baffle has a width that extends along the length of the elongated support plate. The finger baffle may be employed in a high-efficiency gas furnace.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: October 19, 2021
    Assignee: Lennox Industries Inc.
    Inventors: Shiblee S. M. Noman, John W. Whitesitt
  • Patent number: 11127653
    Abstract: A latch assembly for latching a heat sink onto a printed circuit board (PCB). The latch assembly includes a clamp having a connector for connecting the latch assembly to the heat sink. A spring is mounted to the clamp for biasing the clamp away from the heat sink. A handle is rotatably connected to the clamp, and a cam extends from the handle. A hook is moveably mounted to the clamp and has a cam surface engaged with the cam. The hook has an engagement portion for engaging the PCB. Rotation of the handle causes (i) rotation of the hook, which causes the engagement portion to engage the PCB, followed by (ii) movement of the cam along the cam surface, which causes translation of the clamp toward the PCB against the bias of the spring, which causes the heat sink to contact an IC for dissipating heat from the IC.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: September 21, 2021
    Assignee: Southco, Inc.
    Inventor: Richard E. Schlack
  • Patent number: 11122674
    Abstract: A printed circuit board includes a first, second, and third conductive layer. The printed circuit boards also includes a first non-conductive layer between the first and second conductive layers and a second non-conductive layer between the second and third conductive layers. The printed circuit board further includes a dielectric layer between the second conductive layer and the second non-conductive layer and a coin for heat dispersion located underneath the dielectric layer. The printed circuit board also includes a cavity for receiving a component and a plating within the cavity to connect the coin with the second conductive layer. The plating extends less than 50 um above the second conductive layer.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: September 14, 2021
    Inventors: Pui Yin Yu, Xin Hua Zeng, Jian Ying Xue, Hong Tu Zhang
  • Patent number: 11071225
    Abstract: An integrated smart relay assembly includes a case and an electronic solid-state switch disposed inside the case and a gate driver circuit electrically connected to the electronic solid-state switch. The gate driver circuit is configured to drive the electronic solid-state switch with a predetermined gate voltage and a predetermined gate current. The relay assembly further includes a protection circuit electrically connected to the gate driver circuit. The protection circuit is configured to protect the electronic solid-state switch against over-voltage, short circuit, and overheating. The relay assembly further includes a communication interface integrated with the electronic solid-state switch. Each of the protection circuit, electronic solid-state switch, and the communication interface is disposed inside the case.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: July 20, 2021
    Assignee: GM Global Technology Operations LLC
    Inventors: Chandra S. Namuduri, Rashmi Prasad
  • Patent number: 11046190
    Abstract: A pressing member is used for pressing semiconductor modules and cooling pipes which are alternately disposed, and includes a plate and an elastic member. The plate includes a contact plate section that faces an end surface of the fixed unit in the fixed direction and contacts with the end surface of the fixed unit, and plate ribs standing in the fixed direction from an end portion of the contact plate section in a width direction of the contact plate section. The elastic member is disposed in a side of the plate opposite to a side of the plate where the fixed unit is disposed, the elastic member pressing the plate towards a fixed unit side in the fixed direction. The contact plate section has an inner plate surface including a concave surface formed at a portion apart from the plate ribs in a contact region.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: June 29, 2021
    Assignee: DENSO CORPORATION
    Inventors: Kazuki Sakamoto, Hideaki Tachibana, Hiroki Umeda
  • Patent number: 11027354
    Abstract: A power conversion assembly for use in a welding power supply includes a power magnetics module and a power electronics module. The power magnetics module includes at least one transformer disposed on a first wind tunnel housing. The power electronics module is separate from and electrically coupled to the power magnetics module. The power electronics module includes switching circuitry and one or more heat sinks to remove heat from the switching circuitry. The switching circuitry and the heat sinks are disposed on a second wind tunnel housing coupled to the first wind tunnel housing.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: June 8, 2021
    Assignee: Illinois Tool Works Inc.
    Inventors: Jason Alan Dunahoo, Ronald Dewayne Woodward, Benjamin David Romenesko, Chris J. Roehl, Craig Steven Knoener, Joshua Thomas Stiever
  • Patent number: 10985636
    Abstract: A semiconductor device includes: a plurality of control modules that controls a rotating electric machine. Each control module includes at least two sets of arms, each set including high-side and low-side switching elements that provide an inverter. A plurality of arms of each control module are coupled in parallel to each other with respect to a bus bar coupled to one power source. Each control module includes a metal plate on which the high-side and low-side switching elements are mounted, and mediates an electric coupling with the power source. Each metal plate includes a first metal plate on which one set of arms is disposed, a second metal plate on which another set of arms is disposed, and a coupling plate that couples the first and second metal plates.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: April 20, 2021
    Assignee: DENSO CORPORATION
    Inventors: Masayoshi Nishihata, Nobumasa Ueda, Hiroki Kiyose
  • Patent number: 10916953
    Abstract: A housing for an electricity charging station includes a base frame having a mounting rack, a cover connected to the base frame, two doors hinged on the base frame, a base connected to the base frame, two faceplates inserted into the base and two cable panels embedded in the base. A corresponding electricity charging station and a corresponding method for producing or assembling such a housing.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: February 9, 2021
    Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
    Inventors: Volker Reber, Bekim Basha, David Köhler, Karsten Hähre, Camila Zies, Christian Metzger
  • Patent number: 10845409
    Abstract: A substrate inspection device includes: a holding member configured to hold a probe card; a plate-shaped chuck facing the probe card and configured to place a substrate thereon; and an inspection chamber in which the holding member and the chuck are disposed. The substrate is brought into contact with the probe card by moving the chuck closer to the holding member. A sealed space is formed between the holding member and the chuck. A contact state between the probe card and the substrate are maintained by decompressing the sealed space. A gas introduction path is provided separately from the inspection chamber and configured to introduce a gas in a partitioned space into the sealed space, and the partitioned space is filled with a dry gas.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: November 24, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Hiroshi Yamada, Jun Fujihara
  • Patent number: 10797569
    Abstract: A semiconductor device includes: a plurality of control modules to control a rotating electric machine. The plurality of control modules are circularly arranged around a rotary shaft of the rotating electric machine. Each control module includes at least one switching element supplied with a current from a bus bar coupled to a power source. The at least one switching element in one of the control modules under a structural condition of arrangement has a lower resistance than another switching element.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: October 6, 2020
    Assignee: DENSO CORPORATION
    Inventors: Masayoshi Nishihata, Nobumasa Ueda, Hiroki Kiyose
  • Patent number: 10770371
    Abstract: A base plate (1) made of a metal has a through-hole (2). An insulating substrate (3) is provided on the base plate (1). A semiconductor chip (4) is provided on the insulating substrate (3). A case (8) has a screw-hole (9) communicating with the through-hole (2), covers the insulating substrate (3) and the semiconductor chip (4), and is disposed on the base plate (1). A screw (11) made of a metal is inserted into the through-hole (2) and the screw-hole (9) to fix the case (8) to the base plate (1). A flexible material (12) having flexibility is filled in a cavity between a bottom surface of the screw-hole (9) in the case (8) and a distal end of the screw (11).
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: September 8, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yoichi Hironaka, Masuo Koga
  • Patent number: 10681849
    Abstract: An unmanned aerial vehicle (UAV) includes a heat dissipation device, an inertial measurement unit (IMU), and a control module. The heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow, and the heat conduction plate directly constitutes a portion of a sidewall of the air duct. The IMU module is received within the air duct. The control module is located outside the air duct and disposed at a side of the heat conduction plate that faces away from the IMU module. Heat generated by the IMU module is taken away directly by the airflow within the air duct.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: June 9, 2020
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Yin Tang, Xifeng Zhao, Tao Zhao, Xiaokai Guo, Yanxin Huang
  • Patent number: 10615248
    Abstract: Structure and method for a backside capacitor using through-substrate vias (TSVs) and backside metal plates. The structure includes: a substrate, a device layer over the substrate, a first plurality of metal layers connected to the device layer, where the device layer and the first plurality of metal layers are disposed on a first side of the substrate, and a second plurality of metal layers disposed on a second side of the substrate opposite the first side, where the second plurality of metal layers form at least one capacitor and where a plurality of through-substrate vias (TSVs) extend between the first plurality of metal layers and the second plurality of metal layers.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: April 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Hassan Naser, Daniel Stasiak
  • Patent number: 10602635
    Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: March 24, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: John Ditri, Jay H. Ambrose
  • Patent number: 10447170
    Abstract: Provided herein are systems and methods related to an inverter module of a drivetrain system of an electric vehicle. The inverter module can include multiple power modules to form a three phase inverter module to power an electric vehicle. The power modules can be arranged or organized within the inverter module to reduce a footprint of the inverter module and reduce an inductance of the inverter module. The power modules can be arranged within the inverter module in a row like or queue like formation such that a first row of power modules is disposed along a first side of the inverter module and a second row of power modules is disposed along a second side of the inverter module. The positioning of the power modules can reduce an inductance value of the paralleled power loop formed by the multiple power modules, reducing an inductance of the inverter module.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: October 15, 2019
    Assignee: SF Motors, Inc.
    Inventors: Tong Wu, Zhong Nie, Duanyang Wang
  • Patent number: 10444799
    Abstract: An electronic device housing comprises a housing wall with a surface and a nanotube coating coated upon the surface of the housing wall.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: October 15, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bach Lien Nguyen, Hui-Leng Lim, Michael James Pescetto
  • Patent number: 10412848
    Abstract: A power supply device 1 includes a main circuit board 20, a power component 22 connected to the main circuit board 20, a filter component 24 connected to the main circuit board 20, and a casing 10 which houses the main circuit board 20, the power component 22, and the filter component 24. The casing 10 includes a base plate 11 which includes a flat surface 11a in which a fin 14 for heat dissipation is provided on a bottom-surface side, and a protruding part 15 which protrudes from the flat surface toward the fin. The power component 22 and the main circuit board 20 are placed on the flat surface, and the filter component 24 is housed in the protruding part 15.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: September 10, 2019
    Assignee: TDK CORPORATION
    Inventors: Kengo Tsujimoto, Kouji Utsui, Akira Ikezawa
  • Patent number: 10405462
    Abstract: A system and method to ensure the proper operation of a power supply unit in an electronic device. The electronic device has a chassis with a length and a width that includes one area having electronic components. A system fan is located in the chassis relative to the electronic components to generate air flow in the direction of the length of the chassis through the electronic components. A power supply unit is located in parallel to the system fan relative to the width of the chassis. The power supply unit includes an AC input, a DC output and an internal fan. A controller is operable to control the system fan to reduce the air flow when the power supply unit turns on AC power to the AC input, or wakes up from a cold redundant state and outputs DC power from the DC output.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 3, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yi-Chieh Chen, Yueh-Chang Wu, Jhih-Bin Guan
  • Patent number: 10403995
    Abstract: An electrical connector comprises an interface element attachable to a circuit board and a plurality of peripheral connectors. The interface element has an inner contact electrically contacting the circuit board and a connecting interface. The peripheral connectors are each individually matable with the connecting interface. The peripheral connectors include a peripheral plug connector having a plurality of plug connector pins and a peripheral lead connector having a plurality of wires.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: September 3, 2019
    Assignee: TE Connectivity Germany GmbH
    Inventors: Daniel Walldorf, Calogero Mauro Buscemi, Markus Strelow, Chistian Schrettlinger, Frank Wolf, Steffen Burger, Chris Buechling, Mike Laub, Ulrich Buchmann
  • Patent number: 10405465
    Abstract: An electrical device includes an electrical component configured to generate heat during operation of the electrical device. A thermal management coating is configured to transfer heat from the electrical component by thermal conduction. The thermal management coating comprises a non-carbon based topological insulator.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: September 3, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Jeffrey H. Hunt, Wayne R. Howe, Angela W. Li
  • Patent number: 10302081
    Abstract: An electric pump includes a motor portion having a rotary drive force by a power supply, a pump portion being operated by the motor portion, and a control portion controlling an electric power being supplied to the motor portion. The motor portion, the pump portion, and the control portion are integrally formed. The control portion includes a control circuit board controlling the electric power supplied to the motor portion, the control portion including a case containing the control circuit board, the control portion including a temperature sensor being provided at a board surface of the control circuit board, the board surface being disposed at a position facing an inner surface of an area of the case, the area being exposed to external air.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: May 28, 2019
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Takeru Yamamoto, Yoshiaki Ushita, Takashi Matsumoto
  • Patent number: 10295767
    Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: May 21, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuen-Hsien Wu, Kuo-Wei Lee
  • Patent number: 10283429
    Abstract: A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 7, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, Denso Corporation
    Inventors: Shingo Iwasaki, Tomomi Okumura
  • Patent number: 10258950
    Abstract: A method of making a package for a fuel unit, a fuel unit including the package, and a hydrogen generator including one or more of the fuel units are disclosed. The package includes a package strip made by forming apertures in a nonconductive substrate strip, forming conductor sections in a conductor strip, aligning the substrate and conductor strips, bonding the conductor sections to the substrate strip to cover the apertures, and removing non-bonded portions of the conductor strip. A package enclosing a hydrogen generating reactant is formed by securing a segment of the package strip to itself, to one or more other segments and/or to one or more other package components. One or more conductor sections in the package strip are in thermal contact with one or more quantities of reactant composition so heat can be transferred thermally decompose the reactant composition and generate hydrogen gas.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: April 16, 2019
    Assignee: INTELLIGENT ENERGY INC.
    Inventors: Thomas J. Kmetich, Chad E. Law, Richard A. Langan
  • Patent number: 10249554
    Abstract: A heat transfer assembly useful for dissipating heat from the heat emitting device is disclosed. The assembly includes a module inlet for receiving a coolant, at least one module having a first part with a recess to receive a portion of the heat emitting device, and a second part having a shaped cutout portion and a solid portion, where the second part allows a uniform compression of a seal component disposed on the first part. The first part and the second part are mechanically connected to each other; and a module outlet is used for discharging a heat absorbed coolant after absorbing heat from the heat emitting device, where the at least one module is connected to the module inlet and the module outlet. In another embodiment, multiple modules are configured in a symmetrical layout to provide a balanced flow of the coolant in the heat transfer assembly.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 2, 2019
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Stefan Schroeder
  • Patent number: 10229863
    Abstract: The invention relates to a phase module (1) for a power converter (2) comprising at least one switching element (10) and a heatsink (13). In order to improve the cooling properties of a phase module (1), it is proposed that the switching element (10) is connected to the heatsink (13), wherein the connection between switching element (10) and heatsink (13) is a non-detachable connection. The invention further relates to a power converter (2) comprising at least one phase module (1) of this type and a method for producing a phase module (1) of this type, wherein in order to produce a connection between the switching element (10) and the heatsink (13), the switching element (10) is soldered, sintered or glued onto the heatsink (13).
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: March 12, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventors: Roland Lorz, Rainer Sommer
  • Patent number: 10177110
    Abstract: An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: January 8, 2019
    Assignee: Renesas Electronics Corporation
    Inventor: Koji Bando
  • Patent number: 10178812
    Abstract: A heat dissipation device includes an air guiding cover and a heat conduction plate. The air guiding cover includes an air duct configured to guide an airflow and including a mounting window formed on a sidewall of the air duct, an air inlet formed at a first end of the air duct, and an air outlet formed at a second end of the air duct. The heat conduction plate is disposed at the mounting window and covers the mounting window.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: January 8, 2019
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Yin Tang, Xifeng Zhao, Tao Zhao, Xiaokai Guo, Yanxin Huang
  • Patent number: 10177070
    Abstract: A flexible graphite sheet support structure forms a thermal management arrangement for device having a heat source. The flexible graphite sheet support structure includes first and second spaced apart support members and a flexible graphite sheet secured to the spaced apart support members forming a free standing flex accommodating section that spans between them. Curve retention members having convex curved surfaces are used to keep the flex accommodating section in a bell shaped curve while preventing the flexible graphite sheet from exceeding a minimum bend radius. The thermal management arrangement formed by the flexible graphite sheet support structure enables the flexible graphite sheet to move heat from one support structure to the other while reducing the transmission of vibration between them and allowing relative movement between the spaced apart support structures.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 8, 2019
    Assignee: NeoGraf Solutions, LLC
    Inventors: Frank P. Dornauer, Greg P. Kramer, Martin D. Smalc
  • Patent number: 10144360
    Abstract: A bracket and restraints control module assembly attached to the tunnel in the floor of a vehicle. The bracket includes a base plate and an intermediate plate supporting the restraints control module. The intermediate plate defines a plurality of holes and is secured by a limited slip connector assembly that extend through laterally elongated slots defined by the base plate and holes in the intermediate plate, respectively. The connector assembly is tightened to a predetermined level of torque so that the intermediate plate can slide relative to the base plate on upper and lower slide surfaces when a collision force of sufficient magnitude is applied to the bracket and RCM assembly.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: December 4, 2018
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Mohamed Ridha Baccouche, Saied Nusier, David James Bauch, Mahmoud Yousef Ghannam
  • Patent number: 10143116
    Abstract: In accordance with presently disclosed embodiments, an uninterruptable power supply (UPS) is provided. The UPS utilizes two chambers, one which is pneumatically sealed to house control electronics, and one that is not sealed that houses transformers. The pneumatically sealed compartment is cooled through a heat exchanger or air conditioner as well as through a heat sink. The chamber which houses the transformers is cooled by a fan which circulates air from outside the chamber through the chamber and out vents in a wall of the chamber. The UPS may utilizes a series of ducts to direct air flow into the chamber housing the transformers in such a way that the air enters the bottom of the chamber past the control electronics and through vents near the front of the chamber. The UPS may utilize a series of ducts to direct air flow past the heat sink attached to the pneumatically sealed chamber.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: November 27, 2018
    Assignee: Toshiba International Corporation
    Inventor: William Lewis McCollum
  • Patent number: 10123442
    Abstract: A high power density power supply includes a plurality of cooling fans in a casing. Two sides of the cooling fans are provided with a first filter circuit board and a plurality of power modules, respectively. The first filter circuit board includes a first filter thereon. A plurality of second filter circuit boards are provided on top of the cooling fans, respectively. A second filter is disposed beneath each of the second filter circuit boards. The first filter, the second filter and the power modules are staggered each other, which takes advantage of the upper and lower spaces of the power supply to provide a good heat flow path so that the cooling fans can perform heat dissipation effectively for the power modules. The high power density power supply can achieve a better cooling effect in the casing of the same size.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: November 6, 2018
    Assignee: CHYNG HONG ELECTRONIC CO., LTD.
    Inventor: Mu-Chun Lin
  • Patent number: 10008953
    Abstract: An uninterruptible power-supply system is a power converter having a PN laminated bus bar and a plurality of power conversion units and supplying power from a commercial power supply via a converter and an inverter. The power conversion units each have positive side terminals connected to each other and negative side terminals connected to each other through the PN laminated bus bar. At least one power conversion unit constitutes a phase of the converter. At least another one power conversion unit constitutes a phase of the inverter and has the positive side terminal lying adjacent to and connected through the PN laminated bus bar to the positive side terminal of the corresponding power conversion unit constituting the phase of the converter and the negative side terminal lying adjacent to and connected to the negative side terminal of the corresponding power conversion unit constituting the phase of the converter.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: June 26, 2018
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Kamizuma, Yukio Hattori, Tetsuya Kawashima, Akira Mima, Daisuke Matsumoto, Yuuichi Mabuchi
  • Patent number: 9986665
    Abstract: A power conversion apparatus includes a first power converter, second power converter, a case, and partitioning portion. The first power converter performs power conversion. The second power converter performs power conversion. The case houses the first power converter and the second power converter. The partitioning portion partitions the first power converter and the second power converter housed in the case, and forms a coolant flow passage through which a coolant flows. The first power converter includes a first heat-generating component. The second power converter includes a second heat-generating component. The first heat-generating component and the second heat-generating component are each joined to the partitioning portion at a position at which the first heat-generating component and the second heat-generating component do not overlap each other in a perpendicular direction perpendicular to a coolant flow direction of the coolant flow passage.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: May 29, 2018
    Assignee: DENSO CORPORATION
    Inventor: Kazuhiro Kosaka
  • Patent number: 9894805
    Abstract: A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: February 13, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Yong Kim, Yu-Sung Kim, Chung-Hyun Ryu, Sung-Ki Lee
  • Patent number: 9877380
    Abstract: An arrangement for electromagnetic shielding of an electronic component attached to a substrate is described. The arrangement comprises an electrically conductive frame which is attached to the substrate in such a way that the frame frames the component. The arrangement further comprises an electrically conductive covering which is attached at least to a portion of a top side of the component, and which is electrically conductively attached at least to a portion of the frame. Furthermore, a method for electromagnetic shielding of the electronic component attached to the substrate and also a computer program product for carrying out the method are described.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: January 23, 2018
    Assignee: E. SOLUTIONS GmbH
    Inventors: Martin Wanner, Meik Wilhelm Widmer, Thomas Woerz
  • Patent number: 9865529
    Abstract: A semiconductor module including a circuit block that has an electrically insulating layer, a plurality of circuit patterns formed on one surface of the electrically insulating layer, and a plurality of power semiconductors mounted on the circuit patterns. The semiconductor module further includes a heat spreader formed on the other surface of the electrically insulating layer, and a capacitor having two electrodes, one of which is electrically connected to at least one of the circuit patterns, and the other of which is electrically connected to the heat spreader.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: January 9, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Tadahiko Sato
  • Patent number: 9795066
    Abstract: An inverter is provided. In the inverter, an electronic device is disposed inside a first enclosure; a heat radiator and a cooling fan are disposed inside a second enclosure; a magnetic element is disposed outside the first enclosure and the second enclosure. In this way, the cooling effect on the electronic device inside the first enclosure and the heat radiator inside the second enclosure are increased as they may be less affected by the heat generated by the magnetic element. It is also beneficial to heat dissipation of the magnetic element. The cooling fan blows the heat radiator for heat dissipation; the magnetic element does not block the relatively cold air flowing through the heat radiator. Therefore, a less obstructed air duct is formed, and the dissipation effect is improved.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: October 17, 2017
    Assignee: SUNGROW POWER SUPPLY CO., LTD.
    Inventors: Puyun Dong, Yonghong Li, Hao Zhou, Jianhua Mao
  • Patent number: 9723743
    Abstract: An electrical service interface system include an energy storage device and inverter mounted to a transformer tower, wherein each of the energy storage device and inverter include guide wheels configured to rollably mount the energy storage device and inverter to corresponding guide rails mounted to a support pad, and to align the energy storage device to the inverter, and the inverter to the transformer tower. In an installed configuration, the energy storage device electrically and mechanically couples to the inverter via a DC connector and one or more latching mechanisms, and the inverter mechanically and electrically couples to the transformer tower via an AC connector and one or more latching mechanisms.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: August 1, 2017
    Assignee: SAN DIEGO GAS & ELECTRIC COMPANY
    Inventor: Thomas Owen Bialek
  • Patent number: 9634468
    Abstract: A switchgear cabinet comprising a cabinet frame, first and second current converter devices, and an electrical connection clamping device. The first current converter device has first DC voltage positive and negative potential connection elements. The second current converter device has second DC voltage positive and negative potential connection elements. The electrical connection clamping device has an electrically conductive first clamping element and an electrically conductive second clamping element which is electrically insulated from the electrically conductive first clamping element, and a pressure-generating device which generates a pressure that pushes the second clamping element towards the first clamping element. The first clamping element is mechanically connected to the cabinet frame by an electrically non-conductive insulation body such that the first clamping element is electrically insulated from the cabinet frame.
    Type: Grant
    Filed: August 22, 2015
    Date of Patent: April 25, 2017
    Assignee: Semikron Elekronik GmbH & Co., KG
    Inventors: Aurélien Gaumon, Yann Lissilour, Sébastien Touzard
  • Patent number: 9589925
    Abstract: Disclosed is a method for bonding with a silver paste, the method including: coating a silver paste on a semiconductor device or a substrate, the silver paste containing silver and indium; disposing the semiconductor on the substrate; and heating the silver paste to form a bonding layer, wherein the semiconductor device and the substrate are bonded to each other through the bonding layer, and wherein the indium is contained in the silver paste at 40 mole % or less.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: March 7, 2017
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Kyoung-Kook Hong, Hyun Woo Noh, Youngkyun Jung, Dae Hwan Chun, Jong Seok Lee, Su Bin Kang