CMP apparatus
The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin.
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1. Field of the Invention
The present invention relates to a CMP apparatus.
2. Description of the Prior Art
Chemical mechanical polishing (CMP) apparatus are used for the purpose of flattening polishing target members, such as wafer, interconnection layer and insulating layer surfaces, in the processes for manufacturing IC devices, LSIs and other semiconductor devices, and substrates for thin film magnetic heads, among others.
In CMP apparatus, polishing is carried out by dropping a slurry (abrasive slurry) onto an polishing pad. There is a problem, however; on the occasion of polishing, splashes of the slurry are scattered and stick to the inside walls of the apparatus main body made of a SUS stainless steel, acrylic resin, polycarbonate resin, rigid poly(vinyl chloride) resin or the like and the inside surfaces of other apparatus and they then dry and become fixed to such walls or surfaces.
In case such fixed slurry splashes, after gradual deposition, fall off from the surface on which they have remained onto the surface under polishing, a problem arises: scratches are given to the product, making the same fail to meet the standard. Further, when the member surrounding the polishing machine in a CMP apparatus is made of a transparent resin, the slurry adhesion produces another problem: the apparatus inside can no longer be observed by the eye.
Therefore, it is necessary to periodically wash off the slurry adhering to the CMP apparatus inside surfaces. However, it is a problem that the slurry once fixed thereto can hardly be removed and the working efficiency is low.
In the art, the slurry adhering to the inside surfaces of a CMP apparatus is removed by splashing water or a cleaner on those surfaces, followed by rubbing with a cloth or brush. In particular, various cleaners are available on the market but are expensive; and, there is still a problem that a satisfactory level of cleanability has not yet attained with them.
Patent Document 1 (Japanese Kokai (Laid-open) Publication 2005-39198) discloses a method of cleaning the inside surfaces of a semiconductor device manufacturing apparatus. This method relates to a solution for cleaning off the adhering slurry and/or heavy metals and to a cleaning step. There is still a problem, however; the solution is expensive and the cleanability is not yet sufficient.
BRIEF SUMMARY OF THE INVENTIONIn view of the above-discussed state of the art, it is an object of the present invention to provide a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance.
The invention provides a CMP apparatus, at least one covering target selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin.
[
- 1. Polishing pad
- 2. Polishing head
- 3. Surface plate
- 4. Slurry feed pipe
- 5. Slurry
- 6. Packing material
- 7. Polishing target member (Member to be polished)
In the following, the invention is described in detail.
Structurally, the CMP apparatus of the invention is not particularly restricted but may be, for example, an apparatus comprising a polishing pad (1), a polishing head (2), a surface plate (3) and a slurry feed pipe (4), as schematically shown in
According to the schematic depiction shown in
The respective constituent members of the CMP apparatus are not particularly restricted but can be provided using the members known in the art.
For example, the surface plate (3) can be provided using a ceramic material or a metal such as SUS stainless steel, the polishing pad (1) using a thermoplastic resin such as foamed polyurethane, and the slurry feed pipe (4) using a ceramic material, a metal such as SUS stainless steel, or a thermoplastic resin, for instance. The member surrounding the polishing machine in the CMP apparatus shown, namely the apparatus main body inside wall, can be made of glass, SUS stainless steel, aluminum, a polycarbonate resin, an acrylic resin or a rigid poly(vinyl chloride) resin, for instance.
In the CMP apparatus of the invention, at least one covering target selected from the group consisting of the head portion surface and arm portion surface, the slurry feed pipe surface and the apparatus main body inside wall is coated or covered with a fluororesin.
The fluoropolymer constituting the fluororesin comprises a homopolymer chain or copolymer chain containing at least one fluorine-containing monomer-derived repeating unit species, and the polymer chain may be one resulting from polymerization of a fluorine-containing monomer alone or a polymer chain resulting from polymerization of a fluorine-containing monomer and a fluorine-free monomer.
The fluorine-containing monomer is an olefinically unsaturated monomer having a fluorine atom and includes, among others, tetrafluoroethylene [TFE], vinylidene fluoride, chlorotrifluoroethylene [CTFE], vinyl fluoride, hexafluoropropylene [HFP], hexafluoroisobutene, monomers represented by the formula CH2═CX1(CF2)nX2 (wherein X1 is H or F, X2 is H, F or Cl and n is an integer of 1 to 10), and perfluoro(alkyl vinyl ether) [PAVE] species. As the PAVE species, there may be mentioned, for example, perfluoro(methyl vinyl ether) [PMVE], perfluoro(ethyl vinyl ether) [PEVE] and perfluoro(propyl vinyl ether) [PPVE], among others.
From the viewpoint of thermal stability and/or chemical resistance, among others, the fluorine-free monomer is preferably selected from among ethylenic monomers containing not more than 5 carbon atoms, such as ethylene, propylene, 1-butene, 2-butene, vinyl chloride and vinylidene chloride.
As the above fluoropolymer, there may be mentioned, for example, polytetrafluoroethylene [PTFE], ethylene/TFE copolymer [ETFE], TFE/PAVE copolymer [PFA] and TFE/HFP copolymer [FEP]. Among them, those fluoropolymers which comprise the TFE unit as an essential, component are preferred from the chemical resistance viewpoint, and FEP is more preferred from the transparency and chemical resistance viewpoint.
The PTFE so referred to herein may be a tetrafluoroethylene [TFE] homopolymer or a modification of polytetrafluoroethylene [modified PTFE].
The “modified PTFE” so referred to herein is a TFE copolymer obtained by subjecting a very small proportion of a monomer other than TFE, together with TFE, to polymerization so long as that the very small proportion monomer do not substantially deteriorate the properties of the TFE homopolymer. The monomer other than TFE may comprise one single species or a combination of two or more species.
As the above monomer other than TFE, there may be mentioned, for example, the above-mentioned fluorine-containing monomers and fluorine-free monomers.
Generally, the total content of the repeating unit(s) derived from the monomer(s) other than TFE is preferably not higher than 1% by mass, more preferably not higher than 0.5% by mass, of the total amount of the repeating units derived from all the monomers constituting the PTFE.
The above-mentioned fluoropolymer is preferably an adhesive fluoropolymer in view of the latter's bondability or ability of being covered in forming laminates with those thermoplastic resins described later herein.
The adhesive fluoropolymer generally means a fluoropolymer containing a bonding group capable of chemically binding to another material in contact therewith. A fluororesin constituted of an adhesive fluoropolymer is sometimes referred to herein as “adhesive fluororesin”.
The bonding group is preferably at least one species selected from the group consisting of carbonyl group [—C(═O)—], a carbonyl group-containing group, epoxy group, hydroxyl group, an amino group, a silyl group, carbon-carbon double bond, sulfonic acid group, ether bond [—O—] and cyano group and, more preferably, it is carbonyl group or a carbonyl group-containing group.
The carbonyl group-containing group is a functional group containing —C(═O)— basically capable of reacting with such a functional group as amido group [—C(═O)NH—] and an amino group and include, for example, a carbonato group [—OC(═O)O—R group; R being an organic group (e.g. C1-C20 alkyl, ether bond-containing C2-C20 alkyl, etc.)], a haloformyl group [—C(═O)X; X is a halogen element], a formyl group [—C(═O)H], a ketone [R1—C(═O)—R2], carboxyl group [—C(═O)OH], an ester bond [—C(═O)OR1], acid anhydride [—C(═O)O—C(═O)—] and isocyanato group (—N═C═O), among others (R1 and R2 being the same or different and each representing an organic group containing 1 to 20 carbon atoms).
As a monomer having the above-mentioned carboxyl and acid anhydride group, there may be mentioned, among others, maleic acid, itaconic acid, citraconic acid as well as maleic anhydride, itaconic anhydride and citraconic anhydride.
The number of carbonyl groups in the above-mentioned fluoropolymer can be properly selected according, among others, to the thermoplastic resin layer or adhesive layer species, which is described later herein and is to come into contact with the fluoropolymer; however, it is preferably 3 to 1000, in total, per 1×106 main chain carbon atoms. The number of carbonyl groups is more preferably 3 to 500, still more preferably 10 to 300.
The number of carbonyl groups, so referred to herein, is measured by infrared absorption spectrometry according to the method of determining the number of carbonyl group-containing functional groups as described in International Laid-open Publication WO 99/45044.
From the viewpoint of its moldability with the thermoplastic resin layer described later herein, the fluoropolymer preferably has a melting point of 150 to 270° C., more preferably not higher than 230° C., still more preferably not higher than 210° C.
The above melting point is determined as the temperature corresponding to the maximum value of a thermal melting curve obtained by measurement using a differential scanning calorimeter at a programming rate of 10° C./minute.
The above-mentioned fluoropolymer preferably shows a melt flow rate [MFR] of 0.5 to 100 (g/10 minutes), more preferably 5 to 50 (g/10 minutes), at an arbitrary temperature within the range of about 230 to 300° C.
In determining the above MFR, a melt indexer (product of Toyo Seiki Seisakusho Co., Ltd.) is used, the polymer is allowed to flow out at any temperature within the above range through a nozzle with a diameter of 2 mm and a length of 8 mm under a load of 5 kg over a unit period of time (10 minutes), and the portion of the polymer that has flowed out is weighed (g).
The above-mentioned fluoropolymer can be prepared in the conventional manner, for example by suspension polymerization, solution polymerization, emulsion polymerization or bulk polymerization.
In the case of preparing the above-mentioned adhesive fluoropolymer as the fluoropolymer, a carbonyl group can be introduced into the polymer chain terminus, for example by carrying out the polymerization using a polymerization initiator containing a carbonyl group or a functional group convertible to a carbonyl group.
The fluororesin to be used in the practice of the invention can be used, in the form of a fluororesin-based powder coating composition or a film, for coating or covering the covering target.
The average particle diameter of the fluororesin-based powder coating composition may be properly selected according to the desired thickness of the coat film. Preferably, it is 10 to 100 μm.
The average particle diameter of the fluororesin-based powder coating composition, so referred to herein, is the value measured using a laser diffraction particle size distribution analyzer (product of Shimadzu Corporation).
The fluororesin-based powder coating composition and film mentioned above each can be prepared by any of the conventional methods known in the art. Commercial products may also be obtained and used.
In the CMP apparatus of the invention, the above-mentioned fluororesin can be applied to the covering target, for example, by (1) the method comprising applying the fluororesin in the form of a powder coating composition to the covering target or (2) the method comprising applying a film formed from the fluororesin to the covering target.
In the practice of the invention, it is preferred from the slurry adhesion prevention, adhering slurry removal and chemical resistance viewpoint that the covering target be coated or covered with the fluororesin so that the fluororesin may constitute the outermost surface thereof.
The above-mentioned method (1) is preferred since it facilitates the covering of covering targets complicated in shape, such as the head member and arm member of the polishing pad, and the slurry feed pipe.
Preferred as the fluororesin to be used in carrying out the above method (1) are, for example, FEP, ETFE, PFA and PCTFE, among others.
The technique of application in the above (1) is not particularly restricted but, for example, the electrostatic powder coating technique may be mentioned.
When the covering target is made of such a metal as SUS stainless steel, the above method (1) can appropriately be carried out in the manner of electrostatic powder coating.
In carrying out the method (1), the fluororesin-based powder coating composition can be applied so that the coat layer thickness after baking or sintering may preferably amount to 10 to 200 μm, more preferably 50 to 100 μm.
The coat layer thickness as well as the total thickness of the single layer film or laminate to be described later herein and the thickness of each laminate-constituting layer, so referred to herein, are measured by cutting out a thin test specimen from the measurement target coat layer, film or laminate in the direction of thickness using a cutting instrument and observing the section thereof by the eye using an image measuring system.
When the fluororesin employed is an adhesive fluororesin, the above method (1) does not always require the use of a primer. In the case of a non-adhesive fluororesin, a primer is preferably used from the adhesion viewpoint. As the primer, there may be mentioned primers comprising an aromatic resin and a fluororesin, for instance.
The fluororesin to be used in the primer is not particularly restricted but may be the same species as or a species different from the fluororesin constituting the fluororesin-based powder coating composition mentioned above. From the adhesion viewpoint, however, the same species is preferred.
The covering with a fluororesin using the above method (2) is also preferable in that the covering film can be easily replaced according to need. The method (2) is suited for covering the inside wall of the CMP apparatus main body.
The above method (2) includes, among others, (2-1) the method comprising putting or sticking a single-layer fluororesin film on the covering target and (2-2) the method comprising putting or sticking, on the covering target, a laminate comprising a fluororesin layer and a thermoplastic resin layer made of a thermoplastic resin other than the fluororesin.
The adhesive fluororesin mentioned hereinabove is used as the fluororesin in the above method (2-2). The fluororesin layer made of such adhesive fluororesin is sometimes referred to herein as “adhesive fluororesin layer”.
Even when the fluororesin employed is not an adhesive fluororesin, the above method (2-1) makes it possible to cover the covering target by sticking a single-layer fluororesin film to a laminate comprising the fluororesin single layer provided with an adhesive layer and applying the adhesive layer side of the laminate to the covering target. Thus, the above method is preferred in that various fluororesins can be widely used and no thermoplastic resin layer is required to be used, hence the process can be simplified.
In carrying out the above method (2-1), the single-layer fluororesin film is not always required to be made of an adhesive fluororesin since it comprises an adhesive layer and can be stuck onto the covering target; thus, any non-adhesive fluororesin can suitably be used. Preferred as the fluororesin to be used in carrying out the method (2-1) are FEP, ETFE, PFA and PCTFE, among others.
The above-mentioned fluororesin single layer is a film obtained by molding the above-mentioned fluororesin and can be prepared in the conventional manner.
As for the thickness of the fluororesin single layer, an excessively thin layer is too pliable and hard to apply and, when the slurry is acidic or alkaline, is inferior in chemical resistance, whereas an excessively thick layer raises the cost. Thus, the thickness is preferably 20 to 200 μm, more preferably 50 to 100 μm, according to the pH of the slurry to be used.
The adhesive layer in the above method (2-1) may be any one comprising an adhesive showing tackiness to both the covering target and the fluororesin.
The above-mentioned adhesive layer is not particularly restricted but preferably is one mainly constituted of a natural rubber-based adhesive, synthetic rubber-based adhesive, acrylic-based adhesive or silicone-based adhesive.
From the viewpoint of adhesion between the covering target and fluororesin single layer, the adhesive layer preferably has a thickness of 5 to 100 μm, more preferably 10 to 50 μm.
The above-mentioned method (2-1) can be carried out, for example, by sticking a single-layer fluororesin film having an adhesive layer provided on the fluororesin single layer to the covering target with the adhesive layer side against the covering target.
As an example of the method of providing such fluororesin single layer with an adhesive layer, there may be mentioned the method comprising subjecting the fluororesin single layer surface to corona discharge treatment to improve the wettability thereof, followed by coating thereof with the adhesive.
The conditions under which the adhesive application and fluororesin film contact bonding, among others, are carried out in practicing the above method (2-1) can be properly selected according to the adhesive used, the fluororesin species, the thickness and so forth.
The covering with a fluororesin using the method (2-2) is preferred in that the adhesive fluororesin layer can be used for covering in the form of a firm laminate and that the amount of the fluororesin to be used can be reduced and, thus, the material cost can be reduced.
In the above method (2-2), the laminate-constituting adhesive fluororesin layer serves as the outermost surface layer. The adhesive fluororesins mentioned above can be used as adhesive fluororesin constituting the adhesive fluororesin layer.
The thermoplastic resin constituting the above-mentioned thermoplastic resin layer is not particularly restricted but may be any one that shows adhesiveness to the adhesive fluororesin layer and stickiness to the adhesive layer.
The melting point of the thermoplastic resin is not particularly restricted but, when the adhesion to the adhesive fluororesin layer is realized, for example, by the extrusion technique, such as coextrusion or extrusion lamination, which is described later herein, it is generally 100 to 300° C., preferably 120 to 250° C.
The above-mentioned extrusion lamination technique means the technique comprising feeding a film or sheet or the like molded in advance in the form of a roll and pressing, against the same, a film or sheet just after leaving the flat die of an extruder by means of a roll to attain lamination.
In carrying out the method (2-2), the thermoplastic resin to be used for constituting the thermoplastic resin layer is not particularly restricted but includes, for example, polyamide resins, ethylene/vinyl alcohol resins and epoxy-modified polyethylene resins, among others.
When the thermoplastic resin is selected from the group consisting of polyamide resin, ethylene/vinyl alcohol resin and epoxy-modified polyethylene resin, the resin is well compatible with the adhesive and a sufficiently high level of adhesion to the covering target can be attained. Furthermore, in making a replacement of the laminate composed of the adhesive fluororesin layer and thermoplastic resin layer, the old laminate can be peeled off from the covering target in the state of the adhesive layer remaining sticking to the laminate side, so that the adhesive layer will not remain on the covering target; hence, the workability is good.
The above-mentioned polyamide resin is not particularly restricted but include, among others, nylon 6, nylon 66, nylon 11, nylon 12, nylon 610, nylon 612, nylon 46, metaxylylenediamine/adipic acid polymer, nylon 6/66 copolymer and nylon 66/12 copolymer.
The ethylene/vinyl alcohol resin mentioned above preferably has an ethylene unit content of 10 to 50% by mass and preferably has a degree of hydrolysis of 50 to 100%.
As the above-mentioned epoxy-modified polyethylene resin, there may be mentioned glycidyl methacrylate/ethylene copolymer, among others.
Preferred as the above-mentioned thermoplastic resin is polyamide resin in view of their good chemical resistance; among others, nylon 6/66 copolymer, nylon 6, nylon 12 and the like are preferred.
The above-mentioned adhesive fluororesin layer/thermo-plastic resin layer laminate can be prepared by such a conventional extrusion technique as coextrusion or extrusion lamination.
The conditions under which the above-mentioned adhesive fluororesin and thermoplastic resin are molded can be properly selected according to the respective material species in the adhesive fluororesin layer and thermoplastic resin layer, the layer thicknesses and so forth.
The laminate consisting of the adhesive fluororesin layer and thermoplastic resin layer preferably has a total thickness of 30 to 500 μm, more preferably 50 to 200 μm so that the effects of the invention may industrially be produced.
The adhesive fluororesin layer preferably has a thickness of 1 to 20 μm. When the adhesive fluororesin layer is thinner than 1 μm, pinhole formation may occur and, when it is thicker than 20 μm, the material cost increases. A more preferred lower limit to the adhesive fluororesin layer thickness is 5 μm, and a more preferred upper limit thereto is 15 μm.
From the viewpoint of adhesion between the covering target and thermoplastic resin layer, the adhesive layer preferably has a thickness of 5 to 100 μm, more preferably 10 to 50 μm.
The above-mentioned method (2-2) can be carried out, for example, by providing the laminate consisting of an adhesive fluororesin layer and a thermoplastic resin layer with an adhesive layer and then applying the adhesive layer side of the laminate to the covering target for adhesion. The adhesive layer can be provided, for example, by subjecting the thermoplastic resin layer surface to corona discharge treatment for improving the wettability thereof and then applying an adhesive thereto by such a method as coating.
The conditions under which the adhesive application and sticking the laminate onto the covering target, among others, are carried out in accordance with the method (2-2) can be properly selected according to the adhesive species to be used, the laminate constitution, the thickness thereof and so forth.
The CMP apparatus of the invention, which has chemical resistance and comprises the above-mentioned covering target as coated or covered with a fluororesin non-adhesive to the slurry, can reduce the slurry adhesion during use and facilitate the slurry removal by cleaning and, further, is resistant to corrosion caused by the acidic or alkaline slurry or by the cleaning solution.
The CMP apparatus of the invention can be deprived of the adhering slurry exhaustively without carrying out any rubbing operation or using any particular cleaning solution in the step of cleaning, unlike in the prior art, although rubbing using such a tool as a brush may be made in the step of cleaning; for example, washing with water alone can produce an excellent cleaning effect.
The CMP apparatus, which has the constitution described hereinabove, can inhibit slurry adhesion thereto, can easily be deprived of the slurry fixed thereto by cleaning, and is excellent in chemical resistance.
BEST MODES FOR CARRYING OUT THE INVENTIONThe following examples, inclusive of comparative examples, illustrate the present invention in further detail. These examples and comparative examples are, however, by no means limitative of the scope of the invention.
In the examples and comparative examples, the composition-related amounts shown are respectively on a mass basis, unless otherwise specified.
The measured values given in the examples and comparative examples are the values determined by the respective method described below.
1. Monomer Unit ContentsThey were determined by carrying out 19F-NMR analysis.
2. Number of Carbonate Terminal GroupsThe number was determined by infrared absorption spectrum analysis according to the method of determining the number of carbonyl group-containing functional groups as described in International Laid-open Publication WO 99/45044 using a Fourier transform infrared spectrophotometer (product of Perkin-Elmer).
3. Melting PointMeasurements were made at a programming rate of 10° C./minute using a differential scanning calorimeter (product of Seiko). The temperature corresponding to the maximum melting peak value obtained was reported as the melting point.
4. Thickness of Each LayerThin test specimens (thickness, 300 μm) were cut out from the measurement target in the direction of thickness using a cutting instrument and the thickness of each layer was determined by observing the section of each specimen by the eye using an image measuring system (product of Mitutoyo Corp.).
5. Adhesion StrengthTest specimens, 1 cm in width, were cut out from the laminate film (laminate) and subjected to 180° peel testing at a rate of 25 mm/minute using a Tensilon universal testing machine (product of Orientec Co.). The mean of five maxima on an elongation-tensile strength graph was reported as the adhesion strength.
6. Average Particle DiameterMeasurements were made using a laser diffraction particle size distribution analyzer (product of Shimadzu Corp.).
SYNTHESIS EXAMPLE 1 Fluororesin SynthesisA 820-L glass-lined autoclave was charged with 200 L of pure water and, after sufficient substitution of the system inside gas with nitrogen and the subsequent evacuation, further charged with 113 kg of 1-fluoro-1,1-dichloroethane, 95 kg of hexafluoropropylene and 85 g of cyclohexane. Then, 292 g of perfluoro(1,1,5-trihydro-1-pentene) [CH2═CF(CF2)3H] was fed into the autoclave by means of nitrogen gas, and the vessel inside temperature was maintained at 35° C. and the stirring rate at 200 rpm. Further, tetrafluoroethylene was fed under pressure until arrival of the inside pressure at 7.25 kg/cm2G and then ethylene was fed under pressure until arrival of the inside pressure at 8 kg/cm2G.
Then, 1.9 kg of a 50% (by mass) solution of di-n-propyl peroxydicarbonate in methanol was fed to the autoclave to initiate the polymerization. The polymerization was continued while maintaining the polymerization pressure at 8 kg/cm2G by additionally feeding, under pressure, a tetrafluoroethylene/ethylene/hexafluoropropylene mixed gas (mole ratio=39.2:43.6:17.3) to compensate the decrease in vessel inside pressure with the progress of the polymerization. During the polymerization, 1100 g of CH2═CF(CF2)3H was fed, in 20 divided portions, using a micropump and the polymerization was carried out for a total of 32 hours. After completion of the polymerization, the contents were recovered and washed with water to give 95 kg of a powdery fluororesin.
The fluororesin obtained had a monomer unit content ratio (ratio by mass) of TFE/Et/HFP/[CH2═CF(CF2)3H]=38.9/45.9/14.8/0.4, the number of carbonate groups as contained therein was 411 per 1×106 main chain carbon atoms, and the melting point thereof was 171.8° C.
EXAMPLE 1The fluororesin obtained in Synthesis Example 1 and a nylon 6/66 copolymer (Novamid 2430J, product of Mitsubishi Engineering-Plastics Corp.) were subjected to coextrusion using a T die film molding machine (product of Ikegai Corp.) to give a two-layer laminate film (thickness: EFEP layer 10 μm, nylon 6/66 copolymer layer 70 μm, total 80 μm).
Upon adhesion strength measurement of the above laminate film, peeling was impossible.
The nylon 6/66 copolymer side of the above laminate film was coated with an acrylic adhesive (product name S153B, product of Toyo Ink Manufacturing Co.) using a doctor roll coater and the laminate was then stuck on the surface of a rigid poly(vinyl chloride) sheet (30 mm×50 mm in size), and the whole was placed on the inside surface of a CMP apparatus (Musashino Denshi Kogyo's MA-200).
EXAMPLES 2 AND 3A laminate film was produced in the same manner as in Example 1 except that an ethylene/vinyl acetate copolymer (F101A, product of Kuraray Co.) or epoxy-modified polyethylene (Bondfast E, product of Sumitomo Chemical Co.) was used in lieu of the nylon 6/66 copolymer. Each laminate was placed on the inside surface of the CMP apparatus.
EXAMPLE 4A powder coating composition with an average particle diameter of 30 μm was prepared by compressing the fluororesin obtained in Synthesis Example 1 using a roller compactor (product of Matubo Corp.), followed by grinding under particle diameter adjustment.
Further, the above powder coating composition was applied to a SUS stainless steel substrate (30 mm×50 mm) to a layer thickness of 80 μm by the technique of electrostatic powder coating and the coat layer was heated at 200° C. to give a coat layer. The adhesion strength of the coat layer obtained was 13 N/cm. This fluororesin-coated SUS stainless steel sheet was placed on the inside wall of a CMP apparatus (Musashino Denshi Kogyo's MA-200).
COMPARATIVE EXAMPLE 1A SUS stainless steel sheet (30 mm×50 mm in size) was placed on the inside surface of a CMP apparatus (Musashino Denshi Kogyo's MA-200).
COMPARATIVE EXAMPLE 2A rigid poly(vinyl chloride) sheet (30 mm×50 mm in size) was placed on the inside surface of a CMP apparatus (Musashino Denshi Kogyo's MA-200).
TEST EXAMPLEThe CMP apparatus referred to in Examples 1 to 4 and Comparative Examples 1 and 2 was used and operated at 150 rpm while dropping a slurry (Japan Cabot Microelectronics' Semi-Sperse 25-E) onto a polishing pad. The extent of sticking of the slurry thus splashed was observed by the eye for evaluation according to the following criteria.
(Sticking Evaluation Criteria)0: The area covered by slurry splashes is not greater than ⅕ of the area of the sheet placed.
Δ: The area covered by slurry splashes is greater than ⅕ but not greater than ½ of the area of the sheet placed.
X: The area covered by slurry splashed is greater than ½ of the area of the sheet placed.
Further, each sheet placed with slurry splashes sticking thereto was dried at ordinary temperature for 24 hours and then washed by pouring pure water at ordinary temperature thereon for 10 seconds. The cleanability was evaluated according to the following criteria.
(Cleanability Evaluation Criteria)O: The sticking matter can be completely removed.
Δ: The sticking matter remains, though in a very small proportion.
X: The sticking matter can hardly be removed.
The results obtained in the above tests are shown in Table 1.
The above results revealed that the fluororesin-coated or covered CMP apparatus is less susceptible to slurry adhesion and can easily be cleaned.
Claims
1-10. (canceled)
11. A CMP apparatus comprising a main body including an inside wall, said main body housing a surface plate and a polishing pad disposed on said surface plate, a polishing head including a first surface facing the polishing pad and an arm connected to a second surface of the polishing head, and a slurry feed pipe for dispensing a polishing slurry, wherein an inside surface of said CMP apparatus is covered with a single-layer fluororesin film.
12. The CMP apparatus as claimed in claim 11, wherein a surface of said arm is covered with a single-layer fluororesin film via an adhesive layer.
13. The CMP apparatus as claimed in claim 11, wherein a surface of said inside wall is covered with a single-layer fluororesin film via an adhesive layer.
14. The CMP apparatus as claimed in claim 11, adapted for polishing a polishing target member positioned between the polishing pad and the first surface of the polishing head, and wherein said polishing head and surface plate are movable relative to one another.
15. The CMP apparatus as claimed in claim 11, wherein said arm is connected to a second surface of the polishing head opposite the first surface and is rotatable.
16. A CMP apparatus comprising a main body including an inside wall, said main body housing a surface plate and a polishing pad disposed on said surface plate, a polishing head including a first surface facing the polishing pad and an arm connected to a second surface of the polishing head, and a slurry feed pipe for dispensing a polishing slurry, wherein an inside surface of said CMP apparatus is covered with a laminate of a fluororesin layer and a thermoplastic resin layer made of a thermoplastic resin other than said fluororesin.
17. The CMP apparatus as claimed in claim 16, wherein the internal surface is covered with said laminate via an adhesive layer and said thermoplastic resin layer of the laminate is closer to the covered surface than the fluororesin layer.
18. The CMP apparatus as claimed in claim 16, wherein said fluororesin layer comprises a fluororesin containing at least one bonding group selected from the group consisting of a carbonyl group, a carbonyl group-containing group, an epoxy group, a hydroxyl group, an amino group, a silyl group, a group containing a carbon-carbon double bond, a sulfonic acid group, a group containing an ether bond and a cyano group.
19. The CMP apparatus as claimed in claim 17, wherein said adhesive layer comprises an acrylic adhesive.
20. The CMP apparatus as claimed in claim 16, wherein a surface of said arm is covered with said laminate via an adhesive layer.
21. The CMP apparatus as claimed in claim 16 wherein a surface of said inside wall is covered with said laminate via an adhesive layer.
22. The CMP apparatus as claimed in claim 16, wherein the thermoplastic resin layer of said laminate comprises a polyamide resin.
23. The CMP apparatus as claimed in claim 16, wherein the thermoplastic resin layer of said laminate comprises an ethylene/vinyl alcohol resin.
24. The CMP apparatus as claimed in claim 16, wherein the thermoplastic resin layer of said laminate comprises an epoxy-modified polyethylene resin.
25. The CMP apparatus as claimed in claim 16, wherein the fluororesin layer of said laminate has a thickness of 1 to 20 μm.
26. A CMP apparatus comprising a main body including an inside wall, said main body housing a surface plate and a polishing pad disposed on said surface plate, a polishing head including a first surface facing the polishing pad and an arm connected to a second surface of the polishing head, and a slurry feed pipe for dispensing a polishing slurry, wherein an inside surface of said CMP apparatus is covered with a fluororesin film by applying a fluororesin-based powder coating composition to the inside surface.
27. The CMP apparatus as claimed in claim 26, wherein the fluororesin of said fluororesin-based powder coating composition contains at least one bonding group selected from the group consisting of a carbonyl group, a carbonyl group-containing group, an epoxy group, a hydroxyl group, an amino group, a silyl group, a group containing a carbon-carbon double bond, a sulfonic acid group, a group containing an ether bond and a cyano group.
28. The CMP apparatus as claimed in claim 1, wherein the single-layer fluororesin film is removable from the inside surface of the CMP apparatus.
29. The CMP apparatus as claimed in claim 16, wherein the laminate is removable from the inside surface of the CMP apparatus.
30. The CMP apparatus as claimed in claim 26, wherein the fluororesin film is removable from the inside surface of the CMP apparatus.
Type: Application
Filed: May 31, 2007
Publication Date: Dec 4, 2008
Applicant: DAIKIN INDUSTRIES, LTD. (Osaka-Shi)
Inventors: Hidenori Ozaki (Osaka), Masaji Komori (Osaka), Tatsuya Higuchi (Osaka)
Application Number: 11/806,349
