With Mounting Pad Patents (Class 361/767)
  • Patent number: 11664344
    Abstract: A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 30, 2023
    Assignee: SHINKAWA LTD.
    Inventors: Kohei Seyama, Tetsuya Utano
  • Patent number: 11658124
    Abstract: A connection structure embedded substrate includes a printed circuit board including a plurality of first insulating layers, and a plurality of first wiring layers disposed on or between the plurality of first insulating layers; and a connection structure embedded in the printed circuit board, and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers. A lowermost second insulating layer of the plurality of second insulating layers includes an organic insulating material, and is in contact with an upper surface of one of the plurality of first insulating layers.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Soon Jang, Hyung Ki Lee, Ki Suk Kim
  • Patent number: 11646331
    Abstract: This disclosure provides a package substrate including: a first dielectric layer formed of a first molding compound; a first conductive wire and a first conductive channel disposed in the first dielectric layer; a second dielectric layer formed of a second molding compound; a second conductive wire and a second conductive channel disposed in the second dielectric layer; a third dielectric layer formed of a third molding compound; a third conductive wire and a third conductive channel disposed in the third dielectric layer; a fourth dielectric layer formed of a fourth molding compound; a fourth conductive wire, a fourth conductive channel and a circuit device disposed in the fourth dielectric layer; wherein, a first empty region, a second empty region, a third empty region and a fourth empty region are formed in the first, second, third and fourth dielectric layers, respectively, and the empty regions are vertically overlapped.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: May 9, 2023
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Chun-Hsien Yu, Hsien-Ming Tsai
  • Patent number: 11646274
    Abstract: An integrated circuit package may be formed comprising a substrate that includes a mold material layer and a signal routing layer, wherein the mold material layer comprises at least one bridge and at least one foam structure embedded in a mold material. In one embodiment, the substrate may include the mold material of the mold material layer filling at least a portion of cells within the foam structure. In a further embodiment, at least two integrated circuit devices may be attached to the substrate, such that the bridge provides device-to-device interconnection between the at least two integrated circuit devices. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: May 9, 2023
    Assignee: Intel Corporation
    Inventors: Mufei Yu, Gang Duan, Edvin Cetegen, Baris Bicen, Rahul Manepalli
  • Patent number: 11646290
    Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: May 9, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
  • Patent number: 11637071
    Abstract: A package structure, including a conductive element, multiple dies, a dielectric body, a circuit layer and a patterned insulating layer, is provided. The multiple dies are disposed on the conductive element. A portion of the conductive element surrounds the multiple dies. The dielectric body covers the multiple dies. The circuit layer is disposed on the dielectric body. The circuit layer is electrically connected to the multiple dies. The patterned insulating layer covers the circuit layer. A portion of the patterned insulating layer is disposed between the dies that are adjacent. A manufacturing method of a package structure is also provided.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 25, 2023
    Assignee: Powertech Technology Inc.
    Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
  • Patent number: 11627660
    Abstract: A display apparatus, includes: a flexible circuit board including a first board pad and a second board pad, which are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction; a main circuit board coupled to the flexible circuit board; and a display panel coupled to the flexible circuit board, the display panel including a first display pad overlapped with the first board pad and a second display pad overlapped with the second board pad, wherein the first board pad includes a first, second, and third portions, and the second board pad includes a first, second, and third portions.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: April 11, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myong-Soo Oh, Doosan Park, Hyunchul Jin
  • Patent number: 11626379
    Abstract: A method comprises molding laser direct structuring material onto at least one semiconductor die, forming resist material on the laser direct structuring material, producing mutually aligned patterns of electrically-conductive formations in the laser direct structuring material and etched-out portions of the resist material having lateral walls sidewise of said electrically-conductive formations via laser beam energy, and forming electrically-conductive material at said etched-out portions of the resist material, the electrically-conductive material having lateral confinement surfaces at said lateral walls of said etched-out portions of the resist material.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: April 11, 2023
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Roberto Tiziani, Guendalina Catalano
  • Patent number: 11616176
    Abstract: An optoelectronic component is disclosed. In an embodiment an optoelectronic component includes a housing body, an optical element and a rabbet comprising a shoulder and a cheek, wherein the rabbet is located on an upper side of the housing body, wherein the optical element is located in the rabbet such that a brim of the optical element rests on the shoulder of the rabbet, wherein the upper side of the housing body comprises a rectangular shape, and wherein the shoulder of the rabbet is located only at corners of the rabbet.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: March 28, 2023
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Mohd Fauzi Zainordin, Khairul Mohd Arshad, Sok Gek Beh, Jun Jun Lim
  • Patent number: 11616041
    Abstract: A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: March 28, 2023
    Assignee: SHINKAWA LTD.
    Inventors: Kohei Seyama, Tetsuya Utano
  • Patent number: 11576256
    Abstract: The invention provides a PCB for gallium nitride device, on which has been formed: a gallium nitride welding position to which first and second gallium nitride elements having different packages are interchangeably welded; a first/second driving circuit welding position to which a first/second driving circuit of the first/second gallium nitride element is welded; wherein the gallium nitride welding position includes: a first and second gate pad respectively welded to gate electrode of the first and second gallium nitride element and respectively connected to gate signal terminal of the first and second driving circuit; a first and a second ground pad; a first contact contactless connected to the first ground pad and directly connected to ground terminal of the first driving circuit; and a second contact contactless connected to the second ground pad and directly connected to ground terminal of the second driving circuit.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: February 7, 2023
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Tao Wu, Jian Qi
  • Patent number: 11545451
    Abstract: A semiconductor package includes a semiconductor chip having at least one chip pad disposed on one surface thereof; a wiring pattern disposed on top of the semiconductor chip and having at least a portion thereof in contact with the chip pad to be electrically connected to the chip pad; and a solder bump disposed on outer surface of the wiring pattern to be electrically connected to the chip pad through the wiring pattern.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: January 3, 2023
    Assignee: NEPES CO., LTD.
    Inventors: Hyun Sik Kim, Seung Hwan Shin, Yong Tae Kwon, Dong Hoon Seo, Hee Cheol Kim, Dong Soo Lee
  • Patent number: 11538766
    Abstract: A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: December 27, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Vijaylaxmi Gumaste Khanolkar, Robert Martinez, Zhemin Zhang, Yongbin Chu
  • Patent number: 11515270
    Abstract: An antenna package includes a conductive layer, an interconnection structure and an antenna. The interconnection structure is disposed on the conductive layer. The interconnection structure includes a conductive via and a first package body. The conductive via has a first surface facing the conductive layer, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The first package body covers the lateral surface of the conductive via and exposes the first surface and the second surface of the conductive via. The first package body is spaced apart from the conductive layer. The antenna is electrically connected to the second surface of the conductive via.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: November 29, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Lin Shih, Chih-Cheng Lee
  • Patent number: 11482380
    Abstract: An interposer of a multilayer ceramic capacitor includes a first through-hole in which a first pass-through conductive portion is provided on an inside wall thereof. A first surface side of the first through-hole is filled with a first conductive joining material that recessed at a central portion thereof as the first through-hole is seen from a second surface toward a first surface. The interposer includes a second through-hole in which a second pass-through conductive portion is provided on an inside wall thereof. A first surface side of the second through-hole is filled with a second conductive joining material that is recessed at a central portion thereof as the second through-hole is seen from a second surface toward a first surface.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: October 25, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Satoshi Yokomizo
  • Patent number: 11470719
    Abstract: An electronic device package includes a lower surface for conducting electronic signals, a first solder bond pad having a first size disposed on the lower surface, and a plurality of second solder bond pads having second sizes smaller than the first size disposed on the lower surface and surrounding the first solder bond pad.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: October 11, 2022
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Yuji Yashiro, Toru Yamaji
  • Patent number: 11444019
    Abstract: A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes (i) at least one inner dielectric layer, (ii) a plurality of interconnects located in the at least one inner dielectric layer, where the plurality of interconnects includes a pad located on a bottom metal layer of the substrate, (iii) an outer dielectric layer located over the at least one dielectric layer, (iv) at least one routing interconnect coupled to the plurality of interconnects, where the at least one routing interconnect is located over the outer dielectric layer, where the at least one routing interconnect is located below the bottom metal layer of the substrate, and (v) a cover dielectric layer located over the outer dielectric layer and the at least one routing interconnect. The package includes a solder interconnect coupled to the pad located on the bottom metal layer of the substrate.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: September 13, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Aniket Patil, Hong Bok We, Kuiwon Kang
  • Patent number: 11439008
    Abstract: A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: September 6, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Kun Fang, Jaehyun Yeon, Suhyung Hwang, Hyunchul Cho, Boyu Tseng
  • Patent number: 11422961
    Abstract: A multi-chip module (MCM) includes a first integrated circuit (IC) chip to receive first data. The first IC chip includes a first transfer interface to transmit the first data off the first IC chip. A second IC chip includes an input interface to receive the first data from the first IC chip. The second IC chip includes switching circuitry to selectively forward the first data to one of a first output interface or a second output interface. The first output interface is communicatively coupled to a third IC chip, while the second output interface is configured to output the first data from the MCM.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: August 23, 2022
    Assignee: Marvell Asia Pte, Ltd.
    Inventors: Ramin Farjadrad, Paul Langner
  • Patent number: 11395409
    Abstract: A voltage regulator module includes a circuit board, a metallic winding assembly, a switching circuit and a magnetic core assembly. The circuit board includes an accommodation space, a first surface and a second surface. The accommodation space is formed within the circuit board and in communication with a first opening and a second opening. The metallic winding assembly includes third opening. A projection region of the switching circuit and a projection region of the metallic winding assembly on the first surface are partially overlapped with each other. The magnetic core assembly includes an upper core, a lower core and a lateral leg. The upper core and the lower core are disposed on the circuit board. The lateral leg is penetrated through the first opening, the third opening and the second opening. An inductor is defined by the magnetic core assembly and the metallic winding assembly collaboratively.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: July 19, 2022
    Assignee: DELTA ELECTRONICS, INC
    Inventors: Da Jin, Yahong Xiong, Junguo Cui, Qinghua Su
  • Patent number: 11393777
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may a die having a front side and a back side, the die comprising a first material and conductive contacts at the front side; and a thermal layer attached to the back side of the die, the thermal layer comprising a second material and a conductive pathway, wherein the conductive pathway extends from a front side of the thermal layer to a back side of the thermal layer.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: July 19, 2022
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller, Shawna M. Liff, Johanna M. Swan, Paul B. Fischer
  • Patent number: 11372175
    Abstract: An optical module includes a wiring board having a first electrode, an optical waveguide provided on the wiring board, an optical element having a second electrode and provided on the optical waveguide, a conductive bonding material bonding the first and second electrodes, and a fixing member that fixes the optical element to the optical waveguide. The optical waveguide includes a core layer, a first cladding layer provided on a first side of the core layer, a second cladding layer provided on a second side of the core layer opposite to the first side, and an optical path conversion mirror provided on the core layer or the second cladding layer. The optical element is optically coupled to one end of the core layer via the optical path conversion mirror, and a softening point of the fixing member is higher than a melting point of the conductive bonding material.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: June 28, 2022
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kenji Yanagisawa, Koichi Toya
  • Patent number: 11373951
    Abstract: Embodiments include a package structure with one or more layers of dielectric material, where an interconnect bridge substrate is embedded within the dielectric material. One or more via structures are on a first surface of the embedded substrate, where individual ones of the via structures comprise a conductive material and have a tapered profile. The conductive material is also on a sidewall of the embedded substrate.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: June 28, 2022
    Assignee: Intel Corporation
    Inventors: Jeremy D. Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel R. Arana, Chung Kwang Tan, Robert A. May
  • Patent number: 11350525
    Abstract: A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: May 31, 2022
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventor: Simon Wilson
  • Patent number: 11330743
    Abstract: An electronic device is provided. The electronic device includes a display panel, a metal layer disposed on a surface of the display panel, a display driver integrated circuit (DDI) disposed on a surface of the metal layer, a bending part connecting the display panel to the DDI, and a cover member connected to the metal layer while covering the DDI. The cover member includes at least one conductive layer. The metal layer and the cover member form a space in which the DDI is disposed, and the bending part is connected to the DDI via a connection part in the space.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: May 10, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyunjun Park, Seonghoon Kim, Hongkook Lee, Donghwy Kim, Jongkon Bae, Dongkyoon Han
  • Patent number: 11310913
    Abstract: The invention relates to a semiconductor component (2), comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of planar connection points (12), which are arranged on a bottom side of the housing (5) and can be electrically connected by means of connections to corresponding contacts of a contact arrangement having at least two rows, which contact arrangement is arranged on a printed circuit board, wherein the geometry of the contact arrangement corresponds to the geometry of the connection point arrangement (10), a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10), and the second connection points (16A) of the second row (16) are offset to the first connection points (14A) of the first row (14).
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: April 19, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Guenter Gera, Klaus Kosbi, Lars Vollmer, Matthias Lausmann
  • Patent number: 11302656
    Abstract: An integrated circuit (IC) package is described. The IC package includes a package substrate, composed of a substrate core, a first power rail on a first surface of the substrate core, and a second power rail on a second surface of the substrate core. The IC package includes a logic die supported by the second power rail on the second surface of the substrate core. The IC package includes passive devices within the substrate core. Each of the passive devices has a first terminal and a second terminal opposite the first terminal. The first terminal of each of the passive devices is directly coupled to the first power rail, and the second terminal of each of the plurality of the passive devices is directly coupled to the second power rail. The IC package includes package bumps on the second power rail on the second surface of the substrate core.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: April 12, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Hong Bok We, Aniket Patil, Joan Rey Villarba Buot, Zhijie Wang
  • Patent number: 11296051
    Abstract: Semiconductor packages and methods of forming the same are provided. One of the semiconductor packages includes a first semiconductor die, an adhesive layer, a second semiconductor die and an underfill. The first semiconductor die includes a first surface, and the first surface includes a central region and a peripheral region surrounding the central region. The adhesive layer is adhered to the peripheral region and exposes the central region. The second semiconductor die is stacked over the first surface of the first semiconductor die. The underfill is disposed between the first semiconductor die and the second semiconductor die.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 5, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Fu Kao, Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11278224
    Abstract: This application features a method of forming a nanoporous layer. The method includes steps of reducing metal ions in a reverse micelle phase composition to form nanoparticles, removing surfactant from the composition to form clusters of the nanoparticles, dispensing the composition including the nanoparticle clusters dispersed in a liquid on a substrate, and drying to form the nanoporous layer. The nanoporous layer includes nanoparticles deposited to form a three dimensional network of irregularly shaped bodies. The nanoporous layer also includes a three dimensional network of intercluster spaces that are not occupied by the three dimensional network of irregularly shaped bodies.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 22, 2022
    Assignee: UXN Co., Ltd.
    Inventors: Hankil Boo, Rae Kyu Chang
  • Patent number: 11270976
    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge, an underfill layer and a RDL structure. The first die and the second die are placed side by side. The first encapsulant encapsulates sidewalls of the first die and sidewalls of the second die. The bridge electrically connects the first die and the second die through two conductive bumps. The underfill layer fills the space between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsulant. The RDL structure is located over the bridge and electrically connected to the first die and the second die though a plurality of TIVs. The bottom surfaces of the two conductive bumps are level with a bottom surface of the underfill layer.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11249112
    Abstract: A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: February 15, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu
  • Patent number: 11233017
    Abstract: An integrated circuit package includes a first conductive element that is fabricated as part of the integrated circuit package and a micro-wire having a first end coupled to the first conductive element. The micro-wire has been fabricated ex-situ and is of a metal having a diameter of 10 microns or less.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: January 25, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Michael Lee Dawson, Edward J. Pryor, III, Jeffrey L. Large, Mary Coles
  • Patent number: 11199515
    Abstract: A gas sensor device includes a package including a cap in which a through hole for taking gas is formed and a base in which a recessed portion is formed. The cap is attached to the base so that a space is defined around the recessed portion. The device includes metal electrodes fixed to portions surrounding the recessed portion and embedded in the base. The device includes a gas detecting element, which includes a gas detector having a coil-shaped heater that is heated when detecting a predetermined gas, and a plurality of metal lead wires extending from the gas detector to the electrodes. The gas detecting element is held in a suspended state in the recessed portion and/or a space above the recessed portion with the plurality of lead wires, so that the gas detecting element, which includes the heater, does not make contact with walls of the recessed portion.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: December 14, 2021
    Assignee: NISSHA CO., LTD.
    Inventors: Yuki Ura, Muneharu Shimabukuro, Shinichi Matsumoto
  • Patent number: 11201119
    Abstract: A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: December 14, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Martin Schrems, Erich Schlaffer, Steve Anderson
  • Patent number: 11189557
    Abstract: A method of manufacturing a hybrid package including a flat package and a Wafer Level Chip Scale Package (WLCSP) is disclosed. The method includes fabricating a strip including a plurality of flat packages attached to each other via metal pins, turning the strip upside down, applying a layer of a thermal interface material (TIM) on each of the flat packages while the each of the flat packages is turned upside down, mounting the WLCSP on the layer of the TIM such that a top side of the WLCSP is interfaced with the layer of the TIM, curing the layer of the TIM and singulating each of the flat packages by cutting the metal pins and bending the metal pins.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: November 30, 2021
    Assignee: NXP USA, INC.
    Inventors: Akhilesh Kumar Singh, Nishant Lakhera, Chee Seng Foong
  • Patent number: 11177230
    Abstract: An electronic device includes a substrate and first bumps. The first bumps are disposed on the substrate and arranged in a first bump row. Each first bump has a first end and a second end opposite to each other. Centers of the first ends of the first bumps are on a first axial line. A first axial coordinate of a center of the second end of a respective first bump relative to a second axial line perpendicular to the first axial line is XA(1+?AYA), in which XA is a first axial coordinate of the center of the first end of the respective first bump relative to the second axial line, YA is a second axial coordinate of the center of the second end of the respective first bump relative to the first axial line, and ?A is a slope coefficient of the respective first bump.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 16, 2021
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Hsien-Wen Lo, Chang-Sheng Tseng
  • Patent number: 11145587
    Abstract: An electronic component mounting substrate includes: an insulating substrate having a recess that opens in a main surface of the insulating substrate, the recess for mounting an electronic component; a metal layer located on a bottom surface of the recess; an external electrode located on the other main surface of the insulating substrate, the other main surface opposite to the main surface; a connection wiring located between the metal layer and the external electrode in a thickness direction of the insulating substrate; a plurality of first vias that connects the metal layer and the connection wiring and that is located along a side wall of the recess in a perspective plan view; and a plurality of second vias that connects the connection wiring and the external electrode and that is located in a strip shape in the perspective plan view.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: October 12, 2021
    Assignee: KYOCERA CORPORATION
    Inventors: Yuuki Baba, Yousuke Moriyama
  • Patent number: 11128073
    Abstract: A plug connector for establishing an external connection to a printed circuit board, including at least two angled pin-shaped contacts including a first leg, for making contact with a mating plug connector, and a second leg, for making contact with the printed circuit board, an insulating body for accommodating the contacts at least in the region of the first leg, and a contact carrier for accommodating the contacts at the second leg thereof, wherein the contacts, at the end of the second leg, include a stop acting in the axial direction, and the contact carrier includes through-openings including a counter-stop for the second legs and can be moved in the axial direction of the second legs into a housing and be fixed therein. In this way, all the contacts are located on one plane with respect to the printed circuit board and allow the use of SMD or THR processes.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: September 21, 2021
    Assignee: PHOENIX CONTACT GmbH & Co. KG
    Inventors: Alexander Hieber, Michael Delker
  • Patent number: 11115020
    Abstract: A signal transmission device includes a first lead frame supporting a signal transmission chip that includes first and second inductor spiral rings, a first bonding pad electrically coupled between the first and second inductor spiral rings, and a guard ring provided to roundly cover the first and second inductor spiral rings in a plan view. Bonding pads are provided outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other so that the first and second inductor spiral rings are disposed substantially symmetrically about the first bonding pad. A second lead frame supports a semiconductor chip, with the signal transmission chip and the semiconductor chip facing each other.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: September 7, 2021
    Assignee: Rohm Co., Ltd.
    Inventors: Daiki Yanagishima, Toshiyuki Ishikawa, Hirotaka Takihara
  • Patent number: 11094614
    Abstract: A semiconductor device structure may include a semiconductor device, disposed at least in part in a semiconductor substrate, and a first insulator layer, disposed on a surface of the semiconductor device, and comprising a first contact aperture, disposed within the first insulator layer. The semiconductor device structure may also include a first contact layer, comprising a first electrically conductive material, disposed over the insulator layer, and being in electrical contact with the semiconductor device through the first contact aperture, and a second insulator layer, disposed over the first contact layer, wherein the second insulator layer further includes a second contact aperture, displaced laterally from the first contact aperture, by a first distance.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: August 17, 2021
    Assignee: Littelfuse, Inc.
    Inventor: Stefan Steinhoff
  • Patent number: 11094637
    Abstract: A multi-chip package structure includes a chip interconnect bridge, a fan-out redistribution layer structure, a first integrated circuit chip, and a second integrated circuit chip. The chip interconnect bridge includes contact pads disposed on a top-side of the chip interconnect bridge. The fan-out redistribution layer structure is disposed around sidewalls of the chip interconnect bridge and over the top-side of the chip interconnect bridge. The first and second integrated circuit chips are direct chip attached to an upper surface of the fan-out redistribution layer structure, wherein the fan-out redistribution layer structure includes input/output connections between the contact pads on the top-side of the chip interconnect bridge and the first and second integrated circuit chips.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: August 17, 2021
    Assignee: International Business Machines Corporation
    Inventors: Joshua M. Rubin, Steven Lorenz Wright, Lawrence A. Clevenger
  • Patent number: 11073573
    Abstract: An apparatus comprises a first substrate and two coils supported by the first substrate and arranged next to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils. One or more magnetic field sensing elements are positioned in the area between the coils and configured to detect the reflected magnetic field.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: July 27, 2021
    Assignee: Allegro MicroSystems, LLC
    Inventors: Alexander Latham, Michael C. Doogue, Jason Boudreau
  • Patent number: 11069539
    Abstract: Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a semiconductor device comprising an interconnecting structure consisting of a plurality of thin film layers and a plurality of metal layers disposed therein, each of the plurality of metal layers having substantially a same top surface area, and a die comprising an active surface and a backside surface opposite the active surface, the active surface being directly coupled to a first side of the interconnecting structure. The semiconductor device further comprises a first connector directly coupled to a second side of the interconnecting structure, the second side being opposite the first side.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: July 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng
  • Patent number: 11031446
    Abstract: An electronic device includes a substrate; and a pad area on the substrate, the pad area including: a first pad part including a first pad terminal; a second pad part on a side of the first pad part in a first direction and including a second pad terminal; and a third pad part on the other side of the first pad part in the first direction and including a third pad terminal, each of the first pad terminal, the second pad terminal and the third pad terminal including a first long side, a second long side facing the first long side, and at least one bridge extending from the first long side to the second long side, the first long side of the first pad terminal extending in a second direction intersecting the first direction.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: June 8, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jung Yun Jo, Ki Kyung Youk
  • Patent number: 11031366
    Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: June 8, 2021
    Assignee: Amkor Technology Singapore Pte. Ltd.
    Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
  • Patent number: 10993321
    Abstract: A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 27, 2021
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Takahiro Hayashi
  • Patent number: 10993325
    Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: April 27, 2021
    Assignee: ABB Power Electronics Inc.
    Inventors: John Andrew Trelford, Richard John Yeager, Alok Kumar Lohia, Thang Danh Truong
  • Patent number: 10986730
    Abstract: Substrates configured to route electrical signals may include a first dielectric material and an electrically conductive material located on a first side of the first dielectric material. A second dielectric material may be located on a second, opposite side of the first dielectric material. A series of voids may be defined by the second dielectric material extending from the first dielectric material at least partially through the second dielectric material. Footprints of at least some of the voids of the series of voids may at least partially laterally overlap with the electrically conductive material.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: April 20, 2021
    Assignee: Microsemi Semiconductor ULC
    Inventors: Nasser Ghassemi, Mehran Aliahmad
  • Patent number: 10984965
    Abstract: The present description relates to a fully biodegradable supercapacitor and a method for manufacturing the same. When the fully biodegradable supercapacitor and the method for manufacturing the same according to the present description are used, supercapacitor having high capacitance, high energy, and high output is provided by forming a metal oxide on a metal electrode and a surface of a solid electrolyte. In addition, the present description is environment-friendly, biodegradable, and biocompatible to be implanted into a body, and may be a bio-implantable energy storage device in the future.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 20, 2021
    Assignee: Korea University Research and Business Foundation
    Inventors: Jeong Sook Ha, Geumbee Lee, Yu Ra Jeong
  • Patent number: 10980132
    Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 13, 2021
    Assignee: Lumileds LLC
    Inventor: Axel Mehnert