Cooling apparatus

A cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes and the second heat pipes respectively has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes. Thereby, the heat conducting area is increased within the base, and the cooling efficiency of the cooling apparatus is enhanced.

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Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cooling apparatus. In particular, this invention relates to a cooling apparatus that its heat pipes are stacked and heat conducting columns are disposed between the heat pipes so that the heat conducting area is increased.

2. Description of the Related Art

When electric machines or electronic devices are operating, the electronic components often generate a substantial amount of heat. The heat needs to be dissipated so that the electronic components are assured to operate normally and do not suffer damage due to an excessive operating temperature. In case of the CPU in a computer, the processing speed is very high and a lot of heat is generated, which needs to be rapidly dissipated to make the computer operate normally. Therefore, electric machines or electronic devices often have a cooling apparatus to dissipate the heat generated by the electronic components.

The cooling apparatus of the prior art includes a heat conducting block, a cooler and a plurality of heat pipes. The heat-absorbing terminal and the condensing terminal of the heat pipes are respectively connected with the heat conducting block and the cooler. The heat conducting block is located on the electronic components to absorb the heat generated therefrom. The heat is delivered to the cooler to be dissipated via the heat pipes so that the cooling effect is achieved.

However, because the dimension of the base of the cooling apparatus is small, the quantity of the heat pipes that can be disposed on the base is few. The cooling efficiency is inadequate when the operation speed of the electronic components increases.

SUMMARY OF THE INVENTION

One particular aspect of the present invention is to provide a cooling apparatus of which the heat conducting area is increased with respect to its base area so that the cooling efficiency of the cooling apparatus is enhanced.

The cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base at fixed intervals. Each of the second heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes at fixed intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. One end of the first heat conducting column contacts the base, and the second end of the first heat conducting column contacts the heat-absorbing terminal of the second cooling pipe. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes, and one end of the second heat conducting column contacts the heat-absorbing terminal of the first cooling pipe.

In another embodiment, the cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base in order. Each of the second heat pipes has a heat-absorbing terminal. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes in order. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes, and one end of the first heat conducting column contacts the heat-absorbing terminal of the second cooling pipe. Each of the second heat conducting columns includes a first portion and a second portion. The second portion and the first portion are oppositely installed between the heat-absorbing terminals of the two adjacent second heat pipes.

The present invention has the following characteristics. Because the heat pipes of the cooling apparatus are stacked, the quantity of the heat pipes is not limited by the dimension of the base and can be increased. Furthermore, a plurality of heat conducting columns is installed between the heat pipes so that the heat conducting area is increased. Thereby, the heat generated from the electronic components can be rapidly delivered to the cooler.

For further understanding of the invention, reference is made to the following detailed description illustrating the embodiments and examples of the invention. The description is only for illustrating the invention and is not intended to limit of the scope of the claim.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings included herein provide a further understanding of the invention. A brief introduction of the drawings is as follows:

FIG. 1 is an exploded perspective view of the cooling apparatus of the first embodiment of the present invention;

FIG. 2 is an assembly perspective view of the cooling apparatus of the first embodiment of the present invention;

FIG. 3 is a cross-sectional view of the cooling apparatus of the first embodiment of the present invention;

FIG. 4 is a cross-sectional view of the cooling apparatus of the second embodiment of the present invention;

FIG. 5 is a cross-sectional view of the cooling apparatus of the third embodiment of the present invention;

FIG. 6 is a cross-sectional view of the cooling apparatus of the fourth embodiment of the present invention;

FIG. 7 is a cross-sectional view of the cooling apparatus of the fifth embodiment of the present invention;

FIG. 8 is a cross-sectional view of the cooling apparatus of the sixth embodiment of the present invention;

FIG. 9 is a cross-sectional view of the cooling apparatus of the seventh embodiment of the present invention; and

FIG. 10 is a cross-sectional view of the cooling apparatus of the eighth embodiment of the present invention.

 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference is made to FIGS. 1˜3, which show the cooling apparatus of the first embodiment of the present invention. The cooling apparatus includes a base 10, a cooler 20, a plurality of first heat pipes 30, a plurality of second heat pipes 40, a plurality of first heat conducting columns 50, a plurality of second heat conducting columns 60, and a cover 70. The base 10 is made of metallic material. The top surface of the base 10 has a plurality of concave slots 11 for being installed with the first heat pipes 30.

The cooler 20 is a cooing fin set. The cooler 20 has a plurality of through holes 21 for being installed with the first heat pipes 30 and the second heat pipes 40.

Each of the first heat pipes 30 has a heat-absorbing terminal 31 and a condensing terminal 32. The heat-absorbing terminals 31 of the first heat pipes 30 are installed in the concave slots 11 so that the heat-absorbing terminals 31 of the first heat pipes 30 are disposed on the base 10 spaced at intervals. The condensing terminals 32 of the first heat pipes 30 are plugged into the through holes 21 of the cooler 20.

Each of the second heat pipes 40 has a heat-absorbing terminal 41 and a condensing terminal 42. The heat-absorbing terminals 41 of the second heat pipes 40 are stacked above the heat-absorbing terminals 31 of the first heat pipes 30 spaced at intervals, and each of the second heat pipes 40 and the first heat pipes 30 also include a contact portion to directly contact to each other. The condensing terminals 42 of the second heat pipes 40 are also plugged into the through holes 21 of the cooler 20.

Each of the first heat conducting columns 50 has an inverse-ladder shape. The bottom of the first heat conducting column 50 has a bottom jointing surface 51 that corresponds to the base 10, and the top of the first heat conducting column 50 has a top jointing surface 52 that corresponds to the second cooling pipe 40. The two sides of the first heat conducting column 50 respectively have a side jointing surface 53 with a concave arc shape. Each of the first heat conducting columns 50 is correspondingly installed between the two adjacent first heat pipes 30 and is fastened by a welding method or a gluing method. The bottom jointing surface 51 contacts the top surface of the base 10, the top jointing surface 52 contacts the bottom of the heat-absorbing terminal 41 of the second cooling pipe 40, and the two side jointing surfaces 53 respectively contacts the sides of the heat-absorbing terminals 31 of the two adjacent first heat pipes 30.

The bottom of the second heat conducting column 60 has a bottom jointing surface 61, and the two sides of the second heat conducting column 60 respectively have a side jointing surface 62 with a concave arc shape. Each of the second heat conducting columns 60 is installed between the heat-absorbing terminals 41 of the two adjacent second heat pipes 40 and is fastened by a welding method or a gluing method. The bottom jointing surface 61 contacts the heat-absorbing terminals 31 of the first heat pipes 30, and the two side jointing surfaces 62 respectively contacts the sides of the heat-absorbing terminals 41 of the two adjacent second heat pipes 40.

The cover 70 is made of metallic material. The inner surface of the cover 70 has a plurality of concave portions 71 that correspond to the second heat pipes 40. The concave portions 71 contact the top of the heat-absorbing terminals 41 of the second heat pipes 40 so that the cover 70 covers on the second heat pipes 40 and is connected with the second heat conducting columns 60 to fasten the first heat pipes 30 and the second heat pipes 40.

The cooling apparatus is used for dissipating heat generated from an electronic component (not shown in the figure) and the base 10 tightly contacts the electronic component. When the electronic component generates heat, the heat is rapidly absorbed by the heat-absorbing terminals 31 of the first heat pipes 30, some of the heat is delivered to the heat-absorbing terminals 41 of the second heat pipes 40 via the first heat conducting columns 50 and the second heat conducting columns 60, and some of the heat is delivered to the heat-absorbing terminals 41 of the second heat pipes 40 via the contact portions of the first heat pipes 30 and the second heat pipes 40. Thereby, the heat conducting area is increased. Next, the first heat pipes 30 and the second heat pipes 40 deliver the heat to the condensing terminals 32, 42, and the heat is dissipated by the connected cooler 20.

Reference is made to FIG. 4, which shows the cooling apparatus of the second embodiment of the present invention. The difference between the second embodiment and the first embodiment is:

The cover 70 extends downwards to form the second heat conducting columns 60, and the upper half of the side jointing surface 62 of the second heat conducting column 60 has a concave arc shape, and the lower half of the side jointing surface 62 of the second heat conducting column 60 has a flat shape.

Reference is made to FIG. 5, which shows the cooling apparatus of the third embodiment of the present invention. The difference between the third embodiment and the first embodiment is:

The cooling apparatus further includes a plurality of third heat pipes 80 and a plurality of third heat conducting columns 90. Each of the third heat pipes 80 has a heat-absorbing terminal 81 and a condensing terminal 82. The heat-absorbing terminals 81 of the third heat pipes 80 are stacked above the heat-absorbing terminals 41 of the second heat pipes 40 spaced at intervals, and the condensing terminals 82 of the third heat pipes 80 are connected with the cooler 20.

The bottom of the third heat conducting column 90 has a bottom jointing surface 91, and the two sides of the third heat conducting column 90 respectively have a side jointing surface 92 with a concave arc shape. Each of the third heat conducting columns 90 is installed between the two adjacent third heat pipes 80. The bottom jointing surface 91 contacts the top of the heat-absorbing terminals 41 of the second heat pipes 40, and the two side jointing surfaces 92 respectively contacts the sides of the two adjacent third heat pipes 80.

When the electronic component generates heat, the heat is delivered to the heat-absorbing terminals 41 of the second heat pipes 40 and the heat-absorbing terminals 81 of the third heat pipes 80 via the first heat conducting columns 50, the second heat conducting columns 60 and the third heat conducting columns 90, and some of the heat is delivered to the heat-absorbing terminals 41 of the second heat pipes 40 and the heat-absorbing terminals 81 of the third heat pipes 80 via the contact portions of the first heat pipes 30, the second heat pipes 40, and the third cooing pipes 80. Thereby, the heat conducting area is increased.

Reference is made to FIG. 6, which shows the cooling apparatus of the fourth embodiment of the present invention. The difference between the fourth embodiment and the first embodiment is:

The quantity of the second heat pipes 40 is larger than the quantity of the first heat pipes 30, and the cooling apparatus further includes two fourth heat conducting columns 100. The two fourth heat conducting columns 100 are respectively installed between the heat-absorbing terminal 31 of the first cooling pipe 30 and the heat-absorbing terminal 41 of the second cooling pipe 40 that are located at the most outer side of the heat pipes. The bottom, the top, and one side that is adjacent to the first cooling pipe 30 of the fourth heat conducting column 100 respectively forms a bottom jointing surface 101 contacting the top surface of the base 10, a top jointing surface 102 contacting the bottom of the heat-absorbing terminal 41 of the most outer side second cooling pipe 40, and a side jointing surface 103 contacting the side of the heat-absorbing terminal 31 of the outer side first cooling pipe 30.

When the electronic component generates heat, the heat is delivered to the heat-absorbing terminals 41 of the second heat pipes 40 via the first heat conducting columns 50 and the second heat conducting columns 60, and some of the heat is delivered to the heat-absorbing terminals 41 of the second heat pipes 40 via the contact portions of the first heat pipes 30 and the second heat pipes 40. Furthermore, the heat is delivered by the two fourth heat conducting columns 100. The cooling efficiency is enhanced.

Reference is made to FIG. 7, which shows the cooling apparatus of the fifth embodiment of the present invention. The difference between the fifth embodiment and the first embodiment is:

The heat-absorbing terminals 31 of the first heat pipes 30 are adjacently disposed on the base 10, and the heat-absorbing terminals 41 of the second heat pipes 40 are adjacently stacked above the heat-absorbing terminals 31 of the first heat pipes 30.

The first heat conducting column 50 has an inverse-triangle shape. The top jointing surface 52 of the first heat conducting column 50 contacts the bottom of the heat-absorbing terminal 41 of the corresponding second cooling pipe 40, and the two side jointing surfaces 53 respectively contact the sides of the heat-absorbing terminals 31 of the two adjacent first heat pipes 30.

Each of the second heat conducting columns 60 includes a first portion 63 and a second portion 64. The shape of the second portion 64 and the first portion 63 is inverse-triangle. The two sides of the first portion 63 and the second portion 64 respectively form side jointing surfaces 631, 641 with a concave arc shape. The bottom of the first portion 63 forms a bottom jointing surface 632.

The second portion 64 and the first portion 63 are oppositely installed between the heat-absorbing terminals 41 of the two adjacent second heat pipes 40. The side jointing surfaces 631, 641 respectively contact the side of the heat-absorbing terminals 41 of the two adjacent second heat pipes 40, and the bottom jointing surface 632 contacts the top of the heat-absorbing terminal 31 of the corresponding first cooling pipe 30.

The cover 70 covers on the heat-absorbing terminals 41 of the second heat pipes 40, and is connected with the second portions 64 of the second heat conducting columns 60.

Reference is made to FIG. 8, which shows the cooling apparatus of the sixth embodiment of the present invention. The difference between the sixth embodiment and the fifth embodiment is:

The cover 70 extends downwards to form the second portions 64 of the second heat conducting columns 60.

Reference is made to FIG. 9, which shows the cooling apparatus of the seventh embodiment of the present invention. The difference between the seventh embodiment and the fifth embodiment is:

The cooling apparatus further includes a plurality of third heat pipes 80 and a plurality of third heat conducting columns 90. Each of the third heat pipes 80 has a hat-absorbing terminal 81 and a condensing terminal 82. The heat-absorbing terminals 81 of the third heat pipes 80 are adjacently stacked above the heat-absorbing terminals 41 of the second heat pipes 40, and the condensing terminals 82 of the third heat pipes 80 are connected with the cooler 20.

Each of the third heat conducting columns 90 includes a first portion 93 and a second portion 94. The first portion 93 and the second portion 94 are oppositely installed between the heat-absorbing terminals 81 of the two adjacent third heat pipes 80. The two sides of the first portion 93 and the second portion 94 respectively form side jointing surfaces 931, 941 for contacting the sides of the heat-absorbing terminals 81 of the two adjacent third heat pipes 80.

Reference is made to FIG. 10, which shows the cooling apparatus of the eighth embodiment of the present invention. The difference between the eighth embodiment and the fifth embodiment is:

The quantity of the second heat pipes 40 is larger than the quantity of the first heat pipes 30, and the cooling apparatus further includes two fourth heat conducting columns 100 that are respectively installed between the heat-absorbing terminal 31 of the first cooling pipe 30 and the heat-absorbing terminal 41 of the second cooling pipe 40 located at the most outer side of the heat pipes. The bottom, the top, and one side that is adjacent to the first cooling pipe 30 of the fourth heat conducting column 100 respectively forms a bottom jointing surface 101 contacting the top surface of the base 10, a top jointing surface 102 contacting the bottom of the heat-absorbing terminal 41 of the outer side second cooling pipe 40, and a side jointing surface 103 contacting the side of the heat-absorbing terminal 31 of the outer side first cooling pipe 30.

Thereby, the quantity of the heat pipes of the cooling apparatus is not limited by the dimension of the base. The present invention can stack more heat pipes over the heat pipes connected with the base, and use the heat conducting columns to deliver the heat generated from the electronic components to the stacked heat pipes. The heat conducting area is increased, and the cooling efficiency of the cooling apparatus is enhanced.

The description above only illustrates specific embodiments and examples of the invention. The invention should therefore cover various modifications and variations made to the herein-described structure and operations of the invention, provided they fall within the scope of the invention as defined in the following appended claims.

Claims

1. A cooling apparatus, comprising:

a base;
a plurality of first heat pipes, wherein each of the first heat pipes has a heat-absorbing terminal, and the heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals; p1 a plurality of second heat pipes, wherein each of the second heat pipes has a heat-absorbing terminal, and the heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals;
a plurality of first heat conducting columns, wherein each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes, one end of the first heat conducting column contacts the base, and the second end of the first heat conducting column contacts the heat-absorbing terminal of the second heat pipe; and
a plurality of second heat conducting columns, wherein each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes, and one end of the second heat conducting column contacts the heat-absorbing terminal of the first heat pipe.

2. The cooling apparatus as claimed in claim 1, further comprising a cooler, wherein each of the first heat pipes and the second heat pipes respectively has a condensing terminal, and the condensing terminals of the first heat pipes and the second heat pipes are connected with the cooler.

3. The cooling apparatus as claimed in claim 1, further comprising a plurality of third heat pipes and a plurality of third heat conducting columns, each of the third heat pipes has a heat-absorbing terminal, the heat-absorbing terminals of the third heat pipes are stacked above the heat-absorbing terminals of the second heat pipes at fixed intervals, and each of the third heat conducting columns is installed between the heat-absorbing terminals of the two adjacent third heat pipes.

4. The cooling apparatus as claimed in claim 3, further comprising a cooler, wherein each of the first heat pipes, the second heat pipes and the third heat pipes respectively has a condensing terminal, and the condensing terminals of the first heat pipes, the second heat pipes and the third heat pipes are connected with the cooler.

5. The cooling apparatus as claimed in claim 1, further comprising a cover, wherein the cover covers on the heat-absorbing terminals of the second heat pipes, and is connected with the second heat conducting columns.

6. The cooling apparatus as claimed in claim 5, wherein the cover extends to form the second heat conducting columns.

7. The cooling apparatus as claimed in claim 1, further comprising two fourth heat conducting columns, wherein the two fourth heat conducting columns are respectively installed between the heat-absorbing terminals of the first pipe and the second cooling pipe located at the most outer side, and a top, a bottom and a side of the fourth heat conducting column respectively contact the base, the heat-absorbing terminal of the second heat pipe located at the most outer side, and the heat-absorbing terminal of the first heat pipe located at the most outer side.

8. A cooling apparatus, comprising:

a base;
a plurality of first heat pipes, wherein each of the first heat pipes has a heat-absorbing terminal, and the heat-absorbing terminals of the first heat pipes are adjacently disposed on the base;
a plurality of second heat pipes, wherein each of the second heat pipes has a heat-absorbing terminal, and the heat-absorbing terminals of the second heat pipes are adjacently stacked above the heat-absorbing terminals of the first heat pipes.
a plurality of first heat conducting columns; wherein each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes, and one end of the first heat conducting column contacts the heat-absorbing terminal of the second cooling pipe; and
a plurality of second heat conducting columns, wherein each of the second heat conducting columns has a first portion and a second portion, and the first portion and the second portion is correspondingly installed between the heat-absorbing terminals of the two adjacent second heat pipes.

9. The cooling apparatus as claimed in claim 8, further comprising a cooler, wherein each of the first heat pipes and the second heat pipes respectively has a condensing terminal, and the condensing terminals of the first heat pipes and the second heat pipes are connected with the cooler.

10. The cooling apparatus as claimed in claim 8, further comprising a plurality of third heat pipes and a plurality of third heat conducting columns, each of the third heat pipes has a heat-absorbing terminal, the heat-absorbing terminals of the third heat pipes are adjacently stacked above the heat-absorbing terminals of the second heat pipes, and each of the third heat conducting columns is installed between the heat-absorbing terminals of the two adjacent third heat pipes.

11. The cooling apparatus as claimed in claim 10, further comprising a cooler, wherein each of the first heat pipes, the second heat pipes and the third heat pipes respectively has a condensing terminal, and the condensing terminals of the first heat pipes, the second heat pipes and the third heat pipes are connected with the cooler.

12. The cooling apparatus as claimed in claim 8, further comprising a cover, wherein the cover covers on the heat-absorbing terminals of the second heat pipes, and is connected with the second portions of the second heat conducting columns.

13. The cooling apparatus as claimed in claim 12, wherein the cover extends to form the second portions of the second heat conducting columns.

14. The cooling apparatus as claimed in claim 8, further comprising two fourth heat conducting columns, wherein the two fourth heat conducting columns respectively are installed between the heat-absorbing terminals of the first pipe and the second cooling pipe located at the most outer side, and a top, a bottom and a side of the fourth heat conducting column respectively contact the base, the heat-absorbing terminal of the second heat pipe located at the most outer side, and the heat-absorbing terminal of the first heat pipe located at the most outer side.

Patent History
Publication number: 20090151899
Type: Application
Filed: Dec 17, 2007
Publication Date: Jun 18, 2009
Inventor: Cheng-Yi Chang (Chung-Ho City)
Application Number: 12/000,689
Classifications
Current U.S. Class: Air Cooled, Including Fins (165/80.3)
International Classification: F28F 7/00 (20060101);