Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores

Abstract

A method for manufacturing a metallic panel having multilayer arrays of micropores includes the steps of: preparing a metallic thin plate first; forming a plurality of micropores and hollowed portions on the metallic thin plate with the hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a multilayer backlight module is arranged on one side surface of the metallic panel via a hot pressing or adhering process. Finally, a telecommunication module is adhered on one side surface of the backlight module. In this way, the metallic panel having multilayer arrays of micropores can be completed.

Description

RELATED APPLICATIONS

U.S. patent application Ser. No. 11/560,962 filed on Nov. 17, 2006, Ser. No. 11/957,771 filed on Dec. 17, 2007 and Ser. No. 12/014,857 filed on Jan. 17, 2006 are submitted as related applications.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a panel, and in particular to a method for manufacturing a metallic key panel.

2. Description of Prior Art

As shown in FIGS. 1(a) and 1(b), US Patent Publication No. 2007/0205986A1 discloses a metallic panel 10a having an elastic layer 1a. One side surface of the elastic layer 1a has a plurality of protrusions 11a. The other side surface of the elastic layer 1a is arranged with a plurality of metallic keys 2a to correspond to the protrusions 11a. The metallic key 2a has a hollowed portion 21a with a corresponding pattern. A light transmittable resin layer 22a is filled in the hollowed portion 21a. When the metallic key panel 10a is disposed in a base 20a of an electronic device, the metallic key panel 10a is located on a telecommunication module 30a. The telecommunication module 30a has a printed circuit board 31a. The circuit board 31a has a plurality of immovable contacting points 32a. A metallic sheet 33a is disposed on the circuit board 31a. The metallic sheet 33a has a plurality of convex metal domes 331a. The metal dome 331a corresponds to each contacting point 32a, and the other side surface of the metal sheet 331a corresponds to the protrusion 11a. When the metallic key 2a is pressed, the protrusion 11a is caused to press the surface of the metal dome 331a, so that the metal dome 331a is deformed and brought into contact with the contacting point 32a, thereby generating an electronic signal output. Further, when a backlight source is lighted up, the light of the backlight source can pass through the resin layer 22a of the metallic key 2a, so that the user can see the position of each key clearly.

Although the above-mentioned metallic key panel 10a has been manufactured to a compact extent and can be mounted in a small-volume electronic device, during the manufacturing process, it is necessary to fill the individual hollowed portions 21a on the metallic key 2a with the resin layer 22a, and each of the metallic keys 2a has to be adhered onto one side surface of the elastic layer 1a accurately. As a result, the manufacturing process takes a lot of time and labors and is not simple. After the metallic key panel 10a is combined with the base 20a, a gap is formed between the periphery of the metallic key 2a and the base 20a, and the gap may be filled by external dusts or penetrated by moisture easily. As a result, the metallic key cannot be pressed smoothly or an internal short circuit may occur. Further, when the backlight source of the metallic panel 10a is lighted up, the hollowed portion 21a of the key 2a merely displays single luster. Therefore, the external appearance and the overall visual effect of the metallic key panel are dull.

SUMMARY OF THE INVENTION

In view of the above drawbacks, the present invention is to provide a metallic panel that is simple in structure and can be manufactured easily. Further, it has a multilayer backlight source, thereby increasing the whole external appearance and visual effect of the metallic key panel. Further, filler can be applied on the metallic panel, thereby protecting against the dust and the penetration of moisture.

The present invention is to provide a method for manufacturing a metallic panel having multilayer arrays of micropores, which includes the steps of: preparing a metallic thin plate first; performing an etching process to the metallic thin plate so as to form a plurality of micropores and hollowed portions on the metallic thin plate with each hollowed portion forming a key body; arranging the plurality of micropores to form a pattern on the surface of the key body; and cutting the metallic thin plate to form a metallic panel of a predetermined shape. Then, a first and a second light-guiding plate are adhered on one side surface of the metallic panel. The first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process. The first and second light-guiding plates are pressed to form first and second light-guiding microstructures corresponding to the pattern of the key body. The first and second light-guiding microstructures are arranged alternatively. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. Finally, a telecommunication module is adhered on one side surface of the backlight module. The telecommunication module has a flexible printed circuit board. The circuit board is provided thereon with a plurality of contacting points. Each contacting point corresponds to a metal dome. A film layer is arranged on one side surface of the circuit board and the metal dome. A protrusion is provided on one side surface of the protruding portion of the film layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1(a) and 1(b) are schematic views showing a conventional metallic key panel;

FIG. 2 is a schematic view showing the method for manufacturing the metallic panel of the present invention;

FIGS. 3(a) to 3(d) are schematic views showing the respective structures generated by the method for manufacturing the metallic panel of the present invention;

FIG. 4 is an exploded view showing the metallic panel and the backlight module of the present invention;

FIG. 5 is a side view of FIG. 4;

FIG. 6(a) is an assembled side view showing the metallic panel, the backlight module and the telecommunication module of the present invention;

FIG. 6(b) is a schematic view showing a pressing action of the present invention;

FIG. 7 is an assembled side view showing the metallic panel, the backlight module and another telecommunication module of the present invention;

FIG. 8 is a schematic view showing another embodiment of the present invention;

FIG. 9 is a schematic view showing the metallic panel of the present invention being used in a mobile phone;

FIG. 10 is a schematic view showing the metallic panel of the present invention being used in a personal digital assistant; and

FIG. 11 is a schematic view showing the metallic panel of the present invention being used in an automobile stereo panel.

DETAILED DESCRIPTION OF THE INVENTION

The detailed description and technical contents of the present invention will be explained with reference to the accompanying drawings.

With reference to FIG. 2, it is a flow chart showing the method for manufacturing a metallic panel having multilayer arrays of micropores. As shown in this figure, according to the present invention, the method for manufacturing a metallic key panel having arrays of micropores includes the following steps. First, in the step 100, a metallic thin plate 10 is prepared as shown in FIG. 3(a). The metallic thin plate 10 is any one of a stainless steel (SUS) or Al—Mg alloy.

In the step 102, an etching process is applied to the metallic thin plate 10 so as to form a plurality of micropores 11 and hollowed portions 12 on the metallic thin plate 10. The hollowed portion 12 is formed as a key body 13. The plurality of micropores 11 is arranged to form a pattern 14 on the surface of the key body 13, as shown in FIG. 3(b). The above-mentioned pattern 14 is any one of numerals, characters, specific symbols (“#”, “*”, “.”) and direction symbols.

In the step 104, the metallic thin plate 10 is cut to form a metallic panel 1 of a predetermined shape, as shown in FIGS. 3(c) and 3(d).

In the step 106, a backlight module 2 is adhered, as shown in FIGS. 4 and 5. A plate-like first light-guiding plate 21 and a second light-guiding plate 22 are adhered on one side surface of the metallic panel 1. The first light-guiding plate 21 and the second light-guiding plate 22 can be formed on one side of the metallic panel 1 via a hot pressing or adhering process. The first light-guiding plate 21 and the second light-guiding plate 22 are pressed to form first light-guiding microstructures 211 and second light-guiding microstructures 221 each corresponding to the pattern 14 of the key body 13. The first light-guiding microstructure 211 and the second light-guiding microstructure 221 are arranged alternatively on the key body 13. Further, a first set of light-emitting units 23 and a second set of light-emitting units 24 are arranged on one end of the first light-guiding plate 21 and a second light-guiding plate 22, respectively. A sheet-like first shielding unit 25 and a sheet-like second shielding unit 26 are arranged above the first set of light-emitting units 23 and the second set of light-emitting units 24, respectively. The first shielding unit 25 or the second shielding unit 26 shields the light generated by the first set of light-emitting units 23 or the second set of light-emitting units 24, thereby avoiding the mutual interference of light. The first set of light-emitting units 23 and the second set of light-emitting units 24 are constituted of a plurality of light-emitting diodes of the same or different colors. The above-mentioned first and second light-guiding microstructures 211, 221 are recessed in the first and second light-guiding plates 21, 22, or protrude from one side surfaces of the first and second light-guiding plates 21, 22, respectively.

In the step 108, a telecommunication module 3 is adhered, as shown in FIG. 6. A telecommunication module 3 is adhered on one side surface of the backlight module 2. The telecommunication module 3 has a flexible printed circuit board (FPCB) 31. The circuit board 31 is provided thereon with a plurality of contacting points 311. Each contacting point 311 corresponds to a metal dome 32. A film layer 33 is disposed on one side surface of the circuit board 31 and the metal dome 32. One side surface of the protruding portion of the film layer 33 is provided with a protrusion 34. The protrusion 34 corresponds to the first and second light-guiding microstructures 211, 221 of the first and second light-guiding plates 21, 22.

With reference to FIG. 5, it is a schematic view showing the backlight module of the present invention after being lighted up. As shown in this figure, under the control of the circuit (not shown) of an associated electronic device, when one of the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up, the light generated by the first set of light-emitting units 23 or the second set of light-emitting units 24 enters one end of the first light-guiding plate 21 or the second light-guiding plate 22. Then, the light 4 is reflected by the first light-guiding microstructure 211 or the second light-guiding microstructure 221 onto the key body 13. The light 4 passes through the plurality of micropores 11 to display the pattern 14 on the surface of the key body 13. When one of the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up, only the patterns 14 on several rows or lines of key bodies 13 on the metallic panel 1 can be displayed, thereby facilitating the user to operate a TV game or multimedia.

When the first set of light-emitting units 23 and the second set of light-emitting units 24 are lighted up at the same time, the patterns 14 on several rows or lines of key bodies 13 on the metallic panel 1 are displayed to have the same color, while some other rows or lines will display another color. Alternatively, the lights generated by the first set of light-emitting units 23 and the second set of light-emitting units 24 are mixed to generate a light 4 of a third kind of color.

Please refer to FIGS. 6(a) and 6(b). FIG. 6(a) is an assembled side view showing the metallic panel, the backlight module and the telecommunication module of the present invention, and FIG. 6(b) is a schematic view showing a pressing action of the present invention. As shown in these figures, when the surface of the key body 13 of the metallic panel 1 is pressed, the key body 13 is deformed to cause the protrusion 34 to press on the film layer 33. As a result, the metal dome 32 is deformed and pressed to contact with the contacting point 311, thereby generating a conductive signal output.

When one side surface of the metallic key panel 1 is not pressed by an external force, due to the elasticity of the metallic panel 1 and the metal dome 32, the metallic panel 1 may rise automatically to its original state.

Please refer to FIG. 7, which is an assembled side view showing the metallic panel, the backlight module and another telecommunication module of the present invention. As shown in this figure, another telecommunication module 3 is arranged on one side surface of the backlight module. The telecommunication module has a flexible printed circuit board (FPCB) 31. The circuit board 31 is provided thereon with a plurality of contacting points 311. Each contacting point 311 corresponds to a metal dome 32. A film layer 33 is arranged on one side surface of the circuit board 31 and the metal dome 32. The metal dome 33 corresponds to the first and second light-guiding microstructures 211, 221 on the first and second light-guiding plates 21, 22.

When the surface of the key body 13 on the metallic panel 1 is pressed by an external force, the key body 13 is deformed to press the film layer 33. As a result, the metal dome 32 is deformed and pressed to contact with the contacting point 311, thereby generating a conductive signal output.

When one side surface of the metallic key panel 1 is not pressed by an external force, due to the elasticity of the metallic panel 1 and the metal dome 32, the metallic panel 1 may rise automatically to its original state.

Please refer to FIG. 8, it is a schematic view showing another embodiment of the present invention. As shown in this figure, the plurality of micropores 11 on the metallic panel 1 can be filled with filler 5. Alternatively, the filler can be applied on the surface of the metallic key panel 1 with the filler 5 penetrating into the micropores 11, thereby avoiding the accumulation of dust and the penetration of moisture. In this figure, the filler 5 can be any one of UV glue, silicone, Vitro, epoxy or synthetic resin.

With reference to FIG. 9, it is a schematic view showing the metallic panel of the present invention being used in a mobile phone. As shown in this figure, after the metallic panel 1 of the present invention is manufactured completely, it can be applied to a mobile phone 6. When the light illuminates the metallic panel 1, the metallic panel 1 generates a backlight of a luster, thereby increasing the aesthetic feeling of the mobile phone 6.

With reference to FIG. 10, it is a schematic view showing the metallic panel of the present invention being used in a personal digital assistant. As shown in this figure, after the metallic panel 1 of the present invention is manufactured completely, in addition to the mobile phone 6, it can be applied to a personal digital assistant (PDA) 7. When the light illuminates the metallic panel 1, it generates a backlight of a luster, thereby increasing the aesthetic feeling of the personal digital assistant (PDA) 7.

With reference to FIG. 11, it is a schematic view showing the metallic panel of the present invention being used in an automobile stereo panel. As shown in this figure, after the metallic panel 1 of the present invention is manufactured completely, in addition to the mobile phone 6 and the personal digital assistant (PDA) 7, it can be mounted in an automobile stereo panel 8, thereby controlling the operations of an air conditioning system, audio-video system and satellite navigation system.

Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims

1. A method for manufacturing a metallic panel having multilayer arrays of micropores, the metallic panel being disposed on a surface of an electronic device, the method comprising the steps of:

(a) preparing a metallic thin plate;

(b) forming arrays of micropores on the metallic thin plate, the arrays of micropores forming patterns;

(c) cutting the metallic thin plate to form a metallic panel of a predetermined shape; and

(d) adhering a multilayer backlight module on one side surface of the metallic panel.

2. The method according to claim 1, wherein the metallic thin plate prepared in the step (a) is any one of a stainless steel (SUS) or Al—Mg alloy.

3. The method according to claim 1, wherein the metallic thin plate prepared in the step (a) further comprises stripe-like hollowed portions, and each strip-like hollowed portion forms a key body.

4. The method according to claim 1, wherein the pattern formed in the step (b) is formed on a key body.

5. The method according to claim 1, wherein the pattern formed in the step (b) comprises any one of numerals, characters, special symbols and direction symbols.

6. The method according to claim 1, wherein filler is filled in the micropores prior to performing the step (c).

7. The method according to claim 6, wherein the filler is any one of UV glue, silicone, Vitro, epoxy or synthetic resin.

8. The method according to claim 1, wherein the multilayer backlight module of the step (d) is formed by adhering at least a first and second light-guiding plates on one side surface of the metallic panel, the first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process, the first and second light-guiding plates have first and second light-guiding microstructures respectively, and the first and second light-guiding microstructures are arranged alternatively on the key body.

9. The method according to claim 8, wherein a first set of light-emitting units and a second set of light-emitting units are arranged on the first and second light-guiding plates respectively, a first shielding unit and a second shielding unit are arranged above the first and second sets of light-emitting units and the first and second light-guiding plates respectively.

10. The method according to claim 8, wherein the first and second sets of light-emitting units are constituted of a plurality of light-emitting diodes having the same or different colors.

11. The method according to claim 8, wherein the first and second light-guiding microstructures on the first and second light-guiding plates are recessed in or protrude from one side surface of the first and second light-guiding plates.

12. A method for manufacturing a metallic panel having multilayer arrays of micropores, the metallic panel being disposed on a surface of an electronic device, the method comprising the steps of:

(a) preparing a metallic thin plate;

(b) forming arrays of micropores on the metallic thin plate, the arrays of micropores forming patterns;

(c) cutting the metallic thin plate to form a metallic panel of a predetermined shape;

(d) adhering a multilayer backlight module on one side surface of the metallic panel; and

(e) adhering a telecommunication module on one side surface of the multilayer backlight module.

13. The method according to claim 12, wherein the metallic thin plate prepared in the step (a) is any one of a stainless steel (SUS) or Al—Mg alloy.

14. The method according to claim 12, wherein the metallic thin plate prepared in the step (a) further comprises stripe-like hollowed portions, and each strip-like hollowed portion forms a key body.

15. The method according to claim 12, wherein the pattern formed in the step (b) is formed on a key body.

16. The method according to claim 12, wherein the pattern formed in the step (b) comprises any one of numerals, characters, special symbols and direction symbols.

17. The method according to claim 12, wherein a filler is filled in the micropores prior to performing the step (c).

18. The method according to claim 17, wherein the filler is any one of UV glue, silicone, Vitro, epoxy or synthetic resin.

19. The method according to claim 12, wherein the multilayer backlight module of the step (d) is formed by adhering at least a first and second light-guiding plates on one side surface of the metallic panel, the first and second light-guiding plates are formed on one side of the metallic panel via a hot pressing or adhering process, the first and second light-guiding plates have first and second light-guiding microstructures respectively, the first and second light-guiding microstructures are arranged alternatively on the key body.

20. The method according to claim 19, wherein a first set of light-emitting units and a second set of light-emitting units are arranged on the first and second light-guiding plates respectively, a first shielding unit and a second shielding unit are arranged above the first and second sets of light-emitting units and the first and second light-guiding plates respectively.

21. The method according to claim 20, wherein the first and second sets of light-emitting units are constituted of a plurality of light-emitting diodes having the same or different colors.

22. The method according to claim 19, wherein the light-guiding microstructures on the two light-guiding plates are recessed in or protrude from one side surface of the light-guiding plates.

23. The method according to claim 12, wherein the telecommunication module of the step (e) has a flexible printed circuit board, the circuit board has thereon a plurality of contacting points, each contacting point corresponds to a metal dome, a film layer is arranged on one side surface of the circuit board and the metal dome, a protrusion is provided on one side surface of a protruding portion of the film layer.

24. The method according to claim 13, wherein the telecommunication module of the step (e) has a flexible printed circuit board, the circuit board has thereon a plurality of contacting points, each contacting point corresponds to a metal dome, a film layer is arranged on one side surface of the circuit board and the metal dome.